A multi-material assembly fixture for a PCB

Abstract

The utility model discloses a kind of multi-material assembly jigs for PCB, comprising: base, PCB cavity, rotating pressure head, limiting boss, positioning column, positioning hole, first installation component, second installation component.Through the above mode, a kind of multi-material assembly jigs for PCB of the utility model can satisfy multiple material assembly needs, reduce jig development cost, reduce assembly difficulty and repair rate, improve assembly efficiency and capacity, and utilize multiple structures to realize accurate positioning and fixing of each material, prevent stupid while ensure the relative position between materials, improve assembly accuracy, ensure the consistency and yield of product.

Description

Technical Field

[0001] This utility model relates to the field of PCA assembly technology, and in particular to a multi-material assembly fixture for PCBs. Background Technology

[0002] The PCA assembly process uses several materials, including: heat sink base, transistor electronic components, heat sink, assembly screws, sleeves, and retaining plates.

[0003] Materials must be assembled in a sequential, step-by-step manner, with relative positions between them. Each assembly step must ensure that it does not affect the next step, until the final assembly is completed. Different part numbers of transistors are distinguished by different colors, centered on the PCB mounting holes, to reduce the risk of transistor mixing during component insertion. The current main assembly process is: heatsink base --- transistor --- heatsink --- sleeve --- fixing bracket, thus enabling the installation of various components on the PCB.

[0004] However, current assembly processes still have many shortcomings:

[0005] a. With a wide variety of materials and no auxiliary fixtures for positioning, it is difficult to ensure assembly consistency;

[0006] b. The assembled materials are not fixed, and the screws are manually straightened, which carries the risk of the screws being driven off-center or stripped.

[0007] c. If the alignment of materials cannot be guaranteed, it will affect the final assembly, requiring a lot of time to disassemble and adjust, thus reducing the product yield.

[0008] d. Low production efficiency and long online assembly time create bottlenecks that affect the next stage. Utility Model Content

[0009] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0010] A multi-material assembly fixture for PCBs is provided, comprising: a base, a PCB cavity, a rotating pressure head, a limiting boss, a positioning post, a positioning hole, a first mounting assembly, and a second mounting assembly.

[0011] The base is provided with a PCB cavity for placing and positioning the PCB board to be assembled. The first mounting component and the second mounting component are movably connected to the base. Multiple rotating pressure heads are rotatably arranged around the PCB cavity. The rotating pressure heads are used to press the first mounting component and / or the second mounting component onto the base. The base is also provided with multiple limiting bosses. Each rotating boss is provided with a positioning post. The positioning post is movably connected to the positioning holes on the first mounting component and the second mounting component. The limiting bosses are used to position the height of the first mounting component and / or the second mounting component. The positioning post is used to position the horizontal position of the first mounting component and / or the second mounting component.

[0012] The first mounting assembly includes a first pressure strip seat, a first upper cover pressure strip, a spring pressure head, an adjusting guide post, a heat dissipation mounting limit block, a heat dissipation limiting cavity, an electronic component limiting block, and an electronic component limiting cavity. The heat dissipation mounting limit block is movably disposed above the PCB cavity, with its bottom surface contacting the limiting boss. The heat dissipation mounting limit block is provided with the heat dissipation limiting cavity for positioning and mounting the heat dissipation base and / or heat sink. The electronic component limiting block is disposed between the base and the heat dissipation mounting limit block, and is provided with the electronic component limiting cavity. The first pressure strip seat is disposed on both sides of the base. The first upper cover pressure strip is located above the heat dissipation mounting limit block, and its two ends are movably connected to the first pressure strip seat. The first upper cover pressure strip is provided with a plurality of adjusting guide posts and a spring pressure head movably connected to the adjusting guide posts, so that the spring pressure head moves up and down along the adjusting guide posts to press the heat dissipation mounting limit block.

[0013] The second mounting assembly includes a second pressure strip seat, a second upper cover pressure strip, a positioning cavity, a pin positioning groove, a movable connecting groove, an upper pressure block, a movable limiting groove, a locking screw, and a locking screw hole. The second pressure strip seat is disposed on the base. Both ends of the second upper cover pressure strip are movably connected to the second pressure strip seat, and the top of the second pressure strip seat is provided with the rotating pressure head to press the second upper cover pressure strip onto the second pressure strip seat. The second upper cover pressure strip is provided with a positioning cavity for placing and positioning the main structure of the component to be mounted, and a positioning cavity for placing and positioning the component to be mounted. The pin positioning groove of the component pin is provided, and the positioning cavity is connected above the pin positioning groove. The top of the second upper cover pressure strip is provided with the movable connecting groove that communicates with the positioning cavity. The upper pressure block is movably disposed in the movable connecting groove to extend into or out of the positioning cavity, thereby pressing or releasing the component to be installed. The bottom surface of the movable connecting groove is provided with the locking screw hole. The upper pressure block is provided with the movable limiting groove. The lower end of the locking screw passes through the movable limiting groove and connects to the locking screw hole to lock or unlock the position of the upper pressure block.

[0014] In a preferred embodiment of this utility model, a plurality of columns are provided on the top and bottom surfaces of the base.

[0015] In a preferred embodiment of this utility model, the rotating pressure head is rotatably mounted on the top and bottom surfaces of the base via a rotating shaft.

[0016] In a preferred embodiment of this utility model, the base and the heat dissipation mounting limit block are provided with clearance grooves to facilitate the picking and placing of materials.

[0017] In a preferred embodiment of the present invention, the heat dissipation mounting limiting block includes a heat dissipation base limiting block and a heat dissipation fin limiting block, and the heat dissipation mounting limiting block and the electronic component limiting block are provided with a plurality of positioning holes.

[0018] In a preferred embodiment of the present invention, the two ends of the first upper cover pressure strip are provided with protrusions, and the protrusions are movably connected to the grooves on the first pressure strip seat through a snap-fit ​​structure.

[0019] In a preferred embodiment of this utility model, the adjusting guide post and the first upper cover pressure strip are threadedly connected so as to adjust the up and down position of the adjusting guide post, thereby controlling the movement stroke of the spring pressure head.

[0020] In a preferred embodiment of the present invention, the second pressure strip seat is provided with a slot that is movably connected to the second upper cover pressure strip.

[0021] In a preferred embodiment of this utility model, the movable connecting groove has a waist-shaped structure, which facilitates the back-and-forth movement of the upper pressure block.

[0022] In a preferred embodiment of this utility model, a push-pull handle is provided on one side of the upper pressure block.

[0023] The beneficial effects of this utility model are: it can meet the assembly needs of multiple materials, reduce the cost of fixture development, reduce assembly difficulty and rework rate, improve assembly efficiency and production capacity, and use multiple structures to achieve precise positioning and fixing of each material, preventing mistakes while ensuring the relative position between materials, improving assembly accuracy, and ensuring product consistency and yield. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0025] Figure 1 This is a schematic diagram of a preferred embodiment of a multi-material assembly fixture for PCBs according to the present invention;

[0026] Figure 2 This is a schematic diagram of a preferred embodiment of a multi-material assembly fixture for PCBs according to the present invention;

[0027] Figure 3 This is a schematic diagram of a preferred embodiment of a multi-material assembly fixture for PCBs according to the present invention;

[0028] Figure 4 This is a schematic diagram of a preferred embodiment of a multi-material assembly fixture for PCBs according to the present invention;

[0029] Figure 5 This is a schematic diagram of a preferred embodiment of a multi-material assembly fixture for PCBs according to the present invention;

[0030] Figure 6 This is a partial structural schematic diagram of a preferred embodiment of a multi-material assembly fixture for PCBs according to the present invention. Detailed Implementation

[0031] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0032] Please see Figure 1-6 The embodiments of this utility model include:

[0033] A multi-material assembly fixture for PCBs includes: a base 1, a PCB cavity 2, a rotating pressure head 3, a limiting boss 4, a positioning post 5, a positioning hole, a first mounting component, and a second mounting component.

[0034] The base has a PCB cavity for placing and positioning the PCB board to be assembled. The first mounting component and the second mounting component are movably connected to the base. Multiple rotating pressure heads are rotatably arranged around the PCB cavity. The rotating pressure heads are used to press the first mounting component and / or the second mounting component onto the base. The base also has multiple limiting bosses. Each rotating boss has a positioning post. The positioning post is movably connected to the positioning holes on the first mounting component and the second mounting component. The limiting bosses are used to position the height of the first mounting component and the second mounting component. The positioning post is used to position the horizontal position of the first mounting component and / or the second mounting component.

[0035] Preferably, multiple columns 6 are provided on the top and bottom surfaces of the base to accommodate space requirements during assembly. The diameter of the positioning boss is larger than the diameter of the positioning point.

[0036] In a further preferred embodiment, the rotating pressure head is rotatably mounted on the top and bottom surfaces of the base via a rotating shaft.

[0037] The first mounting assembly includes a first pressure strip seat 71, a first upper cover pressure strip 72, a spring pressure head, an adjusting guide post 73, a heat dissipation mounting limit block 74, a heat dissipation limiting cavity 75, an electronic component limiting block 76, and an electronic component limiting cavity 77.

[0038] The heat dissipation mounting limit block is movably positioned above the PCB cavity, with its bottom surface contacting the limiting boss. The heat dissipation mounting limit block has heat dissipation limiting cavities for positioning and mounting the heat dissipation base and / or heat sink. An electronic component limiting block is positioned between the base and the heat dissipation mounting limit block, and it has multiple electronic component limiting cavities for positioning and mounting electronic components such as transistors. A first pressure strip seat is positioned on both sides of the base, and a first upper cover pressure strip is positioned above the heat dissipation mounting limit block, with both ends movably connected to the first pressure strip seat. The first upper cover pressure strip has multiple adjusting guide posts and spring pressure heads. The springs of the spring pressure heads are wound around the outer circumference of the adjusting guide posts, allowing the pressure head (which has a certain elasticity to prevent damage to the product) to move up and down along the adjusting guide posts under the action of the springs, thereby pressing the heat dissipation mounting limit block.

[0039] Further preferably, the base and the heat dissipation mounting limit block are provided with clearance grooves 78 to facilitate the handling of materials. Further preferably, the heat dissipation mounting limit block includes a heat dissipation base limit block and a heat dissipation fin limit block.

[0040] In a further preferred embodiment, the heat sink base limiting block, the heat sink limiting block, and the electronic component limiting block are provided with multiple positioning holes.

[0041] More preferably, the first upper cover pressure strip has protrusions at both ends, and the protrusions are movably connected to the grooves on the first pressure strip seat through snap-fit ​​structures such as buckles and spring buckles.

[0042] Preferably, the adjusting guide post and the first upper cover pressure strip are threaded together so as to adjust the up and down position of the adjusting guide post, thereby controlling the movement stroke of the spring pressure head.

[0043] The second mounting assembly includes a second pressure strip seat 81, a second upper cover pressure strip 82, a positioning cavity 83, a pin positioning groove 84, a movable connecting groove 85, an upper pressure block 86, a movable limiting groove 87, a locking screw 88, and a locking screw hole.

[0044] The second pressure strip seat is set on the base, and the two ends of the second upper cover pressure strip are movably connected to the second pressure strip seat. The top of the second pressure strip seat is provided with a rotating pressure head to press the second upper cover pressure strip onto the second pressure strip seat.

[0045] The second upper cover pressure strip has a positioning cavity for placing and positioning the main body structure of the component to be installed, and a pin positioning groove for placing and positioning the pins of the component to be installed. The positioning cavity is connected above the pin positioning groove. The top of the second upper cover pressure strip has a movable connecting groove that communicates with the positioning cavity. The upper pressure block is movably set in the movable connecting groove to extend into or out of the positioning cavity, thereby pressing or releasing the component (main body) to be installed. The bottom surface of the movable connecting groove has a locking screw hole, and the upper pressure block has a movable limiting groove. The lower end of the locking screw passes through the movable limiting groove and connects to the locking screw hole to lock or unlock the position of the upper pressure block.

[0046] More preferably, the second pressure strip seat is provided with a slot that is movably connected to the second upper cover pressure strip.

[0047] Further preferably, the movable connecting groove has a waist-shaped structure, which facilitates the back-and-forth movement of the upper pressure block.

[0048] A further preferred embodiment has a push-pull handle on one side of the upper pressure block for easy operation.

[0049] The steps for assembly using a multi-material assembly fixture include:

[0050] Step 1: Assemble the heatsink base:

[0051] 1. Place PCB10 into the PCB cavity and fix it with a rotating pressure head. Install the heat sink base limiting block on the base (the bottom surface contacts the limiting boss, and the positioning hole is fitted on the positioning post). Place the heat sink base in the heat sink (base) limiting cavity of the heat sink base limiting block and press it in place with a rotating pressure head. Install the first upper cover pressure strip on the first pressure strip seat. At this time, the spring pressure head presses steadily on the heat sink base to prevent its position from shifting or falling off.

[0052] 2. After the heatsink base is fixed and pressed together, flip the assembly fixture over and use a screwdriver to install the screws into the alignment holes of the PCA and the heatsink base. After assembly, flip the assembly fixture over and remove the first upper cover pressure strip and the heatsink base limiting block to proceed to the next step of material assembly.

[0053] Step 2: Transistor Installation

[0054] Transistor components are distinguished by different colors and inserted into the PCB holes according to their correct reference numbers. Then, electronic component positioning blocks are installed (pushed horizontally towards the PCB cavity from the base) to ensure the transistors are precisely positioned within the electronic component positioning cavity. Notably, the electronic component positioning blocks do not use positioning bosses or positioning pins for positioning.

[0055] Step 3: Heatsink Installation

[0056] First, install the heat sink limiting block (at this time, the heat sink limiting block is located on the electronic component limiting block). Use the limiting boss and positioning post for positioning. You can use the rotating pressure head to fix it at the same time. Place the heat sink 9 in the heat sink (fin) limiting cavity of the heat sink limiting block. The four holes on the heat sink will completely match the four holes of the heat sink base installed in the first step. Use a screwdriver to tighten the corresponding screws. After completing the installation of the heat sink, remove the heat sink limiting block and the electronic component limiting block.

[0057] Step 4: Install the side transistor

[0058] 1. First, loosen the locking screws and pull the upper pressure block away from the positioning cavity; place the transistor body to be installed into the positioning cavity, with the leads positioned in the lead positioning slots, and push the upper pressure block to extend into the positioning cavity. After pushing it into position, tighten the locking screws to fix the upper pressure block, thereby completely fixing the transistor in the pressure strip cavity; install the second upper cover pressure strip with the transistor onto the second pressure strip seat, aligning the transistor leads with the sockets on the PCB, and use the rotating pressure head to fix the second upper cover pressure strip, so that the leads are inserted into the sockets. Use the second upper cover pressure strip to fix and meet the assembly height of the transistor leads, completing the installation.

[0059] 2. After fixing the transistor height, flip the assembly fixture to solder the leads, and finally install the transistor sleeve and fixing plate screws.

[0060] The beneficial effects of this utility model of a multi-material assembly fixture for PCBs are:

[0061] 1. A single fixture design can meet the assembly needs of multiple materials, reducing fixture development costs, lowering assembly difficulty and rework rate, and improving assembly efficiency and production capacity;

[0062] 2. By utilizing multiple structures, precise positioning and fixing of each material is achieved, preventing mistakes while ensuring the relative positions between materials, improving assembly accuracy, and guaranteeing product consistency and yield.

[0063] 3. All components on the fixture are designed with fixed positions, which reduces the storage space required for the fixture and facilitates fixture management.

[0064] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made using the content of this utility model specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A multi-material assembly fixture for PCBs, characterized in that, include: Base, PCB cavity, rotating pressure head, limiting boss, positioning post, positioning hole, first mounting component, second mounting component. The base is provided with a PCB cavity for placing and positioning the PCB board to be assembled. The first mounting component and the second mounting component are movably connected to the base. Multiple rotating pressure heads are rotatably arranged around the PCB cavity. The rotating pressure heads are used to press the first mounting component and / or the second mounting component onto the base. The base is also provided with multiple limiting bosses. Each limiting boss is provided with a positioning post. The positioning post is movably connected to the positioning holes on the first mounting component and the second mounting component. The limiting bosses are used to position the height of the first mounting component and / or the second mounting component. The positioning post is used to position the horizontal position of the first mounting component and / or the second mounting component. The first mounting assembly includes a first pressure strip seat, a first upper cover pressure strip, a spring pressure head, an adjusting guide post, a heat dissipation mounting limit block, a heat dissipation limiting cavity, an electronic component limiting block, and an electronic component limiting cavity. The heat dissipation mounting limit block is movably disposed above the PCB cavity, with its bottom surface contacting the limiting boss. The heat dissipation mounting limit block is provided with the heat dissipation limiting cavity for positioning and mounting the heat dissipation base and / or heat sink. The electronic component limiting block is disposed between the base and the heat dissipation mounting limit block, and is provided with the electronic component limiting cavity. The first pressure strip seat is disposed on both sides of the base. The first upper cover pressure strip is located above the heat dissipation mounting limit block, and its two ends are movably connected to the first pressure strip seat. The first upper cover pressure strip is provided with a plurality of adjusting guide posts and a spring pressure head movably connected to the adjusting guide posts, so that the spring pressure head moves up and down along the adjusting guide posts to press the heat dissipation mounting limit block. The second mounting assembly includes a second pressure strip seat, a second upper cover pressure strip, a positioning cavity, a pin positioning groove, a movable connecting groove, an upper pressure block, a movable limiting groove, a locking screw, and a locking screw hole. The second pressure strip seat is disposed on the base. Both ends of the second upper cover pressure strip are movably connected to the second pressure strip seat, and the top of the second pressure strip seat is provided with the rotating pressure head to press the second upper cover pressure strip onto the second pressure strip seat. The second upper cover pressure strip is provided with a positioning cavity for placing and positioning the main structure of the component to be mounted, and a positioning cavity for placing and positioning the component to be mounted. The pin positioning groove of the component pin is provided, and the positioning cavity is connected above the pin positioning groove. The top of the second upper cover pressure strip is provided with the movable connecting groove that communicates with the positioning cavity. The upper pressure block is movably disposed in the movable connecting groove to extend into or out of the positioning cavity, thereby pressing or releasing the component to be installed. The bottom surface of the movable connecting groove is provided with the locking screw hole. The upper pressure block is provided with the movable limiting groove. The lower end of the locking screw passes through the movable limiting groove and connects to the locking screw hole to lock or unlock the position of the upper pressure block.

2. The multi-material assembly fixture for PCBs according to claim 1, characterized in that, Multiple columns are provided on the top and bottom surfaces of the base.

3. A multi-material assembly fixture for PCBs according to claim 1, characterized in that, The rotating pressure head is rotatably mounted on the top and bottom surfaces of the base via a rotating shaft.

4. A multi-material assembly fixture for PCBs according to claim 1, characterized in that, The base and the heat dissipation mounting limit block are provided with clearance grooves to facilitate the handling of materials.

5. A multi-material assembly fixture for PCBs according to claim 1, characterized in that, The heat dissipation mounting limit block includes a heat dissipation base limit block and a heat dissipation fin limit block, and the heat dissipation mounting limit block and the electronic component limit block are provided with a plurality of positioning holes.

6. A multi-material assembly fixture for PCBs according to claim 1, characterized in that, The first upper cover pressure strip has protrusions at both ends, and the protrusions are movably connected to the grooves on the first pressure strip seat through a snap-fit ​​structure.

7. A multi-material assembly fixture for PCBs according to claim 1, characterized in that, The adjusting guide post is threadedly connected to the first upper cover pressure strip so as to adjust the up and down position of the adjusting guide post, thereby controlling the movement stroke of the spring pressure head.

8. A multi-material assembly fixture for PCBs according to claim 1, characterized in that, The second pressure strip seat is provided with a slot that is movably connected to the second upper cover pressure strip.

9. A multi-material assembly fixture for PCBs according to claim 1, characterized in that, The movable connecting groove has a waist-shaped structure, which facilitates the back-and-forth movement of the upper pressure block.

10. A multi-material assembly fixture for PCBs according to claim 1, characterized in that, A push-pull handle is provided on one side of the upper pressure block.

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