Semiconductor seal ring with high sealing property

Abstract

This utility model relates to the field of semiconductor sealing, and more particularly to a high-sealing semiconductor sealing ring, comprising a composite sealing body, an adaptive deformation layer, and a sealing component. Through the synergistic effect of the two sealing structures, basic sealing performance can be provided. The two sealing layers are made of materials with different properties. Sealing layer one has good chemical corrosion resistance, while sealing layer two has high elasticity and wear resistance, preventing media leakage. When the pressure inside the sealing cavity is significantly higher than that outside, the medium will enter the guide groove through the surface micro-gap and form a controlled flow inside the guide groove. The adaptive deformation layer is made of fluorosilicone rubber. With the high-pressure medium flowing inside the guide groove, the medium can adjust the pressure distribution according to the changes in system pressure, thereby pushing the matrix material of the adaptive deformation layer to accumulate towards the raised gap, enhancing the sealing contact pressure.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor sealing, and in particular to a semiconductor sealing ring with high sealing performance. Background Technology

[0002] High-sealing semiconductor sealing rings are components used to seal semiconductor objects or parts. Through special structural design and material selection, they achieve efficient sealing, prevent leakage, ensure a stable and clean internal environment for semiconductor equipment, and prevent external impurities, gases, liquids, etc. from intruding and affecting the performance and reliability of semiconductor components.

[0003] Sealing rings are mostly made of elastic materials such as fluororubber and silicone rubber. When installed, they are squeezed by external force, the spacing between molecules inside the material changes, and elastic deformation occurs. This deformation fills the micro gaps in the sealing surface, and the deformation generates a reaction force, which causes the sealing ring to apply pressure to the sealing surface, forming a tight sealing contact surface and preventing the leakage of gas, liquid and other media.

[0004] During the sealing process, pressure may be concentrated in certain local areas while other areas have insufficient pressure. This results in the sealing surfaces not fitting together properly, leaving tiny gaps that can easily cause media leakage. This fails to meet the high precision and high reliability requirements for sealing in semiconductor manufacturing and reduces the sealing effect. Utility Model Content

[0005] To overcome the technical problem of insufficient sealing surface fit, resulting in micro-gaps that can easily cause media leakage and reduce sealing effectiveness.

[0006] The technical solution of this utility model is as follows: a high-sealing semiconductor sealing ring, including a composite sealing body, an adaptive deformation layer and a sealing component. The composite sealing body is composed of a sealing layer one and a sealing layer two. An adaptive deformation layer is provided on the outer side of the sealing layer one and the sealing layer two, and the adaptive deformation layer covers the outer surface of the composite sealing body. A guide groove is provided on the inner side of the adaptive deformation layer, and a protrusion is provided on the surface of the adaptive deformation layer.

[0007] Preferably, the hardness of sealing layer one and sealing layer two are different.

[0008] Preferably, the sealing layer one and the sealing layer two are continuous wavy.

[0009] Preferably, an elastic metal sheet is provided between the first sealing layer and the second sealing layer.

[0010] Preferably, the two sides of the elastic metal sheet abut against one side of sealing layer one and sealing layer two, respectively.

[0011] Preferably, both sealing layer one and sealing layer two are covered with a fireproof layer.

[0012] Preferably, the outer side of the adaptive deformation layer is provided with a sealing groove, and the protruding end abuts against the sealing groove.

[0013] The beneficial effects of this utility model are as follows: Through ingenious structural design and the synergistic effect of two sealing layers, this utility model can provide basic sealing performance. The two sealing layers are made of materials with different properties. Sealing layer one has good chemical corrosion resistance, while sealing layer two has high elasticity and wear resistance, preventing media leakage. When the pressure inside the sealed cavity is significantly higher than that outside, the medium will enter the guide groove through the surface micro-gap and form a controlled flow inside the guide groove. The adaptive deformation layer is made of fluorosilicone rubber. With the high-pressure medium flowing inside the guide groove, the medium can adjust the pressure distribution according to the changes in system pressure, thereby pushing the matrix material of the adaptive deformation layer to accumulate towards the raised gap, enhancing the contact pressure of the seal. Attached Figure Description

[0014] Figure 1 The diagram shown is a three-dimensional structural schematic of this utility model;

[0015] Figure 2 The diagram shown is a cross-sectional perspective view of the present invention.

[0016] Figure 3 The diagram shown is a three-dimensional structural schematic of this utility model;

[0017] Figure 4 The diagram shown is a cross-sectional perspective view of the present invention.

[0018] Figure 5 The diagram shown is a partial three-dimensional structural schematic of this utility model;

[0019] Explanation of reference numerals in the attached drawings: 101, composite sealing body; 102, sealing layer one; 103, sealing layer two; 104, self-adaptive deformation layer; 105, flow guide groove; 106, protrusion; 201, elastic metal sheet; 301, fireproof layer; 401, sealing groove. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Please see Figures 1-5This utility model provides an embodiment of a high-sealing semiconductor sealing ring, comprising a composite sealing body 101, an adaptive deformation layer 104, and a sealing component. The composite sealing body 101 is composed of a first sealing layer 102 and a second sealing layer 103. The adaptive deformation layer 104 is disposed on the outer side of the first sealing layer 102 and the second sealing layer 103, and the adaptive deformation layer 104 covers the outer surface of the composite sealing body 101. A guide groove 105 is disposed on the inner side of the adaptive deformation layer 104, and a protrusion 106 is disposed on the surface of the adaptive deformation layer 104. Through the synergistic effect of the two sealing structures, the composite sealing body 101 composed of the first sealing layer 102 and the second sealing layer 103 can provide high sealing performance. For basic sealing performance, the two sealing layers are made of materials with different properties. Sealing layer 102 has good chemical corrosion resistance, while sealing layer 103 has high elasticity and wear resistance, preventing media leakage. When the pressure inside the sealed cavity is significantly higher than that outside, the medium will enter the guide groove 105 through the surface micro gaps and form a controlled flow inside the guide groove 105. The adaptive deformation layer 104 is made of fluorosilicone rubber. With the high-pressure medium flowing inside the guide groove 105, the medium can adjust the pressure distribution according to the changes in system pressure, thereby pushing the base material of the adaptive deformation layer 104 to accumulate in the gap of the protrusion 106, enhancing the contact pressure of the seal.

[0022] Please see Figures 1-5 In this embodiment, the hardness of sealing layer 102 and sealing layer 103 are different. The space between sealing layer 102 and sealing layer 103 is a continuous wave shape. An elastic metal sheet 201 is provided in the middle between sealing layer 102 and sealing layer 103. The two sides of the elastic metal sheet 201 abut against one side of sealing layer 102 and sealing layer 103, respectively. Due to the different hardness of sealing layer 102 and sealing layer 103, they can resist external pressure and deformation, so that the composite sealing body 101 can withstand a certain pressure and achieve a good sealing effect. The wave-shaped structure enhances the contact area and contact length between sealing layer 102 and sealing layer 103, thereby enhancing the sealing effect. The elastic metal sheet 201 allows the composite sealing body 101 to undergo elastic deformation when subjected to external force, thereby enhancing the compressive strength and stability of the composite sealing body 101 and enhancing the sealing.

[0023] Please see Figures 2-5In this embodiment, the outer surfaces of sealing layer 102 and sealing layer 103 are covered with a fireproof layer 301. A sealing groove 401 is provided on the outer side of the adaptive deformation layer 104. One end of the protrusion 106 abuts against the sealing groove 401. The fireproof layer 301 can better prevent heat from being directly transferred to the interior of the composite sealing body 101, thus protecting the integrity of the structure. The sealing groove 401 and the protrusion 106 on the outer side of the adaptive deformation layer 104 cooperate with each other to further improve the sealing performance.

[0024] During operation, the synergistic effect of the two sealing layers provides basic sealing performance. The two sealing layers are made of materials with different properties: sealing layer 102 has good chemical corrosion resistance, while sealing layer 103 has high elasticity and wear resistance, preventing media leakage. When the pressure inside the sealed cavity is significantly higher than the external pressure, the medium enters the guide groove 105 through surface micro-gap and forms a controlled flow within the guide groove 105. The adaptive deformation layer 104, made of fluorosilicone rubber, allows the high-pressure medium to flow within the guide groove 105. This flow adjusts the pressure distribution according to changes in system pressure, thereby pushing the base material of the adaptive deformation layer 104 to accumulate towards the gap of the protrusion 106, enhancing the sealing contact pressure. The different hardness of sealing layer 102 and sealing layer 103 can resist external pressure and deformation, enabling the composite sealing body 101 to withstand certain pressure while achieving a good sealing effect. The corrugated structure enhances the contact area and contact length between sealing layer 102 and sealing layer 103, thus enhancing the sealing effect. The elastic metal sheet 201 allows the composite sealing body 101 to undergo elastic deformation under external force, enhancing its compressive strength and stability, and improving the seal. The fireproof layer 301 better prevents heat from being directly transferred to the interior of the composite sealing body 101, protecting the integrity of the structure. The sealing groove 401 on the outer side of the adaptive deformation layer 104 cooperates with the protrusion 106 to further improve the sealing performance.

[0025] Through the above steps, the synergistic effect of the two sealing structures can provide basic sealing performance. The two sealing layers are made of materials with different properties. Sealing layer 102 has good chemical corrosion resistance, while sealing layer 103 has high elasticity and wear resistance, preventing media leakage. When the pressure inside the sealed cavity is significantly higher than that outside, the medium will enter the guide groove 105 through the surface micro-gap and form a controlled flow inside the guide groove 105. The adaptive deformation layer 104 is made of fluorosilicone rubber. With the high-pressure medium flowing inside the guide groove 105, the medium can adjust the pressure distribution according to the changes in system pressure, thereby pushing the base material of the adaptive deformation layer 104 to accumulate in the gap of the protrusion 106, enhancing the contact pressure of the seal.

Claims

1. A high-sealing semiconductor sealing ring, comprising a composite sealing body (101), characterized in that: It also includes an adaptive deformation layer (104) and a sealing component. The composite sealing body (101) is composed of a sealing layer one (102) and a sealing layer two (103). An adaptive deformation layer (104) is provided on the outer side of the sealing layer one (102) and the sealing layer two (103), and the adaptive deformation layer (104) covers the outer surface of the composite sealing body (101). A guide groove (105) is provided on the inner side of the adaptive deformation layer (104), and a protrusion (106) is provided on the surface of the adaptive deformation layer (104).

2. The high-sealing semiconductor sealing ring according to claim 1, characterized in that: The hardness of sealing layer one (102) and sealing layer two (103) is different.

3. The high-sealing semiconductor sealing ring according to claim 1, characterized in that: The sealing layer 1 (102) and sealing layer 2 (103) are continuous wavy.

4. The high-sealing semiconductor sealing ring according to claim 1, characterized in that: An elastic metal sheet (201) is provided between the sealing layer one (102) and the sealing layer two (103).

5. A high-sealing semiconductor sealing ring according to claim 4, characterized in that: The two sides of the elastic metal sheet (201) abut against one side of the sealing layer one (102) and the sealing layer two (103), respectively.

6. The high-sealing semiconductor sealing ring according to claim 1, characterized in that: The outer surfaces of sealing layer one (102) and sealing layer two (103) are covered with a fireproof layer (301).

7. A high-sealing semiconductor sealing ring according to claim 1, characterized in that: A sealing groove (401) is provided on the outer side of the adaptive deformation layer (104), and one end of the protrusion (106) abuts against the sealing groove (401).

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