Thermal conductive components and electronic devices

Abstract

This application provides a heat-conducting component and an electronic device, relating to the field of electronic device technology. The heat-conducting component includes a cover and a heat dissipation component; a first end of the cover is used to cover the heating unit of the electronic device, and a second end of the cover is connected to the first end to form a heat dissipation channel within the cover; the heat dissipation component is disposed in the heat dissipation channel to dissipate the heat from the heating unit through the heat dissipation channel out of the cover.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a thermally conductive component and electronic equipment. Background Technology

[0002] As the performance requirements of electronic devices increase, the power consumption of internal heat-generating units increases, leading to increased heat generation. This affects the performance, safety, and lifespan of electronic devices, and the resulting heat dissipation issues are receiving increasing attention. Utility Model Content

[0003] The purpose of this application is to provide a thermally conductive component and an electronic device, the technical solution of which is as follows:

[0004] The first aspect of this application provides a thermally conductive component, comprising:

[0005] The cover has a first end for housing the heating unit of the electronic device, and a second end for communicating with the first end to form a heat dissipation channel within the cover.

[0006] The heat dissipation component is located in the heat dissipation channel to dissipate the heat from the heating unit to the cover.

[0007] In some embodiments, the aforementioned heat-conducting component includes a heat-dissipating component comprising a first fan disposed near a first end within a heat-dissipating channel, the first fan blowing heat out of the cover along the heat-dissipating channel; and / or, the heat-dissipating component comprises a second fan disposed near a second end within a heat-dissipating channel, the second fan drawing heat out of the cover along the heat-dissipating channel.

[0008] In some embodiments, the aforementioned heat-conducting component includes a first cover extending along a first direction and a second cover extending along a second direction, the first cover and the second cover communicating to form a heat dissipation channel; the second direction and the first direction have a preset angle.

[0009] In some embodiments, the aforementioned heat-conducting component includes a first shroud having at least a first flexible segment; and / or a second shroud having at least a second flexible segment; wherein the first and / or second flexible segments are flexibly expandable and contractible to form heat dissipation channels.

[0010] In some embodiments, the aforementioned heat-conducting assembly includes a first shroud having at least a first reduced diameter section; and / or a second shroud having at least a second reduced diameter section; wherein the outer diameter of the first and / or second reduced diameter sections decreases along the extension direction from the first end to the second end.

[0011] In some embodiments, the aforementioned heat-conducting component includes a connecting seat at the first end of the cover, the connecting seat having a first connecting portion and a second connecting portion, the second connecting portion being movably connected relative to the first connecting portion to have a different relative positional relationship with respect to the heating unit.

[0012] In some embodiments, the aforementioned heat-conducting component has a target protective layer provided on the outer wall of the cover.

[0013] A second aspect of this application provides an electronic device, comprising:

[0014] The housing contains a heating unit.

[0015] A heat-conducting component, capable of dissipating heat from the heating unit to the outside of the housing, wherein the heat-conducting component includes:

[0016] The cover has a first end that covers the heating unit of the electronic device, and a second end that is connected to the first end to form a heat dissipation channel inside the cover.

[0017] Heat dissipation assembly, which is located in the heat dissipation channel, to dissipate the heat from the heating unit to the cover through the heat dissipation channel;

[0018] The second end is located in the housing so that the heat exhaust channel can connect to the outside of the housing. Heat is discharged from the cover and out of the housing through the heat exhaust channel under the action of the heat exhaust component.

[0019] In some embodiments, the aforementioned electronic device has a heating unit disposed on a first side inside the housing, a second end of the cover disposed on a second side of the housing, and the first side of the housing and the second side of the housing are disposed adjacent to each other.

[0020] In some embodiments, the aforementioned electronic device further includes a second heating unit disposed within the housing, the second heating unit being disposed on a third side of the housing opposite to the second side, and a first heat dissipation assembly disposed on the third side of the housing, the first heat dissipation assembly blowing the heat of the second heating unit toward the second side of the housing and out of the housing via the second side; and / or, a third heating unit is further disposed within the housing, the second end of the third heating unit being disposed on the second side of the housing via a spacer cover, the third heating unit being connected to the second heat dissipation assembly, the second heat dissipation assembly sending the heat of the third heating unit out of the housing via the second side.

[0021] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, the preferred embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 An exploded isometric view of a thermal conductive component according to this application is shown schematically.

[0024] Figure 2 This schematic diagram illustrates the structure of a heat-conducting component according to the present application, in which the first end of the first fan near the cover is disposed in the heat dissipation channel;

[0025] Figure 3 This schematic diagram illustrates the structure of a heat-conducting component according to the present application, in which the second end of the second fan near the cover is disposed within the heat dissipation channel;

[0026] Figure 4 This schematic diagram illustrates the structure of a heat-conducting component according to this application, in which the first and second fans are disposed within a heat dissipation channel;

[0027] Figure 5 The schematic diagram shows the structure of the first and second covers of a heat-conducting component according to this application;

[0028] Figure 6 This schematic diagram illustrates the structure of a first cover having a first flexible segment in a thermally conductive component according to this application.

[0029] Figure 7 This schematic diagram illustrates the structure of a second cover having a second flexible segment in a thermally conductive component according to this application.

[0030] Figure 8 The schematic diagram shows a thermal conductive component of this application having a first diameter reduction section and a second diameter reduction section;

[0031] Figure 9 The schematic diagram shows a structural schematic of a connector for a heat-conducting component according to this application;

[0032] Figure 10 A schematic diagram of the internal structure of an electronic device according to this application is shown.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1. Heat-conducting component; 11. Cover; 12. Heat dissipation component; 111. First end; 112. Second end; 113. Heat dissipation channel; 114. First cover; 115. Second cover; 116. Connecting seat; 121. First fan; 122. Second fan; 1141. First flexible section; 1142. First diameter-reducing section; 1151. Second flexible section; 1152. Second diameter-reducing section; 1161. First connecting part; 1162. Second connecting part;

[0035] 2. Housing; 21. Heating unit; 22. First side; 23. Second side; 24. Third side; 25. Second heating unit; 26. Third heating unit; 241. First heat dissipation assembly; 261. Second heat dissipation assembly;

[0036] A, First direction; B, Second direction; R, Preset angle. Detailed Implementation

[0037] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0038] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0039] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0040] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0041] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0042] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0043] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0044] Example 1

[0045] like Figure 1 As shown, the first aspect of this application provides a heat-conducting component 1, including a cover 11 and a heat dissipation component 12; the first end 111 of the cover 11 is used to cover the heating unit 21 of an electronic device, and the second end 112 of the cover 11 is connected to the first end 111 to form a heat dissipation channel 113 inside the cover 11; the heat dissipation component 12 is disposed in the heat dissipation channel 113 to dissipate the heat of the heating unit 21 through the heat dissipation channel 113 to the cover 11.

[0046] Specifically, the heat-generating unit 21 of the electronic device can be a CPU (Central Processing Unit), GPU (Graphics Processing Unit), PSU (Power Supply Unit), etc., and is not limited to any specific component. Any component that consumes a large amount of power and generates a significant amount of heat when performing certain tasks can be suitable for the heat-conducting component 1 provided in this application. The heat-conducting component 1 of this application is provided with a cover 11. The first end 111 of the cover 11 is used to cover the heat-generating unit 21 of the electronic device, so that the heat generated by the heat-generating unit 21 can be concentrated within the cover 11. The second end 112 of the cover 11 is connected to the first end 111 to form a heat dissipation channel 113. The heat dissipation channel 113 provides a path and space for heat conduction. The second end 112 of the cover 11 can be located on the side wall of the electronic device's housing. Through the opening of the side wall of the housing corresponding to the second end 112, heat can reach the second end 112 of the cover 11 through the heat dissipation channel 113 and then be discharged outside the housing of the electronic device. The second end 112 of the cover 11 can also be connected to a cooling and heat dissipation component of water cooling or air cooling installed outside the electronic device, so that the ambient temperature of the electronic device meets the user's experience. The specific connection is not limited.

[0047] Furthermore, depending on the location of the heat-generating unit 21 within the electronic device, the position of the cover 11 can be adaptively adjusted. This allows the first end 111 of the cover 11 to cover the heat-generating unit 21, while the second end 112 can be positioned at any location within the electronic device's housing as needed, adapting to the device's spatial requirements. Depending on the requirements, the cover 11 can be a multi-segment structure or have flexible segments to accommodate arrangements in narrow and complex spaces; the specific design is not limited.

[0048] To achieve efficient heat removal from the enclosure 11 via the heat dissipation channel 113, this application provides a heat dissipation component 12 within the heat dissipation channel 113. The heat dissipation component 12 can be a fan, heat pipe, heat spreader, or other components, enabling heat to be conducted along a predetermined path until it is removed from the enclosure 11. The heat dissipation component 12 can also be a combination of two or three of the following components: fan, heat pipe, heat spreader, etc., with no specific limitation, as long as heat can be quickly and directly discharged from the heat dissipation channel 113.

[0049] This application provides a heat-conducting component 1, including a cover 11 and a heat dissipation component 12. A first end 111 of the cover 11 is used to cover a heat-generating unit 21 of an electronic device. A second end 112 of the cover 11 communicates with the first end 111 to form a heat dissipation channel 113 within the cover 11. The heat dissipation component 12 is disposed within the heat dissipation channel 113 to dissipate heat from the heat-generating unit 21 out of the cover 11. This application, by covering the heat-generating unit 21 of the electronic device with the first end 111 of the cover 11, concentrates the generated heat within the cover 11. Through the formed heat dissipation channel 113, the heat is efficiently dissipated outside the cover 11 under the action of the heat dissipation component 12, thereby enabling efficient heat dissipation of the electronic device, improving its service life and stability. The application of this application solves the technical problem of increased power consumption and thus increased heat generation of the heat-generating unit 21 inside the electronic device, affecting its performance, safety, and service life.

[0050] like Figures 2 to 4 As shown, in some embodiments, the heat dissipation assembly 12 includes a first fan 121, which is disposed near the first end 111 in the heat dissipation channel 113 and blows heat out of the cover 11 along the heat dissipation channel 113; and / or, the heat dissipation assembly 12 includes a second fan 122, which is disposed near the second end 112 in the heat dissipation channel 113 and draws heat out of the cover 11 along the heat dissipation channel 113.

[0051] Specifically, to improve the efficiency of heat dissipation from the heat exhaust channel 113 to the outside of the cover 11, in one embodiment, the heat exhaust assembly 12 of this application includes a first fan 121. The first fan 121 is disposed near the first end 111 within the heat exhaust channel 113, so that the first fan 121 can blow heat out of the cover 11 along the heat exhaust channel 113, quickly removing heat from the vicinity of the heating unit 21, thereby improving the service life and performance of the heating unit 21. In another embodiment, the heat exhaust assembly 12 of this application includes a second fan 122. The second fan 122 is disposed near the second end 112 in the heat exhaust channel 113. The second fan 122 draws heat out of the cover 11 along the heat exhaust channel 113, so that the heat in the heat exhaust channel 113 is discharged by the suction effect provided by the second fan 122. In another embodiment, the present application may also provide a first fan 121 and a second fan 122, respectively disposed near the first end 111 and the second end 112 in the heat exhaust channel 113, so as to further accelerate the heat flow in the heat exhaust channel 113 and improve the heat conduction efficiency.

[0052] like Figure 5As shown, in some embodiments, the cover 11 includes a first cover 114 extending along a first direction A and a second cover 115 extending along a second direction B. The first cover 114 and the second cover 115 are connected to form a heat dissipation channel 113. The second direction B and the first direction A have a preset angle R.

[0053] Specifically, to adapt to the complex structure and space constraints inside electronic devices, the housing 11 of this application may include a first housing 114 extending along a first direction A and a second housing 115 extending along a second direction B. The first housing 114 and the second housing 115 are connected to form a complete heat dissipation channel 113 to meet the arrangement requirements in complex spaces and improve the flexibility of the structure. The first direction A and the second direction B have a preset angle R. Under different preset angles R, the first housing 114 and the second housing 115 can be arranged more flexibly inside the housing to avoid certain components. At the same time, under different preset angles R, the end of the second housing 115, as a heat dissipation outlet, can also meet the opening reservation requirements of the electronic device housing. For example, the preset angle R can be 45°, 60°, 90°, or 135°, etc. Here, the specific value of the preset angle R is not limited.

[0054] like Figure 6 and Figure 7 As shown, in some embodiments, the first cover 114 has at least a first flexible segment 1141; and / or, the second cover 115 has at least a second flexible segment 1151; wherein the first flexible segment 1141 and / or the second flexible segment 1151 can be flexibly extended and retracted to form a heat dissipation channel 113.

[0055] Specifically, to improve the flexibility and adaptability of the heat-conducting component 1, this application can provide that the first cover 114 has at least a first flexible segment 1141, or the second cover 115 has at least a second flexible segment 1151, or the first cover 114 has the first flexible segment 1141 and the second cover 115 has the second flexible segment 1151. Through the flexible and stretchable characteristics provided by the first flexible segment 1141 or the second flexible segment 1151, the cover 11 can be easily integrated into the housing space without changing the original internal structural layout of the electronic device, simplifying installation. Furthermore, the first flexible segment 1141 or the second flexible segment 1151 enables the cover 11 to cope with the arrangement requirements of narrow and complex spaces within the housing, providing a complete heat dissipation channel 113 for heat removal. Moreover, the flexible and stretchable characteristics of the first flexible segment 1141 and the second flexible segment 1151 can also meet the user's need to adjust the layout of the cover 11 according to requirements, thereby changing the path of the heat dissipation channel 113.

[0056] The first flexible section 1141 and the second flexible section 1151 can be made of metal corrugated pipe or silicone hose to provide sufficient flexibility and toughness to meet the needs of different application scenarios. They can also be designed with a folding structure so that when the user wants to change the path of the heat dissipation channel 113, the arrangement position of the cover 11 can be adjusted by extending or retracting the first flexible section 1141 or the second flexible section 1151.

[0057] like Figure 8 As shown, in some embodiments, the first cover 114 has at least a first reduced diameter section 1142; and / or, the second cover 115 has at least a second reduced diameter section 1152; wherein the outer diameter of the first reduced diameter section 1142 and / or the second reduced diameter section 1152 decreases along the extension direction from the first end 111 to the second end 112.

[0058] Specifically, in order to improve the heat dissipation efficiency of the heat dissipation channel of the heat-conducting component 1, the first cover 114 of this application has at least a first diameter reduction section 1142, or the second cover 115 has at least a second diameter reduction section 1152, or the first cover 114 has the first diameter reduction section 1142 while the second cover 115 has the second diameter reduction section 1152. According to the Venturi effect, when the cross-sectional area of ​​the first cover 114 or the second cover 115 decreases, the flow rate of the medium in the heat dissipation channel 113 increases, that is, the air flow rate carrying heat increases, thereby enabling the heat generated by the heating unit 21 to be discharged outside the cover 11 more quickly through the heat dissipation channel 113, thereby improving the heat dissipation efficiency of the heat-conducting component 1.

[0059] Furthermore, the first reduced diameter section 1142 and the second reduced diameter section 1152 provided by the first cover 114 and the second cover 115 in this application can improve heat dissipation efficiency while reducing the power consumption required by the heat dissipation component 12, saving energy and reducing noise. In addition, the reduced diameter design can also reduce the outer edge size of the cover 11, thereby reducing the arrangement space required for the heat conduction component 1.

[0060] In some embodiments, this application may provide a portion of the first cover 114 with a first diameter reduction section 1142, or the outer diameter of the first cover 114 as a whole may decrease along its extension direction. This application may provide a portion of the second cover 115 with a second diameter reduction section 1152, or the outer diameter of the second cover 115 as a whole may decrease along its extension direction. The specific details are not limited.

[0061] In some embodiments, such as Figure 7As shown, this application can reduce the overall outer diameter of the second cover 115 while having a second flexible segment 1151. At the same time, the outer diameter of the second flexible segment 1151 is reduced, which increases the flow rate of the medium in the heat dissipation channel 113 corresponding to the second cover 115, that is, increases the air flow rate carrying heat. This allows the heat generated by the heating unit 21 to be discharged from the cover 11 more quickly through the heat dissipation channel 113, thereby improving the heat dissipation efficiency of the heat conduction component 1.

[0062] like Figure 9 As shown, in some embodiments, the first end 111 of the cover 11 is provided with a connecting seat 116, the connecting seat 116 having a first connecting portion 1161 and a second connecting portion 1162, the second connecting portion 1162 being movably connected to the first connecting portion 1161 to have a different relative positional relationship with respect to the heating unit 21.

[0063] Specifically, in order to enable the cover of the heat-conducting component 1 to be adapted to the size and model of the base of different heating units 21 for assembly and covering, this application provides a connecting seat 116 at the first end 111 of the cover 11. The connecting seat 116 has a first connecting part 1161 and a second connecting part 1162 that are movably connected. The second connecting part 1162 is movably connected to the first connecting part 1161 so that the second connecting part 1162 has different relative positional relationships with the heating unit 21, thereby adapting to the base of heating units 21 of different sizes and models, and improving the flexibility of assembly.

[0064] In one embodiment, the first connecting part 1161 can be a hinge base fixed to the first end 111 of the cover 11, and the second connecting part 1162 is a movable arm connected by a hinge. The movable arm can rotate within a certain angle range and is fixed to the heating unit 21 base by fasteners such as screws and bolts. In another embodiment, a through groove along the length direction can be opened for the movable arm. When the movable arm rotates at a certain angle, the fastener can be engaged at any position in the through groove along the length direction to adapt to the heating unit 21 base of different sizes and models for assembly. In another embodiment, the first connecting part 1161 can also be a sleeve fixed to the first end 111 of the cover 11, and the second connecting part 1162 is a telescopic rod inserted into the sleeve. The telescopic rod can be fixed to the heating unit 21 base by fasteners such as screws and bolts.

[0065] In some embodiments, a target protective layer is provided on the outer wall of the cover 11.

[0066] Specifically, to effectively manage the heat of the heating unit 21 of the electronic device and ensure the stable operation of the electronic device, this application provides a target protective layer on the outer wall of the enclosure 11. In one embodiment, the target protective layer can be a sound-absorbing or sound-insulating material, which, when placed on the outer wall of the enclosure 11, can effectively absorb and block the heat from the heating unit 21 from being discharged through the heat dissipation channel 113 and the noise generated when the heat dissipation component 12 is working, thereby improving the user experience of the electronic device. In another embodiment, the target protective layer can also use a coating or film with good sealing properties to effectively prevent dust from entering the interior of the enclosure 11 and improve the stability of heat dissipation. In yet another embodiment, the target protective layer can also use heat-insulating materials such as aerogel felt or polyurethane foam to form a heat insulation layer on the outer wall of the enclosure 11, thereby reducing the loss of heat inside the enclosure 11 and enabling the heat from the heating unit 21 to be efficiently discharged outside the electronic device, improving the heat dissipation capacity and performance stability of the electronic device. Furthermore, the target protective layer in this application can also be a composite material that can simultaneously achieve sound insulation, dust prevention, and heat insulation, or a multi-layer structure to achieve the above objectives, and is not specifically limited.

[0067] Example 2

[0068] like Figure 1 and Figure 10 As shown, a second aspect of this application provides an electronic device, including a housing 2 and a heat-conducting component 1; a heating unit 21 is disposed inside the housing 2; the heat-conducting component 1 is capable of dissipating the heat of the heating unit 21 to the outside of the housing 2, wherein the heat-conducting component 1 includes: a cover 11 and a heat dissipation component 12; a first end 111 of the cover 11 covers the heating unit 21 of the electronic device, and a second end 112 communicates with the first end 111 to form a heat dissipation channel 113 inside the cover 11; the heat dissipation component 12 is disposed in the heat dissipation channel 113 to dissipate the heat of the heating unit 21 through the heat dissipation channel 113 to the cover 11; wherein the second end 112 is disposed in the housing 2 so that the heat dissipation channel 113 can communicate with the outside of the housing 2, and the heat is dissipated through the heat dissipation channel 113 to the outside of the housing 2 under the action of the heat dissipation component 12.

[0069] For specific details regarding the characteristics of the heat-conducting component 1, please refer to Embodiment 1; they will not be repeated here.

[0070] The electronic device provided in this application has high heat dissipation requirements and can be an IPC (Industrial PC) used for industrial manufacturing, environmental monitoring, etc., or a server such as a data center or cloud computing platform, or a computer host device, or a portable device such as a mobile phone or tablet, etc., with no specific limitations. The heat-generating unit 21 of the electronic device can be a CPU (Central Processing Unit), GPU (Graphics Processing Unit), PSU (Power Supply Unit), etc., with no specific limitations.

[0071] A second aspect of this application provides an electronic device, including a housing 2 and a heat-conducting component 1; a heating unit 21 is disposed inside the housing 2; the heat-conducting component 1 is capable of dissipating the heat of the heating unit 21 to the outside of the housing 2, wherein the heat-conducting component 1 includes: a cover 11 and a heat dissipation component 12; a first end 111 of the cover 11 covers the heating unit 21 of the electronic device, and a second end 112 communicates with the first end 111 to form a heat dissipation channel 113 inside the cover 11; the heat dissipation component 12 is disposed in the heat dissipation channel 113 to dissipate the heat of the heating unit 21 through the heat dissipation channel 113 to the cover 11; wherein the second end 112 is disposed in the housing 2 so that the heat dissipation channel 113 can communicate with the outside of the housing 2, and the heat is dissipated through the heat dissipation channel 113 to the outside of the housing 2 under the action of the heat dissipation component 12. This application covers the heating unit 21 of the electronic device with a cover 11 at its first end 111, concentrating the heat generated inside the cover 11. The heat is then efficiently dissipated outside the cover 11 through the heat dissipation channel 113 formed by the heat dissipation component 12, thereby enabling efficient heat dissipation, improving the lifespan and reliability of the electronic device. This application solves the technical problem of increased power consumption and heat generation in the heating unit 21 inside the electronic device, which affects its performance, safety, and lifespan.

[0072] like Figure 10 As shown, in some embodiments, the heating unit 21 is disposed on the first side 22 inside the housing 2, and the second end 112 of the cover 11 is disposed on the second side 23 of the housing 2. The first side 22 and the second side 23 of the housing 2 are disposed adjacent to each other.

[0073] Specifically, based on the structural layout within the electronic device housing 2, the heating unit 21 is disposed on the first side 22 within the housing 2. In order to shorten the path of the heat dissipation channel 113, reduce the residence time of heat in the heat conduction component 1, and reduce the operating power required by the heat dissipation component 12, this application disposes of the second end 112 of the cover 11 on the second side 23 of the housing 2, so that it is adjacent to the first side 22 through the second side 23, thereby shortening the heat transfer distance and simplifying the space required for the arrangement of the cover 11.

[0074] like Figure 10 As shown, in some embodiments, a second heating unit 25 is also provided inside the housing 2. The second heating unit 25 is located on a third side 24 inside the housing 2 opposite to the second side 23. A first heat dissipation assembly 241 is also provided on the third side 24 of the housing 2. The first heat dissipation assembly 241 blows the heat from the second heating unit 25 toward the second side 23 of the housing 2 and out of the housing 2 through the second side 23. And / or, a third heating unit 26 is also provided inside the housing 2. The third heating unit 26 is located on the second side 23 of the housing 2 at the second end 112 of the cover 11. The third heating unit 26 is connected to a second heat dissipation assembly 261. The second heat dissipation assembly 261 sends the heat from the third heating unit 26 out of the housing 2 through the second side 23.

[0075] Specifically, in one embodiment of this application, in addition to the heating unit 21, the housing 2 also includes a second heating unit 25. The second heating unit 25 is disposed on the third side 24 of the housing 2 opposite to the second side 23. The housing 2 is also provided with a first heat dissipation component 241 on the third side 24. The first heat dissipation component 241 blows the heat from the second heating unit 25 toward the second side 23 of the housing 2 and out of the housing 2 through the second side 23. This allows the heat generated by the heating unit 21 through the heat dissipation channel 113 of the cover 11 and the heat blown out of the second heating unit 25 by the first heat dissipation component 241 to be discharged through the second side 23 of the housing 2. This facilitates the concentration of heat dissipation paths for electronic devices and simplifies the spatial layout within the housing 2. In one embodiment, the second heating unit 25 can be a hard disk drive module, including multiple HDDs (Hard Disk Drives). The first heat dissipation component 241 can be a heat dissipation fan disposed on the third side 24 of the housing 2 to blow heat out of the housing 2 along the direction from the third side 24 to the second side 23.

[0076] In another embodiment of this application, the housing 2 includes a third heating unit 26. The third heating unit 26 is disposed on the second side 23 of the housing 2, spaced apart from the second end 112 of the cover 11. The third heating unit 26 is connected to a second heat dissipation assembly 261, which sends the heat from the third heating unit 26 out of the housing 2 via the second side 23. This allows the heat generated by the heating unit 21 through the heat dissipation channel 113 of the cover 11 and the heat blown out by the third heating unit 26 by the second heat dissipation assembly 261 to be discharged through the second side 23 of the housing 2, which is beneficial for concentrating the heat dissipation path of the electronic device and simplifying the internal space layout of the housing 2. In one embodiment, the third heating unit 26 can be a PSU (Power Supply Unit), which has a built-in heat dissipation fan that serves as the second heat dissipation assembly 261 to send the heat out of the housing 2 via the second side 23. In another embodiment of this application, the housing 2 includes both a second heating unit 25 and a third heating unit 26. Based on the above-mentioned working distance, it is possible to achieve that the heat is discharged from the second side 23 of the housing 2. This will not be repeated here.

[0077] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0078] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. A thermally conductive component, characterized in that, include: A cover, the first end of which is used to cover the heating unit of an electronic device, and the second end of which is connected to the first end to form a heat dissipation channel within the cover; A heat dissipation component is disposed in the heat dissipation channel to dissipate the heat from the heating unit to the cover via the heat dissipation channel.

2. The thermally conductive component according to claim 1, characterized in that, The heat dissipation assembly includes a first fan, which is disposed near the first end in the heat dissipation channel, and blows the heat out of the cover body along the heat dissipation channel. And / or, The heat dissipation assembly includes a second fan, which is disposed near the second end within the heat dissipation channel. The second fan draws the heat out of the cover body along the heat dissipation channel.

3. The thermally conductive component according to claim 1, characterized in that, The cover includes a first cover extending along a first direction and a second cover extending along a second direction, wherein the first cover and the second cover are connected to form the heat dissipation channel; The second direction has a preset angle with the first direction.

4. The thermally conductive component according to claim 3, characterized in that, The first cover has at least a first flexible segment; And / or, The second cover has at least a second flexible segment; The first flexible segment and / or the second flexible segment can be flexibly extended and retracted to form the heat dissipation channel.

5. The thermally conductive component according to claim 3, characterized in that, The first cover body has at least a first diameter reduction section; And / or, The second cover has at least a partial second reduced diameter section; Wherein, the outer diameter of the first reduced diameter section and / or the second reduced diameter section decreases along the extension direction from the first end to the second end.

6. The thermally conductive component according to claim 1, characterized in that, The first end of the cover is provided with a connecting seat, which has a first connecting part and a second connecting part. The second connecting part is movably connected to the first connecting part so as to have a different relative positional relationship with respect to the heating unit.

7. The thermally conductive component according to claim 1, characterized in that, The outer wall of the cover is provided with a target protective layer.

8. An electronic device, characterized in that, include: A housing, wherein a heating unit is disposed within the housing; A heat-conducting component, capable of dissipating heat from the heating unit to the outside of the housing, wherein the heat-conducting component includes: A cover, wherein a first end of the cover is disposed over the heating unit of the electronic device, and a second end is connected to the first end to form a heat dissipation channel within the cover; A heat dissipation assembly is disposed in the heat dissipation channel to dissipate the heat from the heating unit to the cover through the heat dissipation channel; The second end is disposed on the housing so that the heat dissipation channel can connect to the outside of the housing. The heat is discharged from the cover and discharged to the outside of the housing through the heat dissipation channel under the action of the heat dissipation component.

9. The electronic device according to claim 8, characterized in that, The heating unit is disposed on the first side inside the housing, and the second end of the cover is disposed on the second side of the housing. The first side of the housing and the second side of the housing are disposed adjacent to each other.

10. The electronic device according to claim 9, characterized in that, The housing is further provided with a second heating unit, which is located on a third side opposite to the second side inside the housing. The housing is also provided with a first heat dissipation component on the third side, which blows the heat from the second heating unit toward the second side of the housing and out of the housing through the second side. And / or, The housing is further provided with a third heating unit, which is disposed on the second side of the housing at the second end of the cover. The third heating unit is connected to a second heat dissipation component, which sends the heat of the third heating unit out of the housing through the second side.

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