A semiconductor wafer cassette opening tool

Abstract

The utility model discloses a kind of semiconductor wafer box opening tools, it is related to the field of semiconductor manufacturing device, including integrally-formed setting embedding part, vertical force application part and holding part, holding part is used for hand-held operation, and the surface of holding part is provided with antiskid structure, embedding part is set in the front end of holding part, and embedding part is tapered wedge structure, and is used for being inserted into the connecting gap between the round box cover and box body of semiconductor wafer box, vertical force application part is between embedding part and holding part, the thickness of vertical force application part gradually increases from embedding part to the direction of holding part, and is used for separating round box cover and box body by vertical direction prying force. The utility model is simple in structure, convenient to use, effectively reduces the difficulty of opening cover of semiconductor wafer box, simultaneously, avoid the pollution of wafer by particle.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment, and in particular to a semiconductor wafer cassette unpacking tool. Background Technology

[0002] Semiconductor wafers undergo multiple cleaning and processing steps during manufacturing. Clean wafers are typically stored, handled, and transported in wafer cassettes to prevent surface contamination. These cassettes are primarily made of PP (polypropylene) or PC (polycarbonate), with the lid and body sealed together by an interlocking mechanism. In subsequent processes, operators frequently need to open the cassettes to remove the wafers. In current technology, the common practice is to manually rotate the lid while wearing clean gloves to open the cassettes.

[0003] However, due to the smooth surface of PC material and the thinness of the lid (usually 5-10mm), the contact area between the glove and the lid is small and the friction is insufficient, which requires a large rotational force to open. This can easily cause the chip to vibrate or even be damaged inside the box. PP material round boxes usually have raised stripes on the edge to increase friction, but when rotated forcefully, the glove and stripes rub violently, which can generate particles. These particles falling into the box will contaminate the chip.

[0004] Therefore, how to develop a semiconductor wafer box opening tool that is simple in structure, easy to use, effectively reduces the difficulty of opening semiconductor wafer boxes, and at the same time avoids particle contamination of wafers has become a technical problem that urgently needs to be solved by people in this field. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor wafer box opening tool that is simple in structure, easy to use, effectively reduces the difficulty of opening the semiconductor wafer box, and at the same time avoids particles from contaminating the wafer.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] This utility model discloses a semiconductor wafer cassette unpacking tool, comprising an integrally formed insert, a vertical force-applying part, and a gripping part. The gripping part is used for handheld operation and has an anti-slip structure on its surface. The insert is located at the front end of the grip and has a tapered wedge shape, used to insert into the connection gap between the round cover and the body of the semiconductor wafer cassette. The vertical force-applying part is located between the insert and the gripping part, and its thickness gradually increases from the insert towards the gripping part, used to separate the round cover and the body by a vertical prying force.

[0008] Preferably, the tapering angle of the embedded part is set to 1° to 5°, the length is set to 4 to 6 mm, and the width is set to 4 to 6 mm.

[0009] Preferably, the front end thickness of the vertical force-applying part matches the rear end thickness of the embedded part, and the rear end thickness of the vertical force-applying part matches the thickness of the gripping part.

[0010] Preferably, the anti-slip structure adopts a cross-grid pattern, which covers the surface of the grip portion.

[0011] Preferably, the thickness of the grip portion is set to 3-4 mm.

[0012] Compared with the prior art, the beneficial technical effects of this utility model are as follows:

[0013] 1) Through the integrated design of the embedded part, vertical force application part and gripping part, the tapered wedge structure is precisely inserted into the gap of the round box, and the vertical prying force is combined to directly separate the box cover and the box body, completely eliminating the traditional rotation friction operation and fundamentally avoiding the risk of chip particle contamination.

[0014] 2) Utilizing the high temperature resistance, self-lubrication, and high mechanical strength properties of polyetheretherketone (PEEK) material, combined with the gradually varying thickness of the vertical force application section and the convex cross-section design, the force transmission efficiency is significantly improved, allowing for smooth opening of the box with minimal force and effectively preventing chip vibration damage.

[0015] 3) The cross-grid anti-slip texture of the grip enhances operational stability, and the rounded transition angle design at the top corner of the square structure disperses local stress and extends the tool's service life. Overall, it balances the ease of opening the box, the guarantee of cleanliness, and the durability of the tool, making it suitable for the efficient and safe opening of 2-6 inch PP / PC round boxes. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings.

[0017] Figure 1 This is a top view of a semiconductor wafer cassette unpacking tool according to the present invention;

[0018] Figure 2 This utility model Figure 1 A cross-sectional view along the AA direction.

[0019] Explanation of reference numerals in the attached drawings: 1. Embedded part; 2. Vertical force application part; 3. Holding part. Detailed Implementation

[0020] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0021] like Figure 1-2 As shown, a semiconductor wafer cassette unpacking tool includes an integrally formed insert 1, a vertical force application part 2, and a gripping part 3. The gripping part 3 is used for hand operation, and its surface is provided with an anti-slip structure. The insert 1 is located at the front end of the gripping part 3 and has a tapered wedge shape. It is used to insert into the connection gap between the round cover and the body of the semiconductor wafer cassette. The vertical force application part 2 is located between the insert 1 and the gripping part 3. The thickness of the vertical force application part 2 gradually increases from the insert 1 towards the gripping part 3 and is used to separate the round cover and the body by a vertical prying force.

[0022] Specifically, the present invention adopts a convex-shaped structure design, wherein the embedding part 1, the vertical force application part 2, and the gripping part 3 are all made of polyetheretherketone (PEEK) material; in addition, users can also choose other engineering plastics suitable for cleanrooms for processing according to actual needs. These engineering plastics should have the characteristics of high temperature resistance, self-lubrication, easy processing, and high mechanical strength to ensure the performance and durability of the box opening tool during semiconductor wafer box operation.

[0023] Specifically, the tapering angle of the embedded part 1 is set to 1° to 5°, the length is set to 4 to 6 mm, and the width is set to 4 to 6 mm.

[0024] Specifically, the front end thickness of the vertical force-applying part 2 matches the rear end thickness of the embedded part 1, and the rear end thickness of the vertical force-applying part 2 matches the thickness of the gripping part 3.

[0025] Specifically, the anti-slip structure adopts a cross-grid pattern, which covers the surface of the grip portion 3.

[0026] Specifically, the thickness of the gripping part 3 is set to 3-4 mm.

[0027] Specifically, the top corners of the square structure formed by the vertical force application part 2 and the gripping part 3 are all designed with rounded transition angles.

[0028] The usage process of this utility model is as follows:

[0029] First, the operator holds the grip part 3 and uses the cross-grid anti-slip texture on its surface to firmly grasp the tool, ensuring that it is not easy to slip during the application of force;

[0030] Next, the tapered wedge-shaped structure at the front end of the embedding part 1 is precisely inserted into the connection gap between the round cover and the body of the semiconductor wafer cassette. As the embedding part 1 goes deeper, the gap gradually widens until the front end of the vertical force application part 2 is embedded in the connection gap between the round cover and the body.

[0031] Next, a prying force is applied to the gripping part 3 in the vertical direction. At this time, the vertical force application part 2 concentrates the force to the connection between the lid and the box body. Utilizing the structural characteristics of the round box injection molding demolding taper, the lid and the box body can be separated with a small force.

[0032] Then, during the prying process, the rounded transition angle design at the top corner of the square structure formed by the vertical force application part 2 and the gripping part 3 can avoid stress concentration and prevent the tool from deforming or being damaged due to excessive force.

[0033] Finally, after the lid separates from the box body, the chip is smoothly removed. The entire process does not require rotation or friction, effectively preventing particles from falling off and contaminating the chip, while also protecting gloves and the edges of the round box from wear and tear.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0035] The embodiments described above are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made to the technical solutions of the present utility model by those skilled in the art without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model.

Claims

1. A semiconductor wafer cassette unpacking tool, characterized in that: The device includes an integrally molded insert (1), a vertical force-applying part (2), and a grip (3). The grip (3) is used for hand operation and has an anti-slip structure on its surface. The insert (1) is located at the front end of the grip (3) and has a tapered wedge shape. It is used to insert into the connection gap between the round cover and the body of the semiconductor wafer cassette. The vertical force-applying part (2) is located between the insert (1) and the grip (3). The thickness of the vertical force-applying part (2) gradually increases from the insert (1) towards the grip (3) and is used to separate the round cover and the body by a vertical prying force.

2. The semiconductor wafer cassette unpacking tool according to claim 1, characterized in that: The tapering angle of the embedded part (1) is set to 1° to 5°, the length is set to 4 to 6 mm, and the width is set to 4 to 6 mm.

3. The semiconductor wafer cassette unpacking tool according to claim 2, characterized in that: The front end thickness of the vertical force-applying part (2) matches the rear end thickness of the embedded part (1), and the rear end thickness of the vertical force-applying part (2) matches the thickness of the gripping part (3).

4. The semiconductor wafer cassette unpacking tool according to claim 3, characterized in that: The anti-slip structure adopts a cross-grid pattern, which covers the surface of the grip (3).

5. A semiconductor wafer cassette unpacking tool according to claim 4, characterized in that: The thickness of the gripping part (3) is set to 3-4 mm.

Images