Automatic carrying equipment in semiconductor industry

Abstract

The utility model discloses automatic carrying equipment in the semiconductor industry, which belongs to the technical field of semiconductor production and comprises a carrying machine table, material trays are symmetrically arranged on two sides of the upper end of the carrying machine table, a six-axis robot is arranged on one side of the middle of the carrying machine table, and a camera mounting frame is arranged at the bottom end of the six-axis robot. A visual detection module is mounted on one side of the camera mounting frame, a grabbing module is arranged at the bottom end of the other side of the camera mounting frame, sliding rails are symmetrically arranged in the middle of the upper end of the carrying machine table, a detection table is mounted at the upper ends of the sliding rails, and a controller cabinet is arranged on one side in the carrying machine table; according to the utility model, the six-axis robot is arranged to carry semiconductor materials, the carrying, loading and unloading efficiency is remarkably improved through full-automatic operation, the large-scale continuous production requirements are met, and meanwhile, the visual detection module is arranged to be matched with the six-axis robot, so that the accurate grabbing and placing of the materials are ensured, the error control is accurate, and the system operation is stable.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and specifically relates to an automated handling device for the semiconductor industry. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. The conductivity of semiconductor materials can be altered through doping; the concentration and polarity of the impurities incorporated into the semiconductor significantly affect its conductivity. Semiconductors doped with donor impurities primarily exhibit electron-type conductivity in the conduction band, while semiconductors doped with acceptor impurities exhibit hole-type conductivity.

[0003] In current semiconductor manufacturing processes, material handling is typically done manually. This method has the following problems:

[0004] 1. Low efficiency: Due to the limitations of physical strength and working time, manual labor is less efficient, especially under high-load and long-term tasks, where work efficiency will drop significantly; repetitive movements such as frequent bending, lifting, and rotating may aggravate physical fatigue and lead to joint wear and tear.

[0005] 2. Low precision: Positional deviations are difficult to avoid during manual handling, which can easily lead to damage or quality problems;

[0006] 3. Poor stability: Long-term manual operation may lead to inconsistencies, affecting the production rhythm;

[0007] 4. High labor costs: The demand for manpower increases significantly in high-intensity handling work. Utility Model Content

[0008] To address the problems mentioned in the background section, this invention provides an automated handling device for the semiconductor industry, characterized by precise and convenient handling.

[0009] To achieve the above objectives, this utility model provides the following technical solution: an automated handling equipment for the semiconductor industry, comprising a handling platform, with material trays symmetrically arranged on both sides of the upper end of the handling platform, a six-axis robot arranged on one side of the middle of the handling platform, a camera mounting bracket arranged at the bottom of the six-axis robot, a vision inspection module installed on one side of the camera mounting bracket, a gripping module arranged at the bottom of the other side of the camera mounting bracket, slide rails symmetrically arranged in the middle of the upper end of the handling platform, an inspection table installed at the upper end of the slide rails, and a controller cabinet arranged on one side of the interior of the handling platform.

[0010] Preferably, the visual inspection module includes an industrial camera, a light source module, and an image processing unit.

[0011] Preferably, the camera mounting bracket has an internal slot corresponding to the industrial camera, and an electric push rod is installed inside the slot.

[0012] Preferably, the testing station includes a cylinder drive unit, an embedded sensor, and a placement platform.

[0013] Preferably, the cylinder drive unit is disposed close to the side wall of the slide rail, and a limit slider is provided at the bottom of the placement platform corresponding to the slide rail.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention utilizes a six-axis robot to handle semiconductor materials, achieving fully automated operation that significantly improves handling and loading / unloading efficiency, adapting to the needs of large-scale continuous production. It also incorporates a vision inspection module that works in conjunction with the six-axis robot to ensure precise material gripping and placement, accurate error control, and stable system operation. This reduces errors caused by human fatigue and operational inconsistencies. The equipment is highly adaptable, supporting various material forms and multi-process requirements, allowing for rapid switching between task types, reducing manual operation, lowering labor costs, optimizing enterprise resource allocation, and ensuring fully automated operation, avoiding safety hazards associated with manual handling and improving equipment safety. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model.

[0017] In the diagram: 1. Six-axis robot; 2. Camera mounting bracket; 3. Vision inspection module; 4. Gripping module; 5. Handling platform; 6. Slide rail; 7. Inspection table; 8. Material tray; 9. Controller cabinet. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1The present invention provides the following technical solution: an automatic handling equipment for the semiconductor industry, including a handling platform 5, with material trays 8 symmetrically arranged on both sides of the upper end of the handling platform 5, a six-axis robot 1 arranged on one side of the middle of the handling platform 5, a camera mounting bracket 2 arranged at the bottom of the six-axis robot 1, a vision inspection module 3 installed on one side of the camera mounting bracket 2, a gripping module 4 arranged at the bottom of the other side of the camera mounting bracket 2, a slide rail 6 symmetrically arranged in the middle of the upper end of the handling platform 5, a detection table 7 installed on the upper end of the slide rail 6, and a controller cabinet 9 arranged on one side inside the handling platform 5.

[0020] Specifically, the visual inspection module 3 includes an industrial camera, a light source module, and an image processing unit.

[0021] By adopting the above technical solution, the industrial camera converts the light signal into an ordered electrical signal and transmits it to the image processing unit. The image processing unit converts the raw electrical signal collected by the industrial camera into an analyzable digital image data and transmits it to the controller cabinet 9 for processing.

[0022] Specifically, the camera mounting bracket 2 has an internal slot corresponding to the industrial camera, and an electric push rod is installed inside the slot.

[0023] By adopting the above technical solution, the position of the industrial camera can be adjusted by an electric push rod, thereby improving the shooting accuracy and ensuring the testing quality of semiconductor raw materials.

[0024] Specifically, the testing station 7 includes a cylinder drive unit, an embedded sensor, and a placement stage.

[0025] By adopting the above technical solution and configuring a cylinder drive unit, the functions of clamping, releasing or detecting the status of materials can be realized. An embedded sensor is used to detect whether the material is in place and to confirm the status of the material.

[0026] Specifically, the cylinder drive unit is set close to the side wall of the slide rail 6, and the bottom of the placement platform is provided with a limit slider corresponding to the slide rail 6.

[0027] By adopting the above technical solutions, the smooth operation of the cylinder drive unit is ensured, thereby guaranteeing the clamping quality of semiconductor materials.

[0028] The working principle and usage process of this utility model are as follows: When semiconductor materials need to be transported, the materials are manually placed on the tray 8 on one side of the upper end of the transport platform 5. Then, the shape, position, direction and state of the materials are identified by the vision detection module 3. The gripping module 4 at one end of the six-axis robot 1 clamps the semiconductor materials and adjusts the operation path and gripping angle autonomously based on the position information provided by the vision detection module 3. The clamped semiconductor materials are then placed on the upper end of the detection platform 7 for detection. The clamping, releasing or state detection functions of the materials are realized through the cylinder drive unit. At the same time, the sensors inside the detection platform 7 are used to detect whether the materials are in place and to confirm the state of the materials. After the semiconductor materials are detected, the materials are classified and located by the vision detection module 3 through the edge finding algorithm or template matching technology, and the data is transmitted to the robot control system. The six-axis robot 1 then transports the materials to the tray 8 on the other side of the upper end of the transport platform 5 for placement.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated handling device for the semiconductor industry, comprising a handling platform (5), characterized in that: The upper sides of the conveying platform (5) are symmetrically provided with material trays (8), a six-axis robot (1) is provided on the middle side of the conveying platform (5), a camera mounting bracket (2) is provided at the bottom of the six-axis robot (1), a vision inspection module (3) is installed on one side of the camera mounting bracket (2), a gripping module (4) is provided at the bottom of the other side of the camera mounting bracket (2), a slide rail (6) is symmetrically provided in the middle of the upper end of the conveying platform (5), a detection table (7) is installed at the upper end of the slide rail (6), and a controller cabinet (9) is provided on one side inside the conveying platform (5).

2. The automated handling equipment for the semiconductor industry according to claim 1, characterized in that: The visual inspection module (3) includes an industrial camera, a light source module, and an image processing unit.

3. The automated handling equipment for the semiconductor industry according to claim 2, characterized in that: The camera mounting bracket (2) has an internal slot corresponding to the industrial camera, and an electric push rod is installed inside the slot.

4. The automated handling equipment for the semiconductor industry according to claim 1, characterized in that: The testing station (7) includes a cylinder drive unit, an embedded sensor, and a placement platform.

5. An automated handling device for the semiconductor industry according to claim 4, characterized in that: The cylinder drive unit is set close to the side wall of the slide rail (6), and the bottom of the placement platform is provided with a limit slider corresponding to the slide rail (6).

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