Heat dissipation assembly and electronic equipment

Abstract

The utility model discloses a heat dissipation assembly and electronic equipment, and belongs to the technical field of electronic equipment. The heat dissipation assembly comprises a first cover body; the second cover body and the first cover body are enclosed to form a containing cavity, a mounting hole is formed in the second cover body, and the mounting hole penetrates through the second cover body; one part of the fan is arranged on the side, away from the first cover body, of the second cover body and connected to the second cover body so as to seal the mounting hole, and the other part of the fan extends into the containing cavity from the mounting hole.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, specifically to a heat dissipation component and an electronic device. Background Technology

[0002] Electronic devices contain heat-generating components that generate heat during operation. To improve the reliability of electronic devices, it is necessary to dissipate heat from these components.

[0003] In related technologies, a heat-conducting component is provided on one side of the heat source component, and a heat dissipation component is provided on the side of the heat-conducting component away from the heat source component. The heat dissipation component is bonded to the side of the heat-conducting component away from the heat source component using an adhesive layer, so that the heat dissipation component can remove the heat generated by the heat source component. The heat dissipation component includes an upper cover and a lower cover, which together form a receiving cavity. The fan body is disposed within the receiving cavity and is bonded to the lower cover using double-sided adhesive.

[0004] In related technologies, excessively thick heat dissipation components result in a large thickness of electronic devices, affecting their appearance. Utility Model Content

[0005] This utility model discloses a heat dissipation component and an electronic device to solve, or at least partially solve, the problem in the prior art where the heat dissipation component is too thick, resulting in a large thickness of the electronic device and affecting the appearance of the electronic device.

[0006] To solve the above-mentioned technical problems, this utility model is implemented as follows:

[0007] In a first aspect, this utility model discloses a heat dissipation assembly, which includes a first cover; a second cover, the second cover and the first cover forming a receiving cavity, the second cover having a mounting hole that penetrates the second cover; and a fan, a portion of which is disposed on the side of the second cover away from the first cover and connected to the second cover to close the mounting hole, and another portion of which extends into the receiving cavity from the mounting hole.

[0008] Secondly, this utility model discloses an electronic device, which includes an electronic device body and the heat dissipation component described in the first aspect, wherein the heat dissipation component is disposed within the electronic device body.

[0009] This utility model discloses a heat dissipation component and an electronic device. The heat dissipation component includes a first cover; a second cover, which together with the first cover forms a receiving cavity, and the second cover has a mounting hole that penetrates through the second cover; and a fan, a portion of which is disposed on the side of the second cover away from the first cover and connected to the second cover to close the mounting hole, and another portion of which extends into the receiving cavity from the mounting hole.

[0010] The heat dissipation assembly disclosed in this utility model has a mounting hole on the second cover. A portion of the fan is positioned on the side of the second cover away from the first cover and connected to the second cover to close the mounting hole. The other portion of the fan extends into the receiving cavity through the mounting hole. With this arrangement, the second cover can be closed by a portion of the fan, and the other portion of the fan can extend into the receiving cavity through the mounting hole, thus reducing the height of the fan within the receiving cavity 30. This reduces the thickness of the heat dissipation assembly, improves the appearance of the electronic device, and avoids an excessively thick heat dissipation assembly that would result in an excessively thick electronic device. Attached Figure Description

[0011] Figure 1 This diagram illustrates the structure of the fan described in the embodiments of this utility model. Figure 1 ;

[0012] Figure 2 This diagram illustrates the structure of the fan described in the embodiments of this utility model. Figure 2 ;

[0013] Figure 3 This is an exploded view of the heat dissipation component described in an embodiment of the present invention;

[0014] Figure 4 This is a schematic diagram showing the connection method between the fan and the second cover in an embodiment of the present invention;

[0015] Figure 5 This shows a partial cross-sectional view of the electronic device described in an embodiment of the present invention. Figure 1 ;

[0016] Figure 6 This shows a partial cross-sectional view of the electronic device described in an embodiment of the present invention. Figure 2 .

[0017] Figure label:

[0018] 10: First cover;

[0019] 20: Second cover; 21: Mounting hole; 22: Groove; 23: First fixing part;

[0020] 30: Receiving cavity; 31: Opening;

[0021] 40: Fan; 41: Connecting part; 411: Second fixing part; 42: Fan body;

[0022] 50: Adhesive layer;

[0023] 60: Circuit board;

[0024] 70: Seals;

[0025] 80: Anti-backflow mat;

[0026] 90: Bolt;

[0027] 100: Electronic device body. Detailed Implementation

[0028] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0029] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0030] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] Reference Figure 1 The diagram shows the structure of the fan described in the embodiment of this utility model. Figure 1 ;reference Figure 2 The diagram shows the structure of the fan described in the embodiment of this utility model. Figure 2 ;reference Figure 3 An exploded view of the heat dissipation assembly described in an embodiment of this utility model is shown; refer to Figure 4 This diagram illustrates the connection between the fan and the second cover in an embodiment of the present invention; see reference. Figure 5 This shows a partial cross-sectional view of the electronic device described in an embodiment of the present invention. Figure 1 ;reference Figure 6 This shows a partial cross-sectional view of the electronic device described in an embodiment of the present invention. Figure 2 .

[0033] This utility model discloses a heat dissipation assembly, which includes a first cover 10; a second cover 20, which together with the first cover 10 forms a receiving cavity 30, and the second cover 20 is provided with a mounting hole 21 that penetrates the second cover 20; and a fan 40, a part of which is disposed on the side of the second cover 20 away from the first cover 10 and connected to the second cover 20 to close the mounting hole 21, and the other part of which extends into the receiving cavity 30 through the mounting hole 21.

[0034] This utility model discloses a heat dissipation component that can be installed inside an electronic device to dissipate heat. For example, the heat dissipation component can be installed inside a mobile phone to dissipate heat. It can also be installed inside a computer to dissipate heat. Of course, in this embodiment of the utility model, the specific application of the heat dissipation component is not limited. In practical applications, those skilled in the art can configure it as needed.

[0035] The following description will use the example of installing the heat dissipation component inside a mobile phone to dissipate heat from the phone to illustrate the present invention.

[0036] like Figure 3As shown, the heat dissipation assembly disclosed in this embodiment of the present invention includes a first cover 10 and a second cover 20, which are connected together and enclose a receiving cavity 30. The receiving cavity 30 has an opening 31, through which airflow within the receiving cavity 30 can flow out.

[0037] It should be noted that in this embodiment of the present invention, both the first cover 10 and the second cover 20 are metal covers, and the first cover 10 and the second cover 20 can be detachably connected together by bolts. For example, the first cover 10 is provided with a first through hole, and the second cover 20 is provided with a second through hole. Bolts pass through the first through hole and the second through hole to connect the first cover 10 and the second cover 20 together.

[0038] In this embodiment of the invention, the first cover 10 and the second cover 20 are fixed together with bolts to prevent either the first cover 10 or the second cover 20 from warping up, which could lead to a failure of the seal between the first cover 10 and the second cover 20. Furthermore, the first cover 10 and the second cover 20 are metal covers, and connecting the first cover 10 and the second cover 20 together can serve as a grounding mechanism.

[0039] In this embodiment of the invention, a receiving cavity 30 is formed by the first cover 10 and the second cover 20, which can protect the fan 40. Furthermore, the receiving cavity 30 can serve as the air duct of the fan 40, and the receiving cavity 30 has an opening 31, which can serve as the air outlet of the fan 40.

[0040] like Figure 3 As shown, the second cover 20 is provided with a mounting hole 21 that penetrates the second cover 20. That is, along the thickness direction of the second cover 20, the second cover 20 is provided with a mounting hole 21 that penetrates the second cover 20, and the mounting hole 21 is used to install the fan 40.

[0041] like Figure 5 and Figure 6 As shown, a portion of the fan 40 is disposed on the side of the second cover 20 away from the first cover 10 and connected to the second cover 20 to close the mounting hole 21, so as to form an air duct by enclosing the first cover 10 and the second cover 20. The other portion of the fan 40 extends into the receiving cavity 30 from the mounting hole 21.

[0042] For example, the fan 40 includes a connecting plate and a fan body fixedly connected to the connecting plate. The connecting plate is disposed on the side of the second cover 20 away from the first cover 10, and is bonded to the second cover 20 to fix the fan 40 to the second cover 20. The fan body can extend into the receiving cavity 30 through the mounting hole 21, and the fan body can drive the airflow within the receiving cavity 30 to remove the heat generated by the electronic device. The airflow can flow out from the opening 31 of the receiving cavity 30, thereby achieving heat dissipation of the electronic device.

[0043] The heat dissipation assembly disclosed in this embodiment of the present invention has a mounting hole 21 provided on the second cover 20. A portion of the fan 40 is disposed on the side of the second cover 20 away from the first cover 10 and connected to the second cover 20 to close the mounting hole 21. The other portion of the fan 40 extends into the receiving cavity 30 through the mounting hole 21. With the above arrangement, the second cover 20 can be closed by a portion of the fan 40, and the other portion of the fan 40 can extend into the receiving cavity 30 through the mounting hole 21, so that a portion of the fan is located within the mounting hole 21. This reduces the height of the fan within the receiving cavity 30, thereby reducing the thickness of the heat dissipation assembly at the fan location, improving the appearance of the electronic device, and avoiding an excessively thick heat dissipation assembly that would result in an excessively thick electronic device.

[0044] In some embodiments, such as Figure 1 and Figure 2 As shown, the fan 40 includes a connecting part 41, which is disposed on the side of the second cover 20 away from the first cover 10 and connected to the second cover 20 to close the mounting hole 21; and a fan body 42, which is fixedly connected to the connecting part 41 on the side close to the first cover 10, and the fan body 42 extends into the receiving cavity 30 from the mounting hole 21.

[0045] like Figure 1 and Figure 2 As shown, the fan 40 disclosed in this embodiment of the present invention includes a connecting portion 41 and a fan body 42 fixedly connected to the connecting portion 41. The connecting portion 41 can be a connecting plate, which is a complete flat plate without any openings. The connecting plate is connected to the side of the second cover 20 away from the first cover 10, and is disposed opposite to the mounting hole 21 to close the mounting hole 21. In other words, the connecting plate can serve as the cavity wall of the receiving cavity 30, closing the receiving cavity 30, thereby eliminating the need for a fan duct housing and reducing the thickness of the heat dissipation assembly.

[0046] The fan body 42 is fixedly connected to the connecting part 41 on the side near the first cover 10, and the fan body 42 extends into the receiving cavity 30 through the mounting hole 21. It should be noted that the fan body 42 being fixedly connected to the connecting part 41 on the side near the first cover 10 means that the fan body 42 does not move relative to the connecting part 41.

[0047] For example, the fan body 42 and the connecting part 41 are integrally formed, and the fan body 42 is snapped onto the side of the connecting part 41 near the first cover 10. Of course, the above are just individual examples of the specific connection method between the fan body 42 and the connecting part 41, and are not intended to limit the present invention. In practical applications, those skilled in the art can also set the specific connection method between the fan body 42 and the connecting part 41 as needed.

[0048] The heat dissipation assembly disclosed in this embodiment of the utility model has a mounting hole 21 on the second cover 20. A connecting part 41 is disposed on the side of the second cover 20 away from the first cover 10 and connected to the second cover 20 to close the mounting hole 21. The fan body 42 extends into the receiving cavity 30 through the mounting hole 21. This arrangement allows the second cover 20 to be closed by the connecting part 41, and a portion of the fan body 42 to be disposed within the mounting hole 21. This reduces the height of the fan body 42 within the receiving cavity 30, thereby reducing the thickness of the heat dissipation assembly, improving the appearance of the electronic device, and preventing the heat dissipation assembly from being too thick, which would result in an excessively thick electronic device.

[0049] In some embodiments, such as Figure 1 and Figure 2 As shown, the projection of the fan body 42 onto the plane of the connecting part 41 falls into the connecting part 41.

[0050] like Figure 1 and Figure 2 As shown, the projection of the fan body 42 onto the plane of the connecting part 41 falls within the connecting part 41. It can be understood that the connecting part 41 protrudes from the periphery of the fan body 42, forming a skirt structure. Thus, the mounting hole 21 can be closed by the connecting part 41, allowing the connecting part 41 to serve as the cavity wall of the receiving cavity 30, thereby eliminating the need for a fan duct housing and reducing the thickness of the heat dissipation component.

[0051] It should be noted that in this embodiment of the present invention, the size of the connecting part 41 needs to be adapted to the size of the mounting hole 21 so that the connecting part 41 can close the mounting hole 21.

[0052] The projection of the fan body 42 onto the plane of the connecting portion 41 falls into the connecting portion 41, allowing the fan body 42 to extend into the receiving cavity 30 through the mounting hole 21. The fan body 42 can drive airflow within the receiving cavity 30, carrying away the heat generated by the electronic device, and the airflow can exit from the opening 31 of the receiving cavity 30, thereby achieving heat dissipation for the electronic device.

[0053] It should be noted that the cross-sectional area of ​​the fan body 42 in this embodiment of the present invention is smaller than the cross-sectional area of ​​the mounting hole 21, so that the fan body 42 can extend into the receiving cavity 30 from the mounting hole 21.

[0054] In some embodiments, such as Figure 6 As shown, the heat dissipation assembly also includes an adhesive layer 50, which is disposed on the side of the second cover 20 away from the first cover 10. The connecting part 41 is disposed on the side of the adhesive layer 50 away from the second cover 20, and the connecting part 41 is bonded to the second cover 20 through the adhesive layer 50.

[0055] like Figure 6 As shown, an adhesive layer 50 is provided on the side of the second cover 20 away from the first cover 10, and the adhesive layer 50 surrounds the mounting hole 21. The portion of the connecting part 41 that protrudes from the fan body 42 is provided on the side of the adhesive layer 50 away from the second cover 20, so that the connecting part 41 is bonded to the side of the second cover 20 away from the first cover 10 by the adhesive layer 50, thereby fixing the fan 40.

[0056] For example, the second cover 20 has a first planar structure on the side away from the first cover 10, which surrounds the mounting hole 21 and is used to connect one side of the adhesive layer 50. The connecting portion 41 has a second planar structure on the side near the first cover 10, which surrounds the fan body 42 and is used to connect the other side of the adhesive layer 50.

[0057] It should be noted that the adhesive layer 50 in this embodiment can be double-sided tape, or it can be other materials with adhesive properties. In this embodiment, no restrictions are placed on the specific material of the adhesive layer 50. In practical applications, technicians can select the material of the adhesive layer 50 as needed.

[0058] In this embodiment of the present invention, the connecting part 41 is bonded to the side of the second cover 20 away from the first cover 10 by the adhesive layer 50, so as to simplify the manufacturing process of the heat dissipation component, reduce the manufacturing cost of the heat dissipation component, and enhance the market competitiveness of the heat dissipation component.

[0059] In some embodiments, such as Figure 5As shown, a groove 22 is provided on the side of the second cover 20 away from the first cover 10, and the groove 22 surrounds the mounting hole 21. The heat dissipation assembly also includes an adhesive layer 50, which is embedded in the groove 22. A connecting part 41 is connected to the side of the adhesive layer 50 away from the second cover 20, and the connecting part 41 is bonded to the second cover 20 through the adhesive layer 50.

[0060] like Figure 5 As shown, a groove 22 is provided on the side of the second cover 20 away from the first cover 10, and the groove 22 surrounds the mounting hole 21. The adhesive layer 50 is embedded in the groove 22 to limit the adhesive layer 50, prevent the adhesive layer 50 from shifting, and improve the reliability of the heat dissipation component.

[0061] The connecting part 41 is bonded to the side of the adhesive layer 50 away from the second cover 20, so that the connecting part 41 is bonded to the side of the second cover 20 away from the first cover 10 through the adhesive layer 50. This simplifies the manufacturing process of the heat dissipation component, reduces the manufacturing cost of the heat dissipation component, and enhances the market competitiveness of the heat dissipation component.

[0062] In some embodiments, such as Figure 4 As shown, a groove 22 is provided on the side of the second cover 20 away from the first cover 10. The groove 22 surrounds the mounting hole 21. The connecting part 41 is at least partially embedded in the groove 22. The connecting part 41 is detachably connected to the second cover 20.

[0063] like Figure 4 As shown, a groove 22 is provided on the side of the second cover 20 away from the first cover 10, and the groove 22 surrounds the mounting hole 21. The connecting part 41 is at least partially embedded in the groove 22, so as to limit the connecting part 41 by the groove 22, prevent the connecting part 41 from shifting, and improve the reliability of the heat dissipation assembly.

[0064] It should be noted that in this embodiment of the invention, the shape of the connecting part 41 is adapted to the shape of the groove 22. For example, the connecting part 41 can be a quadrilateral plate, and the groove 22 can be a quadrilateral recess, so that the connecting part 41 can be embedded within the groove 22. Specifically, the connecting part 41 can be completely embedded within the groove 22, or it can be partially embedded within the groove 22.

[0065] In one possible implementation, the connecting portion 41 is detachably connected to the second cover 20. Exemplarily, the connecting portion 41 has a first mounting hole, and the second cover 20 has a second mounting hole; bolts pass through the first and second mounting holes to secure the connecting portion 41 and the second cover 20. Alternatively, the connecting portion 41 has a first snap-fit ​​portion, and the second cover 20 has a second snap-fit ​​portion; the first snap-fit ​​portion snaps into the second snap-fit ​​portion to secure the connecting portion 41 and the second cover 20.

[0066] Of course, the above are merely individual examples of specific ways in which the connecting part 41 is detachably connected to the second cover 20, and are not intended to limit the present invention. In practical applications, those skilled in the art can also configure the specific way in which the connecting part 41 is connected to the second cover 20 as needed.

[0067] In this embodiment of the present invention, the connecting part 41 is detachably connected to the second cover 20 to fix the connecting part 41 and the second cover 20, thereby improving the reliability of the connection between the connecting part 41 and the second cover 20 and improving the reliability of the heat dissipation component.

[0068] In some embodiments, such as Figure 4 As shown, the second cover 20 is provided with a plurality of first fixing parts 23 on the side away from the first cover 10, and the plurality of first fixing parts 23 are spaced apart around the mounting hole 21; the connecting part 41 is provided with a plurality of second fixing parts 411, and the plurality of second fixing parts 411 are spaced apart around the connecting part 41, and the second fixing parts 411 are provided in a one-to-one correspondence with the first fixing parts 23, and the second fixing parts 411 are detachably connected to the first fixing parts 23.

[0069] like Figure 4 As shown, a plurality of first fixing parts 23 are provided on the side of the second cover 20 away from the first cover 10. The plurality of first fixing parts 23 are spaced apart around the mounting holes 21. A plurality of second fixing parts 411 are provided on the connecting part 41, and the plurality of second fixing parts 411 are spaced apart around the connecting part 41. The second fixing parts 411 are provided in a one-to-one correspondence with the first fixing parts 23, that is, each second fixing part 411 is provided in a corresponding position to one first fixing part 23. Each second fixing part 411 is provided with a third mounting hole, and each first fixing part 23 is provided with a fourth mounting hole. Bolts 90 are inserted into the third mounting holes and the fourth mounting holes to fix the second fixing parts 411 and the first fixing parts 23, thereby detachably connecting the connecting part 41 to the second cover 20, improving the reliability of the connection between the connecting part 41 and the second cover 20, and improving the reliability of the heat dissipation assembly.

[0070] In some embodiments, such as Figure 1 As shown, the heat dissipation assembly also includes a circuit board 60, which is electrically connected to the fan 40; and a device disposed on the circuit board 60.

[0071] like Figure 1As shown, the heat dissipation assembly disclosed in this embodiment of the present invention also includes a circuit board 60. The circuit board 60 can be a flexible circuit board, with one end electrically connected to the fan body 42 and the other end electrically connected to the motherboard, so as to conduct electricity between the motherboard and the fan body 42 through the flexible circuit board. Alternatively, the circuit board 60 can also be the motherboard, with the motherboard connected to the fan body 42 through the flexible circuit board, to conduct electricity between the motherboard and the fan body 42.

[0072] It should be noted that in this embodiment of the utility model, the components of the fan 40 are set on the circuit board 60 so that the connecting part 41 can be set as a complete board body, avoiding the situation where the components are set on the connecting part 41, which would cause the receiving cavity 30 to be unable to be sealed.

[0073] In some embodiments, such as Figure 3 As shown, the heat dissipation assembly also includes a sealing element 70, which is disposed between the first cover 10 and the second cover 20.

[0074] like Figure 3 As shown in the embodiment of this utility model, a sealing element 70 is provided between the first cover 10 and the second cover 20. The sealing element 70 seals the gap between the first cover 10 and the second cover 20, thereby improving the sealing performance of the receiving cavity 30.

[0075] It should be noted that the sealing element 70 in this embodiment of the present invention can be double-sided adhesive, which is used to bond the first cover 10 to the second cover 20 to seal the gap between the first cover 10 and the second cover 20.

[0076] Of course, in this embodiment of the invention, there are no excessive restrictions on the specific material of the sealing element 70. In practical applications, technicians can select appropriate materials as needed to prepare the sealing element 70.

[0077] In some embodiments, such as Figure 5 and Figure 6 As shown, the heat dissipation assembly also includes a backflow preventer 80, and the receiving cavity 30 has an opening 31, with the backflow preventer 80 disposed at the opening 31.

[0078] like Figure 5 and Figure 6 As shown in the embodiment of this utility model, an anti-backflow pad 80 is provided at the opening 31 of the receiving cavity 30. The anti-backflow pad 80 allows airflow inside the receiving cavity 30 to flow out through the opening 31, while airflow outside the heat dissipation assembly will not flow into the receiving cavity 30 through the opening 31. In other words, the airflow can only move in one direction, thereby improving the heat dissipation performance of the heat dissipation assembly and enhancing the heat dissipation effect of the electronic device.

[0079] It should be noted that the backflow prevention pad 80 in this embodiment of the present invention is a flexible pad. For example, the backflow prevention pad 80 can be a polyester taffeta backflow prevention pad or a nylon taffeta backflow prevention pad. Of course, in this embodiment of the present invention, there are no excessive restrictions on the specific material of the backflow prevention pad 80. In practical applications, those skilled in the art can choose according to their needs.

[0080] This utility model embodiment also discloses an electronic device, which includes an electronic device body 100 and the heat dissipation component described in the above embodiment, wherein the heat dissipation component is disposed within the electronic device body 100.

[0081] The electronic devices disclosed in this utility model embodiment include, but are not limited to, mobile phones, tablets, and laptops. In this utility model embodiment, no excessive restrictions are placed on the specific type of electronic device; in practical applications, technicians can configure it as needed.

[0082] It should be noted that the heat dissipation component of the electronic device disclosed in this utility model embodiment has the same structure as the heat dissipation component described in the above embodiment, and its beneficial effects are also similar, so it will not be repeated here.

[0083] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0084] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipation component, characterized in that, include: First cover; The second cover body, together with the first cover body, forms a receiving cavity. The second cover body is provided with a mounting hole that penetrates the second cover body. A fan, a portion of which is disposed on the side of the second cover away from the first cover and connected to the second cover to close the mounting hole, and another portion of which extends into the receiving cavity from the mounting hole.

2. The heat dissipation assembly according to claim 1, characterized in that, The fan includes: A connecting portion is disposed on the side of the second cover away from the first cover and is connected to the second cover to close the mounting hole; The fan body is fixedly connected to the side of the connecting part near the first cover, and the fan body extends into the receiving cavity through the mounting hole.

3. The heat dissipation assembly according to claim 2, characterized in that, The projection of the fan body onto the plane of the connecting part falls within the connecting part.

4. The heat dissipation assembly according to claim 2, characterized in that, The heat dissipation component also includes: An adhesive layer is disposed on the side of the second cover away from the first cover, and a connecting portion is disposed on the side of the adhesive layer away from the second cover, the connecting portion being bonded to the second cover through the adhesive layer.

5. The heat dissipation assembly according to claim 2, characterized in that, The second cover has a groove on the side away from the first cover, and the groove surrounds the mounting hole. The heat dissipation component also includes: An adhesive layer is embedded in the groove, and the connecting part is connected to the side of the adhesive layer away from the second cover body. The connecting part is bonded to the second cover body through the adhesive layer.

6. The heat dissipation assembly according to claim 2, characterized in that, The second cover has a groove on the side away from the first cover, the groove surrounds the mounting hole, and the connecting part is at least partially embedded in the groove; The connecting part is detachably connected to the second cover.

7. The heat dissipation assembly according to claim 2, characterized in that, The second cover has a plurality of first fixing parts on the side away from the first cover, and the plurality of first fixing parts are spaced apart around the mounting hole; The connecting part is provided with a plurality of second fixing parts, which are spaced apart around the connecting part. The second fixing parts correspond one-to-one with the first fixing parts, and the second fixing parts are detachably connected to the first fixing parts.

8. The heat dissipation assembly according to claim 1, characterized in that, The heat dissipation component also includes: A circuit board, which is electrically connected to the fan; The device is disposed on the circuit board.

9. The heat dissipation assembly according to claim 1, characterized in that, The heat dissipation assembly further includes: a sealing element disposed between the first cover and the second cover; And / or, The heat dissipation assembly further includes: an anti-backflow pad, wherein the receiving cavity has an opening and the anti-backflow pad is disposed at the opening.

10. An electronic device, characterized in that, The electronic device includes an electronic device body and a heat dissipation component as described in any one of claims 1-9, wherein the heat dissipation component is disposed within the electronic device body.

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