Plasma cleaning machine

Abstract

The utility model relates to a kind of electric plasma cleaning machine, wherein electric plasma cleaning machine includes fixed plate and briquetting, fixed plate is installed in the side of upper cover towards cavity bottom, the side of fixed plate towards cavity bottom is provided with sliding slot, briquetting is installed in sliding slot, briquetting has the first height along vertical direction, substrate has the second height along vertical direction, the distance between fixed plate and the bottom of cavity is equal to the sum of first height and second height.The utility model can install fixed plate and briquetting on upper cover, directly exert pressure on substrate by briquetting, and adjust the position of briquetting by fixed plate, effectively avoid cleaning abnormal situation caused by substrate deformation warping.

Description

Technical Field

[0001] This utility model relates to a semiconductor cleaning device, and more particularly to a plasma cleaning machine. Background Technology

[0002] The description in this section provides only background information related to the disclosure of this utility model and does not constitute prior art.

[0003] Plasma cleaning machines are devices that utilize high-energy particles in plasma (the fourth state of matter) to perform dry, non-destructive cleaning, activation, and modification of substrate surfaces. They generate plasma by exciting gases (such as argon, oxygen, or air) in a vacuum or atmospheric pressure environment. Active components such as free radicals, ions, and electrons interact chemically and physically with the substrate surface, rapidly removing organic contaminants, metal oxide layers, and microparticles, achieving deep cleaning at the molecular level.

[0004] As product manufacturing processes become increasingly demanding, the substrates for flip-chip products are becoming thinner. In the plasma cleaning process, the thinner the substrate material, the greater its deformation, making it more susceptible to discharge anomalies. Currently, in some applications, the substrate thickness is only 0.1mm, and the discharge anomaly alarm rate of plasma cleaning machines is close to 10%, raising concerns about quality.

[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this utility model and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this utility model. Utility Model Content

[0006] The purpose of this invention is to provide a plasma cleaning machine that can apply pressure directly to the substrate by installing a fixing plate and a pressure block on the upper cover, and adjust the position of the pressure block by using the fixing plate, thereby effectively avoiding abnormal cleaning caused by substrate deformation and warping.

[0007] To achieve the above objectives, this utility model discloses a plasma cleaning machine, which includes a cavity. The bottom of the cavity is used to place the substrate to be cleaned, and the top of the cavity includes a top cover. The cavity has an air inlet connected to a gas cylinder and an air outlet for exhausting air.

[0008] The plasma cleaning machine further includes a fixing plate and a pressure block. The fixing plate is installed on the side of the upper cover facing the bottom of the cavity. A groove is provided on the side of the fixing plate facing the bottom of the cavity. The pressure block is installed in the groove. The pressure block has a first height in the vertical direction. The base plate has a second height in the vertical direction. The distance between the fixing plate and the bottom of the cavity is equal to the sum of the first height and the second height.

[0009] As a further description of the above technical solution, the fixing plate is also provided with a waist hole, and the fixing plate is connected to the upper cover by a fastener passing through the waist hole, so that the fixing plate can move horizontally along the extension direction of the waist hole.

[0010] As a further description of the above technical solution, the number of waist holes is two, and the two waist holes extend in parallel directions.

[0011] As a further description of the above technical solution, the fixing plate is made of ceramic.

[0012] As a further description of the above technical solution, the material of the pressing block is set to ceramic.

[0013] As a further description of the above technical solution, two pressure blocks are installed in the groove of the fixing plate, and the two pressure blocks are at the same height.

[0014] As a further description of the above technical solution, the number of combinations of the fixing plate and the pressure block is two, and the two combinations of the fixing plate and the pressure block are mirror images of each other on both sides of the upper cover.

[0015] As a further description of the above technical solution, the pressure block is configured as a cylinder, and the axial length of the cylinder is equal to the first height.

[0016] Based on the above technical solution, the beneficial effects of this utility model are as follows:

[0017] This invention relates to a plasma cleaning machine. By installing a fixing plate and a pressure block on the upper cover, the pressure block directly applies pressure to the substrate, and the fixing plate adjusts the position of the pressure block. This effectively avoids cleaning abnormalities caused by substrate deformation and warping. Specifically, after placing the substrate into the cavity, the fixing plate and pressure block can be directly adjusted so that the pressure block slides to the corresponding position in the groove. This facilitates limiting the deformation of the substrate, preventing excessive local particle accumulation and abnormal discharge caused by deformation of the thin substrate itself during the cleaning process. This results in more stable substrate cleaning.

[0018] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, the drawings provided are for reference and illustration only and are not intended to limit this utility model. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the top cover of a plasma cleaning machine provided in the embodiments of this specification;

[0021] Figure 2 This is a three-dimensional schematic diagram of a plasma cleaning machine provided in the embodiments of this specification;

[0022] Figure 3 This is a frontal view of a plasma cleaning machine provided in the embodiments of this specification;

[0023] In the picture:

[0024] 100. Substrate;

[0025] 1. Cavity;

[0026] 2. Top cover;

[0027] 3. Fixing plate; 31. Slide groove; 32. Waist hole;

[0028] 4. Pressing into blocks. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0030] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0031] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0032] Please see Figure 1-3 This embodiment describes a plasma cleaning machine. The plasma cleaning machine includes a cavity 1. The bottom of the cavity 1 is used to place a substrate 100 to be cleaned. The top of the cavity 1 includes a top cover 2. The cavity 1 has an air inlet connected to a gas cylinder and an air outlet for exhausting air.

[0033] The plasma cleaning machine also includes a fixing plate 3 and a pressure block 4. The fixing plate 3 is installed on the side of the upper cover 2 facing the bottom of the cavity 1. A groove 31 is provided on the side of the fixing plate 3 facing the bottom of the cavity 1. The pressure block 4 is installed in the groove 31. The pressure block 4 has a first height in the vertical direction. The base plate 100 has a second height in the vertical direction. The distance between the fixing plate 3 and the bottom of the cavity 1 is equal to the sum of the first height and the second height.

[0034] With the above structure, during use, the substrate 100 is first placed at the bottom of the cavity 1, and the pressure block 4 in the sliding groove 31 of the fixing plate 3 on the upper cover 2 is adjusted so that the pressure block 4 is aligned with the near geometric center of the substrate 100. The upper cover 2 is then tightened so that the bottom of the pressure block 4 is in contact with or nearly in contact with the top surface of the substrate 100. Then, the cavity 1 is evacuated, and argon gas is injected through the air inlet on one side of the cavity 1 via a gas cylinder, forming a high-voltage alternating electric field inside the cavity 1. The argon gas is vibrated into highly reactive or high-energy ions, which bombard the surface of the substrate 100 from top to bottom to achieve physical etching of the surface of the substrate 100 and react with organic pollutants on the surface of the substrate 100 to form volatile substances. Finally, the internal gases are extracted from the outlet on the other side of the cavity 1 by a vacuum pump, thereby cleaning and activating the surface of the substrate 100 material and improving its water-repellent properties.

[0035] It is worth noting that during the above process, if the material of the substrate 100 has a certain deformation, the more ions accumulate at the highest point of the deformation, the more likely abnormal discharge will occur, and in severe cases, the substrate 100 may be broken down or burned. In this embodiment, since a pressing block 4 is provided on the top of the substrate 100 to abut the substrate in the event that the substrate 100 may warp, the deformation of the substrate 100 is suppressed.

[0036] In other words, in the above embodiments, by installing a fixing plate 3 and a pressure block 4 on the upper cover 2, downward pressure can be applied directly to the substrate 100 using the pressure block 4, and the position of the pressure block 4 can be adjusted using the fixing plate 3. This effectively avoids abnormal cleaning caused by deformation and warping of the substrate 100. Specifically, after the substrate 100 is placed into the cavity 1, the fixing plate 3 and the pressure block 4 can be directly adjusted so that the pressure block 4 slides to the corresponding position of the slide groove 31. This facilitates limiting the deformation of the substrate 100, thus preventing excessive local particle accumulation on the substrate 100 due to deformation of the thin substrate 100 itself during the cleaning process, which could lead to abnormal discharge. This makes the cleaning of the substrate 100 more stable.

[0037] In the above embodiment, the fixing plate 3 is also provided with a waist hole 32. The fixing plate 3 is connected to the upper cover 2 by a fastener passing through the waist hole 32, so that the fixing plate 3 can move horizontally along the extension direction of the waist hole 32. That is to say, the fixing plate 3 in this embodiment can be displaced relative to the extension direction of the waist hole 32 under pushing, and the waist hole 32 limits the above-mentioned movement, so that the fixing plate 3 can be effectively slightly adjusted in the horizontal direction. Specifically, in the above embodiment, there are two waist holes 32, and the extension directions of the two waist holes 32 are parallel. Under the limitation of the two waist holes 32, the sliding displacement direction of the fixing plate 3 relative to the upper cover 2 is limited. In this embodiment, the slide groove 31 extends along the first direction, and the two waist holes 32 are not parallel to the extension direction of the slide groove 31. Therefore, the position of the pressure block 4 on the horizontal plane can be controlled and adjusted to the maximum extent.

[0038] Furthermore, in this embodiment, both the fixing plate 3 and the pressure block 4 are made of ceramic. By using ceramic as the limiting material, a consistent electric field environment can be ensured within the cavity 1, and abnormal discharge can be minimized by using the same materials.

[0039] It is worth noting that the cavity 1 is at high temperature during operation, so the material must be heat-resistant. Ceramic is heat-resistant and will not expand or melt due to high temperature. At the same time, ceramic is an insulating material that can avoid electric field interference, ensure uniform plasma distribution, and the ceramic surface is smooth, making it less likely to adsorb particles or organic matter, thus reducing secondary pollution.

[0040] In another embodiment, two pressure blocks 4 are installed in the groove 31 of the fixing plate 3. The two pressure blocks 4 are at the same height and can provide a stable downward pressure on the same substrate 100. The applied force is more uniform, and the possibility of substrate 100 deformation is avoided to the greatest extent.

[0041] like Figure 1 As shown, there are two combinations of fixing plates 3 and pressing blocks 4, and the two combinations of fixing plates 3 and pressing blocks 4 are mirror images of each other on both sides of the upper cover 2. Therefore, in this embodiment, two mirror images of the substrate 100 can be cleaned in the same cavity 1, or a larger substrate 100 can be cleaned, and the four pressing blocks 4 are used to press it at the four corners of the substrate 100, forming a good stabilizing effect on the rectangular structure.

[0042] In this embodiment, the pressure block 4 is set to a cylindrical shape, and the axial length of the cylinder is equal to the first height. That is to say, the cylindrical pressure block 4 is installed perpendicular to the direction of the substrate 100, so that the friction force on the top surface of the substrate 100 is minimized, thus avoiding accidental scratches.

[0043] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the scope of the patent application of the present utility model. Therefore, all equivalent technical changes made using the contents of the present utility model specification and drawings are included in the scope of the patent application of the present utility model.

[0044] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0045] Although this application has been described by way of examples, those skilled in the art will know that this application has many modifications and variations without departing from the spirit of this application, and it is intended that the appended embodiments include these modifications and variations without departing from this application.

Claims

1. A plasma cleaning machine, the plasma cleaning machine comprising a cavity, the bottom of the cavity for placing a substrate to be cleaned, the top of the cavity including a top cover, the cavity having an air inlet connected to a gas cylinder and an air outlet for exhausting gas, characterized in that, The plasma cleaning machine further includes a fixing plate and a pressure block. The fixing plate is installed on the side of the upper cover facing the bottom of the cavity. A groove is provided on the side of the fixing plate facing the bottom of the cavity. The pressure block is installed in the groove. The pressure block has a first height in the vertical direction. The base plate has a second height in the vertical direction. The distance between the fixing plate and the bottom of the cavity is equal to the sum of the first height and the second height.

2. The plasma cleaning machine according to claim 1, characterized in that: The fixing plate is also provided with a waist hole, and the fixing plate is connected to the upper cover by a fastener passing through the waist hole, so that the fixing plate can move horizontally along the extension direction of the waist hole.

3. The plasma cleaning machine according to claim 2, characterized in that: The number of waist holes is two, and the two waist holes extend in parallel directions.

4. The plasma cleaning machine according to claim 1, characterized in that: The fixing plate is made of ceramic.

5. The plasma cleaning machine according to claim 1, characterized in that: The material of the pressing block is ceramic.

6. The plasma cleaning machine according to claim 1, characterized in that: Two pressure blocks are installed in the groove of the fixing plate, and the two pressure blocks are at the same height.

7. The plasma cleaning machine according to claim 6, characterized in that: The number of combinations of the fixing plate and the pressure block is two, and the two combinations of the fixing plate and the pressure block are mirror images arranged on both sides of the upper cover.

8. The plasma cleaning machine according to claim 1, characterized in that: The pressure block is cylindrical, and the axial length of the cylinder is equal to the first height.

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