Printing ink coating device for PCB (printed circuit board) processing

By designing components such as multi-depth immersion chambers and electric telescopic rods, the problem of existing devices being unable to adapt to PCB boards of different sizes has been solved, achieving efficient and flexible ink coating and improving immersion efficiency and practicality.

CN224290193UActive Publication Date: 2026-05-26JIANGXI SONGWEI CIRCUIT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGXI SONGWEI CIRCUIT CO LTD
Filing Date
2025-03-29
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing PCB processing equipment cannot adapt to PCBs of different sizes, especially longer ones, when immersing them in ink coating. This results in some areas not being fully immersed or having low immersion efficiency, and the equipment cannot be statically stacked, making it impractical.

Method used

The design incorporates immersion chamber structures of varying depths and orientations, combined with electric telescopic rods and sealing plates, to enable flexible positioning and lifting of the PCB board, ensuring full immersion coverage. This includes the combined use of components such as cylindrical immersion cylinders, sealing plates, cover plates, and electric telescopic rods.

Benefits of technology

It improves the efficiency and coverage of PCB board ink immersion, adapts to boards of different sizes, and enhances the practicality and ease of operation of the device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a printed circuit board (PCB) processing printing ink coating device which comprises a coating device body, the interior of the coating device body is of a cavity structure, a top plate is arranged on the top of the coating device body, an annular sealing plate is arranged on the top plate, a fixing flange is arranged at the bottom of the annular sealing plate and fixed on the top plate through bolts, and the fixing flange is provided with a fixing groove. A cylindrical immersion barrel is arranged in the middle of the top plate, a sealing plate is arranged between the side wall of the cylindrical immersion barrel and the top of the annular sealing plate, a first cover plate and a second cover plate are arranged on the sealing plate, a printing ink storage cavity is formed in the coating device body, and an inclined guide plate is arranged at the bottom of the printing ink storage cavity; a first discharging pipe is arranged at the bottom of the inclined guide plate, a first horizontal circular plate is arranged at the bottom of the ink storage cavity, and a first annular inclined plate is arranged on the side wall of the first horizontal circular plate. The beneficial effects of the utility model are that the immersion effect of the PCB printing ink is improved by arranging the immersion cavities with different depths and different orientations.
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Description

Technical Field

[0001] This utility model relates to the technical field of PCB board processing, and in particular to an ink coating device for PCB board processing. Background Technology

[0002] Although existing PCBs can be immersed in ink for coating, they still have some drawbacks: 1. The depth of the existing device is fixed, the container is a spout, and only one PCB can be immersed at a time. There are no supporting components. When the PCB is long, some parts of the PCB are not immersed in the ink, resulting in secondary immersion. At the same time, the PCB cannot be stationary during the immersion process, resulting in low immersion efficiency and poor practicality. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art by providing a PCB board processing ink coating device that improves the immersion effect of PCB board ink by setting immersion chambers of different depths and orientations.

[0004] The purpose of this utility model is achieved through the following technical solution: a PCB board processing ink coating device, including a coating device body, the interior of the coating device body is a cavity structure, and a top plate is provided on the top of the coating device body, an annular sealing plate is provided on the top plate, and a fixing flange is provided on the bottom of the annular sealing plate, and the fixing flange is fixed to the top plate by bolts.

[0005] Preferably, a cylindrical immersion cylinder is provided in the middle of the top plate, and a sealing plate is provided between the side wall of the cylindrical immersion cylinder and the top of the annular sealing plate. The sealing plate is provided with a cover plate one and a cover plate two. The interior of the coating device body is provided with an ink storage cavity, and an inclined guide plate is provided at the bottom of the ink storage cavity. A discharge pipe is provided at the bottom of the inclined guide plate. The bottom of the ink storage cavity is a horizontal circular plate one, and an annular inclined plate one is provided on the side wall of the horizontal circular plate one. The side wall of the annular inclined plate one is fixedly connected by bolts. An overlapping cavity is provided on the outer wall of the ink storage cavity, and the overlapping cavity includes an annular inclined overlapping plate. The bottom of the annular inclined overlapping plate is fixed to the outer wall of the coating device body by bolts.

[0006] Preferably, the height of the cylindrical immersion cylinder is greater than that of the annular sealing plate, the top plate is provided with a discharge pipe II in the middle, the horizontal circular plate I is provided with a discharge pipe III at the bottom, and the overlapping cavity and the ink storage cavity are provided with an opening I and an opening II.

[0007] Preferably, the horizontal circular plate is provided with a semi-circular baffle one, a semi-circular baffle two, a semi-circular baffle three, and a semi-circular baffle four. The semi-circular baffle one and the semi-circular baffle two are arranged in concentric circles, and the semi-circular baffle three and the semi-circular baffle four are arranged in concentric circles.

[0008] Preferably, the top plate is provided with a first through hole section and a second through hole section, and each of the first through hole section and the second through hole section is provided with a plurality of through holes one. Each through hole one is provided with a sealing rubber plug. The side wall of the annular sealing plate is provided with through holes two. The through holes one are located at the bottom of the cavity formed between the annular sealing plate and the cylindrical immersion cylinder.

[0009] Preferably, both through hole 2 and through hole 1 are provided with sealing plugs, and through hole 2 is arranged vertically at equal intervals. The top of the cylindrical immersion cylinder is provided with a positioning plate, and the positioning plate is provided with rectangular opening 1, rectangular opening 2 and rectangular opening 3.

[0010] Preferably, a placement box 1 and a placement box 2 are provided below the positioning plate, and an electric telescopic rod 1 and an electric telescopic rod 2 are respectively provided inside the placement box 1 and the placement box 2. A lifting plate 1 is provided at the bottom of the electric telescopic rod 1 and the electric telescopic rod 2, and the distance between the lifting plate 1 and the inner wall of the cylindrical immersion cylinder is 0.1-5cm.

[0011] Preferably, the cylindrical immersion cylinder is provided with a feed pipe 1, a feed pipe 2, a discharge pipe 1, and a discharge pipe 2 on its side wall, and the discharge pipe 1 and the discharge pipe 2 are located below the feed pipe 1 and the discharge pipe 2.

[0012] This utility model has the following advantages:

[0013] 1. The coating device body of this utility model has a hollow cavity structure inside, and a top plate is provided on the top of the coating device body. An annular sealing plate is provided on the top plate, and a fixing flange is provided on the bottom of the annular sealing plate. The fixing flange is fixed to the top plate by bolts, which realizes the convenient disassembly and replacement of the annular sealing plate and facilitates the cleaning of the bottom.

[0014] A cylindrical immersion cylinder is provided in the middle of the top plate, and a sealing plate is provided between the side wall of the cylindrical immersion cylinder and the top of the annular sealing plate. The sealing plate is provided with a cover plate one and a cover plate two. The interior of the coating device body is provided with an ink storage chamber, and an inclined guide plate is provided at the bottom of the ink storage chamber. A discharge pipe is provided at the bottom of the inclined guide plate. The bottom of the ink storage chamber is a horizontal circular plate one, and an annular inclined plate one is provided on the side wall of the horizontal circular plate one. The side wall of the annular inclined plate one is fixedly connected by bolts. The annular inclined plate one is provided with an overlapping protrusion to facilitate the placement of the PCB board. An overlapping cavity is provided on the outer wall of the ink storage chamber, and the overlapping cavity includes an annular inclined overlapping plate. The bottom of the annular inclined overlapping plate is fixed to the outer wall of the coating device body by bolts. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the top plate structure in this utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the horizontal circular plate in this utility model;

[0018] Figure 4 for Figure 1 A magnified view of a portion of point A in the middle.

[0019] In the diagram, the coating device consists of: 1. Body; 2. Top plate; 3. Annular sealing plate; 4. Fixed flange; 5. Cylindrical immersion cylinder; 6. Sealing plate; 7. Cover plate one; 8. Cover plate two; 9. Ink storage chamber; 10. Inclined guide plate; 11. Discharge pipe one; 12. Horizontal circular plate one; 13. Annular inclined plate one; 14. Overlapping cavity; 15. Annular inclined overlapping plate; 16. Discharge pipe two; 17. Discharge pipe three; 18. Opening one; 19. Opening two; 20. Semi-arc baffle one; 21. Semi-arc baffle two; 22. Semi-arc baffle three; 23. Semi-arc baffle four; 24. First through hole section; 25. Second through hole section; 26. Through hole one; 27. Sealing rubber plug; 28. Through hole two; 29. ​​Positioning plate; 30. Rectangular opening one; 31. Placement box one; 32. Electric telescopic rod one; 33. Lifting plate one; 34. Feed pipe one; 35. Discharge pipe one. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings. The scope of protection of the present invention is not limited to the following description:

[0021] like Figures 1-4 As shown, a PCB board processing ink coating device includes a coating device body 1. The interior of the coating device body 1 is a cavity structure. A top plate 2 is provided on the top of the coating device body 1. An annular sealing plate 3 is provided on the top plate 2. A fixing flange 4 is provided on the bottom of the annular sealing plate 3. The fixing flange 4 is fixed to the top plate 2 by bolts. The annular sealing plate 3 can be easily disassembled.

[0022] In this embodiment, a cylindrical immersion cylinder 5 is provided in the middle of the top plate 2, and a sealing plate 6 is provided between the side wall of the cylindrical immersion cylinder 5 and the top of the annular sealing plate 3. The sealing plate 6 is provided with a cover plate 7 and a cover plate 8. The inside of the coating device body 1 is provided with an ink storage cavity 9, and an inclined guide plate 10 is provided at the bottom of the ink storage cavity 9. A discharge pipe 11 is provided at the bottom of the inclined guide plate 10. The bottom of the ink storage cavity 9 is a horizontal circular plate 12, and an annular inclined plate 13 is provided on the side wall of the horizontal circular plate 12. The side wall of the annular inclined plate 13 is fixedly connected by bolts. An overlapping cavity 14 is provided on the outer side wall of the ink storage cavity 9, and the overlapping cavity 14 includes an annular inclined overlapping plate 15. The bottom of the annular inclined overlapping plate 15 is fixed to the outer side wall of the coating device body 1 by bolts.

[0023] In this embodiment, the height of the cylindrical immersion cylinder 9 is greater than that of the annular sealing plate 3. The top plate 2 is provided with a discharge pipe 2 16 in the middle, and the bottom of the horizontal circular plate 12 is provided with a discharge pipe 3 17. The overlapping cavity 14 and the ink storage cavity 9 are provided with an opening 18 and an opening 2 19, and are not limited to one, to ensure the placement and immersion of the PCB board.

[0024] In this embodiment, the horizontal circular plate 12 is provided with a semi-circular baffle 20, a semi-circular baffle 21, a semi-circular baffle 3 22 and a semi-circular baffle 4 23. The semi-circular baffle 20 and the semi-circular baffle 21 are arranged in concentric circles, and the semi-circular baffle 3 22 and the semi-circular baffle 4 23 are arranged in concentric circles.

[0025] In this embodiment, the top plate 2 is provided with a first through hole section 24 and a second through hole section 25, and both the first through hole section 24 and the second through hole section 25 are provided with a plurality of through holes 26. A sealing rubber plug 27 is provided on the through hole 26. The side wall of the annular sealing plate 3 is provided with a through hole 28. The through hole 26 is located at the bottom of the cavity formed between the annular sealing plate 3 and the cylindrical immersion cylinder 9.

[0026] In this embodiment, both through hole 28 and through hole 26 are provided with sealing plugs, and through hole 28 is arranged vertically at equal intervals. The top of the cylindrical immersion cylinder 9 is provided with a positioning plate 29, and the positioning plate 29 is provided with rectangular opening 30, rectangular opening 2 and rectangular opening 3, so that the PCB board can be placed vertically for immersion.

[0027] In this embodiment, a placement box 31 and a placement box 2 are provided below the positioning plate 29. An electric telescopic rod 32 and an electric telescopic rod 2 are respectively provided inside the placement box 31 and the placement box 2. A lifting plate 33 is provided at the bottom of the electric telescopic rod 32 and the electric telescopic rod 2. The distance between the lifting plate 33 and the inner wall of the cylindrical immersion cylinder 9 is 0.1-5cm, so that the ink and PCB board can be lifted at the same time as the lifting plate 33 is lifted, or the PCB board can be lifted separately.

[0028] In this embodiment, the cylindrical immersion cylinder 9 is provided with a feed pipe 34, a feed pipe 2, a discharge pipe 35, and a discharge pipe 2 on its side wall. The discharge pipe 35 and the discharge pipe 2 are located below the feed pipe 34 and the feed pipe 2, and the lifted ink can be discharged through the discharge pipe 35 and the discharge pipe 2.

[0029] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A PCB board processing ink coating device, characterized in that: The coating device includes a coating device body, the interior of which is a cavity structure, and a top plate is provided on the top of the coating device body. An annular sealing plate is provided on the top plate, and a fixing flange is provided on the bottom of the annular sealing plate. The fixing flange is fixed to the top plate by bolts. A cylindrical immersion cylinder is provided in the middle of the top plate, and a sealing plate is provided between the side wall of the cylindrical immersion cylinder and the top of the annular sealing plate. The sealing plate is provided with a cover plate one and a cover plate two. The interior of the coating device body is provided with an ink storage chamber, and an inclined guide plate is provided at the bottom of the ink storage chamber. A discharge pipe is provided at the bottom of the inclined guide plate. The bottom of the ink storage chamber is a horizontal circular plate one, and an annular inclined plate one is provided on the side wall of the horizontal circular plate one. The side wall of the annular inclined plate one is fixedly connected by bolts. An overlapping cavity is provided on the outer wall of the ink storage chamber, and the overlapping cavity includes an annular inclined overlapping plate. The bottom of the annular inclined overlapping plate is fixed to the outer wall of the coating device body by bolts.

2. The PCB board processing ink coating device according to claim 1, characterized in that: The height of the cylindrical immersion cylinder is greater than that of the annular sealing plate. The top plate is provided with a discharge pipe 2 in the middle and a discharge pipe 3 on the bottom of the horizontal circular plate 1. The overlapping cavity and the ink storage cavity are provided with an opening 1 and an opening 2.

3. The PCB board processing ink coating device according to claim 2, characterized in that: The horizontal circular plate is provided with a semi-circular baffle 1, a semi-circular baffle 2, a semi-circular baffle 3 and a semi-circular baffle 4. The semi-circular baffle 1 and the semi-circular baffle 2 are arranged in concentric circles, and the semi-circular baffle 3 and the semi-circular baffle 4 are arranged in concentric circles.

4. The PCB board processing ink coating device according to claim 1, characterized in that: The top plate is provided with a first through hole section and a second through hole section, and each of the first through hole section and the second through hole section is provided with a plurality of through holes one. Each through hole one is provided with a sealing rubber plug. The side wall of the annular sealing plate is provided with through holes two. The through holes one are located at the bottom of the cavity formed between the annular sealing plate and the cylindrical immersion cylinder.

5. The PCB board processing ink coating device according to claim 4, characterized in that: Both through hole 2 and through hole 1 are provided with sealing plugs, and through hole 2 is arranged vertically at equal intervals. The top of the cylindrical immersion cylinder is provided with a positioning plate, and the positioning plate is provided with rectangular opening 1, rectangular opening 2 and rectangular opening 3.

6. The PCB board processing ink coating device according to claim 5, characterized in that: Below the positioning plate are two placement boxes, and inside each of the two placement boxes are two electric telescopic rods, one electric telescopic rod and the other electric telescopic rod. At the bottom of each of the two electric telescopic rods is a lifting plate, and the distance between the lifting plate and the inner wall of the cylindrical immersion cylinder is 0.1-5cm.

7. The PCB board processing ink coating device according to claim 6, characterized in that: The cylindrical immersion cylinder is provided with feed pipe 1, feed pipe 2, discharge pipe 1 and discharge pipe 2 on its side wall, and discharge pipe 1 and discharge pipe 2 are located below feed pipe 1 and feed pipe 2.