A power module assembly, controller and electric drive

Abstract

This utility model relates to a power module assembly, including a power circuit PCB layer and a logic circuit PCB layer. The power circuit PCB layer includes a single transistor and a first molding compound. The single transistor includes a substrate, a power chip, several first conductive layers, and a second molding compound. The power chip is mounted on the substrate and electrically connected to it. Several first conductive layers are respectively mounted on the upper surface of the power chip and the upper surface of the substrate, and electrically connected to corresponding pins on the power chip. The lower surface of the substrate and the upper surface of the first conductive layers are exposed outside the second molding compound. The logic circuit PCB layer is mounted on the upper surface of the power circuit PCB layer. This utility model uses a method of encapsulating the chip within a single transistor to solve the problems of difficult process implementation, high cost, and low reliability. It further solves the problem that the performance parameters of the power module, such as inductance and thermal resistance, are difficult to improve due to limitations in the packaging method. This utility model also relates to a controller and an electric drive.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, and in particular to a power module assembly, controller and electric drive. Background Technology

[0002] As a core component of the inverter, the power module's power density, parasitic parameters, and integration level directly affect the performance of the controller and electric drive. By optimizing and improving the power module's packaging scheme, the inverter's weight and size, as well as module efficiency, can be directly affected, resulting in a significant improvement in the vehicle's range and energy efficiency.

[0003] Currently, the power modules used in the main drive inverters of new energy vehicles are limited by their packaging methods, resulting in significant room for improvement in performance parameters such as stray inductance and thermal resistance. Furthermore, future electric drive assemblies will require even higher levels of integration. Patent CN119833504 A describes an AMB substrate embedded in a PCB package to integrate a power module, which can effectively improve power density and reduce module weight and size. However, its chips are exposed, requiring copper plating on the chip surface before packaging and electrical connection, leading to complex manufacturing processes, low reliability, and high costs. Utility Model Content

[0004] The first objective of this utility model patent is to provide a power module assembly that uses a method of packaging the chip first in a single tube to solve the problems of difficult process implementation, high cost, and low reliability. Furthermore, it solves the problem that the performance parameters of the power module, such as inductance and thermal resistance, are difficult to improve due to the limitation of the packaging method.

[0005] A power module assembly includes a power circuit PCB layer and a logic circuit PCB layer;

[0006] The power circuit PCB layer includes a single tube and a first molding compound;

[0007] The first molding compound covers the single tube;

[0008] The single tube includes a substrate, a power chip, several first conductive layers, and a second molding compound.

[0009] The power chip is mounted on the substrate and electrically connected to the substrate;

[0010] Several of the first conductive layers are respectively attached to the upper surface of the power chip and the upper surface of the substrate, and are electrically connected to the corresponding pins on the power chip.

[0011] The second molding compound covers the substrate, the power chip and several first conductive layers, and the lower surface of the substrate and the upper surface of the first conductive layers are exposed outside the second molding compound.

[0012] The logic circuit PCB layer is mounted on the upper surface of the power circuit PCB layer;

[0013] The logic circuit PCB layer is provided with several through holes, all of which penetrate the upper and lower surfaces of the logic circuit PCB layer.

[0014] The through-hole is filled with a conductive medium and is electrically connected to the corresponding first conductive layer through the conductive medium.

[0015] Specifically, the logic circuit PCB layer includes several second conductive layers and several first insulating layers;

[0016] Several second conductive layers and several first insulating layers are alternately arranged from bottom to top.

[0017] Specifically, the upper and lower surfaces of the substrate are both third conductive layers, and the middle layer of the substrate is a second insulating layer.

[0018] Specifically, the material of the second insulating layer is silicon nitride.

[0019] Furthermore, a drive control chip is also provided on the PCB layer of the logic circuit, and the drive control chip is electrically connected to the power chip in the single transistor.

[0020] Preferably, a heat dissipation structure is mounted on the lower surface of the power circuit PCB layer.

[0021] The second objective of this invention is to provide a controller comprising the aforementioned power module assembly.

[0022] The third objective of this invention is to provide an electric drive, including the aforementioned controller.

[0023] Compared with the prior art, the power module assembly, controller, and electric drive of this utility model have the following advantages:

[0024] (1) Improve the integration of controller and electric drive assembly, which has the advantages of high power density, short current path, small stray inductance, low thermal resistance and high efficiency;

[0025] (2) After the chip is packaged in a single tube, it is then embedded into the PCB module, which greatly reduces the process difficulty of embedding the power chip into the module and improves the reliability of the module. Attached Figure Description

[0026] Figure 1 This is a cross-sectional schematic diagram of a power module assembly according to Embodiment 1;

[0027] Figure 2 This is a schematic diagram of the structure of a power module assembly according to Embodiment 1;

[0028] Figure 3This is a schematic diagram of the single tube structure in Example 1;

[0029] Figure 4 This is a cross-sectional schematic diagram of a single tube in Example 1. Detailed Implementation

[0030] The specific embodiments of this utility model patent will be further described in detail below with reference to the accompanying drawings.

[0031] Example 1

[0032] In this embodiment, as Figure 1 and Figure 2 As shown, a power module assembly includes a power circuit PCB layer 1 and a logic circuit PCB layer 2;

[0033] The power circuit PCB layer 1 includes a single tube 3 and a first molding compound 4;

[0034] The first molding compound 4 covers the single tube 3;

[0035] like Figure 3 and Figure 4 As shown, the single tube 3 includes a substrate 5, a power chip 6, several first conductive layers 7, and a second molding compound 8;

[0036] The power chip 6 is mounted on the substrate 5 and electrically connected to the substrate 5;

[0037] A plurality of the first conductive layers 7 are respectively attached to the upper surface of the power chip 6 and the upper surface of the substrate 5, and are connected to the corresponding pin electrical signals on the power chip 6.

[0038] The second molding compound 8 covers the substrate 5, the power chip 6 and several first conductive layers 7, and the lower surface of the substrate 5 and the upper surface of the first conductive layers 7 are exposed outside the second molding compound 8.

[0039] The logic circuit PCB layer 2 is mounted on the upper surface of the power circuit PCB layer 1;

[0040] The logic circuit PCB layer 2 is provided with a plurality of through holes 9, all of which penetrate the upper and lower surfaces of the logic circuit PCB layer 2.

[0041] The through hole 9 is filled with a conductive medium and is electrically connected to the corresponding first conductive layer 7 through the conductive medium.

[0042] Specifically, in this embodiment, the logic circuit PCB layer 2 includes a plurality of second conductive layers 10 and a plurality of first insulating layers 11;

[0043] A plurality of second conductive layers 10 and a plurality of first insulating layers 11 are alternately arranged from bottom to top.

[0044] In this embodiment, the upper and lower surfaces of the substrate 5 are both third conductive layers 12, and the middle layer of the substrate 5 is a second insulating layer 13. Further, the second insulating layer 13 is made of silicon nitride, which has excellent thermal conductivity, a low coefficient of thermal expansion, and excellent mechanical properties.

[0045] In this embodiment, a drive control chip 12 is also provided on the PCB layer 2 of the logic circuit, and the drive control chip 2 is electrically connected to the power chip 6 in the single tube 3.

[0046] In this embodiment, a heat dissipation structure (not shown in the figure) can be attached to the lower surface of the power circuit PCB layer 1 to improve heat dissipation performance.

[0047] Working principle: This utility model provides an embedded PCB power module that improves the integration of the controller and the electric drive. By using PCB lamination and metal vias, the drive control module and the single transistor are electrically connected, shortening the circuit path and reducing stray inductance and thermal resistance. It has the advantages of high power density, short circuit path, low stray inductance, low thermal resistance, simple process, and high reliability.

[0048] Example 2

[0049] A controller comprising the power module assembly described in Embodiment 1.

[0050] Example 3

[0051] An electric drive includes the controller described in Embodiment 2.

[0052] The preferred embodiments of this utility model have been described in detail above, but this utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this utility model, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A power module assembly, characterized in that, Including the power circuit PCB layer and the logic circuit PCB layer; The power circuit PCB layer includes a single tube and a first molding compound; The first molding compound covers the single tube; The single tube includes a substrate, a power chip, several first conductive layers, and a second molding compound. The power chip is mounted on the substrate and electrically connected to the substrate; Several of the first conductive layers are respectively attached to the upper surface of the power chip and the upper surface of the substrate, and are electrically connected to the corresponding pins on the power chip. The second molding compound covers the substrate, the power chip and several first conductive layers, and the lower surface of the substrate and the upper surface of the first conductive layers are exposed outside the second molding compound. The logic circuit PCB layer is mounted on the upper surface of the power circuit PCB layer; The logic circuit PCB layer is provided with several through holes, all of which penetrate the upper and lower surfaces of the logic circuit PCB layer. The through hole is filled with a conductive medium and is electrically connected to the corresponding first conductive layer through the conductive medium.

2. The power module assembly according to claim 1, characterized in that, The logic circuit PCB layer includes several second conductive layers and several first insulating layers; Several second conductive layers and several first insulating layers are alternately arranged from bottom to top.

3. The power module assembly as described in claim 1, characterized in that, The upper and lower surfaces of the substrate are both third conductive layers, and the middle layer of the substrate is a second insulating layer.

4. A power module assembly as described in claim 3, characterized in that, The second insulating layer is made of silicon nitride.

5. A power module assembly according to claim 1, characterized in that, The logic circuit PCB layer is also provided with a drive control chip, which is electrically connected to the power chip in the single transistor.

6. A power module assembly according to claim 1, characterized in that, A heat dissipation structure is attached to the lower surface of the power circuit PCB layer.

7. A controller, characterized in that, Includes the power module assembly as described in any one of claims 1 to 6.

8. An electric drive, characterized in that, Includes the controller as described in claim 7.

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