Heat dissipation devices and electronic equipment
By incorporating a storage section and a flow guiding structure into the heat dissipation device, the problem of overflow caused by insufficient or excessive use of heat dissipation gel is solved, achieving efficient heat dissipation and improved equipment reliability.
CN224290443UActive Publication Date: 2026-05-26LENOVO (BEIJING) LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LENOVO (BEIJING) LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-26
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Figure CN224290443U_ABST
Abstract
This disclosure provides a heat dissipation device and an electronic device, wherein the heat dissipation device includes: a heat sink and a storage section; the heat sink has a connection area for connecting a heat sink; the storage section is disposed on the periphery of the heat sink and is correspondingly disposed to the connection area, the storage section is capable of accommodating an overflow portion formed by the heat sink under pressure, wherein the overflow portion is located outside the connection area.
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