A turnover device for chip manufacturing production

Abstract

The utility model discloses a turnover device for chip manufacturing production, belonging to the technical field of chip production and manufacturing. It solves the problems that the existing device is difficult to ensure that the bottom surface of the clamped chip and the top surface of the support plate are in the same plane, the position of the support plate is not convenient to adjust, and it is not convenient to support chips at different positions. It includes a bottom plate. A support column is fixedly installed at the rear side of the top surface of the bottom plate. A rotary clamping component is arranged at the top of the support column. A support component is arranged below the rotary clamping component. Through the settings of the second motor, the threaded rod, the slider, the cross plate, the support seat, the capacitive pressure sensor and their connection relationships, the top surface of the support seat can be made to contact the bottom surface of the clamped chip, and then the support seat supports the chip. Through the setting of the capacitive pressure sensor, it is convenient to judge whether the top surface of the support seat contacts the bottom surface of the chip, achieving the purpose of conveniently adjusting the position of the support seat and then supporting chips at different positions.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, specifically a flipping device for chip manufacturing. Background Technology

[0002] A chip is an electronic device that integrates multiple electronic components and their interconnections onto a tiny semiconductor substrate using semiconductor manufacturing processes. It performs functions such as signal processing, data storage, and logical operations, and is a core component of modern electronic devices. During the manufacturing process, chips often need to be flipped over.

[0003] A search revealed that patent application number 202321474011.4 discloses a flipping device for chip manufacturing, comprising a device base plate, a first support, a fixture, a second support, and clamping blocks. The first support is fixed to one side of the top of the device base plate. The fixture is disposed on one side of the first support. The clamping blocks are disposed on both sides inside the fixture. Second telescopic drive members are installed on the outer walls of both sides of the fixture. The output ends of the second telescopic drive members extend into the interior of the fixture and are fixedly connected to the clamping blocks. A rotary drive member is installed on the top of the first support. The output end of the rotary drive member is fixedly connected to the outer wall of the fixture. The second support is fixed to the other side of the top of the device base plate.

[0004] Although the chip manufacturing flipping device uses a side clamping method, which does not obstruct the chip or cause wear on the chip surface, and the first telescopic drive component extends the drive plate to the bottom of the chip to support it, it is difficult to ensure that the bottom surface of the clamped chip and the top surface of the support plate are on the same plane after the chip is clamped by the clamping device. The position of the support plate is not easy to adjust and it is not convenient to support the chip in different positions.

[0005] Therefore, we propose a flipping device for chip manufacturing. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model provides a flipping device for chip manufacturing, which solves the problems of existing devices making it difficult to ensure that the bottom surface of the clamped chip and the top surface of the tray are on the same plane, the inconvenience of adjusting the position of the tray, and the inconvenience of supporting chips in different positions.

[0007] To achieve the above objectives, this utility model is implemented through the following technical solution: a flipping device for chip manufacturing, including a base plate, a support column fixedly installed on the rear side of the top surface of the base plate, and a rotating clamping assembly provided on the top of the support column;

[0008] A support component is provided below the rotary clamping assembly, and an installation groove is provided at the top of the rear side of the support column, and a sliding groove is provided on the front side of the support column.

[0009] The support assembly includes a second motor fixedly installed on the bottom surface of the inner wall of the slide groove. The output end of the second motor is fixedly connected to a threaded rod. The top end of the threaded rod is rotatably installed on the top end of the inner wall of the slide groove through a bearing ring. A slider that is slidably fitted inside the slide groove is threaded onto the outer surface of the threaded rod. A horizontal plate is fixedly installed on the front side of the slider. A support seat is fixedly installed on the top surface of the front end of the horizontal plate.

[0010] Preferably, the support base is bucket-shaped, and a groove is formed in the middle of the top surface of the support base. A capacitive pressure sensor is embedded in the groove, and a silicone pad is adhered to the top surface of the support base. The chip held by the rotating clamping assembly is supported by the top surface of the support base. The pressure of the chip on the top surface of the capacitive pressure sensor can be measured by the support base to determine whether the top surface of the support base is in contact with the bottom surface of the chip.

[0011] Preferably, the rotating clamping assembly includes a first motor fixedly installed on the front sidewall of the mounting slot. The output end of the first motor is fixedly installed with a U-shaped plate through the front sidewall of the mounting slot, wherein the first motor can drive the U-shaped plate to rotate.

[0012] Preferably, hydraulic rods are fixedly installed at both ends of the U-shaped plate, and a clamping plate is fixedly installed at the output end of the hydraulic rod through the side wall of the U-shaped plate. A silicone pad is adhered to the surface of the clamping plate. The clamping plate is pushed towards the middle of the U-shaped plate by the hydraulic rods so as to clamp and fix the chip.

[0013] Preferably, a control panel is fixedly installed on the front side of the top surface of the base plate. The second motor, capacitive pressure sensor, first motor, and hydraulic rod are all electrically connected to the control panel. The control panel can control the start and stop of the second motor, capacitive pressure sensor, first motor, and hydraulic rod. The pressure received by the capacitive pressure sensor can be displayed on the control panel. When the pressure received by the capacitive pressure sensor reaches a predetermined value, which can be a range or an exact number, the control panel then controls the second motor to shut down. This is existing technology and will not be described in detail here.

[0014] This invention provides a flipping device for chip manufacturing. It has the following advantages:

[0015] 1. This flipping device for chip manufacturing, through the arrangement of a second motor, threaded rod, slider, horizontal plate, support base, capacitive pressure sensor, and their connection relationships, allows the top surface of the support base to contact the bottom surface of the clamped chip, thereby supporting the chip. The capacitive pressure sensor facilitates the determination of whether the top surface of the support base is in contact with the bottom surface of the chip, achieving the purpose of easily adjusting the position of the support base and supporting chips in different positions. This solves the problems of existing devices that make it difficult to ensure that the bottom surface of the clamped chip and the top surface of the support plate are on the same plane, and that the position of the support plate is inconvenient to adjust and support chips in different positions.

[0016] 2. This chip manufacturing flipping device can clamp and fix the chip inside the chassis through hydraulic rods and clamping plates. The first motor drives the U-shaped plate, hydraulic rods, clamping plates and the clamped chip to flip over, and then the chip is supported again by the support components. It is simple and convenient to use. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the rear structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the rotating clamping assembly structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the support component structure of this utility model.

[0021] In the diagram: 1. Base plate; 2. Support column; 21. Mounting groove; 22. Slide groove; 3. Rotary clamping assembly; 31. First motor; 32. U-shaped plate; 33. Hydraulic rod; 34. Clamping plate; 4. Support assembly; 41. Second motor; 42. Threaded rod; 43. Slider; 44. Horizontal plate; 45. Support base; 46. Capacitive pressure sensor; 5. Control panel. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1:

[0024] like Figure 1-4As shown: The system includes a base plate 1, a support column 2 fixedly mounted on the rear side of the top surface of the base plate 1, a rotating clamping assembly 3 at the top of the support column 2, and a support assembly 4 below the rotating clamping assembly 3. A mounting groove 21 is formed at the top of the rear side of the support column 2, and a sliding groove 22 is formed on the front side of the support column 2. The support assembly 4 includes a second motor 41 fixedly mounted on the bottom surface of the inner wall of the sliding groove 22. A threaded rod 42 is fixedly connected to the output end of the second motor 41. The top of the threaded rod 42 is rotatably mounted on the top of the inner wall of the sliding groove 22 via a bearing ring. A slider 43, which is slidably fitted inside the sliding groove 22, is threaded onto the outer surface of the threaded rod 42. A horizontal plate 44 is fixedly mounted on the front side of the slider 43. The front end of the horizontal plate 44... A support base 45 is fixedly installed on the top surface. The support base 45 is bucket-shaped, and a groove is opened in the middle of the top surface of the support base 45. A capacitive pressure sensor 46 is embedded in the groove. A silicone pad is adhered to the top surface of the support base 45. Through the arrangement of the second motor 41, threaded rod 42, slider 43, horizontal plate 44, support base 45, capacitive pressure sensor 46 and their connection relationship, the top surface of the support base 45 can be made to contact the bottom surface of the chip being clamped. Then the support base 45 supports the chip. The capacitive pressure sensor 46 makes it easy to determine whether the top surface of the support base 45 is in contact with the bottom surface of the chip, so as to facilitate the adjustment of the position of the support base 45 and thus support the chip at different positions.

[0025] Example 2:

[0026] like Figure 1-3 As shown: The rotary clamping assembly 3 includes a first motor 31 fixedly installed on the front side wall of the mounting slot 21. The output end of the first motor 31 passes through the front side wall of the mounting slot 21 and is fixedly installed with a U-shaped plate 32. Hydraulic rods 33 are fixedly installed at both ends of the U-shaped plate 32. The output end of the hydraulic rods 33 passes through the side wall of the U-shaped plate 32 and is fixedly installed with a clamping plate 34. A silicone pad is adhered to the surface of the clamping plate 34. A control panel 5 is fixedly installed on the front side of the top surface of the base plate 1. The second motor 41, the capacitive pressure sensor 46, the first motor 31 and the hydraulic rods 33 are all electrically connected to the control panel 5. The chip can be clamped and fixed inside the chassis by the hydraulic rods 33 and the clamping plate 34. The first motor 31 drives the U-shaped plate 32, the hydraulic rods 33, the clamping plate 34 and the clamped chip to flip over. Then the chip is supported again by the support assembly 4. It is simple and convenient to use.

[0027] The working principle and usage process of this utility model: This flipping device for chip manufacturing is used by placing the chip between two clamping plates 34, then activating the hydraulic rod 33 to push the clamping plates 34 to clamp and fix the chip, and then activating the second motor 41 to drive the threaded rod 42 to rotate. The threaded rod 42 then drives the slider 43 to move along the inner wall of the slide groove 22, so that the horizontal plate 44, the support base 45 and the capacitive pressure sensor 46 can move together with the slider 43 until the top surface of the support base 45 contacts the bottom surface of the clamped chip, thus supporting the chip. The value displayed by the capacitive pressure sensor 46 can determine whether the top surface of the support base 45 is in contact with the bottom surface of the chip. When the value displayed by the capacitive pressure sensor 46 reaches the predetermined value, the second motor 41 is turned off by controlling the control panel 5, so that the support base 45 supports the top surface of the chip.

[0028] When the chip needs to be flipped, the second motor 41 is started to rotate in the opposite direction, which moves the slider 43, the horizontal plate 44, the support base 45 and the capacitive pressure sensor 46 downward. Then the first motor 31 is started to drive the U-shaped plate 32, the hydraulic rod 33, the clamping plate 34 and the clamped chip to flip over. Then the chip is supported again by the support component 4.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0030] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A flipping device for chip manufacturing, comprising a base plate (1), wherein a support column (2) is fixedly installed on the rear side of the top surface of the base plate (1), and a rotating clamping assembly (3) is provided on the top of the support column (2); Its features are: A support assembly (4) is provided below the rotating clamping assembly (3). An installation groove (21) is provided at the top of the rear side of the support column (2), and a sliding groove (22) is provided on the front side of the support column (2). The support assembly (4) includes a second motor (41) fixedly installed on the bottom surface of the inner wall of the slide groove (22). The output end of the second motor (41) is fixedly connected to a threaded rod (42). The top end of the threaded rod (42) is rotatably installed on the top end of the inner wall of the slide groove (22) through a bearing ring. The outer surface of the threaded rod (42) is threaded with a slider (43) that is slidably fitted inside the slide groove (22). A horizontal plate (44) is fixedly installed on the front side of the slider (43). A support seat (45) is fixedly installed on the top surface of the front end of the horizontal plate (44).

2. The flipping device for chip manufacturing according to claim 1, characterized in that: The support base (45) is bucket-shaped, and a groove is provided in the middle of the top surface of the support base (45). A capacitive pressure sensor (46) is embedded in the groove, and a silicone pad is attached to the top surface of the support base (45).

3. The flipping device for chip manufacturing according to claim 2, characterized in that: The rotating clamping assembly (3) includes a first motor (31) fixedly installed on the front side wall of the mounting groove (21), and a U-shaped plate (32) is fixedly installed on the output end of the first motor (31) through the front side wall of the mounting groove (21).

4. The flipping device for chip manufacturing according to claim 3, characterized in that: Hydraulic rods (33) are fixedly installed at both ends of the U-shaped plate (32). A clamping plate (34) is fixedly installed through the side wall of the U-shaped plate (32) at the output end of the hydraulic rod (33). A silicone pad is adhered to the surface of the clamping plate (34).

5. The flipping device for chip manufacturing according to claim 4, characterized in that: A control panel (5) is fixedly installed on the front side of the top surface of the base plate (1). The second motor (41), the capacitive pressure sensor (46), the first motor (31) and the hydraulic rod (33) are all electrically connected to the control panel (5).

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