Needle jig

Abstract

This application relates to the field of fixture technology, specifically to a pin insertion fixture. This application aims to solve the problem of low pin positioning accuracy. An embodiment of this application provides a pin insertion fixture, including a base, a first positioning plate, and a second positioning plate. The base is used to fix the device to be inserted (pin). The first positioning plate faces the base and has at least one first positioning hole configured to align with a pad on the device to be inserted. The second positioning plate is located on the side of the first positioning plate opposite to the base and has at least one second positioning hole. The first and second positioning holes are used to accommodate the same pin. The first positioning hole can perform a primary positioning of the pin, and the second positioning hole can perform a secondary positioning, achieving secondary positioning. The improved coaxiality and positional accuracy of the first and second positioning holes reduce the impact of errors between the first or second positioning hole and the pad on the pin, thereby improving the pin positioning accuracy.

Description

Technical Field

[0001] This application relates to the field of fixture technology, specifically to a pin insertion fixture. Background Technology

[0002] Power modules are typically connected to circuit boards via pins. These pins usually need to be soldered onto the power module's substrate using a pin fixture. A pin fixture generally includes a positioning plate and a base. The positioning plate and base are connected, and the substrate is fixed to the base. The pins can pass through the positioning plate and contact the substrate. However, the positioning accuracy of the pins is not high because the position between the pins and the substrate is determined by the connection between the positioning plate and the base. Utility Model Content

[0003] This application relates to the field of fixture technology, specifically to a pin insertion fixture that can improve the positioning accuracy of pins.

[0004] This application provides a pin insertion fixture, including a base for fixing a device to be implanted with pins. The pin insertion fixture also includes a first positioning plate and a second positioning plate. The first positioning plate faces the base and has at least one first positioning hole configured to align with a pad on the device to be implanted with pins. The second positioning plate is located on the side of the first positioning plate opposite to the base and is parallel to the first positioning plate. The second positioning plate has at least one second positioning hole, and the first and second positioning holes are used to accommodate the same pin.

[0005] Since both the second and first positioning plates are used to position the pins, each pin needs to pass through both the first and second positioning holes. Passing through the first positioning hole positions the pin once, and passing through the second positioning hole positions it again, achieving secondary positioning.

[0006] Since the first positioning hole and the second positioning hole are used to accommodate the same pin, the coaxiality and position of the first positioning hole and the second positioning hole are improved. This reduces the impact of the error between the first positioning hole or the second positioning hole and the pad on the pin. As a result, the error between the position of the pin after passing through the first positioning hole and the ideal position is reduced, thereby improving the positioning accuracy of the pin and ensuring that the pin can contact the pad and be soldered.

[0007] In some embodiments that may include the above embodiments, the first positioning plate and the second positioning plate are spaced apart, and the cross-sectional area of ​​the second positioning hole is smaller than the cross-sectional area of ​​the first positioning hole.

[0008] The cross-sectional area of ​​the second positioning hole is smaller than that of the first positioning hole. The size of the second positioning hole is insufficient for the entire pin to pass through; only the tip of the pin can pass through the second positioning hole. When the second positioning plate is installed on the pin, the second positioning plate will exert downward pressure on the pin, constraining the tip of the pin to a fixed position through the second positioning hole, reducing the cumulative error of the preceding process and improving the positioning accuracy of the pin.

[0009] In some embodiments that may include the above embodiments, the first positioning plate and the base are detachably connected.

[0010] When using the pin insertion fixture, the device to be implanted needs to be fixed to the base first. The detachable connection between the first positioning plate and the base makes it easier to fix the device to be implanted to the base. At the same time, the distance between the first positioning plate and the base can be adjusted according to the length of the pin to avoid the distance between the first positioning plate and the base being too long, which would cause the pin to deviate when it passes through the first positioning plate and contacts the device to be implanted, thus affecting the positioning accuracy of the pin.

[0011] In some embodiments that may include the above-described embodiments, the pin insertion fixture further includes a fixing post, one end of which is detachably connected to the base, and / or the other end of which is detachably connected to the first positioning plate. The fixing post is provided with a positioning boss, which is used to limit the distance between the first positioning plate and the base.

[0012] One end of the fixing post is detachably connected to the base, and / or the other end of the fixing post is detachably connected to the first positioning plate, making it easier to connect the base to the device to be implanted. If the fixing post, base or first positioning plate is damaged, it can be replaced at any time to ensure the normal use of the needle insertion fixture.

[0013] The fixed column is provided with a positioning boss, which is used to limit the distance between the first positioning plate and the base, thereby ensuring that the part of the pin is located between the first positioning plate and the base. The top of the pin is exposed outside the first positioning plate, which facilitates the subsequent installation of the second positioning plate and ensures the positioning accuracy of the pin.

[0014] In some embodiments that may include the above embodiments, the base has a fixed surface, which is arranged parallel to the first positioning plate, and the fixed surface is used for detachable connection with the device to be implanted.

[0015] The base is set parallel to the first positioning plate, which ensures that when the pin is inserted into the first positioning plate, the pin is perpendicular to the base, thereby ensuring that the pin is perpendicular to the device to be implanted and ensuring the accuracy of the pin's position.

[0016] The device to be implanted is fixed on the surface of the base facing the first positioning plate, which facilitates the subsequent welding of the device to be implanted to the pin. The detachable connection between the device to be implanted and the base allows for the reuse of the pin fixture. After the pin is welded to the device to be implanted, the device to be implanted can be removed from the base for packaging and assembly into a power module.

[0017] In some embodiments that may include the above embodiments, at least one third positioning hole is provided on the fixed surface, and the pin fixture also includes at least one positioning post, one end of which is inserted into the third positioning hole and the other end of which is inserted into the fourth positioning hole.

[0018] The position of the third positioning hole corresponds to the position of the fourth positioning hole. One end of the positioning post is connected to the third positioning hole, and the other end of the positioning post is connected to the fourth positioning hole. The positioning post can realize the connection between the device to be implanted and the base, so that the position of the device to be implanted on the base is fixed, thereby making the positional error between the first positioning hole and the pad smaller when the first positioning plate and the base are connected later.

[0019] In some embodiments that may include the above embodiments, the number of third positioning holes is multiple, and at least two of the multiple third positioning holes are unequal in distance from the center of the fixed surface.

[0020] At least two of the multiple third positioning holes are unequal in distance from the center of the fixed surface. The connection direction between the device to be implanted and the base can be determined based on the position of the third positioning holes, so as to avoid the device to be implanted and the base being installed in reverse, which would cause an error between the pad and the first positioning hole and affect the connection between the pin and the pad.

[0021] At least two of the multiple third positioning holes are at unequal distances from the center of the fixed surface, which can ensure the accuracy of the soldering between the pin and the pad and improve the stability of the power module quality.

[0022] In some embodiments that may include the above embodiments, the number of third positioning holes is multiple, and at least two of the multiple third positioning holes have different diameters.

[0023] Having at least two of the multiple third positioning holes with different diameters can further enhance the specialization of the third positioning holes, thereby ensuring the accuracy of the connection between the device to be implanted and the base, and avoiding the device to be implanted and the base being installed backwards.

[0024] In some embodiments that may include the above embodiments, a pressure plate is provided on the fixed surface, the pressure plate being used to clamp the edge of the device to be implanted between the pressure plate and the fixed surface.

[0025] The clamping plate engages with the device to be implanted, further securing the device in place and preventing it from falling out during rotation. The symmetrical arrangement of the clamping plates ensures even force distribution on both sides, avoiding concentrated stress on one side and reducing the risk of disengagement from a single clamping plate.

[0026] In some embodiments that may include the above embodiments, the thickness of the first positioning plate is 3-8 mm.

[0027] The first positioning plate is thicker, which increases the contact area between the first positioning plate and the pin. This allows the first positioning plate to provide stronger support for the pin, preventing it from tilting under its own weight or external forces, thus ensuring that the pin is perpendicular to the pad and that the soldering between the pin and the pad is successful.

[0028] In some embodiments that may include the above embodiments, there are multiple first positioning plates, which are spaced apart. The thickness of the first positioning plate is 0.5-2mm, and the distance between two adjacent first positioning plates is 2-3mm.

[0029] There are multiple first positioning plates. The pin needs to pass through multiple first positioning plates before contacting the device to be implanted. Each time the pin passes through a first positioning plate, it can be positioned once. After multiple positioning processes, the pin error can be reduced and the pin position accuracy can be improved.

[0030] Meanwhile, the presence of multiple first positioning plates increases the contact area between the first positioning plates and the pins. Multiple first positioning plates can support the pins in segments, ensuring the pins are perpendicular to the pads. The thinness of the first positioning plates allows the pin tips to be exposed outside the first positioning plates, facilitating the subsequent installation of the second positioning plates.

[0031] In some embodiments that may include the above embodiments, the pin insertion fixture may further include a limiting washer disposed between two adjacent first positioning plates.

[0032] By adjusting the number and thickness of the limiting shims, the distance between the two first positioning plates can be adjusted to ensure the supporting effect of the first positioning plates on the pins. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the structure of the energy storage device provided in the embodiments of this application;

[0034] Figure 2 This is a schematic diagram of the power module provided in an embodiment of this application;

[0035] Figure 3 This is a schematic diagram of the structure of the pin insertion fixture provided in the embodiments of this application;

[0036] Figure 4 An exploded view of the pin fixture provided in the embodiments of this application;

[0037] Figure 5 Assembly process of the pin fixture provided in the embodiments of this application Figure 1 ;

[0038] Figure 6 Assembly process of the pin fixture provided in the embodiments of this application Figure 2 ;

[0039] Figure 7 Assembly process of the pin fixture provided in the embodiments of this application Figure 3 ;

[0040] Figure 8 A schematic diagram of the structure of the pin insertion fixture provided in the embodiments of this application, including a first positioning plate;

[0041] Figure 9 This is a schematic diagram of the structure of the two first positioning plates provided in the embodiments of this application;

[0042] Figure 10 A schematic diagram of the structure of the pin insertion fixture provided in the embodiments of this application, including two first positioning plates;

[0043] Figure 11 Schematic diagram of the structure of the pressure plate and base provided in the embodiments of this application Figure 1 ;

[0044] Figure 12 Schematic diagram of the structure of the pressure plate and base provided in the embodiments of this application Figure 2 .

[0045] Explanation of reference numerals in the attached figures:

[0046] 10: Energy storage device; 11: Power module; 12: Electronic device; 13: Circuit board; 14: Chip; 15: First substrate; 151: Copper layer; 152: Ceramic layer; 16: Second substrate; 17: Heat sink; 18: Solder pad; 19: Pin; 191: Protrusion; 20: Pin fixture; 21: Base; 211: Through hole; 212: Fixing surface; 22: Device to be implanted; 23: First positioning plate; 24: Second positioning plate; 31: First positioning hole; 32: Second positioning hole; 33: Third positioning hole; 34: Fourth positioning hole; 35: Positioning post; 36: Pressure plate; 361: Top plate; 362: Side plate; 41: First through hole; 42: Second through hole; 43: Third through hole; 44: First threaded hole; 45: Groove; 46: First magnet; 47: Second magnet; 50: Fixing post; 51: First through hole; 52: Second through hole; 53: Positioning boss; 54: Nut; 55: Limiting washer; 56: Mark; 57: Washer. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0048] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0049] Furthermore, in the embodiments of this application, directional terms such as "up," "down," "left," "right," "horizontal," and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0050] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, an electrical connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0051] Please refer to Figure 1 Electronic devices generally include a power module 11, which controls and transmits power current to achieve various electrical energy conversions. This application embodiment does not limit the electronic devices; for example, electronic devices may include mobile phones, computers, etc. Energy storage devices 10 typically include a power module 11 and electronic components 12. The power module 11 and electronic components 12 are mounted on the same circuit board 13 and electrically connected through traces on the circuit board 13, thereby realizing the function of the energy storage device 10. This application embodiment does not limit the energy storage device 10 and the power module 11; for example, the energy storage device 10 may include an energy storage power station, etc. The power module 11 may include an inverter, rectifier, energy storage converter, etc. This application embodiment also does not limit the electronic components 12; for example, electronic components 12 may include inductors, resistors, capacitors, etc.

[0052] Continue to refer to Figure 1 and Figure 2The power module 11 typically includes a chip 14, a first substrate 15, and a second substrate 16. This application embodiment does not limit the first substrate 15; for example, the first substrate 15 can be a resin substrate, a ceramic substrate, etc. In embodiments where the first substrate 15 includes a ceramic substrate, the first substrate 15 can be a Direct Bonded Copper Ceramic Substrate (DBC), a Direct Plating Copper Ceramic Substrate (DPC), a Direct Bonding Aluminum Ceramic Substrate (DBA), a Thick Printing Ceramic Substrate (TPC), etc.

[0053] In the implementation where the first substrate 15 is a direct copper-clad ceramic substrate, the first substrate 15 is composed of a copper layer 151 and a ceramic layer 152. The first substrate 15 includes two copper layers 151, and the ceramic layer 152 is located between the two copper layers 151. The chip 14 is soldered onto the copper layer of the first substrate 15. Circuitry is also disposed on the first substrate 15, and the chip 14 can be connected to the circuitry on the first substrate 15 via bonding wires.

[0054] The power module 11 also includes a heat sink 17. A second substrate 16 is disposed between the first substrate 15 and the heat sink 17. The first substrate 15 is soldered to the surface of the second substrate 16 away from the heat sink 17. This allows the heat from the first substrate 15 to be absorbed and transferred to the heat sink 17. The second substrate 16 can also be referred to as a Base Plate, or BP for short.

[0055] This application does not limit the heat sink 17. For example, the heat sink 17 may include an air-cooled heat sink and a liquid-cooled heat sink. In the implementation of the heat sink 17 as an air-cooled heat sink, the heat sink 17 includes heat dissipation fins and a fan. The air force generated by the fan can carry away the heat on the second substrate 16, thereby achieving heat dissipation on the first substrate 15.

[0056] In the implementation of the heat sink 17 as a liquid-cooled heat sink, the heat sink 17 includes a liquid cooling plate containing coolant, which absorbs heat from the second substrate 16. The liquid cooling plate can be connected to a cooling device via pipes, which cools the coolant. The pipes include a first pipe and a second pipe. The coolant, having absorbed heat from the second substrate 16, experiences a temperature increase and can be transferred to the cooling device via the first pipe for cooling. The cooled coolant can then flow back to the liquid cooling plate via the second pipe to continue dissipating heat from the second substrate 16.

[0057] The first substrate 15 has pads 18, and pins 19 on the power module 11 can connect to the pads 18, thereby connecting the pins 19 to the chip 14 or other circuits within the power module 11. The power module 11 and the circuit board 13 are electrically connected via the pins 19, which reduces parasitic parameters in the circuit and lowers the stress on the chip 14. Here, parasitic parameters refer to the additional parameters generated in electronic circuits due to the interconnection between components. Parasitic parameters mainly include parasitic resistance, parasitic inductance, and parasitic capacitance.

[0058] For example, parasitic resistance is directly proportional to the length of the trace; the longer the trace, the higher the resistance, which can easily lead to signal delay and increased power consumption. Parasitic capacitance can easily form between the trace and adjacent signal lines or ground; the longer the trace, the larger the parasitic capacitance. Parasitic inductance of the trace can impede rapid changes in current; the longer the trace, the larger the parasitic inductance, which can easily generate noise.

[0059] The pin 19 includes a top end and a bottom end, with the cross-sectional area of ​​the top end being smaller than that of the bottom end. The top end of the pin 19 is used to insert itself onto the circuit board, enabling an electrical connection between the power module 11 and the circuit board. The bottom end of the pin 19 can be soldered to the pad 18, thus securing the pin 19 to the power module 11.

[0060] Please refer to Figure 3 and Figure 4 This application provides a pin insertion fixture 20, which is an auxiliary device for fixing pins 19 to a device 22 to be inserted, and also serves as an auxiliary function for guiding the processing. The device 22 to be inserted includes the power module 11 in the above embodiments. It is understood that, in addition to the power module 11 mentioned in the embodiments of this application, the pin insertion fixture 20 can also be used to fix pins of other similar devices.

[0061] The pin insertion fixture 20 provided in this embodiment includes a base 21 for fixing the device 22 to be implanted. This embodiment does not limit the shape of the base 21; for example, the base 21 can be a cuboid to facilitate fixing the device 22. It is understood that multiple weight-reducing holes can be provided on the base 21 to reduce its weight, save materials required for manufacturing the base 21, and facilitate operation. A groove can also be provided on the base 21, within which the device 22 can be placed, facilitating positioning of the device 22 and reducing errors when fixing the pin 19.

[0062] This application does not limit the material of the base 21. For example, the base 21 can be made of aluminum alloy or stainless steel. In the implementation where the base 21 is made of aluminum alloy, aluminum alloy has good thermal conductivity and heat resistance, which can effectively transfer and disperse heat in high-temperature environments, making the heating of the device 22 to be implanted more uniform.

[0063] Here, the device to be implanted 22 refers to the first substrate 15 and the second substrate 16 soldered together. It can be understood that, compared to the device to be implanted 22 which only includes the first substrate 15, the device to be implanted 22 includes the first substrate 15 and the second substrate 16. After the pin 19 and the device to be implanted 22 are soldered together, they can be packaged immediately, thereby saving subsequent packaging steps and reducing packaging difficulty.

[0064] The pin insertion fixture 20 also includes a first positioning plate 23, which faces the base 21. The first positioning plate 23 has at least one first positioning hole 31, configured to align with the pad 18 on the device 22 to which the pin is to be inserted. It is understood that the position of the first positioning hole 31 corresponds to the position of the pad 18. When the pin 19 passes through the first positioning hole 31, the correspondence between the pin 19 and the pad 18 is achieved, facilitating subsequent soldering of the pin 19 and the pad 18 together.

[0065] Since the pin 19 passes through the first positioning hole 31, and the cross-sectional area of ​​the first positioning hole 31 is slightly larger than the cross-sectional area of ​​the pin 19, the pin 19 can be freely inserted or removed. Here, "slightly larger" means that the distance between the first positioning hole 31 and the pin 19 is 0.01-0.1 mm. For example, the distance can be 0.01 mm, 0.05 mm, or 0.1 mm.

[0066] In some embodiments, the first positioning plate 23 is further provided with a first through hole 41. It is understood that the first through hole 41 is created by hollowing out the first positioning plate 23. The first positioning plate 23 is used to position the pin 19. The remaining positions without the first positioning hole 31 can be hollowed out, thereby saving material and reducing the cost of the fixture material.

[0067] Meanwhile, hollowing out the first positioning plate 23 can reduce the weight of the first positioning plate 23, reduce the amount of material used in its manufacture, and make it easier to operate the first positioning plate 23.

[0068] The pin insertion fixture 20 also includes a second positioning plate 24, which is disposed on the side of the first positioning plate 23 away from the base 21, and is arranged parallel to the first positioning plate 23. The second positioning plate 24 is provided with at least one second positioning hole 32, and the first positioning hole 31 and the second positioning hole 32 are used to accommodate the same pin 19.

[0069] The second positioning plate 24 is arranged parallel to the first positioning plate 23. The positions of each second positioning hole 32 correspond one-to-one with the positions of each first positioning hole 31. That is to say, the positions of the second positioning holes 32 correspond to the positions of the pads 18. The pin 19 passes through the second positioning hole 32, which can realize the correspondence between the pin 19 and the pads 18, making it easier to solder the pin 19 and the pads 18 together in the future.

[0070] Since both the second positioning plate 24 and the first positioning plate 23 are used to position the pins 19, each pin 19 needs to pass through the first positioning hole 31 and the second positioning hole 32. Passing through the first positioning hole 31 allows the pin 19 to be positioned once, and passing through the second positioning hole 32 allows the pin 19 to be positioned again, thus achieving secondary positioning.

[0071] Since the first positioning hole 31 and the second positioning hole 32 are used to accommodate the same pin 19, the coaxiality and positional accuracy of the first positioning hole 31 and the second positioning hole 32 are improved, which reduces the influence of the error between the first positioning hole 31 or the second positioning hole 32 and the pad 18 on the pin 19. This reduces the error between the position of the pin 19 after passing through the first positioning hole 31 and the second positioning hole 32 and the ideal position, thereby improving the positioning accuracy of the pin 19 and ensuring that the pin 19 can contact and solder with the pad 18.

[0072] Here, coaxiality refers to the precision of whether the axes of two or more holes lie on the same straight line. Position accuracy refers to the allowable deviation range of the actual position of a hole from its theoretical ideal position. The higher the position accuracy, the smaller the deviation between the actual and ideal positions of the hole.

[0073] In some embodiments, the second positioning plate 24 is further provided with a second through hole 42. It is understood that the second through hole 42 is created by hollowing out the second positioning plate 24. The second positioning plate 24 is used to position the pin 19. Hollowing out other positions where the second positioning hole 32 is not provided can save material usage and reduce the cost of the fixture material.

[0074] Meanwhile, hollowing out the second positioning plate 24 can reduce the weight of the second positioning plate 24, reduce the amount of material used in its manufacture, and make it easier to operate the second positioning plate 24.

[0075] Please refer to Figure 5 , Figure 6 and Figure 7 During the assembly process, the device to be implanted 22 is first fixed to the base 21, and the position of the device to be implanted 22 is determined (e.g., Figure 5(As shown). The tip of the pin 19 is inserted into the first positioning plate 23. The pin 19 is provided with a protrusion 191, which allows the pin 19 to be inserted into the first positioning plate 23, preventing the pin 19 from directly passing through the first positioning plate 23 (as shown). Figure 6 (As shown).

[0076] Since the device to be implanted 22 is fixed to the base 21, the pin insertion fixture 20 can be flipped so that the device to be implanted 22 is positioned above the first positioning plate 23, that is, so that the pad 18 of the device to be implanted 22 corresponds to the bottom end of the pin 19. At this time, the base 21 can be fixed to the first positioning plate 23, so that the positions of the pin 19 and the device to be implanted 22 are fixed, and the bottom end of the pin 19 faces the device to be implanted 22, which facilitates subsequent soldering (e.g., ...). Figure 7 (As shown).

[0077] After the base 21 and the first positioning plate 23 are fixed, the pin insertion fixture 20 can be flipped over so that the top of the pin 19 faces upward. Under the action of gravity, the bottom of the pin 19 contacts the device 22 to be implanted. At this time, the pin insertion fixture 20 can be flipped over again, and the second positioning plate 24 can be installed on the top of the pin 19. The second positioning plate 24 can further position the pin 19. Finally, the pin insertion fixture 20 is placed in the reflow oven to achieve the welding of the pin 19 and the device 22 to be implanted.

[0078] The embodiments of this application do not limit the position of the solder. For example, the solder can be pre-placed on the pad 18 of the device 22 to be implanted, and the solder can also be pre-placed at the bottom of the pin 19.

[0079] Depending on the heating method, the base 21 can be adjusted. For example, in an embodiment using direct heating (contact heating), the heat source transfers heat to the device 22 to be implanted via the base 21, melting the solder and soldering the pin 19 to the pad 18. Because direct heating uses contact heat transfer, the larger area of ​​the base 21 ensures faster heat transfer, thus accelerating the welding process.

[0080] In the embodiment employing the hot air heating method, a through hole 211 is provided on the base 21, the position of which corresponds to the position of the device 22 to be implanted. Hot air can pass through the through hole 211 to directly heat the solder, causing the solder to melt and the pin 19 to be soldered to the pad 18. Since the hot air heating method uses air to conduct heat, the through hole 211 on the base 21 can increase the flow rate of hot air, resulting in a faster heat transfer rate and thus accelerating the welding speed.

[0081] Continue to refer to Figure 3 and Figure 4In some embodiments, the first positioning plate 23 and the second positioning plate 24 are spaced apart, and the cross-sectional area of ​​the second positioning hole 32 is equal to the cross-sectional area of ​​the first positioning hole 31. Here, the cross-sectional area refers to the area of ​​the positioning hole obtained by cutting the positioning plate with a plane parallel to the positioning plate.

[0082] The cross-sectional areas of the first positioning hole 31 and the second positioning hole 32 are equal. This means that the first positioning plate 23 and the second positioning plate 24 are essentially the same type of positioning plate. When the pin 19 passes through the first positioning plate 23, the first positioning plate 23 can position the pin 19 once, ensuring that the pin 19 corresponds to the position of the pad 18. When the pin 19 passes through the second positioning plate 24, the second positioning plate 24 can perform a second positioning of the pin 19, further ensuring that the pin 19 corresponds to the position of the pad 18, reducing errors and improving the positioning accuracy of the pin 19.

[0083] Continue to refer to Figure 7 It is understandable that the pin 19 does not completely pass through the first positioning plate 23 and the second positioning plate 24; a portion of the pin 19 passes through the first positioning plate 23 and the second positioning plate 24, and is located between the first positioning plate 23 and the device 22 to be implanted. In other words, the first positioning plate 23 and the second positioning plate 24, in addition to positioning the pin 19, can also support the pin 19, ensuring that the pin 19 is perpendicular to the surface where the pad 18 is located.

[0084] In some embodiments, the first positioning plate 23 and the second positioning plate 24 are spaced apart, and the cross-sectional area of ​​the second positioning hole 32 is smaller than that of the first positioning hole 31. The size of the second positioning hole 32 is insufficient for the entire pin 19 to pass through; only the tip of the pin 19 can pass through the second positioning hole 32. When the second positioning plate 24 is installed on the pin 19, the second positioning plate 24 exerts downward pressure on the pin 19, constraining the tip of the pin 19 to a fixed position through the second positioning hole 32, reducing the cumulative error of the preceding process, and improving the positioning accuracy of the pin 19.

[0085] Please refer to Figure 8 In some embodiments, the thickness d1 of the first positioning plate 23 is 3mm-8mm. For example, the thickness d1 of the first positioning plate 23 can be 3mm, 4mm, 5mm, 7mm, or 8mm. It is understood that a larger thickness of the first positioning plate 23 can ensure the supporting function of the first positioning plate 23 for the pin 19, and prevent the first positioning plate 23 from being too thin, which would cause the pin 19 to tilt under its own weight or external force, thereby affecting the soldering of the pin 19 to the pad 18.

[0086] The first positioning plate 23 is thicker, which increases the contact area between the first positioning plate 23 and the pin 19. As a result, the first positioning plate 23 can provide strong support for the pin 19, ensuring that the pin 19 is set perpendicular to the pad 18.

[0087] Please refer to Figure 9 and Figure 10 In some embodiments, there are multiple first positioning plates 23, which are spaced apart. The thickness d2 of each first positioning plate 23 is 0.5-2mm. For example, the thickness d2 of the first positioning plate 23 can be 0.5mm, 1mm, or 2mm. The distance L between two adjacent first positioning plates 23 is 2mm-3mm. For example, the distance L between two adjacent first positioning plates 23 can be 2mm, 2.5mm, or 3mm.

[0088] There are multiple first positioning plates 23. The pin 19 needs to pass through multiple first positioning plates 23 before contacting the device to be implanted 22. The pin 19 can be positioned once by passing through the first positioning plate 23 once. After multiple positioning, the error of the pin 19 can be reduced and the positional accuracy of the pin 19 can be improved.

[0089] Meanwhile, the presence of multiple first positioning plates 23 increases the contact area between the first positioning plates 23 and the pins 19. Multiple first positioning plates 23 can support the pins 19 in segments, ensuring that the pins 19 are positioned perpendicular to the pads 18. The relatively small thickness of the first positioning plates 23 ensures that the tip of the pins 19 can be exposed outside the first positioning plates 23, facilitating the subsequent installation of the second positioning plate 24.

[0090] In some embodiments, a limiting shim 55 may be provided between two adjacent first positioning plates 23. By adjusting the number and thickness of the limiting shims 55, the distance between the two first positioning plates 23 can be adjusted to ensure the supporting function of the first positioning plates 23 for the pin 19. This application embodiment does not limit the number and thickness of the limiting shims 55. For example, the greater the thickness of the limiting shims 55, the greater the distance between two adjacent first positioning plates 23; the more limiting shims 55 there are, the greater the distance between two adjacent first positioning plates 23.

[0091] In some embodiments, the limiting shim 55 can be fixed to a first positioning plate 23. For example, two first positioning plates 23 are spaced apart, and the limiting shim 55 is disposed on the surface of one first positioning plate 23 near the other. The limiting shim 55, fixed to the first positioning plate 23, can satisfy the distance between the two first positioning plates 23 while preventing the two first positioning plates 23 from being installed backwards.

[0092] In some embodiments, the limiting gaskets 55 are detachable. After fixing one first positioning plate 23, the corresponding number and thickness of limiting gaskets 55 are installed according to the actual distance requirements, and then the other first positioning plate 23 is fixed.

[0093] Continue to refer to Figure 3 and Figure 4 In the above embodiment, the first positioning plate 23 and the base 21 are detachably connected. It is understood that when using the pin insertion fixture 20, the device to be implanted 22 needs to be fixed to the base 21 first. The detachable connection between the first positioning plate 23 and the base 21 makes fixing the device to be implanted 22 to the base 21 more convenient. Simultaneously, the distance between the first positioning plate 23 and the base 21 can be adjusted according to the length of the pin 19, preventing the distance between the first positioning plate 23 and the base 21 from being too long, which could cause the pin 19 to shift when it passes through the first positioning plate 23 and contacts the device to be implanted 22, affecting the positioning accuracy of the pin 19.

[0094] Continue to refer to Figure 3 and Figure 4 In the above embodiment, the pin insertion fixture 20 further includes a fixing post 50, one end of which is detachably connected to the base 21, and / or the other end of which is detachably connected to the first positioning plate 23. The fixing post 50 is provided with a positioning boss 53, which is used to limit the distance between the first positioning plate 23 and the base 21.

[0095] In some embodiments, one end of the fixing post 50 is detachably connected to the base 21, and the other end of the fixing post 50 can be fixedly connected to the first positioning plate 23. For example, the base 21 is provided with a first through hole, and the fixing post 50 is provided with a positioning boss 53. The cross-sectional area of ​​the positioning boss 53 is larger than the cross-sectional area of ​​the first through hole. One end of the fixing post 50 is inserted into the first through hole to achieve the connection between the fixing post 50 and the base 21.

[0096] In some embodiments, the other end of the fixing post 50 is detachably connected to the first positioning plate 23, and one end of the fixing post 50 is fixedly connected to the base 21. For example, the first positioning plate 23 is provided with a second through hole, and the fixing post 50 is provided with a positioning boss 53. The cross-sectional area of ​​the positioning boss 53 is larger than the cross-sectional area of ​​the second through hole. The other end of the fixing post 50 is inserted into the second through hole, thereby achieving the connection between the fixing post 50 and the first positioning plate 23.

[0097] In some embodiments, one end of the fixing post 50 is detachably connected to the base 21, and the other end of the fixing post 50 is detachably connected to the first positioning plate 23. For example, the base 21 has a first through hole, the first positioning plate 23 has a second through hole, and the fixing post 50 has a positioning boss 53. The cross-sectional area of ​​the positioning boss 53 is larger than the cross-sectional area of ​​the first through hole, and the cross-sectional area of ​​the positioning boss 53 is larger than the cross-sectional area of ​​the second through hole. Inserting one end of the fixing post 50 into the first through hole and the other end of the fixing post 50 into the second through hole allows for the connection between the first positioning plate 23 and the fixing post 50.

[0098] One end of the fixing post 50 is detachably connected to the base 21, and / or the other end of the fixing post 50 is detachably connected to the first positioning plate 23, making it easier to connect the base 21 to the device to be implanted with needles. If the fixing post 50, the base 21 or the first positioning plate 23 is damaged, it can be replaced at any time to ensure the normal use of the needle insertion fixture 20.

[0099] The fixed post 50 is provided with a positioning boss 53, which is used to limit the distance between the first positioning plate 23 and the base 21, thereby ensuring that part of the pin 19 is located between the first positioning plate 23 and the base 21. The top end of the pin 19 is exposed outside the first positioning plate 23, which facilitates the subsequent installation of the second positioning plate 24 and ensures the positioning accuracy of the pin 19.

[0100] In some embodiments, the pin insertion fixture 20 may further include a nut 54 and a washer 57, with the nut 54 fixed to the other end of the fixing post 50 and the washer 57 disposed between the nut 54 and the first positioning plate 23. The nut 54 and the washer 57 can further secure the first positioning plate 23 and prevent the first positioning plate 23 from falling off when flipped.

[0101] In the above embodiment, the same mark 56 is provided on the surface of the base 21 near the first positioning plate 23 and on the surface of the first positioning plate 23 near the second positioning plate 24. When the base 21 is connected to the first positioning plate 23, the position of the mark can be observed to ensure that the marks are oriented on the same side, thus ensuring the accuracy of the installation direction of the base 21 and the first positioning plate 23.

[0102] The shape of the mark is not limited in the embodiments of this application. For example, the mark can be an arrow mark, a circular mark, an irregularly shaped mark, or text or a symbol.

[0103] In the embodiment marked with arrows, both the base 21 and the first positioning plate 23 are provided with arrow marks. When the base 21 is connected to the first positioning plate 23, the arrow marks on the base 21 and the first positioning plate 23 face the same direction (e.g., both facing upwards), and the two arrows point in the same direction. This avoids connection errors between the base 21 and the first positioning plate 23 (e.g., the base 21 and the first positioning plate 23 are installed backwards), ensures that the first positioning hole 31 corresponds to the pad 18 on the device to be implanted 22, and guarantees the accuracy of soldering between the pin 19 and the pad 18.

[0104] Continue to refer to Figure 5 In the above embodiment, the base 21 has a fixing surface 212, which is arranged parallel to the first positioning plate 23. The fixing surface 212 is used for detachable connection with the needle device 22 to be implanted.

[0105] The fixed surface 212 is the surface of the base 21 near the first positioning plate 23. The fixed surface 212 is parallel to the first positioning plate 23 and is detachably connected to the device to be implanted 22. Thus, the first positioning plate 23 can be parallel to the device to be implanted 22, which can ensure that when the pin 19 passes through the first positioning plate 23 and contacts the device to be implanted 22, the pin 19 is perpendicular to the pad 18 on the device to be implanted 22. This can reduce the error between the base 21 and the first positioning plate 23 and improve the accuracy of the position of the pin 19.

[0106] The device to be implanted 22 is fixed on the fixed surface 212, which facilitates the subsequent welding of the device to be implanted 22 to the pin 19. The detachable connection between the device to be implanted 22 and the fixed surface 212 allows for the reuse of the pin fixture 20. After the pin 19 is welded to the device to be implanted 22, the device to be implanted 22 can be removed from the base 21 for encapsulation to form the power module 11. Figure 2 (As shown).

[0107] In the above embodiment, at least one third positioning hole 33 is provided on the fixed surface 212, and the needle insertion fixture 20 also includes at least one positioning post 35. One end of the positioning post 35 is inserted into the third positioning hole 33, and the other end of the positioning post 35 is used to be inserted into the fourth positioning hole 34 of the needle-to-be-implanted device 22.

[0108] Understandably, the third positioning hole 33 and the fourth positioning hole 34 are used to connect the fixing surface 212 and the device 22 to be implanted. The two ends of the positioning post 35 are connected to the third positioning hole 33 and the fourth positioning hole 34 respectively, and the positions of each third positioning hole 33 correspond to the positions of each fourth positioning hole 34. One end of the positioning post 35 is connected to the third positioning hole 33, and the other end of the positioning post 35 is connected to the fourth positioning hole 34. The positioning post 35 can realize the connection between the device 22 to be implanted and the base 21, so that the position of the device 22 to be implanted on the base 21 is fixed, thereby making the positional error between the first positioning hole 31 and the pad 18 smaller when the first positioning plate 23 and the base 21 are connected later.

[0109] In the above embodiments, there are multiple third positioning holes 33, and at least two of the multiple third positioning holes 33 are unequal in distance from the center of the fixing surface 212. Here, the center refers to the geometric center of the fixing surface 212. For example, in an embodiment where the fixing surface 212 is rectangular, the center is the intersection of the diagonals of the fixing surface 212.

[0110] Understandably, the distances from at least two of the third positioning holes 33 to the center of the fixing surface 212 are unequal, and the fourth positioning hole 34 corresponds to the third positioning hole 33. That is, the distances from at least two of the fourth positioning holes 34 to the center of the first positioning plate 23 are unequal. When the first positioning plate 23 is connected to the fixing surface 212, the connection can be made according to the positions of the third positioning hole 33 and the fourth positioning hole 34, thereby avoiding the reverse mounting of the needle-to-be-implanted device 22 and the fixing surface 212.

[0111] This application does not limit the position of the at least two third positioning holes 33. For example, in some embodiments, the at least two third positioning holes 33 may not be symmetrical about the center of the fixing surface 212. For example, one third positioning hole 33 is located at the lower left corner of the fixing surface 212, and the other third positioning hole 33 is located at the upper right corner of the fixing surface 212. The distances of these two third positioning holes 33 from the center of the fixing surface 212 are not equal.

[0112] In some embodiments, at least two third positioning holes 33 may not be symmetrical about the center line of the fixing surface 212. The center line may include a first center line x and a second center line y. The first center line x is parallel to the width direction of the fixing surface 212 and perpendicular to the length direction of the fixing surface 212. The second center line y is parallel to the length direction of the fixing surface 212 and perpendicular to the width direction of the fixing surface 212.

[0113] For example, one third positioning hole 33 is located to the left of the first center line, and another third positioning hole 33 is located to the right of the first center line. The distances of the two third positioning holes 33 from the center line are not equal, and thus the distances of the two third positioning holes 33 from the center of the fixed surface 212 are not equal.

[0114] At least two of the multiple third positioning holes 33 are at different distances from the center of the fixed surface 212. The connection direction between the device to be implanted 22 and the base 21 can be determined based on the position of the third positioning hole 33, so as to avoid the device to be implanted 22 and the base 21 being installed in reverse, which would cause an error between the pad 18 and the first positioning hole 31 and affect the connection between the pin 19 and the pad 18.

[0115] At least two of the multiple third positioning holes 33 are unequally distanced from the center of the fixed surface 212, which ensures the accuracy of soldering between the pin 19 and the pad 18 and improves the power module 11 ( Figure 2 The stability of the mass (as shown).

[0116] In some embodiments, there are multiple third positioning holes 33, and at least two of the third positioning holes 33 have different diameters. It is understood that each third positioning hole 33 corresponds one-to-one with a fourth positioning hole 34, and at least two of the fourth positioning holes 34 have different diameters. The positioning post 35 is connected to the third positioning holes 33 and the fourth positioning holes 34. Since at least two of the third positioning holes 33 have different diameters, the positioning post 35 can be connected to the corresponding fourth positioning hole 34 according to the diameter of the third positioning hole 33, thereby achieving the connection between the needle-to-be-implanted device 22 and the base 21.

[0117] The shape of the third positioning hole 33 is not limited in this application embodiment. For example, the shape of the third positioning hole 33 can be circular, square, or irregular.

[0118] The fact that at least two of the multiple third positioning holes 33 have different diameters can further enhance the special characteristics of the third positioning holes 33, thereby ensuring the accuracy of the connection between the needle device 22 to be implanted and the base 21, and avoiding the needle device 22 to be implanted and the base 21 being installed backwards.

[0119] In some embodiments, there are multiple third positioning holes 33, and at least two of the multiple third positioning holes 33 have different shapes. The different shapes of the third positioning holes 33 can further enhance the specialization of the third positioning holes 33, avoid the base 21 and the device to be implanted 22 being installed backwards, thereby improving the accuracy of the connection between the device to be implanted 22 and the base 21, and further improving the accuracy of the position between the pin 19 and the pad 18.

[0120] In the above embodiments, a pressure plate 36 is provided on the fixed surface 212. The pressure plate 36 is used to clamp the edge of the device to be implanted between the pressure plate 36 and the fixed surface 212. This application embodiment does not limit the connection method between the pressure plate 36 and the fixed surface 212. For example, the pressure plate 36 can be welded to the fixed surface 212, or the pressure plate 36 and the fixed surface 212 can be integrally formed; the pressure plate 36 can also be detachably connected to the fixed surface 212.

[0121] The pressure plate 36 typically includes a top plate 361 and a side plate 362. The top plate 361 contacts the side of the device 22 to be implanted that is away from the fixing surface 212, and the side plate contacts the side wall of the device 22 to be implanted. This embodiment does not limit the length of the top plate. For example, the longer the top plate 361, the larger the contact area between the pressure plate 36 and the device 22 to be implanted, and the better the fixing effect of the pressure plate 36 on the device 22 to be implanted. However, if the top plate is too long, the area covered by the top plate on the device 22 to be implanted will increase, which may easily affect the welding of the device 22 to be implanted and the pin 19.

[0122] The distance between the pressure plate 36 and the fixed surface 212 (i.e., the height of the side plate) is almost equal to the thickness of the device to be implanted 22, so that the pressure plate 36 can clamp the edge of the device to be implanted 22 between the pressure plate 36 and the fixed surface 212. The pressure plate 36 can press the device to be implanted 22 tightly, preventing the device to be implanted 22 from being misaligned or shaking during the flipping process, thereby reducing the error generated during the assembly of the pin insertion fixture 20 and improving the quality of the power module 11.

[0123] The number of pressure plates 36 is not limited in this application embodiment. For example, there may be one pressure plate 36 or multiple pressure plates 36. In embodiments with multiple pressure plates 36, multiple pressure plates 36 may be symmetrically arranged on the fixing surface 212. For example, in embodiments with two pressure plates 36, the two pressure plates 36 may be symmetrically arranged along the center line of the fixing surface 212. In embodiments with four pressure plates 36 and the fixing surface 212 is rectangular, the pressure plates 36 may be arranged close to the four edges of the fixing surface 212.

[0124] The pressure plates 36 are symmetrically arranged on the fixed surface 212, which can make the force borne by each pressure plate 36 evenly distributed, avoid concentrated force on one side of the pressure plate 36, and reduce the risk of one side of the pressure plate 36 falling off.

[0125] Continue to refer to Figure 5In some embodiments, the pressure plate 36 is detachably connected to the base 21. It is understood that after the device to be implanted 22 is fixed to the base 21 by the positioning post 35, the top plate 361 of the pressure plate 36 can contact the surface of the device to be implanted 22, thus fixing the pressure plate 36 to the base 21. The detachable connection between the pressure plate 36 and the base 21 reduces the difficulty of connecting the positioning post 35 to the third positioning hole 33 and the fourth positioning hole 34. Simultaneously, the pressure plate 36 can better adapt to the thickness of the device to be implanted 22.

[0126] This application embodiment does not limit the connection method between the pressure plate 36 and the base 21. For example, the pressure plate 36 and the base 21 can be connected by bolts, or the pressure plate 36 and the base 21 can be connected by magnets.

[0127] Please refer to Figure 11 In the embodiment where the pressure plate 36 and the base 21 are connected by bolts, the pressure plate 36 is provided with at least one third through hole 43, and the base 21 is provided with at least one first threaded hole 44. The bolt is inserted into the third through hole 43 and tightened with the first threaded hole 44, so that the pressure plate 36 and the base 21 are connected.

[0128] Please refer to Figure 12 In the embodiment where the pressure plate 36 and the base 21 are connected by a magnet, the pressure plate 36 is provided with at least one third through hole 43, and the base 21 is provided with at least one corresponding groove 45. The first magnet 46 is placed in the third through hole 43, and the second magnet 47 is placed in the groove 45. Since opposite poles of the magnets attract each other, for example, the side of the first magnet 46 closest to the base 21 is the S pole (N pole), and the side of the second magnet closest to the pressure plate 36 is the N pole (S pole). When the N pole and the S pole meet, they attract each other, thus connecting the pressure plate 36 and the base 21.

[0129] Two adjacent first magnets 46 can have opposite magnetic poles. For example, the side of one first magnet 46 closest to the base 21 is the S pole, and the side of the adjacent first magnet 46 closest to the base 21 is the N pole. The alternating polarity arrangement can avoid misalignment and improve the stability of the connection between the pressure plate 36 and the base 21.

[0130] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A pin insertion fixture, characterized in that, include: A base, used to fix the device to be implanted with needles; A first positioning plate is disposed facing the base, and at least one first positioning hole is provided on the first positioning plate, the first positioning hole being configured to align with the pads on the device to be implanted. The second positioning plate is disposed on the side of the first positioning plate away from the base. The second positioning plate is parallel to the first positioning plate. The second positioning plate is provided with at least one second positioning hole. The first positioning hole and the second positioning hole are used to accommodate the same pin.

2. The pin insertion fixture according to claim 1, characterized in that, The first positioning plate and the second positioning plate are spaced apart, and the cross-sectional area of ​​the second positioning hole is smaller than that of the first positioning hole.

3. The pin insertion fixture according to claim 1 or 2, characterized in that, The first positioning plate is detachably connected to the base.

4. The pin insertion fixture according to claim 3, characterized in that, The pin insertion fixture further includes a fixing post, one end of which is detachably connected to the base, and / or the other end of which is detachably connected to the first positioning plate; The fixed column is provided with a positioning boss, which is used to limit the distance between the first positioning plate and the base.

5. The pin insertion fixture according to claim 1 or 2, characterized in that, The base has a fixed surface, which is arranged parallel to the first positioning plate, and the fixed surface is used for detachable connection with the device to be implanted.

6. The pin insertion fixture according to claim 5, characterized in that, At least one third positioning hole is provided on the fixed surface, and the needle insertion fixture also includes at least one positioning post. One end of the positioning post is inserted into the third positioning hole, and the other end of the positioning post is used to be inserted into the fourth positioning hole of the device to be implanted.

7. The pin insertion fixture according to claim 6, characterized in that, There are multiple third positioning holes, and at least two of the multiple third positioning holes are unequal in distance from the center of the fixed surface.

8. The pin insertion fixture according to claim 6, characterized in that, There are multiple third positioning holes, and at least two of the multiple third positioning holes have different diameters.

9. The pin insertion fixture according to claim 5, characterized in that, A pressure plate is provided on the fixed surface, and the pressure plate is used to clamp the edge of the device to be implanted between the pressure plate and the fixed surface.

10. The pin insertion fixture according to claim 1 or 2, characterized in that, The thickness of the first positioning plate is 3-8mm.

11. The pin insertion fixture according to claim 1 or 2, characterized in that, There are multiple first positioning plates, which are spaced apart. The thickness of the first positioning plate is 0.5-2mm, and the distance between two adjacent first positioning plates is 2-3mm.

12. The pin insertion fixture according to claim 11, characterized in that, The needle insertion fixture also includes a limiting pad, which is disposed between two adjacent first positioning plates.

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