An angle-adjustable wafer cleaning nozzle device

Abstract

The utility model relates to the field of wafer cleaning, specifically relates to an angle adjustable wafer cleaning shower nozzle device, including connecting seat, the connecting seat below is provided with the cleaning shower nozzle, the cleaning shower nozzle below is provided with the rack. The utility model discloses through the stretching of two groups of electric push rod, and the shrink, thereby drives the cleaning shower nozzle below to swing left and right, and simultaneously, the cooperation of gear no.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning, specifically to a wafer cleaning nozzle device with an adjustable angle. Background Technology

[0002] Wafer cleaning is a critical step in the semiconductor manufacturing process. Its core objective is to remove contaminants such as particles, organic matter, metal ions, and natural oxides from the wafer surface through physical, chemical, or mechanical means to ensure that the wafer surface achieves extremely high cleanliness and meets the stringent requirements of subsequent processes.

[0003] A search revealed a utility model patent with publication number CN219616252U, which specifically discloses a wafer cleaning overflow tank and wafer cleaning equipment. The wafer cleaning overflow tank includes a water tank body with an open top; water inlet pipes at least at the bottom and top of the water tank body; the height of the water inlet pipe at the top of the water tank body is lower than the overflow height of the cleaning liquid at the top of the water tank body; each water inlet pipe has multiple spray holes arranged sequentially along its length; each water inlet pipe penetrates the water tank body in a predetermined direction; wherein, the predetermined direction is perpendicular to the direction of the wafer being cleaned when it is placed in the water tank body. In this application, water inlet pipes are provided at both the bottom and top of the water tank body, which can simultaneously spray water to clean the wafer surface, ensuring that the entire surface of the wafer is in a stable water flow field, thus improving the uniformity and comprehensiveness of wafer cleaning.

[0004] Existing wafer cleaning equipment suffers from several drawbacks. The fixed angle of the cleaning nozzles prevents adjustment based on cleaning requirements. Furthermore, the wafers must be secured during cleaning to facilitate nozzle operation, a process typically performed manually, significantly reducing cleaning efficiency.

[0005] Therefore, it is necessary to invent an adjustable-angle wafer cleaning nozzle device to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide an adjustable-angle wafer cleaning nozzle device. By rotating and swinging the cleaning nozzle left and right, a multi-angle adjustment effect can be achieved. Furthermore, the downward movement of the cleaning nozzle can automatically fix the wafer, thereby solving the problems of existing cleaning nozzles not being able to be adjusted to multiple angles and having low cleaning efficiency.

[0007] To achieve the above objectives, the present invention provides the following technical solution: an adjustable-angle wafer cleaning nozzle device, including a connecting base, a cleaning nozzle disposed below the connecting base, and a placement rack disposed below the cleaning nozzle;

[0008] The fixing component located below the connecting seat includes a connecting ring 1. The connecting ring 1 is located below the connecting seat, and multiple sets of hydraulic rods are installed in a ring-shaped arrangement between the connecting ring 1 and the connecting seat.

[0009] The angle adjustment component located below the connector includes a fixed seat. The fixed seat is installed below the connector, and multiple sets of mating seats are installed in a ring on the surface of the fixed seat. Multiple sets of mating seats are also installed in a ring on the inner wall of the connector ring.

[0010] Preferably, the fixing component further includes a second connecting ring, which is disposed below the first connecting ring, and multiple sets of connecting rods are installed in a ring-shaped arrangement between the first connecting ring and the second connecting ring.

[0011] Preferably, a fixing ring is provided below the second connecting ring, and multiple sets of limiting rods are installed in a ring shape above the fixing ring. Multiple sets of limiting grooves are provided in a ring shape below the second connecting ring, and the limiting grooves extend into the connecting rods. The limiting grooves are slidably connected to the corresponding limiting rods, and a spring is attached between the upper part of the inner wall of the limiting groove and the upper part of the limiting rod.

[0012] Preferably, the angle adjustment assembly further includes a docking rod, the surface of which has a sliding cavity, and the sliding cavity is slidably connected to the docking seat on the corresponding fixed seat surface and the inner wall of the connecting ring.

[0013] Preferably, a rotating seat is rotatably connected below the fixed seat, a gear one is sleeved and fixed on the rotating seat, a motor is installed on one side of the fixed seat, a gear two is installed at the output end of the motor, and the gear two meshes with the corresponding gear one.

[0014] Preferably, electric push rods are symmetrically rotatably connected above the cleaning nozzle, and the output ends of both sets of electric push rods are provided with sliding grooves, which are slidably connected to the bottom of the rotating seat.

[0015] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0016] The cleaning nozzle is oscillating left and right by an electric push rod, while the motor rotates the cleaning nozzle through the cooperation of gear one and gear two, thus achieving multi-angle adjustment. The fixing ring and the placement bracket can fix the wafer. Through this structure, the cleaning nozzle can be adjusted to multiple angles during the cleaning process, and the fixing ring and placement bracket can fix the wafer, thereby achieving multi-angle adjustment of the cleaning nozzle and cleaning efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the planed structure of the connecting rod of this utility model;

[0020] Figure 3 This is a schematic diagram of the connection structure between the cleaning nozzle and the rotating base of this utility model;

[0021] Figure 4 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0022] Figure 5 For the present utility model Figure 2 Enlarged structural diagram at point B.

[0023] Explanation of reference numerals in the attached figures:

[0024] 001. Connecting seat; 101. Cleaning nozzle; 102. Placement rack; 002. Fixing assembly; 201. Connecting ring one; 202. Hydraulic rod; 203. Connecting ring two; 204. Connecting rod; 205. Fixing ring; 206. Limiting rod; 207. Limiting groove; 208. Spring; 003. Angle adjustment assembly; 301. Fixing seat; 302. Connecting rod; 303. Slide cavity; 304. Rotating seat; 305. Gear one; 306. Motor; 307. Gear two; 308. Electric push rod; 309. Slide groove; 310. Connecting seat. Detailed Implementation

[0025] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0026] This utility model provides, for example Figure 1-5 An adjustable-angle wafer cleaning nozzle device is shown, including a connecting base 001, a cleaning nozzle 101 disposed below the connecting base 001, and a placement rack 102 disposed below the cleaning nozzle 101.

[0027] The wafer can be cleaned by using the cleaning nozzle 101.

[0028] The fixing component 002 located below the connecting seat 001 includes a connecting ring 201. The connecting ring 201 is located below the connecting seat 001, and multiple sets of hydraulic rods 202 are installed in a ring-shaped arrangement between the connecting ring 201 and the connecting seat 001.

[0029] Multiple sets of hydraulic rods 202 can be used to make the connecting ring 201 move downward below the connecting seat 001.

[0030] The angle adjustment component 003 located below the connecting seat 001 includes a fixing seat 301. The fixing seat 301 is installed below the connecting seat 001. Multiple sets of docking seats 310 are installed in a ring on the surface of the fixing seat 301, and multiple sets of docking seats 310 are also installed in a ring on the inner wall of the connecting ring 201.

[0031] Furthermore, in the above structure, the fixing component 002 also includes a second connecting ring 203, which is disposed below the first connecting ring 201. Multiple sets of connecting rods 204 are installed in a ring arrangement between the first connecting ring 201 and the second connecting ring 203.

[0032] The connecting rod 204 is used to connect and fix the connecting ring 203 and the connecting ring 201.

[0033] Furthermore, in the above structure, a fixing ring 205 is provided below the connecting ring 203, and multiple sets of limiting rods 206 are installed in a ring above the fixing ring 205. Multiple sets of limiting grooves 207 are provided in a ring below the connecting ring 203, and the limiting grooves 207 extend into the connecting rod 204. The limiting grooves 207 are slidably connected to the corresponding limiting rods 206. A spring 208 is attached between the upper part of the inner wall of the limiting groove 207 and the upper part of the limiting rod 206.

[0034] The spring 208 keeps the limiting rod 206 in the limiting groove 207, so that when the hydraulic rod 202 is pushed down, the fixing ring 205 can work with the placement frame 102 to fix the wafer. At this time, the spring 208 can buffer the fixing ring 205 to avoid the problem of wafer compression damage.

[0035] Furthermore, in the above structure, the angle adjustment component 003 also includes a docking rod 302, the surface of which is provided with a sliding cavity 303, and the sliding cavity 303 is slidably connected to the surface of the corresponding fixed seat 301 and the docking seat 310 on the inner wall of the connecting ring 201.

[0036] The sliding cavity 303 on the surface of the docking rod 302 allows the connecting ring 201 to slide within the docking seat 310 as it moves downward.

[0037] Furthermore, in the above structure, a rotating seat 304 is rotatably connected below the fixed seat 301, and a gear 305 is sleeved and fixed on the rotating seat 304. A motor 306 is installed on one side of the fixed seat 301, and a gear 307 is installed at the output end of the motor 306, and the gear 307 meshes with the corresponding gear 305.

[0038] Motor 306 can drive gear 2 307 to rotate, which in turn drives rotating seat 304 to rotate via gear 1 305, thus achieving the rotation effect of rotating seat 304.

[0039] Furthermore, in the above structure, electric push rods 308 are symmetrically rotatably connected above the cleaning nozzle 101. The output ends of the two sets of electric push rods 308 are provided with sliding grooves 309, and the sliding grooves 309 are slidably connected to the bottom of the rotating seat 304.

[0040] By extending and retracting the electric push rod 308, the cleaning nozzle 101 can swing under the rotating seat 304, thereby adjusting the angle of the cleaning nozzle 101. In conjunction with the rotation of the rotating seat 304, multi-angle adjustment of the cleaning nozzle 101 can be achieved.

[0041] The working principle of this practical application is as follows:

[0042] Refer to the instruction manual appendix Figure 1-5 By placing the wafer into the placement rack 102, the hydraulic rod 202 drives the connecting ring 201 to move downward, allowing the connecting ring 203 to enter the placement rack 102, thus fixing the wafer. The cleaning nozzle 101 then cleans the wafer. The extension and retraction of the electric push rod 308 causes the cleaning nozzle 101 to swing left and right below the rotating base 304. Simultaneously, the motor 306 drives the gear 2 307 to rotate, which in turn drives the rotating base 304 to rotate via the gear 1 305, thus achieving multi-angle adjustment of the cleaning nozzle 101. This structure allows for multi-angle adjustment of the cleaning nozzle 101 during the cleaning process. Furthermore, the cooperation between the fixing ring 205 and the placement rack 102 ensures the wafer is fixed, thereby achieving multi-angle adjustment of the cleaning nozzle 101 and improving cleaning efficiency.

[0043] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An adjustable-angle wafer cleaning nozzle device, comprising a connecting base (001), characterized in that: A cleaning nozzle (101) is provided below the connecting seat (001), and a placement rack (102) is provided below the cleaning nozzle (101); The fixing component (002) located below the connecting seat (001) includes a connecting ring (201), which is located below the connecting seat (001). Multiple sets of hydraulic rods (202) are installed in a ring arrangement between the connecting ring (201) and the connecting seat (001). The angle adjustment component (003) located below the connecting seat (001) includes a fixed seat (301). The fixed seat (301) is installed below the connecting seat (001). Multiple sets of docking seats (310) are installed in a ring on the surface of the fixed seat (301), and multiple sets of docking seats (310) are also installed in a ring on the inner wall of the connecting ring (201).

2. The adjustable-angle wafer cleaning nozzle device according to claim 1, characterized in that: The fixing component (002) also includes a second connecting ring (203), which is located below the first connecting ring (201). Multiple sets of connecting rods (204) are installed in a ring between the first connecting ring (201) and the second connecting ring (203).

3. The adjustable-angle wafer cleaning nozzle device according to claim 2, characterized in that: A fixing ring (205) is provided below the second connecting ring (203). Multiple sets of limiting rods (206) are installed in a ring above the fixing ring (205). Multiple sets of limiting grooves (207) are provided in a ring below the second connecting ring (203), and the limiting grooves (207) extend into the connecting rod (204). The limiting grooves (207) are slidably connected to the corresponding limiting rods (206). A spring (208) is attached between the upper part of the inner wall of the limiting groove (207) and the upper part of the limiting rod (206).

4. The adjustable-angle wafer cleaning nozzle device according to claim 1, characterized in that: The angle adjustment assembly (003) further includes a docking rod (302), the surface of which is provided with a sliding cavity (303), and the sliding cavity (303) is slidably connected to the surface of the corresponding fixed seat (301) and the docking seat (310) on the inner wall of the connecting ring (201).

5. The adjustable-angle wafer cleaning nozzle device according to claim 4, characterized in that: A rotating seat (304) is rotatably connected below the fixed seat (301). A gear one (305) is sleeved and fixed on the rotating seat (304). A motor (306) is installed on one side of the fixed seat (301). A gear two (307) is installed at the output end of the motor (306), and the gear two (307) meshes with the corresponding gear one (305).

6. The adjustable-angle wafer cleaning nozzle device according to claim 1, characterized in that: The cleaning nozzle (101) is symmetrically rotatably connected to an electric push rod (308). The output ends of the two sets of electric push rods (308) are provided with a sliding groove (309), and the sliding groove (309) is slidably connected to the bottom of the rotating seat (304).

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