Heat dissipation cold plate adopting efficient heat-conducting medium

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation cold plate adopting a high-efficiency heat-conducting medium, which comprises a first heat dissipation part, a second heat dissipation part, a third heat dissipation part, a fourth heat dissipation part, a third heat dissipation part and a fourth heat dissipation part, and is characterized in that the first heat dissipation part comprises a first substrate, a top of a second substrate, a first flow channel and a second flow channel; the other end of the first flow channel is connected with one end of the second flow channel through a conical flow channel, a water outlet is formed in the other end of the second flow channel, and the water inlet and the water outlet are both formed in the first side face of the first base plate; and the second heat dissipation part is arranged at the bottom of the first heat dissipation part and comprises the bottom of a second substrate and a plurality of conical heat dissipation channels penetrating through the interior of the bottom of the second substrate. According to the utility model, the heat dissipation efficiency and the heat dissipation uniformity are improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation cold plate using a high-efficiency thermally conductive medium. Background Technology

[0002] As electronic devices evolve towards higher performance and greater integration, the power consumption and heat flux density of chips and electronic components have increased significantly. Overheating has become a key factor restricting equipment reliability and lifespan. Traditional heat dissipation methods (such as natural convection and ordinary air cooling) are no longer sufficient to meet the heat dissipation requirements of high heat loads, especially in fields such as aerospace, new energy batteries, 5G communications, high-power LEDs, and high-performance computing, where efficient and compact heat dissipation solutions are urgently needed.

[0003] As a highly efficient active / passive heat dissipation technology, heat dissipation plates utilize internal flow channel design to allow the cooling medium (such as water, ethylene glycol solution, fluorinated liquid, etc.) to flow across the heat source contact surface, rapidly removing heat through convection heat transfer. However, existing heat dissipation plate technologies still face challenges, such as balancing pressure drop and heat transfer uniformity in flow channel design, thermal stress deformation under high power consumption, and stability control under two-phase flow conditions.

[0004] Chinese Patent Publication No. CN208462270U discloses a water-cooled heat dissipation plate, characterized in that it includes: a water inlet section, in which a water inlet channel is provided; a water outlet section, in which a water outlet channel is provided; and a main body section, the thickness of which is thinner than that of the water inlet section and the water outlet section, and the two ends of which are respectively connected to the water inlet section and the water outlet section; and a middle water channel is provided in the main body section, which is connected to the water inlet channel and the water outlet channel to form a cooling water circulation loop.

[0005] However, the existing technology has the following problems: the size of the flow channel is the same from beginning to end in the existing technology, which causes the heat dissipation efficiency of the medium to gradually decrease during the flow process, resulting in uneven heat dissipation. Utility Model Content

[0006] Therefore, this utility model provides a heat dissipation cold plate using a high-efficiency thermally conductive medium to overcome the problems of low heat dissipation efficiency and poor heat dissipation uniformity caused by the uniform design of flow channel dimensions in the prior art.

[0007] To achieve the above objectives, this utility model provides a heat dissipation cold plate using a high-efficiency thermally conductive medium, comprising:

[0008] The first heat dissipation part includes a first substrate, the top of a second substrate, a first flow channel and a second flow channel. One end of the first flow channel is provided with a water inlet, and the other end of the first flow channel is connected to one end of the second flow channel through a tapered flow channel. The other end of the second flow channel is provided with a water outlet. The water inlet and the water outlet are both provided on the first side surface of the first substrate.

[0009] The second heat dissipation part is disposed at the bottom of the first heat dissipation part, and includes the bottom of the second substrate and a plurality of tapered heat dissipation channels penetrating the interior of the bottom of the second substrate.

[0010] Furthermore, the first flow channel and the second flow channel are uniformly arranged in an S-shape between the bottom surface of the first substrate and the top surface of the second substrate, wherein the cross-sectional area of ​​the flow channels in the first substrate and the second substrate is equal.

[0011] Furthermore, the cross-sections of the first flow channel and the second flow channel are circular or rectangular.

[0012] Furthermore, the cross-sectional area of ​​the first flow channel is larger than the cross-sectional area of ​​the second flow channel.

[0013] Furthermore, a temperature sensor is provided on the first side.

[0014] Furthermore, the first substrate and the second substrate have the same length and width, and the thickness of the first substrate is less than the thickness of the second substrate.

[0015] Furthermore, the first substrate and the second substrate are connected by bolts.

[0016] Furthermore, the wide end of the tapered heat dissipation channel is disposed on the second side surface of the second substrate.

[0017] Furthermore, a ventilation section is provided at one end of the second side surface of the second substrate, and the ventilation section is provided with a plurality of cooling fans corresponding to the conical heat dissipation channel.

[0018] Furthermore, the second side and the first side are on the same plane.

[0019] Compared with the prior art, the beneficial effect of this utility model is that by setting up a first flow channel and a second flow channel, a velocity gradient of the medium is constructed, and the heat dissipation efficiency is improved by controlling the flow rate of the medium, thereby achieving uniform heat dissipation.

[0020] Furthermore, this utility model improves heat dissipation efficiency through the design of a double-layer heat dissipation plate. By monitoring the temperature at the water outlet with a temperature sensor, the cooling fan is activated based on the condition that the temperature at the water outlet is greater than or equal to a preset temperature, thus achieving flexible control of heat dissipation. Attached Figure Description

[0021] Figure 1 This is a side view of a heat dissipation cold plate using a high-efficiency thermally conductive medium, according to an embodiment of the present invention.

[0022] Figure 2This is a schematic diagram of the internal structure of the first heat dissipation part in an embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of the internal structure of the second heat dissipation part in an embodiment of the present invention;

[0024] Figure 4 This is a side view of the heat dissipation cold plate using a high-efficiency thermally conductive medium, according to an embodiment of the present invention.

[0025] In the figure: 1. First heat dissipation unit; 11. First substrate; 12. First flow channel; 13. Second flow channel; 14. Water inlet; 15. Conical flow channel; 16. Water outlet; 17. First side surface; 18. Temperature sensor; 2. Second heat dissipation unit; 21. Second substrate; 22. Conical heat dissipation channel; 23. Second side surface; 24. Cooling fan. Detailed Implementation

[0026] To make the objectives, features, and advantages of this utility model more apparent and understandable, the technical solutions in the embodiments of this utility model are clearly and completely described. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0027] It should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0028] In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0030] Please see Figure 1-4These are, respectively, a side view of the heat dissipation cold plate using a high-efficiency thermally conductive medium in an embodiment of the present invention; a schematic diagram of the internal structure of the first heat dissipation part in an embodiment of the present invention; a schematic diagram of the internal structure of the second heat dissipation part in an embodiment of the present invention; and a side view of the heat dissipation cold plate using a high-efficiency thermally conductive medium in an embodiment of the present invention.

[0031] This utility model embodiment uses a heat dissipation cold plate with a high-efficiency thermally conductive medium, including:

[0032] The first heat dissipation part 1 includes a first substrate 11, the top of a second substrate 21, a first flow channel 12 and a second flow channel 13. One end of the first flow channel 12 is provided with a water inlet 14, and the other end of the first flow channel 12 is connected to one end of the second flow channel 13 through a tapered flow channel 15. The other end of the second flow channel 13 is provided with a water outlet 16. The water inlet 14 and the water outlet 16 are both provided on the first side surface 17 of the first substrate 11.

[0033] The second heat dissipation part 2 is disposed at the bottom of the first heat dissipation part 1, including the bottom of the second substrate 21 and a plurality of tapered heat dissipation channels 22 penetrating the interior of the bottom of the second substrate 21.

[0034] Specifically, the first flow channel 12 and the second flow channel 13 are evenly arranged in an S-shape between the bottom surface of the first substrate 11 and the top surface of the second substrate 21. The cross-sectional area of ​​the flow channels in the first substrate 11 and the second substrate 21 is equal. This arrangement increases the contact area between the flow channels and the substrate, ensuring the uniformity of heat dissipation.

[0035] Specifically, the cross-sections of the first flow channel 12 and the second flow channel 13 are circular or rectangular.

[0036] Specifically, the cross-sectional area of ​​the first flow channel 12 is larger than that of the second flow channel 13. The specific cross-sectional area is not limited. With this setting, the flow rate of the medium can be increased by reducing the cross-sectional area of ​​the latter half of the flow channel, thereby avoiding the problem of reduced heat conduction efficiency of the medium during the flow process.

[0037] Specifically, a temperature sensor 18 is provided on the first side 17 to monitor the temperature at the water outlet 16. The cooling fan is turned on when the temperature at the water outlet 16 is greater than or equal to a preset temperature of 45°C.

[0038] In this embodiment of the present invention, the preset temperature is 45°C, but the above value is not limited to this. Those skilled in the art can adjust the value according to actual needs.

[0039] Specifically, the first substrate 11 and the second substrate 21 have the same length and width, and the thickness of the first substrate 11 is less than the thickness of the second substrate 21.

[0040] Specifically, the first substrate 11 and the second substrate 21 are connected by bolts, and the flow channel joint is sealed with sealant.

[0041] Specifically, the wide end of the tapered heat dissipation channel 22 is disposed on the second side surface 23 of the second substrate 21.

[0042] Specifically, a ventilation section is provided at one end of the second side surface 23 of the second substrate 21, and the ventilation section is provided with a plurality of cooling fans 24 corresponding to the conical heat dissipation channel 22.

[0043] Specifically, the second side 23 and the first side 17 are on the same plane.

[0044] For those skilled in the art, based on the ideas of the embodiments of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A heat dissipation cold plate using a high-efficiency thermally conductive medium, characterized in that, include: The first heat dissipation part includes a first substrate, the top of a second substrate, a first flow channel and a second flow channel. One end of the first flow channel is provided with a water inlet, and the other end of the first flow channel is connected to one end of the second flow channel through a tapered flow channel. The other end of the second flow channel is provided with a water outlet. The water inlet and the water outlet are both provided on the first side surface of the first substrate. The second heat dissipation part is disposed at the bottom of the first heat dissipation part, and includes the bottom of the second substrate and a plurality of tapered heat dissipation channels penetrating the interior of the bottom of the second substrate.

2. The heat dissipation cold plate with a high-efficiency thermally conductive medium according to claim 1, characterized in that, The first flow channel and the second flow channel are uniformly arranged in an S-shape between the bottom surface of the first substrate and the top surface of the second substrate, wherein the cross-sectional area of ​​the flow channels in the first substrate and the second substrate is equal.

3. The heat dissipation cold plate with a high-efficiency thermally conductive medium according to claim 2, characterized in that, The cross-sections of the first flow channel and the second flow channel are circular or rectangular.

4. The heat dissipation cold plate with a high-efficiency thermally conductive medium according to claim 3, characterized in that, The cross-sectional area of ​​the first flow channel is larger than that of the second flow channel.

5. The heat dissipation cold plate with a high-efficiency thermally conductive medium according to claim 1, characterized in that, A temperature sensor is provided on the first side.

6. The heat dissipation cold plate with a high-efficiency thermally conductive medium according to claim 1, characterized in that, The first substrate and the second substrate have the same length and width, and the thickness of the first substrate is less than the thickness of the second substrate.

7. The heat dissipation cold plate with a high-efficiency thermally conductive medium according to claim 6, characterized in that, The first substrate and the second substrate are connected by bolts.

8. The heat dissipation cold plate with a high-efficiency thermally conductive medium according to claim 1, characterized in that, The wide end of the tapered heat dissipation channel is located on the second side of the second substrate.

9. The heat dissipation cold plate with a high-efficiency thermally conductive medium according to claim 8, characterized in that, A ventilation section is provided at one end of the second side surface of the second substrate, and the ventilation section is provided with a plurality of cooling fans corresponding to the conical heat dissipation channel.

10. The heat dissipation cold plate with a high-efficiency thermally conductive medium according to claim 8, characterized in that, The second side is on the same plane as the first side.

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