Substrate transport carrier

By setting contoured positioning pins and support parts on the substrate transport vehicle, the problem of edge chipping caused by collision during substrate transportation is solved, thus improving the substrate yield.

CN224297857UActive Publication Date: 2026-05-29QULIANG ELECTRONICS CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
QULIANG ELECTRONICS CO LTD
Filing Date
2025-06-16
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

During substrate transportation, collisions between the substrate and the positioning pins can cause edge chipping, affecting the yield rate.

Method used

Design a substrate transport carrier that employs multiple positioning pins, each with a contoured surface for contacting the edge of the substrate, and provides vertical support on the carrier body to reduce the impact of collisions.

Benefits of technology

It significantly reduces the impact of collisions between the substrate and the positioning pins, avoids chipping at the substrate edges, and improves the yield rate.

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Abstract

The utility model relates to a kind of substrate transport carriers, wherein substrate transport carriers include carrier body, the carrier body is provided with mounting area, the mounting area is used to place substrate;The carrier body is provided with support portion in the edge position of the mounting area, and the support portion is used to abut the bottom surface of the substrate;Positioning pin, the number of the positioning pin is multiple, multiple positioning pins are installed on the same face of the carrier body, and multiple positioning pins are arranged around the mounting area, and each positioning pin is used to be provided with profiled surface with the side of the substrate abutment. The utility model can be used to contact the positioning pin with the edge of substrate and set profiled surface, so that the influence of collision on substrate is significantly reduced, and substrate collapse is avoided.
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Description

Technical Field

[0001] This utility model relates to a circuit board processing device, and more particularly to a substrate transport carrier. Background Technology

[0002] The description in this section provides only background information related to the disclosure of this utility model and does not constitute prior art.

[0003] During the packaging process, substrates are typically transported using carriers. Specifically, the substrate is placed directly into its designated position on the carrier, and positioning pins on the carrier stabilize the substrate. During transport, the substrate undergoes multi-directional relative movement with the positioning pins due to inertia and gravity. This can lead to collisions between the substrate and the positioning pins. In severe cases, these collisions can cause chipping at the substrate edges, resulting in scrapped boards.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this utility model and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this utility model. Utility Model Content

[0005] The purpose of this invention is to provide a substrate transport carrier that can significantly reduce the impact of collisions on the substrate and avoid substrate chipping by setting the positioning pins used to contact the edge of the substrate with a contoured surface.

[0006] To achieve the above objectives, this utility model discloses a substrate transport carrier, the substrate transport carrier comprising:

[0007] A carrier body, wherein an installation area is provided on the carrier body, and the installation area is used to place a substrate;

[0008] The carrier body is provided with a support portion at the edge of the installation area, and the support portion is used to abut against the bottom surface of the substrate.

[0009] The locating pins are multiple in number and are installed on the same surface of the carrier body. The multiple locating pins are arranged around the mounting area, and each locating pin has a contoured surface for abutting against the substrate.

[0010] As a further description of the above technical solution, the vehicle body is provided with a recessed portion at the corner of the installation area, the recessed portion is connected to the installation area, and the recessed portion extends in a direction away from the installation area.

[0011] As a further description of the above technical solution, the mounting area is set as a rectangle with the same size as the substrate, and the recess is set as an L-shape that fits against the corner of the rectangle.

[0012] As a further description of the above technical solution, each end of the relief portion is provided with a positioning pin.

[0013] As a further description of the above technical solution, the contoured surface of the positioning pin extends axially and penetrates the entire positioning pin setting.

[0014] As a further description of the above technical solution, the positioning pin is configured as a cylindrical segment with the contoured surface on one side.

[0015] As a further description of the above technical solution, each of the positioning pins protrudes from the carrier body at the same height in the vertical direction.

[0016] As a further description of the above technical solution, the number of positioning pins is 8, and a pair of positioning pins is provided at each corner of the substrate.

[0017] As a further description of the above technical solution, the side of the contoured surface facing the substrate is parallel to the corresponding edge of the substrate, so that the contoured surface is in contact with the edge of the substrate.

[0018] Based on the above technical solution, the beneficial effects of this utility model are as follows:

[0019] This invention relates to a substrate transport carrier. By providing a contoured surface to the positioning pins that contact the substrate edges, the impact of collisions on the substrate is significantly reduced, preventing substrate chipping. Specifically, the carrier body provides a mounting area for placing the substrate, and a support portion below the mounting area provides vertical support to the substrate. The positioning pins provide horizontal support. Since the positioning pins have contoured surfaces for contacting the substrate edges, compared to positioning pins without contoured surfaces, the positioning pins in this invention have a larger contact area with the substrate edges, providing less pressure and reducing the likelihood of substrate chipping due to excessive stress, thus ensuring a high yield rate.

[0020] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, the drawings provided are for reference and illustration only and are not intended to limit this utility model. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a substrate transport vehicle provided in the embodiments of this specification;

[0023] Figure 2 This is a schematic diagram of a positioning pin for a substrate transport carrier provided in the embodiments of this specification;

[0024] In the picture:

[0025] 100. Substrate;

[0026] 1. Vehicle body; 11. Installation area; 12. Recessed section; 13. Support section;

[0027] 2. Locating pin; 21. Contour surface. Detailed Implementation

[0028] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0029] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0030] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0031] Please see Figure 1-2 This embodiment provides a substrate transport carrier, which includes:

[0032] The carrier body 1 has an installation area 11, which is used to place the base plate 100.

[0033] Support 13: The carrier body 1 is provided with a support 13 at the edge of the mounting area 11. The support 13 is used to abut against the bottom surface of the substrate 100.

[0034] Positioning pin 2, there are multiple positioning pins 2, multiple positioning pins 2 are installed on the same surface of the carrier body 1, multiple positioning pins 2 are arranged around the installation area 11, and each positioning pin 2 has a contoured surface 21 for abutting against the substrate 100 on the side for fitting with the substrate 100.

[0035] With the above structure, when installing the substrate 100, the substrate 100 is first placed in the direction of the mounting area 11 of the carrier body 1, so that the bottom of the substrate 100 contacts the support portion 13 at the edge of the mounting area 11, and the position is adjusted so that the edge position of the substrate 100 corresponds to the positioning pin 2. This correspondence can be reserved for a certain example, or the edge position of the substrate 100 can directly contact the positioning pin 2. The contact surface is the contour surface 21 on one side of the positioning pin 2, not other positions of the positioning pin 2. After the substrate 100 is securely fixed, the substrate transport carrier is moved. During the movement, the support portion 13 at the bottom of the substrate 100 provides support. When the substrate 100 experiences a horizontal offset force, the side wall of the substrate 100 contacts the contour surface 21 of the positioning pin 2 in the corresponding direction, and the substrate 100 is confined in the mounting area 11 of the carrier body 1.

[0036] Based on the above structure, by providing a contoured surface 21 for the positioning pin 2 that contacts the edge of the substrate, the impact of collisions on the substrate 100 can be significantly reduced, thus preventing substrate chipping. Specifically, this invention provides a mounting area 11 for placing the substrate on the carrier body, and provides vertical support force to the substrate 100 through the support portion 13 at the edge of the mounting area 11, and provides horizontal support force to the substrate 100 through the positioning pin 2. The positioning pin 2 has a contoured surface 21 for contacting the edge of the substrate 100. Therefore, compared with a positioning pin 2 without a contoured surface 21, the positioning pin 2 in this invention has a larger contact area with the edge of the substrate 100, provides less pressure, and is less likely to cause substrate chipping due to excessive stress, thus ensuring a high yield rate.

[0037] The contoured surface 21 is parallel to the edge of the substrate 100 on the side facing the substrate 100, so that the contoured surface 21 is in surface contact with the edge of the substrate 100. Compared with existing line contact or point contact, the surface-to-surface contact in this embodiment significantly reduces the contact pressure between the two.

[0038] The vehicle body 1 in the above embodiments is configured as follows: Figure 1 The plate-like structure shown can be expanded based on the size of the substrate 100. For example, in this embodiment, the substrate 100 is set as a traditional rectangle. Therefore, the carrier body 1 is set as a correspondingly enlarged rectangular plate. The mounting area 11 in the carrier body 1 for placing the substrate 100 can be set in the center position, so that the supporting force on the substrate 100 is relatively balanced. At the same time, the width of the edge position of the carrier body 1 away from the substrate 100 is uniform, which is convenient for the operator to hold manually and also convenient for the mechanical device to pick up or position the carrier body 1.

[0039] The mounting area 11 is set as an open area with an opening at the center of the substrate 100, so that the support part 13 extending into the opening area in all four directions can directly contact the substrate 100.

[0040] In this embodiment, the substrate 100 can be set as a conventional rectangular rigid plate, which has a certain material strength and can be guaranteed not to deform after its edges and bottom are supported.

[0041] The support part 13 is a strip-shaped plate structure that extends integrally from the carrier body 1. In some embodiments, the support part 13 can also be set as a strip, column, suction cup, etc., as long as it can support one of the non-side surfaces of the substrate 100.

[0042] Of course, in another embodiment, the support part 13 may not be provided, and the carrier body 1 is placed vertically, so that the base plate 100 is placed vertically and is supported entirely by the positioning pin 2 outside the mounting area 11.

[0043] Please see Figure 1 The carrier body 1 has a recessed portion 12 at the corner of the mounting area 11. The recessed portion 12 is connected to the mounting area 11 and extends in a direction away from the mounting area 11. In the embodiment where the recessed portion 12 is provided, after the substrate 100 is placed in the mounting area 11, the corner of the substrate 100 is in a suspended state completely free from contact with the outside. Specifically, the corner of the substrate 100 is sharper and more prone to breakage. Therefore, the recessed portion 12 at the corner, which is connected to the mounting area 11, can minimize the risk of the corner of the substrate 100 colliding with the carrier body 1.

[0044] Of course, the setting of the retraction part 12 also makes it more convenient for the operator to pick up the substrate 100. The operator can directly pass through the retraction part 12 to the bottom of the carrier body 1 and then hook the substrate 100.

[0045] In this embodiment, the mounting area 11 is set as a rectangle with the same size as the substrate 100, and the recess 12 is set as an L-shape that fits against the corners of the rectangle. The L-shaped structure is easier to manufacture and has a stable structure. Based on this, a positioning pin 2 is provided at each end of the recess 12. That is, in this embodiment, the positioning pins 2 are located near the corners of the substrate 100. Taking a rectangular substrate 100 as an example, in this embodiment, there are 8 positioning pins 2. Each corner of the substrate 100 is provided with a pair of positioning pins, meaning that each corner has two positioning pins 2, forming a relatively stable edge support for the substrate 100. Even if the substrate 100 is impacted by the positioning pins 2 or subjected to excessive stress, resulting in slight deformation, the core processing area of ​​the substrate 100 is less affected because the contact position is close to the corners.

[0046] like Figure 2 As shown, the contoured surface 21 of the locating pin 2 extends axially and penetrates the entire locating pin 2. Simultaneously, the locating pin is configured as a cylindrical segment with a contoured surface on one side. That is to say, the locating pin 2 in this embodiment can be derived from a conventional cylindrical locating pin through further machining, and the machining process is simple, requiring only cutting. Alternatively, in cases of high demand, it can be directly cold-forged, saving metal material compared to ordinary locating pins.

[0047] In this embodiment, each positioning pin 2 protrudes from the carrier body 1 at the same height in the vertical direction, maintaining a standardized limit range. The same positioning pin 2 also helps to reduce costs. At the same time, the height of each positioning pin 2 is not less than that of the substrate 100 after placement, so as to prevent the substrate 100 from detaching in the horizontal direction.

[0048] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the scope of the patent application of the present utility model. Therefore, all equivalent technical changes made using the contents of the present utility model specification and drawings are included in the scope of the patent application of the present utility model.

[0049] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0050] Although this application has been described by way of examples, those skilled in the art will know that this application has many modifications and variations without departing from the spirit of this application, and it is intended that the appended embodiments include these modifications and variations without departing from this application.

Claims

1. A substrate transport carrier, characterized in that, The substrate transport vehicle includes: The carrier body has an installation area for placing a substrate; the carrier body has a support portion at the edge of the installation area for abutting the bottom surface of the substrate. The locating pins are multiple in number and are installed on the same surface of the carrier body. The multiple locating pins are arranged around the mounting area, and each locating pin has a contoured surface for abutting against the substrate.

2. The substrate transport carrier according to claim 1, characterized in that: The vehicle body is provided with a recessed portion at the corner of the installation area. The recessed portion is connected to the installation area and extends in a direction away from the installation area.

3. The substrate transport carrier according to claim 2, characterized in that: The mounting area is set as a rectangle with the same size as the substrate, and the recess is set as an L-shape that fits against the corner of the rectangle.

4. The substrate transport carrier according to claim 3, characterized in that: Each end of the relief section is provided with a positioning pin.

5. The substrate transport carrier according to claim 1, characterized in that: The contoured surface of the locating pin extends axially and penetrates the entire locating pin configuration.

6. The substrate transport carrier according to claim 1, characterized in that: The locating pin is configured as a cylindrical segment with the contoured surface on one side.

7. The substrate transport carrier according to claim 1, characterized in that: Each of the positioning pins protrudes from the vehicle body at the same height in the vertical direction.

8. The substrate transport carrier according to claim 1, characterized in that: The number of positioning pins is 8, and a pair of positioning pins is provided at each corner of the substrate.

9. The substrate transport carrier according to claim 1, characterized in that: The contoured surface facing the substrate is parallel to the corresponding edge of the substrate, so that the contoured surface is in contact with the edge of the substrate.