A mainboard support and electronic device

Abstract

This application provides a motherboard bracket and an electronic device. The motherboard bracket includes: an earpiece module, which includes an earpiece module body and an earpiece module connecting portion. A first end of the earpiece module connecting portion is connected to the earpiece module body, and a second end of the earpiece module connecting portion is used for electrical connection to the motherboard; and a bracket body, which includes a first surface facing the display panel, a second surface facing the motherboard, and a reinforcing layer. The first surface has a bracket groove for accommodating the earpiece module body. This application relates to the field of electronic device technology. The reinforcing layer improves the structural strength of the motherboard bracket, ensuring that the structural strength of the motherboard bracket remains within a normal range even with the bracket groove in the bracket body. The earpiece module body is disposed within the bracket groove, forming a motherboard bracket with an earpiece, which greatly reduces the space occupied by the earpiece module, improves integration, and simultaneously achieves a thinner and lighter motherboard bracket.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and more particularly to a motherboard bracket and an electronic device. Background Technology

[0002] In recent years, with the rapid development and popularization of electronic devices such as smart mobile terminals, smart mobile terminals have been evolving towards thinner and more integrated designs.

[0003] In order to achieve a thinner form factor for smart mobile terminals, the front-facing camera and earpiece in related technologies need to be arranged in the first and second areas of the motherboard facing the display panel, respectively.

[0004] However, while the design of the related technologies meets the need for thinner smart mobile terminals, it takes up a lot of motherboard layout area, reducing the number of functional modules or components that can be placed inside the smart mobile terminal, which is not conducive to improving the integration of smart mobile terminals. Utility Model Content

[0005] To address the aforementioned technical issues, this application provides a motherboard bracket and an electronic device that can meet the requirements for both thinness and high integration of electronic devices.

[0006] In a first aspect, embodiments of this application provide a motherboard bracket, including: an earpiece module, the earpiece module including an earpiece module body and an earpiece module connection part, a first end of the earpiece module connection part being connected to the earpiece module body, and a second end of the earpiece module connection part being electrically connected to the motherboard; a bracket body, the bracket body including a first surface facing the display panel, a second surface facing the motherboard, and a reinforcing layer, the first surface having a bracket groove for accommodating the earpiece module body.

[0007] The reinforcing layer enhances the structural strength of the motherboard bracket, ensuring that its strength remains within a normal range even with a bracket groove in the bracket body. In this embodiment, the earpiece module is positioned within the bracket groove, forming a motherboard bracket with an earpiece. This arrangement significantly reduces the space occupied by the earpiece module and improves integration. It also provides a basis for stacking the front-facing camera module above the earpiece in electronic devices. This achieves both high integration and a thinner, lighter design.

[0008] In some possible implementations, the support body also includes a plastic layer, and the reinforcing layer includes steel sheets used to reinforce the support body. The plastic material is lightweight, while the steel sheets have high mechanical strength; the combination of the two allows for a thin and lightweight support body while maintaining good mechanical strength.

[0009] In some possible implementations, the steel sheet is located between the first and second surfaces, or at least partially exposed on the second surface. The steel sheet is not exposed on the first surface, thus eliminating the iron-plastic bonding interface on the first surface. This arrangement blocks the path of external water intrusion, significantly improving the waterproof performance of the support body.

[0010] In some possible implementations, the bracket recess includes sides and a bottom surface. The motherboard bracket also includes an earpiece retainer and a sealing ring. The sealing ring is located at the edge of the bottom surface, between the earpiece module body and the bottom surface. The earpiece retainer connects the earpiece module body and the bracket body, allowing the sealing ring to have an interference fit between the earpiece module body and the bottom surface. The interference fit sealing ring provides waterproofing, further enhancing the waterproof performance of the motherboard bracket.

[0011] In some possible implementations, the earpiece fixing part includes screw holes located on the earpiece module body and the bracket body, or includes snap-fit ​​connections on the earpiece module body and the bracket body. This connection method is simple and effective, improving the manufacturing efficiency of the motherboard bracket while ensuring high reliability of the connection between the earpiece module body and the bracket body.

[0012] In some possible implementations, the sealing ring is made of a rubbery material. Rubbery materials offer high water resistance, ensuring waterproofing between motherboards.

[0013] In some possible implementations, a reinforcing part is also included. The earpiece module body includes a magnet disposed inside the earpiece module body, with a portion of the magnet's surface exposed on the side edge of the earpiece module body. The reinforcing part is at least disposed within the gap between the earpiece module body and the bracket groove, and the surface of the reinforcing part contacts the surface of the magnet. With the reinforcement, the earpiece module body, including the magnet, can be firmly bonded to the bracket body, preventing the magnet from dislodging upon impact.

[0014] In some possible implementations, the reinforcing part includes adhesive, and the earpiece module body also includes a pressure relief hole located on the side edge of the earpiece module body. The side of the bracket groove includes a retaining wall to press down the pressure relief hole; the side also includes an adhesive overflow surface, the height of which is the same as the highest point of the exposed surface of the magnet. This embodiment combines the earpiece module body and the bracket body using an adhesive dispensing process. When the retaining wall presses down on the pressure relief hole, it prevents adhesive from flowing into the pressure relief hole. Due to the presence of the adhesive overflow surface, it is easy to determine whether the adhesive height exceeds the highest point of the exposed surface of the magnet, thereby determining whether the magnet and the bracket body are firmly bonded.

[0015] In some possible implementations, the reinforcement includes adhesive located within the gap between the earpiece module body and the bracket recess, and the earpiece module body exposed on a back plate outside the bracket recess. The earpiece module body also includes a pressure relief hole located at its side edge, and the side of the bracket recess includes a retaining wall to press down the pressure relief hole. This embodiment combines the earpiece module body and the bracket body using an adhesive backing process, improving waterproofing.

[0016] In some possible implementations, the reinforcement includes a filler gasket that interference-fills the gap between the earpiece module body and the bracket recess. Unlike adhesive, the filler gasket does not require curing, thus improving assembly efficiency.

[0017] In some possible implementations, the bracket body also includes a window, through which the second end of the earpiece module connector extends to the motherboard side and then folds back. This arrangement prevents the second end of the earpiece module connector from touching the adhesive backing area, thus avoiding scratches on the adhesive.

[0018] Secondly, embodiments of this application also provide an electronic device, including any of the aforementioned motherboard brackets, and further including a front-facing camera module. The front-facing camera module and the earpiece module body of the motherboard bracket at least partially overlap in the thickness direction of the electronic device. Therefore, the electronic device has a high degree of integration, achieving both high integration and a thinner design. Attached Figure Description

[0019] Figure 1 A schematic diagram of the front structure of a mobile phone provided in an embodiment of this application;

[0020] Figure 2 A schematic diagram of the back structure of a mobile phone provided in an embodiment of this application;

[0021] Figure 3 This is a schematic diagram of the front structure of a motherboard bracket provided in Embodiment 1 of this application;

[0022] Figure 4 This is a schematic diagram of the back structure of a motherboard bracket provided in Embodiment 1 of this application;

[0023] Figure 5 for Figure 3 A cross-sectional view of the section formed along the Z-axis at point AA';

[0024] Figure 6 for Figure 5 Enlarged view of area B;

[0025] Figure 7 for Figure 3 Enlarged view of region C;

[0026] Figure 8This is a schematic diagram of the front structure of a motherboard bracket provided in Embodiment 2 of this application;

[0027] Figure 9 This is a schematic diagram of the back structure of a motherboard bracket provided in Embodiment 2 of this application;

[0028] Figure 10 for Figure 8 A cross-sectional view of the section formed along the Z-axis at point AA';

[0029] Figure 11 for Figure 10 Enlarged view of area B;

[0030] Figure 12 for Figure 8 Enlarged view of region C;

[0031] Figure 13 This is a schematic diagram of the front structure of a motherboard bracket provided in Embodiment 3 of this application;

[0032] Figure 14 This is a schematic diagram of the back structure of a motherboard bracket provided in Embodiment 3 of this application;

[0033] Figure 15 for Figure 13 A cross-sectional view of the section formed along the Z-axis at point AA';

[0034] Figure 16 for Figure 15 Enlarged view of area B;

[0035] Figure 17 for Figure 13 Enlarged view of region C. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0038] The terms "up," "down," "left," and "right," used in this document to indicate direction, are intended only to clearly explain the embodiments and describe one possible arrangement or layout of the components. They are not intended to limit the relationship between components or the orientation of the components.

[0039] The terms "first" and "second," etc., used in the specification and claims of this application are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0040] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0041] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0042] This application provides an electronic device, which may be a mobile phone, tablet computer, personal digital assistant (PDA), in-vehicle computer, smart wearable device, smart home device, etc. This application does not impose any special limitation on the specific form of the above-mentioned electronic device. Figure 1 This is a schematic diagram of the front structure of a mobile phone provided in an embodiment of this application. Figure 2 This is a schematic diagram of the back structure of a mobile phone provided in an embodiment of this application. See also... Figure 1 and Figure 2 For ease of explanation, the following description uses a mobile phone as an example. To clearly describe the various structural features and their positional relationships, the X, Y, and Z axes are used to define the positional relationships of the structures within the phone. The X-axis represents the width of the phone, the Y-axis represents its length, and the Z-axis represents its thickness.

[0043] like Figure 1 and Figure 2As shown, the mobile phone 100 includes a mid-frame 10, a back cover 20, and a display panel 30. The back cover 20 and the display panel 30 are positioned opposite each other, with the mid-frame 10 located between them. The mid-frame 10, back cover 20, and display panel 30 can form a receiving cavity. The receiving cavity houses a front-facing camera, a motherboard, a motherboard bracket, a battery, and a battery cover (not shown) that secures the battery. The motherboard bracket is connected to the motherboard, stabilizing its position and protecting the components on it. The motherboard houses a processor and a memory. The memory stores computer program code, which includes computer instructions. The processor invokes these instructions to cause the mobile phone 100 to perform corresponding operations.

[0044] The material of the back cover 20 may include, for example, opaque materials such as plastic, vegan leather, and fiberglass; or it may include translucent materials such as glass. This application does not limit the material of the back cover 20.

[0045] The display panel 30 includes, for example, a liquid crystal display (LCD) panel, an organic light-emitting diode (OLED) display panel, and an LED display panel, wherein the LED display panel includes, for example, a micro-LED display panel and a mini-LED display panel. This application embodiment does not limit the type of the display panel 30.

[0046] The specific structure of the motherboard bracket is explained below.

[0047] Example 1

[0048] Figure 3 This is a schematic diagram of the front structure of a motherboard bracket provided in Embodiment 1 of this application. Figure 4 This is a schematic diagram of the back structure of a motherboard bracket provided in Embodiment 1 of this application. Figure 5 for Figure 3 See the cross-sectional view of the section formed along the Z-axis at point AA'. Figures 3-5The motherboard bracket 40 includes a bracket body 41 and an earpiece module 42. The earpiece module 42 includes an earpiece module body 421 and an earpiece module connecting part 422. The bracket body 41 includes a first surface 411 facing the display panel 30 and a second surface 412 facing the motherboard. The first surface 411 of the bracket body 41 has a bracket groove 413 for accommodating the earpiece module body 421. The material of the bracket body 41 can include materials such as plastic or plastic, as well as metal materials such as steel. It can be obtained by forming a flat steel sheet into a steel sheet 414 of the desired shape, and then forming a plastic layer 415 on the outside of the steel sheet 414 through injection molding or other processes. Since the steel sheet 414 has sufficient strength, the thickness of the plastic layer 415 does not need to be very thick. This can reduce the thickness of the bracket body 41 while ensuring that the bracket body 41 has sufficient structural strength. The bracket body 41 can provide sufficient internal space, which is beneficial for the thinning of electronic devices, or it can also allow electronic devices to accommodate more functional modules.

[0049] See also Figure 5 The bracket body 41 can be configured such that its first surface 411 consists only of a plastic layer 415, with the steel sheet 414 located inside the bracket body 41 or exposed on the second surface 412 opposite to the first surface 411, i.e., the steel sheet 414 is exposed on the surface of the bracket body 41 facing the motherboard. The advantage of this configuration is that it ensures the first surface 411 of the bracket body 41 does not have a metal-plastic interface, thus preventing gaps between the metal and plastic. This prevents the first surface 411 of the bracket body 41 from failing to waterproof in the event of accidental water ingress into the electronic device. This design allows the bracket body 41 to meet the IP68 waterproof and dustproof standard, making it suitable for use in waterproof electronic devices.

[0050] See also Figure 3 and Figure 5The bracket groove 413 includes a side surface 4131 and a bottom surface 4132. The side surface 4131 includes a first side surface, a second side surface, a third side surface, and a fourth side surface. The first side surface and the third side surface are arranged opposite each other, and the second side surface and the fourth side surface are arranged opposite each other. The motherboard bracket 40 also includes an earpiece fixing part (not shown in the figure) and a sealing ring 43. The earpiece fixing part can be a screw hole located between the earpiece module body 421 and the bracket body 41, or a snap-fit ​​structure located between the earpiece module body 421 and the bracket body 41. The sealing ring 43 can be made of rubber or plastic or other adhesive materials, or it can be made of any other material and is a sealing component. A sealing ring 43 is disposed around the perimeter of the bottom surface 4132. The earpiece module body 421 is connected to the bracket body 41 via a screw or snap-fit ​​connection through the earpiece fixing part, thereby creating Z-axis pressure between the earpiece module body 421 and the bracket body 41, pressing the earpiece module body 421 onto the sealing ring 43, resulting in an interference fit between the sealing ring 43 and the bottom surface 4132. The sealing ring 43 provides a sealing and waterproofing effect, further improving the waterproof reliability of the motherboard bracket 40.

[0051] Figure 6 for Figure 5 Enlarged view of region B, Figure 7 for Figure 3 See the enlarged view of region C. Figure 6 and Figure 7The earpiece module body 421 includes a magnet 4211 and a pressure relief hole 4212. The magnet 4211 is disposed inside the earpiece module body 421, with a portion of its surface exposed on the side edge of the earpiece module body 421. The pressure relief hole 4212 is also disposed on the side edge of the earpiece module body 421. The side surface 4131 of the bracket groove 413 includes a retaining wall 41311 and an adhesive overflow surface 41312. The retaining wall 41311 is disposed on the first side surface at a position corresponding to the pressure relief hole 4212. When the earpiece module body 421 is assembled in the bracket groove 413, the retaining wall 41311 can press down the pressure relief hole 4212. The height of the adhesive overflow surface 41312 can be set to be the same as the height of the upper surface of the magnet 4211. To ensure a tight fit between the earpiece module body 421 and the bracket groove 413 of the bracket body 41, adhesive 44 can be applied using a dispensing process to fill the space between the earpiece module body 421 and the side 4131 of the bracket groove 413, until the adhesive 44 overflows the overflow surface 41312. At this point, the adhesive 44 fully covers the exposed surface of the magnet 4211, further securing the connection between the earpiece module body 421 and the bracket body 41, and preventing the magnet 4211 inside the earpiece module body 421 from falling off. This arrangement also provides X-axis and Y-axis limits for the earpiece module body 421 and increases the rigidity of the motherboard bracket 40. Furthermore, the baffle 41311 prevents adhesive 44 from flowing into the pressure relief hole 4212 during the dispensing process.

[0052] See also Figure 3 and Figure 4 The earpiece module connection part 422 can be any component capable of establishing an electrical connection between the earpiece module body 421 and the motherboard. This application does not limit the specific form of the earpiece module connection part 422, as long as it satisfies the above-mentioned functions. For example, the earpiece module connection part 422 can be a flexible printed circuit (FPC). The bracket body 41 also includes a window 416. The first end of the earpiece module connection part 422 is connected to the earpiece module body 421, extends through the window 416 to the motherboard side, and is folded back so that the second end of the earpiece module connection part 422 is precisely located on the spring contact of the motherboard, pressing the second end of the earpiece module connection part 422 onto the spring contact of the motherboard to form an electrical connection. Because of this arrangement, the second end of the earpiece module connection part 422 cannot contact the adhesive area projected from the earpiece module body 421 along the Z-axis direction onto the bracket body 41. Therefore, the adhesive area will not be scratched by the second end of the earpiece module connection part 422, thus protecting the adhesive. In addition, this embodiment saves the bending space required for the earpiece module connection part 422, and makes the spring piece position as close as possible to the edge of the motherboard, thereby improving the layout utilization of the motherboard.

[0053] Example 2

[0054] Figure 8 This is a schematic diagram of the front structure of a motherboard bracket provided in Embodiment 2 of this application. Figure 9 This is a schematic diagram of the back structure of a motherboard bracket provided in Embodiment 2 of this application. Figure 10 for Figure 8 See the cross-sectional view of the section formed along the Z-axis at point AA'. Figures 8-10 The motherboard bracket 40 includes a bracket body 41 and an earpiece module 42. The earpiece module 42 includes an earpiece module body 421 and an earpiece module connecting part 422. The bracket body 41 includes a first surface 411 facing the display panel 30 and a second surface 412 facing the motherboard. The first surface 411 of the bracket body 41 has a bracket groove 413 for accommodating the earpiece module body 421. The material of the bracket body 41 can include materials such as plastic or plastic, as well as metal materials such as steel. It can be obtained by forming a flat steel sheet into a steel sheet 414 of the desired shape, and then forming a plastic layer 415 on the outside of the steel sheet 414 through injection molding or other processes. Since the steel sheet 414 has sufficient strength, the thickness of the plastic layer 415 does not need to be very thick. This can reduce the thickness of the bracket body 41 while ensuring that the bracket body 41 has sufficient structural strength. The bracket body 41 can provide sufficient internal space, which is beneficial for the thinning of electronic devices, or it can also allow electronic devices to accommodate more functional modules.

[0055] See also Figure 10 The bracket body 41 can be configured such that its first surface 411 consists only of a plastic layer 415, with the steel sheet 414 located inside the bracket body 41 or exposed on the second surface 412 opposite to the first surface 411, i.e., the steel sheet 414 is exposed on the surface of the bracket body 41 facing the motherboard. The advantage of this configuration is that it ensures the first surface 411 of the bracket body 41 does not have a metal-plastic interface, thus preventing gaps between the metal and plastic. This prevents the first surface 411 of the bracket body 41 from failing to waterproof in the event of accidental water ingress into the electronic device. This design allows the bracket body 41 to meet the IP68 waterproof and dustproof standard, making it suitable for use in waterproof electronic devices.

[0056] See also Figure 8 and Figure 10The bracket groove 413 includes a side surface 4131 and a bottom surface 4132. The side surface 4131 includes a first side surface, a second side surface, a third side surface, and a fourth side surface. The first side surface and the third side surface are arranged opposite each other, and the second side surface and the fourth side surface are arranged opposite each other. The motherboard bracket 40 also includes an earpiece fixing part (not shown in the figure) and a sealing ring 43. The earpiece fixing part can be a screw hole located between the earpiece module body 421 and the bracket body 41, or a snap-fit ​​structure located between the earpiece module body 421 and the bracket body 41. The sealing ring 43 can be made of rubber or plastic or other adhesive materials, or it can be made of any other material and is a sealing component. A sealing ring 43 is disposed around the bottom surface 4132. The earpiece module body 421 is connected to the bracket body 41 by a screw or snap-fit ​​connection through the earpiece fixing part, thereby creating pressure in the Z-axis direction between the earpiece module body 421 and the bracket body 41, pressing the earpiece module body 421 onto the sealing ring 43, resulting in an interference fit between the sealing ring 43 and the bottom surface 4132. The sealing ring 43 provides a sealing and waterproofing effect, further improving the waterproof reliability of the motherboard bracket 40.

[0057] Figure 11 for Figure 10 Enlarged view of region B, Figure 12 for Figure 8 See the enlarged view of region C. Figure 11 and Figure 12 The earpiece module body 421 includes a magnet 4211 and a pressure relief hole 4212. The magnet 4211 is disposed inside the earpiece module body 421, with a portion of its surface exposed on the side edge of the earpiece module body 421. The pressure relief hole 4212 is also disposed on the side edge of the earpiece module body 421. The side 4131 of the bracket groove 413 includes a retaining wall 41311, which is disposed on the first side corresponding to the pressure relief hole 4212. When the earpiece module body 421 is assembled in the bracket groove 413, the retaining wall 41311 can press down the pressure relief hole 4212. To achieve a tight fit between the earpiece module body 421 and the bracket groove 413 of the bracket body 41, adhesive 44 can be used to fill the space between the earpiece module body 421 and the side 4131 of the bracket groove 413, as well as the exposed surface of the earpiece module body 421. At this point, the adhesive 44 fully covers the exposed surface of the magnet 4211, which further stabilizes the connection between the earpiece module body 421 and the bracket body 41, prevents the magnet 4211 inside the earpiece module body 421 from falling off, and also improves the waterproof effect. This arrangement also provides X-axis and Y-axis limits for the earpiece module body 421 and increases the rigidity of the motherboard bracket 40. In addition, due to the function of the baffle 41311, the adhesive 44 can be prevented from flowing into the pressure relief hole 4212 during the dispensing process.

[0058] See also Figure 8 and Figure 9 The earpiece module connection part 422 can be any component capable of establishing an electrical connection between the earpiece module body 421 and the motherboard. This application does not limit the specific form of the earpiece module connection part 422, as long as it satisfies the above-mentioned functions. For example, the earpiece module connection part 422 can be a flexible printed circuit (FPC). The bracket body 41 also includes a window 416. The first end of the earpiece module connection part 422 is connected to the earpiece module body 421, extends through the window 416 to the motherboard side, and is folded back so that the second end of the earpiece module connection part 422 is precisely located on the spring contact of the motherboard, pressing the second end of the earpiece module connection part 422 onto the spring contact of the motherboard to form an electrical connection. Because of this arrangement, the second end of the earpiece module connection part 422 cannot contact the adhesive area projected from the earpiece module body 421 along the Z-axis direction onto the bracket body 41. Therefore, the adhesive area will not be scratched by the second end of the earpiece module connection part 422, thus protecting the adhesive. In addition, this embodiment saves the bending space required for the earpiece module connection part 422, and makes the spring piece position as close as possible to the edge of the motherboard, thereby improving the layout utilization of the motherboard.

[0059] Example 3

[0060] Figure 13 This is a schematic diagram of the front structure of a motherboard bracket provided in Embodiment 3 of this application. Figure 14 This is a schematic diagram of the back structure of a motherboard bracket provided in Embodiment 3 of this application. Figure 15 for Figure 13 See the cross-sectional view of the section formed along the Z-axis at point AA'. Figures 13-15The motherboard bracket 40 includes a bracket body 41 and an earpiece module 42. The earpiece module 42 includes an earpiece module body 421 and an earpiece module connecting part 422. The bracket body 41 includes a first surface 411 facing the display panel 30 and a second surface 412 facing the motherboard. The first surface 411 of the bracket body 41 has a bracket groove 413 for accommodating the earpiece module body 421. The material of the bracket body 41 can include materials such as plastic or plastic, as well as metal materials such as steel. It can be obtained by forming a flat steel sheet into a steel sheet 414 of the desired shape, and then forming a plastic layer 415 on the outside of the steel sheet 414 through injection molding or other processes. Since the steel sheet 414 has sufficient strength, the thickness of the plastic layer 415 does not need to be very thick. This can reduce the thickness of the bracket body 41 while ensuring that the bracket body 41 has sufficient structural strength. The bracket body 41 can provide sufficient internal space, which is beneficial for the thinning of electronic devices, or it can also allow electronic devices to accommodate more functional modules.

[0061] See also Figure 15 The bracket body 41 can be configured such that its first surface 411 consists only of a plastic layer 415, with the steel sheet 414 located inside the bracket body 41 or exposed on the second surface 412 opposite to the first surface 411, i.e., the steel sheet 414 is exposed on the surface of the bracket body 41 facing the motherboard. The advantage of this configuration is that it ensures the first surface 411 of the bracket body 41 does not have a metal-plastic interface, thus preventing gaps between the metal and plastic. This prevents the first surface 411 of the bracket body 41 from failing to waterproof in the event of accidental water ingress into the electronic device. This design allows the bracket body 41 to meet the IP68 waterproof and dustproof standard, making it suitable for use in waterproof electronic devices.

[0062] See also Figure 13 and Figure 15The bracket groove 413 includes a side surface 4131 and a bottom surface 4132. The side surface 4131 includes a first side surface, a second side surface, a third side surface, and a fourth side surface. The first side surface and the third side surface are arranged opposite each other, and the second side surface and the fourth side surface are arranged opposite each other. The motherboard bracket 40 also includes an earpiece fixing part (not shown in the figure) and a sealing ring 43. The earpiece fixing part can be a screw hole located between the earpiece module body 421 and the bracket body 41, or a snap-fit ​​structure located between the earpiece module body 421 and the bracket body 41. The sealing ring 43 can be made of rubber or plastic or other adhesive materials, or it can be made of any other material and is a sealing component. A sealing ring 43 is disposed around the bottom surface 4132. The earpiece module body 421 is connected to the bracket body 41 by a screw or snap-fit ​​connection through the earpiece fixing part, thereby creating pressure in the Z-axis direction between the earpiece module body 421 and the bracket body 41, pressing the earpiece module body 421 onto the sealing ring 43, resulting in an interference fit between the sealing ring 43 and the bottom surface 4132. The sealing ring 43 provides a sealing and waterproofing effect, further improving the waterproof reliability of the motherboard bracket 40.

[0063] Figure 16 for Figure 15 Enlarged view of region B, Figure 17 for Figure 13 See the enlarged view of region C. Figure 16 and Figure 17 The motherboard bracket 40 also includes a filler ring 45, which, exemplarily, can be a rubber ring. The earpiece module body 421 includes a magnet 4211, which is disposed inside the earpiece module body 421, with a portion of its surface exposed on the side edge of the earpiece module body 421. To ensure that the earpiece module body 421, including the magnet 4211, is tightly fitted within the bracket groove 413 of the bracket body 41, the filler ring 45 can be used to press-fit between the earpiece module body 421 and the side surface 4131 of the bracket groove 413. In this case, the filler ring 45 securely fixes the earpiece module body 421 to the bracket body 41, while preventing the magnet 4211 inside the earpiece module body 421 from falling out, thus improving waterproofing. This arrangement also provides X-axis and Y-axis limits for the earpiece module body 421 and increases the rigidity of the motherboard bracket 40.

[0064] See also Figure 13 and Figure 14The earpiece module connection part 422 can be any component capable of establishing an electrical connection between the earpiece module body 421 and the motherboard. This application does not limit the specific form of the earpiece module connection part 422, as long as it satisfies the above-mentioned functions. For example, the earpiece module connection part 422 can be a flexible printed circuit (FPC). The bracket body 41 also includes a window 416. The first end of the earpiece module connection part 422 is connected to the earpiece module body 421, extends through the window 416 to the motherboard side, and is folded back so that the second end of the earpiece module connection part 422 is precisely located on the spring contact of the motherboard, pressing the second end of the earpiece module connection part 422 onto the spring contact of the motherboard to form an electrical connection. Because of this arrangement, the second end of the earpiece module connection part 422 cannot contact the adhesive area projected from the earpiece module body 421 along the Z-axis direction onto the bracket body 41. Therefore, the adhesive area will not be scratched by the second end of the earpiece module connection part 422, thus protecting the adhesive. In addition, this embodiment saves the bending space required for the earpiece module connection part 422, and makes the spring piece position as close as possible to the edge of the motherboard, thereby improving the layout utilization of the motherboard.

[0065] In the above embodiments, the motherboard bracket and earpiece are integrated into one, forming a thin and light motherboard bracket-earpiece composite, which greatly reduces the space occupied by the earpiece module. Therefore, the front-facing camera module can be at least partially stacked on top of the earpiece. Thus, electronic devices using the motherboard bracket provided in this application can achieve high integration while maintaining a thin and light design. Furthermore, the above embodiments are some optional implementations. In actual implementation, adjustments can be made according to actual needs, such as omitting glue 44 or filler ring 45, replacing the steel sheet with other reinforcing layer materials, or removing waterproof-related technical features in electronic devices that do not require waterproofing.

[0066] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many variations under the guidance of this application without departing from the spirit and scope of the claims. Those skilled in the art will understand that this utility model is not limited to the specific embodiments described herein. Various obvious changes, readjustments, combinations, reasonable reductions and substitutions of features can be made by those skilled in the art without departing from the protection scope of this utility model, and all such changes and substitutions are within the protection scope of this application.

Claims

1. A motherboard bracket, characterized in that, include: The earpiece module includes an earpiece module body and an earpiece module connection part, wherein a first end of the earpiece module connection part is connected to the earpiece module body, and a second end of the earpiece module connection part is used for electrical connection to the motherboard. The bracket body includes a first side facing the display panel, a second side facing the motherboard, and a reinforcing layer. The first side has a bracket groove for accommodating the earpiece module body.

2. The motherboard bracket according to claim 1, characterized in that, The support body also includes a plastic layer, and the reinforcing layer includes steel sheets, which are used to reinforce the support body.

3. The motherboard bracket according to claim 2, characterized in that, The steel sheet is located between the first surface and the second surface, or is at least partially exposed on the second surface.

4. The motherboard bracket according to claim 1, characterized in that, The bracket groove includes a side surface and a bottom surface. The motherboard bracket also includes an earpiece fixing part and a sealing ring. The sealing ring is disposed on the edge of the bottom surface and located between the earpiece module body and the bottom surface. The earpiece fixing part is used to connect the earpiece module body and the bracket body, so that the sealing ring is interference-fitted between the earpiece module body and the bottom surface.

5. The motherboard bracket according to claim 4, characterized in that, The earpiece fixing part includes screw holes located on the earpiece module body and the bracket body, or includes buckles located on the earpiece module body and the bracket body.

6. The motherboard bracket according to claim 4, characterized in that, The sealing ring is made of a rubber material.

7. The motherboard bracket according to claim 1, characterized in that, It also includes a reinforcing part. The earpiece module body includes a magnet, which is disposed inside the earpiece module body. A portion of the surface of the magnet is exposed on the side edge of the earpiece module body. The reinforcing part is at least disposed in the gap between the earpiece module body and the bracket groove. The surface of the reinforcing part contacts the surface of the magnet.

8. The motherboard bracket according to claim 7, characterized in that, The reinforcing part includes adhesive, and the earpiece module body also includes a pressure relief hole located on the side edge of the earpiece module body. The side of the bracket groove includes a retaining wall for pressing down the pressure relief hole. The side includes an overflow adhesive surface, the height of which is the same as the highest point of the exposed surface of the magnet.

9. The motherboard bracket according to claim 7, characterized in that, The reinforcement includes adhesive located in the gap between the earpiece module body and the bracket groove, and the earpiece module body exposed on the back plate outside the bracket groove. The earpiece module body also includes a pressure relief hole located on the side edge of the earpiece module body. The side of the bracket groove includes a retaining wall for pressing down the pressure relief hole.

10. The motherboard bracket according to claim 7, characterized in that, The reinforcing part includes a filling rubber ring, which is press-filled in the gap between the earpiece module body and the bracket groove.

11. The motherboard bracket according to claim 1, characterized in that, The bracket body also includes a window, through which the second end of the earpiece module connection passes to the motherboard and folds back.

12. An electronic device, characterized in that, The motherboard bracket includes any one of claims 1-11, and further includes a front-facing camera module, wherein the front-facing camera module and the earpiece module body of the motherboard bracket at least partially overlap in the thickness direction of the electronic device.

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