Heat dissipation module

Abstract

This application provides a heat dissipation module, comprising: a first plate having a first heat-conducting component for contacting a first heat source and transferring heat; a second plate having a second heat-conducting component for contacting a second heat source and transferring heat; and a target heat pipe for connecting the first plate and the second plate, one end of the target heat pipe being disposed on the first plate and in contact with the first heat-conducting component, and the other end being disposed on the second plate and in contact with the second heat-conducting component; the target heat pipe includes a target pipe segment, the outer contour dimension of the target pipe segment along a first direction being larger than the outer contour dimension along a second direction, so that the bending strength of the target pipe segment along the second direction is less than the bending strength along the first direction; wherein, the first direction is different from the second direction.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation module. Background Technology

[0002] When heat dissipating heat from different heat-generating devices simultaneously through a heat sink, it is necessary to maintain good contact between the heat dissipation module and the heat-generating devices. However, due to the tolerances between various components, the heat sink is required to absorb component errors while ensuring tight contact and heat dissipation performance in order to ensure stable system operation. Utility Model Content

[0003] This disclosure proposes a heat dissipation module, comprising:

[0004] The first plate is provided with a first heat-conducting component for contacting the first heat source and transferring heat;

[0005] The second plate is provided with a second heat-conducting component for contacting the second heat source and transferring heat;

[0006] A target heat pipe is used to connect the first plate and the second plate. One end of the target heat pipe is disposed on the first plate and in contact with the first heat-conducting component, and the other end is disposed on the second plate and in contact with the second heat-conducting component.

[0007] The target heat pipe includes a target pipe segment, wherein the outer contour dimension of the target pipe segment along the first direction is larger than the outer contour dimension along the second direction, so that the bending strength of the target pipe segment along the second direction is less than the bending strength along the first direction.

[0008] The first direction is different from the second direction.

[0009] In some embodiments, a movable gap is provided between the target pipe segment and the side of the first plate away from the first heat source, and between the target pipe segment and the side of the second plate away from the second heat source, so that the target pipe segment can move closer to or away from the first plate and / or the second plate.

[0010] In some embodiments, the target heat pipe further includes heat-conducting pipe segments, which are respectively disposed at both ends of the target pipe segment and communicate with the target pipe, for contacting the first heat-conducting component and the second heat-conducting component, thereby conducting heat from the first heat source and the second heat source.

[0011] In some embodiments, the radial cross-sectional shape of the heat-conducting pipe section is rectangular or elliptical.

[0012] In some embodiments, a clearance portion is provided on the side of the first plate away from the first heat source and / or on the side of the second plate away from the second heat source to form a receiving space, and the heat-conducting pipe segment is disposed in the clearance portion.

[0013] In some embodiments, the first plate is disposed along a second direction, the second plate is disposed along a third direction, and the third direction is perpendicular to the plane formed by the first direction and the second direction, so that the first plate is perpendicular to the second plate;

[0014] The first plate is disposed on the outer periphery of the second plate, the first heat source is located on the side of the first plate away from the second plate, the second heat source is located on the side of the second plate away from the first plate, and the other side of the first plate and the other side of the second plate enclose a heat dissipation area.

[0015] In some embodiments, the first plate and the second plate are spaced apart and disposed opposite to each other, the first heat source and the second heat source are respectively located on the opposite side of the first plate and the second plate, and a heat dissipation area is formed between the first plate and the second plate.

[0016] In some embodiments, both the first plate and the second plate are provided with mounting holes, and mounting members are assembled in the mounting holes. The mounting members pass through the mounting holes with a first end and are provided with external threads at the first end. An elastic member is sleeved on the outside of the mounting member. One end of the elastic member abuts against the first plate and / or the second plate, and the other end of the elastic member abuts against the second end of the mounting member.

[0017] The diameter of the mounting hole is larger than the outer diameter of the mounting component.

[0018] In some embodiments, the first heat-conducting component includes a plurality of first heat-conducting pipes, and the second heat-conducting component includes a plurality of second heat-conducting pipes, wherein the first heat-conducting pipes and / or the second heat-conducting pipes extend toward the heat dissipation area.

[0019] In some embodiments, a fin module is further included, the fin module being disposed in the heat dissipation area, and the first heat pipe and / or the second heat pipe passing through the fin module;

[0020] The fin module includes several spaced fins, with heat dissipation gaps formed between adjacent fins for heat dissipation. Attached Figure Description

[0021] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0022] Figure 1 A schematic diagram of a heat dissipation module is shown.

[0023] Figure 2 A schematic diagram of the movable gap between the plate and the target heat pipe is shown from a first-person perspective.

[0024] Figure 3 A schematic diagram of the movable gap between the plate and the target heat pipe is shown from a second perspective.

[0025] Figure 4 A schematic diagram of the assembly of a target heat pipe with the first and second plates of a heat dissipation module is shown.

[0026] Figure 5 The diagram schematically illustrates the heat dissipation area formed by a heat dissipation module, as well as the first heat pipe and the second heat pipe.

[0027] Figure 6 A schematic diagram of the assembly of a heat dissipation module mounting components and mounting holes is shown.

[0028] Figure 7 The diagram schematically illustrates a heat dissipation module with a fin module assembled in the heat dissipation area.

[0029] Explanation of icon numbers:

[0030] 10. First plate; 11. First heat-conducting component; 111. First heat-conducting pipe;

[0031] 20. Second plate; 21. Second heat-conducting component; 211. Second heat-conducting pipe;

[0032] 30. Target heat pipe; 31. Target pipe section; 32. Heat transfer pipe section;

[0033] 40. Clearance; 50. Circumvention area; 60. Heat dissipation area; 70. Mounting hole; 80. Mounting component; 90. Elastic component;

[0034] 100. Fin module; 101. Fin. Detailed Implementation

[0035] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0036] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0037] Specific embodiments of this application are described thereafter with reference to the accompanying drawings; however, it should be understood that the described embodiments are merely examples of this application, which may be implemented in various ways. Well-known and / or repeated functions and structures are not described in detail to avoid unnecessary or redundant details that could obscure the application. Therefore, the specific structural and functional details applied herein are not intended to be limiting, but merely serve as the basis and representative basis for the claims to teach those skilled in the art to use this application in a variety of substantially any suitable detailed structures.

[0038] This specification may use the phrases “in one embodiment,” “in another embodiment,” “in yet another embodiment,” or “in other embodiments,” all of which may refer to one or more of the same or different embodiments according to this application.

[0039] like Figure 1 As shown, this disclosure proposes a heat dissipation module, comprising:

[0040] The first plate 10 is provided with a first heat-conducting component 11 for contacting the first heat source and transferring heat;

[0041] The second plate 20 is provided with a second heat-conducting component 21 for contacting the second heat source and transferring heat;

[0042] The target heat pipe 30 is used to connect the first plate 10 and the second plate 20. One end of the target heat pipe 30 is disposed on the first plate 10 and in contact with the first heat-conducting component 11, and the other end is disposed on the second plate 20 and in contact with the second heat-conducting component 21.

[0043] The target heat pipe 30 includes a target pipe segment 31, the outer contour dimension of the target pipe segment 31 along the first direction is larger than the outer contour dimension along the second direction, so that the bending strength of the target pipe segment 31 along the second direction is less than the bending strength along the first direction.

[0044] The first direction is different from the second direction.

[0045] Understandably, in order to meet the demand for efficient heat dissipation of electronic devices and to meet installation tolerances so that the heat-conducting components can make stable contact with the heat source, the heat dissipation module proposed in this disclosure includes a first plate 10, a second plate 20 and a target heat pipe 30.

[0046] A first heat-conducting component 11 is provided on the first plate 10. The first heat-conducting component 11 is used to contact and absorb heat from the first heat source. The first plate 10 can support the first heat-conducting component 11, so that it is mounted on the first plate 10, and can make stable contact with the first heat source by utilizing the first body, thereby improving the heat absorption efficiency of the first heat-conducting component 11 on the first heat source.

[0047] Similarly, the second plate 20 is equipped with a second heat-conducting component 21, which is responsible for contacting the second heat source and absorbing heat. The second plate 20 also serves to support the second heat-conducting component 21 and ensure stable contact between the second heat-conducting component 21 and the second heat source.

[0048] Furthermore, the relative positional relationship between the first plate 10 and the second plate 20 can be adjusted according to the relative positions of the first heat source and the second heat source.

[0049] The target heat pipe 30 is used to connect the first plate 10 and the second plate 20, and can also realize the heat transfer between the first heat-conducting component 11 and the second heat-conducting component 21.

[0050] The target heat pipe 30 includes a target pipe segment 31, and the outer contour dimension of the target pipe segment 31 along the first direction is larger than the outer contour dimension along the second direction. This can be understood as the target heat pipe 30 having different physical properties in different directions, such as bending strength. Because the outer contour dimension along the second direction is smaller, the bending strength in that direction is lower, while the opposite is true along the first direction.

[0051] The heat dissipation module, by taking advantage of the differences in the outer contour dimensions and bending strength of the target pipe section 31, can adapt to installation tolerances during the installation process, namely the deviation between the design dimensions and the actual manufacturing or assembly dimensions, thereby ensuring stable contact with the heat source, especially when the positions of the first heat source and the second heat source in electronic equipment are relatively fixed.

[0052] After the heat dissipation structure is installed, the first heat-conducting component 11 on the first plate 10 and the second heat-conducting component 21 on the second plate 20 cannot achieve close contact with the first and second heat sources. However, close contact between the heat-conducting components and the heat sources can be achieved by the relative movement of the first plate 10 and the second plate 20. At this time, since the first plate 10 and the second plate 20 are connected by the target heat pipe 30, and the bending strength of the target pipe segment 31 in the target heat pipe 30 along the second direction is lower than that in the first direction, the target pipe segment 31 is more likely to bend in the second direction. The bending strength in the first direction is higher, which can provide stronger structural stability. The target heat pipe 30 can compensate for the positional deviation by bending along the second direction, thereby changing the relative position of the first body and the second body to achieve close contact between the first heat-conducting component 11, the second heat-conducting component 21 and the first and second heat sources. At the same time, the high bending strength along the first direction ensures that the overall structure will not fail due to excessive bending.

[0053] The target heat pipe 30 serves as a connector between the first plate 10 and the second plate 20. The difference in bending strength between the first and second directions gives it flexibility, allowing the two plates to move relative to each other within a certain range. This provides greater freedom for the heat dissipation module, enabling it to better adapt to installation tolerances.

[0054] When the first heat source and the second heat source are not on the same plane, the target heat pipe 30 can compensate for the height difference by bending or twisting; when the installation surface is uneven, the flexibility of the target heat pipe 30 can relieve local stress and avoid damage to the heat pipe.

[0055] It also improves the fit between the heat-conducting components and the heat source. Compared to traditional rigid heat dissipation modules, which typically require precise installation and positioning to avoid poor contact or installation failure, the target heat pipe 30 in this solution, through its flexibility, reduces the requirements for installation precision and simplifies the installation process. This not only improves production efficiency but also reduces rework rates caused by improper installation.

[0056] In modern electronic devices, there are often multiple heat sources (such as CPU, GPU, power modules, etc.), and the location and power density of each heat source may vary. The flexible design of the target heat pipe 30 allows the heat dissipation module to flexibly adapt to the layout of different heat sources, while ensuring that each heat source is effectively cooled.

[0057] For space-constrained compact devices (such as laptops and servers), the heat dissipation module can complete complex wiring installations within a limited space. The anisotropic structure of the target heat pipe 30 enables it to achieve efficient heat transfer in a small space while adapting to the complex internal structure of the device.

[0058] Because the target heat pipe 30 can accommodate installation tolerances and evenly distribute contact pressure, the heat dissipation module avoids loosening or poor contact during long-term operation. This significantly improves the reliability and lifespan of the equipment.

[0059] The anisotropic and flexible characteristics of the target heat pipe 30 allow the heat dissipation module to effectively adapt to installation tolerances during installation, ensuring stable contact with the heat source. This not only improves heat dissipation efficiency but also reduces installation difficulty, enhancing the reliability and adaptability of the equipment. It is suitable for multi-heat source systems and compact devices.

[0060] Meanwhile, the target heat pipe 30 also serves as a heat transfer device. One end of the target heat pipe 30 is located on the first plate 10 and in contact with the first heat-conducting component 11, while the other end is located on the second plate 20 and in contact with the second heat-conducting component 21, forming an effective heat transfer channel. Even if the positions and temperatures of the two heat sources are different, it ensures that heat is effectively transferred from the higher temperature region to the lower temperature region. During the transfer process, efficient heat dissipation can be achieved using the corresponding heat dissipation devices on the first plate 10 and the second plate, improving the utilization efficiency of the heat dissipation devices and preventing any heat dissipation device on either plate from being idle. The heat dissipation device can be a fin 101, a fan, etc.

[0061] The target pipe section 31 can be elliptical in shape. The elliptical cross section has two different principal axes (major axis and minor axis). The major axis direction can correspond to a larger outer contour dimension (first direction), and the minor axis direction can correspond to a smaller outer contour dimension (second direction). The major axis direction can provide higher fixed rigidity and is suitable for withstanding larger bending forces, while the minor axis direction is easier to bend and can adapt to installation tolerances.

[0062] It is necessary to maintain structural stability in one direction while allowing a certain degree of flexibility in another direction. For example, in an electronic device such as a computer case, the first heat source is the CPU and the second heat source is the GPU. After the first body is tightly fitted and installed with the CPU, the position of the second plate 20 can be adjusted by bending the target pipe segment 31 along the second direction. After absorbing the installation tolerance, the second plate 20 can be fitted and installed with the GPU.

[0063] The target pipe segment 31 can also be a flat rectangle. The flat rectangular cross-section is wider in the height direction (first direction) and narrower in the width direction (second direction). The width direction (first direction) has higher bending strength, which is suitable for directions requiring rigidity. The thickness direction (second direction) is thinner, making it easier to bend and adjust during installation.

[0064] The target pipe segment 31 can also be D-shaped, with one side of the cross-section being curved and the other side being flat, giving it an overall "D"-like shape. The curved portion provides higher rigidity (first direction), while the flat portion is relatively easy to bend (second direction). This allows for a certain degree of mechanical flexibility while ensuring heat conduction efficiency. It is suitable for scenarios requiring contact with a flat surface, such as applications that adhere to heat sinks or other surfaces.

[0065] The target pipe section 31 can also be a hyperboloid (convex or concave shape). The hyperboloid shape can be a design with local convexity or concavity, and anisotropy can be achieved by changing the geometric properties of the cross section.

[0066] The convex direction (first direction) has higher rigidity, while the concave direction (second direction) is more prone to bending. This provides greater flexibility for adjustment, making it suitable for complex spatial layouts or scenarios requiring special mechanical properties.

[0067] The target pipe segment 31 can also be wavy (periodic undulation). The wavy shape increases the material distribution along one direction (the first direction), thereby improving the rigidity in that direction; while maintaining a lower material distribution in the other direction (the second direction) to reduce bending strength. This provides good mechanical balance, maintaining stability in the first direction while achieving flexible adjustment in the second direction. It is suitable for applications that require a balance between rigidity and flexibility.

[0068] The shape of the target pipe section 31 can be selected based on its functional requirements, mechanical properties and thermal performance. All of the above shapes can satisfy the requirement that the outer contour dimension of the target pipe section 31 along the first direction is greater than the outer contour dimension along the second direction, and that the bending strength in the second direction is less than that in the first direction.

[0069] The material used to make the target heat pipe 30 can be copper, aluminum, stainless steel, or other materials.

[0070] In some embodiments, such as Figure 2-3 As shown, there are movable gaps 40 between the target pipe section 31 and the side of the first plate 10 away from the first heat source, and between the target pipe section 31 and the side of the second plate 20 away from the second heat source, so that the target pipe section 31 can move closer to or away from the first plate 10 and / or the second plate 20.

[0071] Understandably, this is to address manufacturing errors or deviations during assembly and to further enhance the flexibility and adaptability of the heat dissipation module during installation.

[0072] By leaving a movable gap 40 on both the side of the target pipe section 31 away from the first heat source and the side of the target pipe section 31 away from the second heat source, the target pipe section 31 can move away from or close to the first plate 10 and / or the second plate 20, so that the target heat pipe 30 can be appropriately adjusted according to the actual situation, thereby effectively compensating for installation tolerances.

[0073] The movable gap 40 provides the target heat pipe 30 with a certain degree of freedom of movement, enabling it to better adapt to different installation conditions. It can also adapt to the thermal expansion or contraction caused by temperature changes during the operation of electronic devices. Even if the internal components undergo a certain relative displacement due to temperature changes, the movable gap 40 can absorb the displacement and reduce stress.

[0074] Furthermore, to ensure efficient heat transfer and maintain close contact between the heat dissipation module and the heat source, the movable gap 40 allows the target heat pipe 30 to be finely adjusted according to the actual position of the heat source, thereby maintaining optimal contact pressure and area and improving overall heat dissipation efficiency.

[0075] In some embodiments, such as Figure 4 As shown, the target heat pipe 30 also includes a heat-conducting pipe section 32, which is respectively disposed at both ends of the target pipe section 31 and connected to the target pipe, for contacting the first heat-conducting component 11 and the second heat-conducting component 21, thereby conducting heat from the first heat source and the second heat source.

[0076] Understandably, the heat pipe section 32, as a bridge for heat transfer from the heat source to the target heat pipe 30, can ensure that the heat generated by the heat source can be quickly and effectively absorbed into the target heat pipe 30 by directly contacting the first heat-conducting component 11 and the second heat-conducting component 21.

[0077] To maximize heat transfer efficiency, the heat pipe segment 32 can be tightly fitted to the corresponding heat-conducting component. The heat pipe segment 32 can be manufactured using a high thermal conductivity material, and appropriate surface treatment techniques (such as polishing or adding thermal paste) can be used to reduce contact thermal resistance.

[0078] The heat pipe section 32 can be made of the same high thermal conductivity material as the target pipe section 31, such as copper or aluminum. This ensures the consistency and continuity of the entire heat pipe system.

[0079] The heat pipe section 32 can adopt a flattened structure, which can increase the contact area, make the structure compact, and occupy less space.

[0080] The heat-conducting pipe section 32 and the target pipe section 31 can be connected by welding or brazing. This provides good mechanical strength and ensures smooth heat transfer between different parts, reducing heat loss at the joint.

[0081] In some embodiments, the radial cross-sectional shape of the heat-conducting pipe section 32 is rectangular or elliptical.

[0082] Understandably, in order to meet the heat transfer efficiency of the heat dissipation module, the radial cross section of the heat pipe section 32 is set to a rectangle or an ellipse.

[0083] The cross-section can be rectangular radially, which provides a larger contact area, especially when in contact with the first heat-conducting component 11 or the second heat-conducting component 21. This allows for better contact with the planar heat source and reduces contact thermal resistance. The rectangular cross-section is also suitable for layout designs in compact devices, particularly when installation space is limited. The rectangular shape makes better use of narrow spaces, allowing the cross-section to integrate better into the overall structure. Furthermore, the rectangular cross-section increases the cross-sectional area of ​​the heat transfer path, thereby reducing thermal resistance and improving heat dissipation efficiency.

[0084] The heat pipe section 32 can also be an elliptical radial cross-section. An elliptical cross-section has two distinct principal axes (major and minor axes). The major axis provides a larger outer profile with higher rigidity, suitable for withstanding greater bending forces, while the minor axis is narrower, making it easier to bend and adapt to installation tolerances or space constraints. The elliptical cross-section also exhibits lower fluid flow resistance, facilitating the rapid movement of the working fluid (such as steam or liquid) within the heat pipe, thereby improving heat transfer efficiency.

[0085] The smooth transition of the elliptical cross-section reduces stress concentration points and facilitates manufacturing and processing. When the target heat pipe 30 needs to be bent to a certain extent during installation, the elliptical cross-section can better adapt to the installation requirements. Furthermore, by optimizing the ratio of the major and minor axes, the elliptical cross-section can further improve heat transfer efficiency, making it suitable for high heat density applications.

[0086] In some embodiments, such as Figure 4 As shown, the first plate 10 is provided with a clearance portion 50 on the side away from the first heat source and / or the second plate 20 is provided with a clearance portion 50 to form a receiving space, and the heat conduction pipe section 32 is provided in the clearance portion 50.

[0087] Understandably, in order to avoid the heat conduction pipe section 32 occupying additional space and thus make more efficient use of the limited space inside the equipment, a clearance part 50 is provided on the side of the plate away from the heat source. The clearance part 50 can be a receiving area formed by the groove and the step lamp, providing a receiving space for the heat conduction pipe section 32.

[0088] Furthermore, embedding the heat-conducting pipe section 32 into the clearance portion 50 reduces the risk of exposure, thereby lowering the possibility of damage caused by external mechanical impact or vibration. In addition, it also prevents the heat-conducting pipe section 32 from interfering with other components.

[0089] The clearance section 50 also enables the heat-conducting pipe section 32 to be accurately positioned during installation, avoiding problems such as poor contact or increased thermal resistance due to positional misalignment. Furthermore, the stability of the heat-conducting pipe section 32 can be further enhanced through methods such as clips and adhesives.

[0090] The shape and size of the clearance portion 50 can be adapted to the heat conduction pipe section 32. If the heat conduction pipe section 32 has a rectangular cross section, the clearance portion 50 may be designed as a flat groove.

[0091] If the heat pipe section 32 has an elliptical cross-section, the clearance part 50 may be designed as an arc-shaped groove;

[0092] The depth and width of the clearance section 50 need to be slightly larger than the outer contour dimensions of the heat-conducting pipe section 32 to facilitate installation and adjustment, while avoiding excessive pressure on the heat-conducting pipe section 32.

[0093] The clearance section 50 allows the heat pipe section 32 to fit tightly against the plate, thereby significantly reducing the overall volume of the heat dissipation module. This not only improves the space utilization of the heat dissipation module but also enhances installation stability and heat transfer efficiency.

[0094] In some embodiments, such as Figure 4-5 As shown, the first plate 10 is arranged along the first direction, and the second plate 20 is arranged along the third direction, and the third direction is perpendicular to the plane formed by the first direction and the second direction, so that the first plate 10 is perpendicular to the second plate 20.

[0095] The first plate 10 is disposed on the outer periphery of the second plate 20, the first heat source is located on the side of the first plate 10 away from the second plate 20, the second heat source is located on the side of the second plate 20 away from the first plate 10, and the other side of the first plate 10 and the other side of the second plate 20 enclose each other to form a heat dissipation area 60.

[0096] Understandably, if the first plate 10 can be set along the first and second directions, then the second plate 20 can be set along the third direction.

[0097] The first plate 10 can be arranged along a specific direction, such as the horizontal X-axis, while the second plate 20 is arranged along a direction perpendicular to the plane formed by the first and second directions, such as the Z-axis, so that the first plate 10 is perpendicular to the second plate 20. It can be understood that the first plate 10 and the second plate 20 are perpendicular to each other in three-dimensional space, forming an L-shaped or T-shaped structure.

[0098] The first heat source is located on the side of the first plate 10 away from the second plate 20. This first heat source can be installed on the side of the first plate 10 furthest from the second plate 20 to ensure that heat is directly conducted from the first heat source to the first plate 10. Similarly, the second heat source is located on the side of the second plate 20 away from the first plate 10, so that heat can be efficiently conducted to the second plate 20.

[0099] A heat dissipation area 60 is formed by enclosing the first plate 10 and the second plate 20 on the other side, utilizing the enclosure of the first plate 10 and the second plate 20 to form a heat dissipation area. Additional heat dissipation components, such as heat sink fins 101 and fans, can be accommodated in the heat dissipation area 60, thereby improving overall heat dissipation efficiency.

[0100] By arranging the first plate 10 and the second plate 20 along the second direction (e.g., the X-axis) and the third direction (e.g., the Z-axis) respectively, this three-dimensional spatial layout enables the heat dissipation module to maximize the use of available volume within a limited space, thereby avoiding interference between different components.

[0101] Furthermore, since the first plate 10 and the second plate 20 are located on different planes (X-axis and Z-axis), heat can be dispersed from multiple directions.

[0102] The heat dissipation module with the above structural features can be applied to compact electronic devices, such as miniaturized chassis and server racks. For example, miniaturized chassis have small size and limited internal space, and the heat dissipation module can significantly reduce the space occupied by the heat dissipation system while ensuring sufficient heat dissipation performance. By arranging it vertically, the heat dissipation area can be increased without increasing the thickness of the device.

[0103] In some embodiments, the first plate 10 and the second plate 20 are spaced apart and disposed opposite to each other, the first heat source and the second heat source are respectively located on the opposite side of the first plate 10 and the second plate 20, and a heat dissipation area 60 is formed between the first plate 10 and the second plate 20.

[0104] Understandable.

[0105] By arranging the first plate 10 and the second plate 20 in parallel at a certain distance and facing each other, a space is formed between the two plates, namely the heat dissipation area 60.

[0106] The distance between the first plate 10 and the second plate 20 can be adjusted according to specific application requirements, which can ensure sufficient space to accommodate heat dissipation components (such as fans, heat sink 101, etc.) while avoiding occupying too much internal space of the device.

[0107] The first heat source is located on the side of the first plate 10 away from the second plate 20, and the second heat source is located on the side of the second plate 20 away from the first plate 10. This ensures that heat can be directly conducted from the heat source to the corresponding plate without affecting the heat dissipation efficiency due to mutual interference between the heat sources.

[0108] The heat dissipation area 60 between the first plate 10 and the second plate 20 can centrally manage and dissipate the heat transferred from the two heat sources. By integrating heat dissipation components such as fins 101, heat pipes, and fans into the heat dissipation area 60, efficient heat dissipation can be achieved. After the heat is conducted from the first heat source and the second heat source to the first plate 10 and the second plate 20 respectively, the heat can be dispersed in multiple directions through the components in the heat dissipation area 60. It is suitable for complex systems that need to manage multiple heat sources at the same time.

[0109] The gap between the first plate 10 and the second plate 20 can be supported by the target heat pipe 30, or by support frames, connectors, support columns, etc., to ensure the mechanical stability of the entire heat dissipation module, especially under vibration or impact conditions.

[0110] By arranging the first plate 10 and the second plate 20 at intervals and opposite to each other, forming a heat dissipation area 60 between them, not only is efficient heat management achieved, but the internal space of the device is also fully utilized. This method is applicable to both compact devices and complex multi-heat source systems, maximizing heat dissipation efficiency within limited space while maintaining system compactness and reliability.

[0111] In some embodiments, such as Figure 6 As shown, both the first plate 10 and the second plate 20 are provided with mounting holes 70. Mounting parts 80 are assembled in the mounting holes 70. The mounting parts 80 pass through the mounting holes 70 with their first end and are provided with external threads at the first end.

[0112] An elastic element 90 is sleeved on the outer side of the mounting part 80. One end of the elastic element 90 abuts against the first plate 10 and / or the second plate 20, and the other end of the elastic element 90 abuts against the second end of the mounting part 80.

[0113] The diameter of the mounting hole 70 is larger than the outer diameter of the mounting part 80.

[0114] Understandably, mounting holes 70 are formed on the first plate 10 and the second plate 20 of the heat dissipation module, and a mounting component 80 with an outer elastic element 90 is fitted inside the mounting holes 70. The diameter of the mounting holes 70 is set to be larger than the outer diameter of the mounting component 80. This ensures tight contact between the mounting component 80 and the heat source, and allows the plate to have a certain degree of movement to accommodate the mounting surface. It should be noted that the heat source can be fixedly mounted on a carrier, which can be a PCB motherboard, and the heat source can be a CPU / GPU, or the carrier can be the casing of an electronic device. Due to the relatively fixed position of the heat source, the heat dissipation module... To meet heat dissipation requirements, it needs to be in close contact with the heat source. Specifically, the first plate 10 and the second plate 20 are in close contact with the second heat source and the second heat source, respectively. The first end of the mounting part 80 is threadedly connected to the carrier to achieve relative fixation. Furthermore, to achieve a tight fit, an elastic element 90 is sleeved on the outside of the mounting part 80, so that the two ends of the elastic element 90 abut against the second end of the mounting part 80 and the corresponding plate, respectively, which can provide pre-tightening force. The elastic force after the elastic element 90 is deformed makes the first body and / or the second plate 20 fit tightly with the carrier. The elastic element 90 can be a stainless steel spring or a rubber washer, etc.

[0115] On the other hand, it is also necessary to allow the first plate 10 and the second plate 20 to correspond to the heat source respectively. Therefore, the diameter of the mounting hole 70 is set to be larger than the outer diameter of the mounting part 80, so that the first plate 10 and the second plate 20 can have a certain amount of displacement, that is, they can wobble within a certain range, thereby adapting to the installation tolerance or slight positional deviation, so as to achieve the effect of corresponding contact with the heat source. After tightening the mounting part 80, the movement of the first plate 10 and the second plate 20 can be limited by the elastic element 90, avoiding poor contact caused by loosening.

[0116] Therefore, the heat dissipation module effectively absorbs and regulates mechanical stress by providing mounting parts 80 with elastic elements 90 on the first plate 10 and the second plate 20. This not only improves the installation stability and adaptability of the heat dissipation module but also enhances the overall heat dissipation efficiency and service life. Since the diameter of the mounting hole 70 is larger than the outer diameter of the mounting part 80, the plate is allowed to wobble within a certain range to accommodate installation tolerances. The elastic element 90 provides the necessary preload to ensure tight contact between the heat dissipation component and the heat source while absorbing mechanical stress. The external thread at the first end of the mounting part 80 is used to fix it to the carrier of the heat source (such as a PCB board or the housing of electronic equipment), providing a stable connection that maximizes heat dissipation efficiency within a limited space while maintaining the system's compactness and reliability.

[0117] In some embodiments, such as Figure 5As shown, the first heat-conducting component 11 includes a plurality of first heat-conducting pipes 111, and the second heat-conducting component 21 includes a plurality of second heat-conducting pipes 211. The first heat-conducting pipes 111 and / or the second heat-conducting pipes 211 extend toward the heat dissipation area 60.

[0118] Understandably, the first heat-conducting component 11 may include a plurality of first heat-conducting pipes 111, which are used to transfer the heat generated by the first heat source to the first plate 10 and the heat dissipation area 60; the second heat-conducting component 21 may include a plurality of second heat-conducting pipes 211, which are used to transfer the heat generated by the second heat source to the second plate 20 and the heat dissipation area 60.

[0119] The first heat pipe 111 can be multiple and arranged in parallel on the first plate 10, and the second heat pipe 211 can be multiple and arranged in parallel on the second plate 20. Both the first heat pipe and the second heat pipe can extend into the heat dissipation area 60. The arrangement in the heat dissipation area 60 can be staggered and interwoven. Without interference, they are arranged at intervals in the heat dissipation area 60 to increase the space occupied in the heat dissipation area 60, thereby distributing heat evenly in the heat dissipation area 60. This can significantly increase the heat dissipation area in the heat dissipation area 60, avoid local overheating, improve the overall heat dissipation efficiency, and make the temperature distribution of the heat dissipation module uniform.

[0120] After the first and second heat pipes 211 extend into the heat dissipation area 60, they can come into close contact with other heat dissipation components, such as fins 101 and heat spreaders. The heat spreader can be positioned on the side of the first and second plates 20 away from the heat dissipation area 60 and closely fitted with the first and second heat pipes 211. The heat spreader, in contact with the heat source, improves heat conduction efficiency. Furthermore, the ends of the first and second heat pipes 211 that contact the first plate 10 and the second plate 20 can be flattened, increasing the contact area with the heat spreader and allowing them to be embedded within the plates, becoming an integral part of the heat dissipation module, thereby reducing the overall size of the heat dissipation module.

[0121] In some embodiments, such as Figure 7 As shown, it also includes a fin module 100, which is disposed in the heat dissipation area 60, and the first heat pipe 111 and / or the second heat pipe 211 are inserted into the fin module 100.

[0122] The fin module 100 includes a number of spaced fins 101, with heat dissipation gaps formed between adjacent fins 101 for heat dissipation.

[0123] Understandably, by inserting the first heat pipe 111 and / or the second heat pipe 211 into the fin module 100, heat can be transferred to the fins 101, thereby utilizing the heat dissipation gaps between the fins 101 for efficient heat dissipation.

[0124] The fins 101 can be made of highly thermally conductive materials, such as aluminum or copper, to increase heat exchange efficiency by increasing the surface area, thereby dissipating heat more effectively. The gaps between the fins 101 allow airflow, thereby carrying away more heat.

[0125] The first heat pipe 111 and / or the second heat pipe 211 are inserted into the fin module 100, so that the heat pipes pass directly through multiple fins 101, ensuring that heat can be efficiently conducted to each fin 101.

[0126] To ensure good thermal contact, the heat pipe and fins 101 are typically fixed together by welding, pressing, or using thermal paste. This not only reduces contact thermal resistance but also prevents loosening due to vibration or impact.

[0127] The heat pipe uses its internal working fluid (such as water or ethanol) for phase change heat transfer (evaporation-condensation cycle), rapidly transferring heat from the heat source to the fin module 100. Then, the fins 101 exchange heat with the surrounding environment through their large surface area, dissipating the heat. Because the heat pipe is embedded within multiple fins 101, heat can be evenly distributed among the fins, preventing the formation of localized hot spots. The fins 101 can be arranged according to the path of the heat pipe and the space of the heat dissipation area 60, for example, they can be arranged in a straight line, staggered, or multi-layered manner to maximize heat dissipation.

[0128] In a multi-heat source system, the first heat pipe 111 and the second heat pipe 211 correspond to different heat sources. By passing through the fin module 100, the heat from different heat sources can be concentrated into a unified heat dissipation space for management. This is particularly suitable for high-performance computing devices (such as servers and workstations) or complex electronic devices (such as automotive electronic systems). If the power of the heat source changes during device operation (such as the CPU generating more heat under high load), the fin module 100 can respond quickly and transfer the heat to the heat dissipation area 60, ensuring that the heat dissipation system is always in a highly efficient working state.

[0129] By embedding the first heat pipe 111 and the second heat pipe 211 within the fin module 100, not only is the heat transfer path and distribution optimized, but the overall performance of the heat dissipation module is also significantly improved. The fin module 100 achieves efficient heat exchange by increasing the surface area and optimizing the heat dissipation gaps. Whether for multi-heat source systems or compact devices, it provides strong support for efficient heat dissipation of modern electronic devices. The heat dissipation module of this application can maximize heat dissipation efficiency within a limited space while maintaining the system's compactness and reliability.

[0130] It should be noted that the above embodiments can exist individually or in combination. It should be understood that although this application is described according to various embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0131] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation module, characterized in that, include: The first plate is provided with a first heat-conducting component for contacting the first heat source and transferring heat; The second plate is provided with a second heat-conducting component for contacting the second heat source and transferring heat; A target heat pipe is used to connect the first plate and the second plate. One end of the target heat pipe is disposed on the first plate and in contact with the first heat-conducting component, and the other end is disposed on the second plate and in contact with the second heat-conducting component. The target heat pipe includes a target pipe segment, wherein the outer contour dimension of the target pipe segment along the first direction is larger than the outer contour dimension along the second direction, so that the bending strength of the target pipe segment along the second direction is less than the bending strength along the first direction. The first direction is different from the second direction.

2. The heat dissipation module according to claim 1, characterized in that, There are movable gaps between the target pipe segment and the side of the first plate away from the first heat source, and between the target pipe segment and the side of the second plate away from the second heat source, so that the target pipe segment can move closer to or away from the first plate and / or the second plate.

3. The heat dissipation module according to claim 1, characterized in that, The target heat pipe also includes: A heat-conducting pipe segment is disposed at both ends of the target pipe segment and connected to the target pipe, for contacting the first heat-conducting component and the second heat-conducting component, thereby conducting heat from the first heat source and the second heat source.

4. The heat dissipation module according to claim 3, characterized in that, The radial cross-sectional shape of the heat-conducting pipe section is rectangular or elliptical.

5. The heat dissipation module according to claim 3, characterized in that, The first plate is provided with a clearance portion on the side away from the first heat source and / or the second plate is provided with a clearance portion to form a receiving space, and the heat-conducting pipe section is provided in the clearance portion.

6. The heat dissipation module according to claim 1, characterized in that, The first plate is disposed along the second direction, and the second plate is disposed along the third direction, and the third direction is perpendicular to the plane formed by the first direction and the second direction, so that the first plate is perpendicular to the second plate; The first plate is disposed on the outer periphery of the second plate, the first heat source is located on the side of the first plate away from the second plate, the second heat source is located on the side of the second plate away from the first plate, and the other side of the first plate and the other side of the second plate enclose a heat dissipation area.

7. The heat dissipation module according to claim 1, characterized in that, The first plate and the second plate are spaced apart and arranged opposite to each other. The first heat source and the second heat source are respectively located on the opposite side of the first plate and the second plate, and a heat dissipation area is formed between the first plate and the second plate.

8. The heat dissipation module according to any one of claims 1-7, characterized in that, Both the first plate and the second plate are provided with mounting holes, and mounting components are assembled in the mounting holes. The mounting components pass through the mounting holes with a first end and are provided with external threads at the first end. An elastic element is sleeved on the outside of the mounting component. One end of the elastic element abuts against the first plate and / or the second plate, and the other end of the elastic element abuts against the second end of the mounting component. The diameter of the mounting hole is larger than the outer diameter of the mounting component.

9. The heat dissipation module according to claim 6 or 7, characterized in that, The first heat-conducting component includes a plurality of first heat-conducting pipes, and the second heat-conducting component includes a plurality of second heat-conducting pipes, wherein the first heat-conducting pipes and / or the second heat-conducting pipes extend toward the heat dissipation area.

10. The heat dissipation module according to claim 9, characterized in that, It also includes: A fin module is disposed in the heat dissipation area, and the first heat pipe and / or the second heat pipe passes through the fin module. The fin module includes several spaced fins, with heat dissipation gaps formed between adjacent fins for heat dissipation.

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