A biomimetic cellular integrated micro heat pipe array heat dissipation device for 5G base stations

Abstract

This invention proposes a biomimetic integrated cellular micro heat pipe array heat dissipation device for 5G base stations, comprising a thermally conductive pad, a cellular substrate, and heat pipes; the cellular substrate is disposed on the surface of the thermally conductive adhesive layer, and the heat pipe array is arranged on the cellular substrate. This invention achieves heat dissipation through a combination of the cellular substrate and the heat pipe array, with a heat dissipation density of 500W / m². 2 The temperature drop is greater than 25%, which effectively improves the heat dissipation efficiency compared to existing heat dissipation devices. In addition, the heat dissipation device of this utility model has a compact structure, which solves the problem of structural redundancy in the existing technology and is suitable for the small space of 5G base stations.

Description

Technical Field

[0001] This utility model relates to the field of 5G base station heat dissipation technology, and in particular to a biomimetic cellular integrated micro heat pipe array heat dissipation device for 5G base stations. Background Technology

[0002] 5G base station RF module power density exceeds 50W / cm² 2 Traditional aluminum fin heat dissipation solutions use aluminum fins combined with a fan for heat dissipation, achieving a heat dissipation density of 200W / m². 2 With a thickness greater than 25mm, these heat dissipation structures are large, inefficient, and prone to dust accumulation due to electrostatic adsorption between the fins. Furthermore, their mechanical mechanisms suffer from noise and vibration failures over extended periods, significantly impacting the surrounding environment and failing to meet the heat dissipation requirements of modern 5G base stations. Current trends favor biomimetic structures, such as honeycomb and leaf vein designs, combined with phase change heat transfer technology to achieve high-density heat dissipation. However, existing heat dissipation devices suffer from complex manufacturing processes and high costs. Utility Model Content

[0003] The purpose of this invention is to propose a miniaturized, highly efficient, and economical biomimetic honeycomb integrated micro heat pipe array heat dissipation device.

[0004] To achieve the above objectives, this utility model proposes a biomimetic cellular integrated micro heat pipe array heat dissipation device for 5G base stations, including a thermal pad, a cellular substrate and heat pipes.

[0005] A honeycomb substrate is disposed on the surface of a thermally conductive adhesive layer, and heat pipes are arranged in an array on the honeycomb substrate to form a heat pipe array.

[0006] Furthermore, a thermal pad is attached to the surface of the heating element.

[0007] Furthermore, the cellular substrate includes multiple arrayed hexagonal cellular cells, each with a diameter of 5 mm, a wall thickness of 0.8 mm, and a height of 10 mm.

[0008] Furthermore, the two leads of the heat pipe are diffusely soldered to the intersection of adjacent cells; multiple heat pipes are vertically inserted into the surface of the cell substrate to form a heat pipe array.

[0009] Furthermore, the heat pipes are connected to the sidewalls of the honeycomb substrate; that is, the heat pipes pass through the through-holes in the middle of the sidewall of each honeycomb unit and are arranged in an S-shaped array.

[0010] Furthermore, the heat pipe has a diameter of 2mm.

[0011] Furthermore, thermoelectric modules are welded to the edges of the cellular substrate.

[0012] Compared with the prior art, the advantages of this utility model are:

[0013] 1. This utility model solves the problems of redundant structure and high thermal resistance in the prior art by using a honeycomb wall thickness of 0.8mm and a Φ5mm honeycomb unit with a heat pipe for high-density integration, with a thickness of only 10mm. It is suitable for the narrow space of 5G base stations.

[0014] 2. This invention utilizes a honeycomb substrate combined with a heat pipe array for heat dissipation, achieving a heat dissipation density of 500W / m². 2 The temperature drop is greater than 25%, which effectively improves the heat dissipation efficiency compared to existing heat dissipation devices.

[0015] 3. The honeycomb substrate of this utility model has a simple overall structure, strong durability, and will not generate vibration or noise. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the biomimetic honeycomb integrated micro heat pipe array heat dissipation device in Embodiment 1 of this utility model. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be further explained below.

[0018] Example 1:

[0019] like Figure 1 As shown, this utility model proposes a biomimetic cellular integrated micro heat pipe array heat dissipation device for 5G base stations, which consists of three parts: a thermal pad 2, a cellular substrate 3, and a heat pipe array 4.

[0020] Specifically, the honeycomb substrate 3 is disposed on the surface of the heat-conducting layer. The honeycomb is basically composed of multiple arrayed hexagonal honeycomb units, each with a diameter of 5mm, a wall thickness of 0.8mm, and a height of 10mm. A through-hole is formed in the center of the opposite sidewall of each honeycomb unit. An S-shaped heat pipe array 4 is inserted through the through-hole and suspended within the honeycomb substrate 3, ensuring that the heat pipe array 4 and the honeycomb are in near-complete contact for heat conduction while providing sufficient space for heat dissipation, thus reducing thermal resistance and improving heat dissipation efficiency. In this embodiment, the diameter of the heat pipe is 2mm.

[0021] To further facilitate understanding by those skilled in the art, the application steps of the heat dissipation device in this embodiment are as follows:

[0022] S1: Bracket Fixing: Use an L-shaped stainless steel bracket to vertically fix the heating component 1: GaN RF chip to the back panel of the cabinet.

[0023] S2: Thermal pad 2 bonding: A copper-based thermal pad 2 with a thermal conductivity of 8W / m·K is pre-attached to the bottom of the heating component 1, and vacuum adsorption is used to ensure that there are no air bubbles.

[0024] S3: Assemble the honeycomb substrate 3: Insert the heat pipe array 4 into the side wall of the honeycomb substrate 3 (size 200×150×10mm).

[0025] S4: Thermoelectric module integration: In the 10×10×0.5mm welding area reserved at the edge of the honeycomb substrate 3, the thermoelectric module is welded using Sn96.5Ag3Cu0.5 solder paste (melting point 217℃). The reflow soldering peak temperature is 250℃ and the time is 10s to accelerate the heat dissipation of the honeycomb substrate 3.

[0026] The heat dissipation principle is as follows: the heat from the heat-generating component 1 is transferred to the honeycomb substrate 3 through the heat-conducting pad 2, and the honeycomb substrate 3 transfers the heat to the heat pipe array 4, and heat dissipation is carried out based on the phase change principle of the heat pipe array 4.

[0027] The biomimetic honeycomb integrated micro heat pipe array 4 heat dissipation device in this embodiment is only 10mm thick and weighs ≤1.2kg / m². 2 It is compatible with 5G base station U-shaped cabinets (standard depth 300mm). It also supports parallel connection of multiple baseboards and can be quickly expanded through snap-fit ​​interfaces (tolerance ±0.2mm). A single cabinet can support up to 6 baseboards.

[0028] Example 2:

[0029] Example 2 has the same overall structure as Example 1, and will not be described again here. The difference lies in the connection structure between the heat pipe array and the biomimetic honeycomb.

[0030] Specifically, the two pins of each U-shaped heat pipe are fixed to the intersection of the adjacent honeycomb cells in the biomimetic honeycomb substrate by diffusion welding in a vacuum environment of 650℃ for 30 minutes; multiple heat pipes are vertically inserted into the surface of the honeycomb substrate to form a heat pipe array.

[0031] The above are merely preferred embodiments of this utility model and do not constitute any limitation on this utility model. Any equivalent substitutions or modifications made by those skilled in the art to the technical solutions and contents disclosed in this utility model without departing from the scope of the technical solutions of this utility model shall still fall within the protection scope of this utility model.

Claims

1. A biomimetic cellular integrated micro heat pipe array heat sink for 5G base station, characterized in that, Includes thermal pads, honeycomb substrates, and heat pipes; The honeycomb substrate is disposed on the surface of the thermal pad, and the heat pipes are arranged in an array on the honeycomb substrate to form a heat pipe array.

2. The biomimetic cellular integrated micro heat pipe array heat dissipation device for 5G base stations according to claim 1, characterized in that, The thermal pad is attached to the surface of the heating element.

3. The biomimetic cellular integrated micro heat pipe array heat dissipation device for 5G base stations according to claim 1, characterized in that, The cellular substrate includes multiple arrayed hexagonal cellular cells, each with a diameter of 5 mm, a wall thickness of 0.8 mm, and a height of 10 mm.

4. The biomimetic cellular integrated micro heat pipe array heat dissipation device for 5G base stations according to claim 3, characterized in that, The two leads of the heat pipe are diffusely soldered to the adjacent intersections of the cellular unit; multiple heat pipes are vertically inserted into the surface of the cellular substrate to form the heat pipe array.

5. The biomimetic cellular integrated micro heat pipe array heat dissipation device for 5G base stations according to claim 3, characterized in that, The heat pipes are connected to the sidewall of the honeycomb substrate; that is, the heat pipes are arranged in an S-shaped array after passing through the through hole in the middle of the sidewall of each honeycomb unit.

6. The biomimetic cellular integrated micro heat pipe array heat dissipation device for 5G base stations according to claim 1, characterized in that, The heat pipe has a diameter of 2 mm.

7. The biomimetic cellular integrated micro heat pipe array heat dissipation device for 5G base stations according to claim 1, characterized in that, The edge of the honeycomb substrate is welded with a thermoelectric module.

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