3D heat spreader and controller
By setting a first protrusion and capillary structure in the three-dimensional heat dissipation plate, the working fluid exchanges and circulates heat in the vertical direction, which solves the problem of insufficient heat dissipation of high computing power chips and achieves a more efficient heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SZ ZHUOYU TECH CO LTD
- Filing Date
- 2025-05-13
- Publication Date
- 2026-05-26
Smart Images
Figure CN224290609U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation device technology, specifically to a three-dimensional heat dissipation plate and controller. Background Technology
[0002] The chipset in the controller generates heat during operation. To ensure the reliability and safety of the controller, heat dissipation of the chipset is generally required. Current heat dissipation structures typically employ a solution of fins / heat sinks + heat spreaders / copper blocks / thermal conductive adhesive.
[0003] However, current heat dissipation structures are insufficient for high-performance chips. This is especially true for automotive domain controllers. As automotive electronics and intelligence continue to increase, the computing power and power consumption of automotive domain controllers are also increasing, leading to a sharp rise in heat generation. Traditional heat dissipation structures cannot achieve the desired cooling effect. Utility Model Content
[0004] To solve at least one of the above problems, according to one aspect of the present invention, a three-dimensional heat spreader is provided.
[0005] The three-dimensional heat spreader includes a top plate with a first protrusion thereon; the first protrusion has a first cavity, which is connected to the first receiving cavity of the three-dimensional heat spreader, and a first capillary structure is provided inside the first cavity.
[0006] Since conventional heat exchangers typically include an evaporation zone and a steam chamber, when the top plate of this application is used on a conventional heat exchanger, the working fluid in the three-dimensional heat exchanger evaporates in the evaporation zone at the bottom of the heat exchanger, passes through the steam chamber, and then rises to the top of the first cavity. The liquid phase flows back through the first capillary structure within the first cavity of the first protrusion, and finally, the steam diffuses into the condensation zone through the steam chamber. Because the top plate of this application has a first protrusion and a first capillary structure in the first cavity of the first protrusion, the heat exchanger of this application is more three-dimensional and can exchange heat in the vertical direction. Compared with conventional heat exchangers, it can utilize more surface area for heat exchange. Moreover, since the first capillary structure provides a specific channel for steam to diffuse into the condensation zone, the liquid can also flow back to the evaporation section along a specific path, thus reducing the resistance to heat transfer and improving heat exchange efficiency without significantly increasing the volume of the heat exchanger.
[0007] In some embodiments, the cross-section of the first protrusion is circular or square. This facilitates the processing of the first protrusion.
[0008] In some embodiments, the three-dimensional heat exchanger further includes a bottom plate, and the bottom plate and top plate are sealed together to form a first receiving cavity for containing the working fluid. A second capillary structure is provided on the side of the bottom plate facing the top plate. When the working fluid is heated in the second capillary structure, it evaporates into vapor and then rises to the top of the first cavity, enabling heat exchange in the vertical direction. Compared with a typical heat exchanger block, it can utilize more surface area for heat exchange. Furthermore, since the first capillary structure provides a specific channel for vapor to diffuse into the condensation zone, the liquid can also flow back to the evaporation section along a specific path, reducing the resistance to heat transfer and improving heat exchange efficiency without significantly increasing the volume of the heat exchanger.
[0009] In some embodiments, the first protrusion is a column or a vertical plate. This facilitates the machining of the first protrusion.
[0010] In some embodiments, at least one of the first capillary structure and the second capillary structure is sintered powder, metal mesh, or microchannels. Thus, when the bottom plate is heated at the heating end, the working fluid can vaporize under the action of the second capillary structure; and the vapor rising to the first protrusion of the top plate can liquefy and flow back to the heating end under the guidance of the first capillary structure.
[0011] In some implementations, the thickness T1 of the bottom of the top plate ranges from 0.5 mm to 3 mm. This ensures both the strength and heat dissipation of the top plate.
[0012] In some embodiments, the height H of the column ranges from 5mm to 30mm. This ensures the quantity and effectiveness of the first capillary structures within the first cavity of the column.
[0013] In some embodiments, when the first protrusion is a column, the diameter D of the column ranges from 3 mm to 10 mm. This ensures the quantity and effectiveness of the first capillary structures within the first cavity of the column.
[0014] In some embodiments, when the first protrusion is a column, the spacing L2 between the columns is not less than 0.7 mm. Thus, by ensuring the number of columns, the number and effectiveness of the first capillary structures within the first cavity of the column are guaranteed.
[0015] In some embodiments, when the first protrusion is a vertical plate, the spacing L3 between the vertical plates is not less than 1.5 mm. Thus, by ensuring the number of vertical plates, the number and effectiveness of the first capillary structures in the first cavity of the vertical plate are guaranteed.
[0016] In some embodiments, when the first protrusion is a vertical plate, the thickness T2 of the vertical plate is not less than 1.5 mm. This ensures the quantity and effectiveness of the first capillary structures in the first cavity of the vertical plate.
[0017] In some embodiments, when the first protrusion is a column, the column is a frustum of a cone, and its diameter is smallest at its base furthest from the top plate. This ensures that when steam enters the first cavity of the column, it makes full contact with the first capillary structure, thus guaranteeing the effectiveness of the first capillary structure.
[0018] In some implementations, the first protrusion is made of copper. This ensures effective heat dissipation from the first protrusion.
[0019] In some embodiments, when the first protrusion is a column, the ratio of the column's height to its diameter is not less than 3. This ensures that the surface area of the first cavity of the column is guaranteed while also guaranteeing the number of columns.
[0020] In some embodiments, when the first protrusion is a vertical plate, the ratio of the height of the vertical plate to the width of its cross-section is not less than 3. This ensures that the surface area of the first cavity of the vertical plate is guaranteed while maintaining the number of vertical plates.
[0021] According to another aspect of this utility model, a controller is provided, comprising: a top cover and a chip; the top cover includes the aforementioned three-dimensional heat dissipation plate, which is disposed on the top cover at a position corresponding to the chip. Thus, the three-dimensional heat dissipation plate can ensure effective heat dissipation for the chip.
[0022] In some implementations, a first through-hole is provided on the top cover at the position corresponding to the chip, and the vapor chamber is used to seal the first through-hole by welding or gluing. This ensures the heat dissipation effect of the vapor chamber without increasing the size of the controller.
[0023] In some implementations, the controller also includes a fan positioned on the side of the top cover opposite to the chip. This allows for further improvement in heat dissipation.
[0024] In some embodiments, the bottom of the top plate of the vapor chamber forms part of the cover body of the upper cover, and the first protrusion forms part of the first heat dissipation feature in the first liquid flow channel of the upper cover; the difference between the height h of the first liquid flow channel and the height of the first protrusion is no greater than 2mm. Therefore, not only can the heat dissipated by the chip be directly conducted to the vapor chamber for heat dissipation, but also, since the first protrusion forms part of the first heat dissipation feature, the height, diameter, and first cavity of the first protrusion can be set relatively large without increasing the overall volume of the controller. Simultaneously, the volume of the first receiving cavity of the vapor chamber can also be set relatively large without increasing the overall volume of the controller, thereby greatly improving heat dissipation efficiency without increasing the volume of the controller; furthermore, the height of the first protrusion can be guaranteed, thereby guaranteeing the number of capillary structures in the first cavity of the first protrusion. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the fluid movement direction structure in a heat exchanger block of existing technology.
[0026] Figure 2 This is a schematic diagram of the disassembly structure of a three-dimensional heat spreader according to one embodiment of the present invention.
[0027] Figure 3 This is a schematic diagram of the top plate according to one embodiment of the present invention;
[0028] Figure 4 for Figure 3 A structural schematic diagram of the top plate from another perspective;
[0029] Figure 5 This is a schematic diagram of the top plate according to another embodiment of the present invention;
[0030] Figure 6 A schematic diagram of the structure of the top cover of a controller in the prior art;
[0031] Figure 7 This is a partial cross-sectional structural diagram of a controller in the prior art;
[0032] Figure 8 A schematic diagram of the structure of the upper cover of the controller according to one embodiment of this utility model;
[0033] Figure 9 This is a partial cross-sectional structural diagram of the controller according to one embodiment of the present invention;
[0034] Figure 10 for Figure 8 A partial structural schematic diagram of the top cover from another perspective;
[0035] Figure 11 This is a schematic diagram of the upper cover of the controller according to another embodiment of the present invention;
[0036] Figure 12 This is a partial cross-sectional structural diagram of the controller according to another embodiment of the present invention;
[0037] Reference numerals: 20, heat spreader; 21, capillary structure; 22, heat flow; 23, condensing medium; 24, heat source; 25, cold end; 30, three-dimensional heat spreader; 31, top plate; 311, first protrusion; 3111, first cavity; 3112, first capillary structure; 312, bottom; 32, base plate; 321, second capillary structure; 40, controller; 41, top cover; 410, cover body; 411, first liquid flow channel; 412, first heat dissipation feature; 413, liquid inlet; 414, liquid outlet; 415, first through hole; 416, first sink; 417, mounting hole; 418, fan exhaust direction; 42, chip; 43, thermally conductive adhesive. Detailed Implementation
[0038] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.
[0039] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising" or "including" include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terminology used herein is generally that commonly used by those skilled in the art; in case of any discrepancy with commonly used terminology, the terminology used herein shall prevail.
[0040] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship between one element or component and another (or other) element or component as shown in the figure. In addition to the orientation shown in the figure, spatial relative terms are intended to include different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein can be interpreted accordingly.
[0041] In this article, the term "vapor chamber" (VC) refers to a highly efficient heat dissipation element whose working principle is based on the gas-liquid phase change of an internal liquid. It typically consists of a sealed cavity filled with a small amount of working liquid (such as deionized water or acetone), and the liquid circulates through capillary structures on its inner walls. When heat from a heat source (such as a CPU or GPU) is conducted to the vapor chamber, the liquid vaporizes in the evaporation zone. The vapor flows to the condensation zone under pressure difference, dissipates heat in the condensation zone, and then recondenses back into liquid, flowing back to the evaporation zone through the capillary structure. Specifically, the liquid recirculation is due to the capillary structure using capillary force to transport the condensed liquid from the low-temperature region to the high-temperature region, ensuring continuous circulation and thus achieving rapid heat conduction and diffusion. A vapor chamber generally includes a shell, working liquid, and capillary structure. The shell can be made of copper, stainless steel, or aluminum alloy. The working liquid can be deionized water or acetone. The capillary structure can be sintered copper powder, copper mesh, or a composite structure. The evaporation and condensation of the working fluid absorb and release a large amount of latent heat, and the heat transfer efficiency is much higher than that of pure copper heat conduction. Moreover, the temperature distribution on the surface of the heat spreader is uniform during the phase change process, which can reduce the problem of local overheating.
[0042] In this article, the "working fluid" is a working medium sealed inside the heat exchanger, typically a low-boiling-point liquid (such as water, ethanol, acetone, etc.). Its core function is to achieve phase change... This enables rapid heat transfer. The working fluid absorbs heat at the evaporation end of the heat spreader and vaporizes. The vapor diffuses to the condensation end, releasing heat, and finally flows back through the capillary structure, forming a cycle.
[0043] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0044] Figures 2 to 4 A three-dimensional heat spreader 30 according to a first embodiment of the present invention is schematically shown.
[0045] like Figure 2 As shown, the three-dimensional heat spreader 30 includes a top plate 31, on which a first protrusion 311 is integrally formed, processed or connected; the first protrusion 311 is integrally formed or processed with a first cavity 3111, the first cavity 3111 is connected to the first receiving cavity of the three-dimensional heat spreader 30, and a first capillary structure 3112 is provided in the first cavity 3111.
[0046] Since a typical heat spreader 20 includes an evaporation zone and a steam chamber (such as...) Figure 1 As shown, the bottom and top plates of the heat exchanger 20 are provided with capillary structures 21 on their respective surfaces. When the bottom plate of the heat exchanger 20 is heated by the heat source 24, the working fluid in the heat exchanger 20 evaporates in the evaporation zone at the bottom of the heat exchanger 20, forming a heat flow 22. This heat flow 22 moves towards the cold end 25 of the heat exchanger 20 (where the top plate is located) through the steam chamber. When the heat flow 22 reaches the top plate of the heat exchanger 20, it undergoes heat exchange to form a condensed working fluid 23. The condensed working fluid 23 flows back to the bottom plate of the heat exchanger 20 (the end where the heat source 24 is located). The working fluid is then heated again by the heat source 24, causing it to form a heat flow 22 that flows towards the cold end 25. Through the circulation of the working fluid between the heat source 24 and the cold end 25, the heat source 24 is cooled. However, in the prior art heat exchanger 20, after the heat flow 22 reaches the cold end, the flow direction is horizontal, and the surface area of the top plate is small, resulting in low heat dissipation efficiency.
[0047] When the top plate 31 of this application is used on a common heat exchanger block 20, a three-dimensional heat exchanger plate 30 is formed. After the working fluid in the three-dimensional heat exchanger plate 30 evaporates in the evaporation zone at the bottom of the three-dimensional heat exchanger plate 30 (i.e., the bottom plate 32 of the three-dimensional heat exchanger plate 30), it can rise to the top of the first cavity 3111 after passing through the steam chamber (first receiving cavity). The liquid phase flows back through the first capillary structure 3112 in the first cavity 3111 of the first protrusion 311, and finally the steam diffuses to the condensation zone through the steam chamber. Because the top plate 31 of this application is provided with the first protrusion 311, and in the first cavity 3111 of the first protrusion 311, the working fluid in the first cavity 3111 of the first protrusion 311... The first capillary structure 3112 is provided in 111, which makes the three-dimensional heat exchange plate 30 of this application more three-dimensional and enables heat exchange in the vertical direction. Compared with the general heat exchange block 20, it can utilize more surface area for heat exchange. Moreover, since the first capillary structure 3112 provides a specific channel for vapor to diffuse into the condensation zone, the liquid can also flow back to the evaporation section along a specific path. This reduces the resistance to heat transfer and can improve the heat exchange efficiency without increasing the volume of the three-dimensional heat exchange plate 30 (the temperature after heat dissipation is more than 3° lower than that of the heat exchange block 20 in the prior art).
[0048] In some embodiments, such as Figure 2 As shown, the three-dimensional heat exchanger 30 also includes a bottom plate 32, which and a top plate 31 are sealed together to form a first receiving cavity for containing the working fluid. A second capillary structure 321 is provided on the side of the bottom plate 32 facing the top plate 31. The working fluid can be, for example, water (e.g., deionized water), methanol, ethanol, n-pentane, HFE7100 (perfluorinated liquid), propylene glycol, etc. When the working fluid is heated in the second capillary structure 321, it evaporates into vapor and then rises to the top of the first cavity 3111, enabling heat exchange in the vertical direction. Compared with a general heat exchanger block 20, it can utilize more surface area for heat exchange. Furthermore, since the first capillary structure 3112 provides a specific channel for vapor to diffuse into the condensation zone, the liquid can also flow back to the evaporation section along a specific path, reducing the resistance to heat transfer and improving heat exchange efficiency without significantly increasing the volume of the three-dimensional heat exchanger 30.
[0049] In some embodiments, at least one of the top plate 31 and the bottom plate 32 is made of materials such as copper, aluminum, stainless steel, titanium alloy, and silicon.
[0050] In some embodiments, at least one of the first capillary structure 3112 and the second capillary structure 321 is sintered powder, metal mesh, or microchannels, so that when the bottom plate 32 is heated at the heating end, the working fluid can be vaporized under the action of the second capillary structure 321; and the vapor rising to the first protrusion 311 of the top plate 31 can be liquefied and flow back to the heating end under the guidance of the first capillary structure 3112.
[0051] In some embodiments, the thickness T1 of the bottom 312 of the top plate 31 is in the range of 0.5mm to 3mm, so as to ensure the strength of the top plate 31 while ensuring the heat dissipation effect of the top plate 31.
[0052] In some embodiments, the first protrusion 311 is made of copper to ensure the heat dissipation effect of the first protrusion 311.
[0053] In some embodiments, continue to refer to Figures 2 to 4 As shown, the first protrusion 311 has a circular cross-section to facilitate its processing. In some embodiments, the first protrusion 311 is a column to facilitate its processing. In some embodiments, the height H of the column ranges from 5mm to 30mm to ensure the quantity and effectiveness of the first capillary structures 3112 in the first cavity 3111 of the column. In some embodiments, the diameter D of the first protrusion 311 is a column ranging from 3mm to 10mm to ensure the quantity and effectiveness of the first capillary structures 3112 in the first cavity 3111 of the column. In some embodiments, the spacing L2 between the first protrusion 311 is not less than 0.7mm to ensure the quantity and effectiveness of the first capillary structures 3112 in the first cavity 3111 of the column by ensuring the quantity of the columns. In some embodiments, the first protrusion 311 is a column, which is a frustum of a cone, and its bottom 312, away from the top plate 31, has the smallest diameter, so that when steam enters the first cavity of the column, it can fully contact the first capillary structure 3112, ensuring the effectiveness of the first capillary structure 3112. In some embodiments, the first protrusion 311 is a column, and the ratio of the height of the column to the diameter of the column is not less than 3, so as to ensure the surface area of the first cavity 3111 of the column while ensuring the number of columns.
[0054] Figure 5 A three-dimensional heat spreader 30 according to a second embodiment of the present invention is schematically shown. The difference between this embodiment and the first embodiment of the three-dimensional heat spreader 30 is that the first protrusion 311 is not a column, nor is its cross-section circular; rather, it is... Figure 5As shown, the first protrusion 311 is a vertical plate. For example, the cross-section of the first protrusion 311 is square to facilitate the processing of the first protrusion 311. In some embodiments, when the first protrusion 311 is a vertical plate, the spacing L3 of the vertical plates is not less than 1.5 mm, so as to ensure the quantity and effect of the first capillary structures 3112 in the first cavity 3111 of the vertical plate by ensuring the quantity of the vertical plates. In some embodiments, when the first protrusion 311 is a vertical plate, the thickness T2 of the vertical plate is not less than 1.5 mm, so as to ensure the quantity and effect of the first capillary structures 3112 in the first cavity 3111 of the vertical plate. In some embodiments, when the first protrusion 311 is a vertical plate, the ratio of the height of the vertical plate to the width of the cross-section of the vertical plate is not less than 3, so as to ensure the surface area of the first cavity 3111 of the vertical plate while ensuring the quantity of the vertical plates.
[0055] Figures 8 to 10 The controller 40 according to a first embodiment of the present invention is shown schematically.
[0056] like Figures 8 to 10 As shown, the controller 40 includes an upper cover 41 and a chip 42. The upper cover includes the aforementioned three-dimensional heat dissipation plate 30, which is disposed on the upper cover 41 at a position corresponding to the chip 42, so as to ensure the heat dissipation effect of the chip 42 through the three-dimensional heat dissipation plate 30.
[0057] In some embodiments, continue to refer to Figures 8 to 10 The upper cover 41 shown has a first through hole 415 at the position corresponding to the chip 42. The three-dimensional heat dissipation plate 30 seals the first through hole 415 by welding or gluing. This ensures the heat dissipation effect of the three-dimensional heat dissipation plate 30 without increasing the size of the controller 40.
[0058] In some embodiments, continue to refer to Figures 8 to 10 As shown, the bottom 312 of the top plate 31 of the three-dimensional heat spreader 30 constitutes part of the cover body 410 of the upper cover 41, and the first protrusion 311 constitutes part of the first heat dissipation feature 412 in the first liquid flow channel 411 of the upper cover 41; the difference between the height h of the first liquid flow channel 411 and the height of the first protrusion 311 is no greater than 2mm. Figure 9The cross-section of the first protrusion 311 indicates that it has a hollow structure. Therefore, not only can the heat emitted by the chip 42 be directly conducted to the three-dimensional heat dissipation plate 30 for heat dissipation, but also, since the first protrusion 311 constitutes a component of the first heat dissipation feature 412, the height, diameter, and first cavity of the first protrusion 311 can be set relatively large without increasing the overall volume of the controller 40. Simultaneously, the volume of the first receiving cavity of the three-dimensional heat dissipation plate 30 can also be set relatively large without increasing the overall volume of the controller 40. Thus, heat dissipation efficiency is greatly improved without increasing the volume of the controller 40. Furthermore, the height of the first protrusion 311 can be guaranteed, thereby ensuring the number of capillary structures in the first cavity 3111 of the first protrusion 311.
[0059] Figures 11 to 12 The controller 40 according to a second embodiment of the present invention is shown schematically. The controller 40 of this embodiment differs from the controller 40 of the first embodiment in that it further includes a fan, which is disposed on the side of the upper cover 41 opposite to the chip 42, so as to further improve the heat dissipation effect.
[0060] In this invention, the connection or installation is a fixed connection unless otherwise specified. A fixed connection can be implemented as a detachable or non-detachable connection commonly used in the prior art. A detachable connection can be implemented using existing technologies, such as threaded connections or keyed connections. A non-detachable connection can also be implemented using existing technologies, such as welding or adhesive bonding.
[0061] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.
Claims
1. A three-dimensional heat spreader (30), characterized in that, Includes a top plate (31) on which a first protrusion (311) is provided; The first protrusion (311) has a first cavity (3111), which is connected to the first receiving cavity of the three-dimensional heat spreader (30), and a first capillary structure (3112) is provided in the first cavity (3111).
2. The three-dimensional heat spreader (30) according to claim 1, characterized in that, The first protrusion (311) has a circular or square cross-section; and / or, It also includes a bottom plate (32), which and the top plate (31) are sealed together to form the first receiving cavity, which is used to contain the working medium. A second capillary structure (321) is provided on the side of the bottom plate (32) facing the top plate (31).
3. The three-dimensional heat spreader (30) according to claim 2, characterized in that, The first protrusion (311) is a column or a vertical plate; and / or, At least one of the first capillary structure (3112) and the second capillary structure (321) is sintered powder, metal mesh or microchannel.
4. The three-dimensional heat spreader (30) according to claim 3, characterized in that, The thickness T1 of the bottom (312) of the top plate (31) ranges from 0.5 mm to 3 mm; and / or, The height H of the column is in the range of 5mm to 30mm.
5. The three-dimensional heat spreader (30) according to claim 3, characterized in that, When the first protrusion (311) is a column, the diameter D of the column ranges from 3mm to 10mm, and the spacing L2 between the columns is not less than 0.7mm; and / or, When the first protrusion (311) is a vertical plate, the spacing L3 of the vertical plates is not less than 1.5mm, and the thickness T2 of the vertical plate is not less than 1.5mm.
6. The three-dimensional heat spreader (30) according to claim 3, characterized in that, When the first protrusion (311) is a column, the column is a frustum, and its diameter is smallest at its base (312) furthest from the top plate (31); and / or, The first protrusion (311) is made of copper.
7. The three-dimensional heat spreader (30) according to any one of claims 3 to 6, characterized in that, When the first protrusion (311) is a column, the ratio of the column's height to its diameter is not less than 3; and / or, When the first protrusion (311) is a vertical plate, the ratio of the height of the vertical plate to the width of the cross-section of the vertical plate is not less than 3.
8. A controller (40), characterized in that, include: Top cover (41), chip (42); The top cover (41) includes a three-dimensional heat spreader (30) as described in any one of claims 1 to 7, the three-dimensional heat spreader (30) being disposed on the top cover (41) at a position corresponding to the chip (42).
9. The controller (40) according to claim 8, characterized in that, The upper cover (41) has a first through hole (415) at the position corresponding to the chip (42), and the three-dimensional heat spreader (30) seals the first through hole (415) by welding or gluing; and / or, It also includes a fan, which is located on the side of the upper cover (41) away from the chip (42).
10. The controller (40) according to any one of claims 8 and 9, characterized in that, The bottom (312) of the top plate (31) of the three-dimensional heat spreader (30) constitutes part of the cover body (410) of the upper cover (41), and the first protrusion (311) constitutes part of the first heat dissipation feature (412) in the first liquid flow channel (411) of the upper cover (41). The difference between the height h of the first liquid flow channel (411) and the height of the first protrusion (311) is no greater than 2 mm.