Hinge assembly and electronic device

By incorporating a buffer component between the hinge cover and the bracket body, the problem of hinge assembly damage due to drops is solved, thereby improving the reliability and durability of electronic devices.

CN224301224UActive Publication Date: 2026-05-29BEIJING XIAOMI MOBILE SOFTWARE CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
Filing Date
2025-06-09
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

In existing foldable electronic devices, the hinge assembly is easily damaged by drops when the device is folded, affecting its reliability.

Method used

A buffer component is installed between the hinge cover and the bracket body. The buffer component causes the hinge cover to move in the direction of the resultant force to absorb the impact force, reduce the impact on the screen assembly of the electronic device, and improve the reliability of the electronic device.

Benefits of technology

By absorbing impact through buffer components, the effect on screen components is reduced, thereby improving the reliability and durability of electronic devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present disclosure relates to a hinge assembly and an electronic device, wherein the hinge assembly comprises a support and two folding parts connected with the support, the two folding parts being capable of moving relative to the support to fold and unfold with each other; the support comprises a support body and a rotating shaft cover arranged outside the support body, a buffer member is arranged between the rotating shaft cover and the support body, and the buffer member is configured to enable the rotating shaft cover to move in a direction opposite to the resultant force direction of the support body, so as to absorb the impact force on the rotating shaft cover. In this way, the impact force on the screen assembly of the electronic device can be reduced, thereby effectively improving the reliability of the electronic device.
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Description

Technical Field

[0001] This disclosure relates to the field of electronic devices, and more particularly to a hinge assembly and an electronic device. Background Technology

[0002] For example, foldable electronic devices such as mobile phones are popular with users because of their portability when folded and the ability to increase screen size when unfolded. However, in related technologies, the hinge components of foldable electronic devices are easily damaged by drops when folded, thus affecting the reliability of the electronic devices. Utility Model Content

[0003] To overcome the problems existing in the related technologies, this disclosure provides a hinge assembly and an electronic device.

[0004] According to a first aspect of this disclosure, a hinge assembly is provided, including a bracket and two folding portions connected to the bracket, the two folding portions being movable relative to the bracket to fold and unfold with each other; the bracket includes a bracket body and a pivot cover disposed on the outside of the bracket body, a buffer member being disposed between the pivot cover and the bracket body, the buffer member being configured such that the pivot cover is movable in a direction opposite to the direction of the resultant force on the bracket body, so as to absorb the impact force on the pivot cover.

[0005] In some embodiments of this disclosure, the buffer member includes: a support member disposed on the inner surface of the pivot cover; and a buffer assembly, one end of which is disposed on the support body and the other end of which is disposed on the support member. The buffer assembly is used to cooperate with the support member so that the pivot cover can move relative to the support body in a direction perpendicular to the support body to absorb the impact force on the pivot cover.

[0006] In some embodiments of this disclosure, a preset gap is formed between the support member and the inner surface of the pivot cover. The buffer assembly includes: a buffer structure, which includes a fixing part and a guide part. The fixing part is fixed to the bracket body, a first end of the guide part is connected to the fixing part, and a second end of the guide part passes through the support member to extend into the preset gap; and an elastic member, sleeved on the guide part and located on the side of the support member away from the pivot cover.

[0007] In some embodiments of this disclosure, the fixing part includes a first plate connected to each other and two second plates respectively connected to both ends of the first plate. The guide part is disposed on the surface of the first plate facing the pivot cover, and both second plates are connected to the bracket body.

[0008] In some embodiments of this disclosure, the bracket body is provided with a hollow structure corresponding to the position of the first plate, the first plate is located in the hollow structure, and each end of the first plate is provided with an extension extending toward the pivot cover, and the two second plates are respectively connected to the two extensions.

[0009] In some embodiments of this disclosure, the guide portion includes a first position and a second position, wherein the distance between the guide portion and the inner surface of the pivot cover at the first position is greater than the distance between the guide portion and the inner surface of the pivot cover at the second position, and the buffer assembly further includes a limiting portion for stopping the guide portion at the first position.

[0010] In some embodiments of this disclosure, the limiting portion includes a protrusion structure disposed on the outer surface of the second end of the guide portion, and in the first position, the protrusion structure abuts against the surface of the support member facing the pivot cover.

[0011] In some embodiments of this disclosure, an annular groove is provided on the outer surface of the second end of the guide portion, and the protrusion structure includes a retaining ring that is engaged in the annular groove. In the first position, the retaining ring abuts against the surface of the support member facing the rotating shaft cover.

[0012] In some embodiments of this disclosure, at the first position, the distance between the guide portion and the inner surface of the pivot cover is 0.2 mm to 0.3 mm; and / or, the guide portion is a columnar structure.

[0013] In some embodiments of this disclosure, the support member includes a plate-like structure and two bent portions respectively connected to both ends of the plate-like structure. The bent portions are connected to the inner surface of the pivot cover. The plate-like structure and the inner surface of the pivot cover form the preset gap. The plate-like structure is provided with a through hole corresponding to the position of the guide portion. The second end of the guide portion extends from the through hole into the preset gap.

[0014] According to a second aspect of this disclosure, an electronic device is provided, the electronic device including a hinge assembly as described in the first aspect.

[0015] In some embodiments of this disclosure, the electronic device further includes a flexible screen connected to two of the folds of the hinge assembly to be able to fold and unfold following the two folds.

[0016] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0017] The hinge assembly disclosed herein includes a buffer member between the hinge cover and the bracket body. The buffer member enables the hinge cover to move in a direction opposite to the direction of the resultant force on the bracket body, thereby absorbing the impact force on the hinge cover. This reduces the impact force on the screen assembly of the electronic device, thus effectively improving the reliability of the electronic device.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0020] Figure 1 This is a schematic diagram of the structure of an electronic device when the guide portion is in a first position, according to an exemplary embodiment;

[0021] Figure 2 yes Figure 1 Sectional view along the middle AA direction;

[0022] Figure 3 yes Figure 2 A magnified view of a section at point B in the middle;

[0023] Figure 4 This is a schematic diagram of the structure of an electronic device when the guide portion is in the second position, according to an exemplary embodiment.

[0024] Figure 5 yes Figure 4 A cross-sectional view along the CC direction;

[0025] Figure 6 yes Figure 5 A magnified view of a section at point D;

[0026] Figure 7 This is a schematic diagram of a buffer structure according to an exemplary embodiment;

[0027] Figure 8 This is a schematic diagram illustrating the mating structure between the pivot cover and the support member according to an exemplary embodiment.

[0028] In the picture:

[0029] 1-Electronic device; 11-Middle frame; 12-Flexible screen; 13-Hinge cover; 14-Support body; 141-Hollow structure; 15-Folding part; 2-Buffer component; 21-Support component; 211-Plate structure; 2111-Through hole; 212-Bending part; 22-Buffer structure; 221-Fixing part; 2211-First plate; 2212-Second plate; 2213-Extension part; 222-Guide part; 2221-Annular groove; 23-Elastic component; 24-Retaining ring. Detailed Implementation

[0030] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0031] Foldable electronic devices, such as mobile phones, are popular due to their portability when folded and the increased screen size when unfolded. However, foldable electronic devices suffer from low reliability. For example, when an electronic device is dropped while folded, the most likely scenario for screen failure is when the hinge cover impacts the ground. In this case, the impact force is transmitted to the hinge assembly, causing deformation and displacement of components, which in turn compresses the screen assembly, leading to screen failure and thus reducing the device's reliability.

[0032] To address the aforementioned technical issues, this disclosure provides a hinge assembly with a buffer member disposed between the hinge cover and the bracket body. The buffer member enables the hinge cover to move in a direction opposite to the direction of the resultant force on the bracket body, thereby absorbing the impact force on the hinge cover. This reduces the impact force on the screen assembly of the electronic device, thus effectively improving the reliability of the electronic device.

[0033] An exemplary embodiment of this disclosure provides a hinge assembly, such as Figure 1 , Figure 2 and Figure 3 As shown, the hinge assembly includes a bracket and two folding portions 15 connected to the bracket. The two folding portions 15 are movable relative to the bracket to fold and unfold with each other. The two folding portions 15 are respectively used to connect to the two middle frames 11 of the electronic device 1, and the two middle frames 11 can be folded and unfolded with each other through the two folding portions 15, thereby realizing the foldable function of the electronic device 1.

[0034] The bracket includes a bracket body 14 and a hinge cover 13 disposed on the outside of the bracket body 14. When the two folding parts 15 are folded, i.e., when the electronic device 1 is in the folded state, the hinge cover 13 is exposed. When the two folding parts 15 are unfolded, i.e., when the electronic device 1 is in the unfolded state, the two middle frames 11 are joined together, and the hinge cover 13 is hidden inside the joined middle frames 11. The hinge cover 13 can hide the internal components of the hinge assembly, thereby improving the aesthetics of the electronic device 1 and preventing damage to the hinge assembly, thus improving the reliability of the hinge assembly. It should be noted that, combined with Figure 2 and Figure 3 When the hinge assembly is installed on the electronic device 1, the side of the bracket body 14 opposite to the flexible screen 12 of the electronic device 1 is the outer side of the bracket body 14.

[0035] Combination Figure 3 A buffer member 2 is provided between the hinge cover 13 and the bracket body 14. The buffer member 2 is configured such that the hinge cover 13 can move in a direction opposite to the direction of the resultant force on the bracket body 14, thereby absorbing the impact force on the hinge cover 13. For example, the buffer member 2 can be an elastic component such as foam or a spring assembly. Taking foam as an example, the foam is disposed on the surface of the hinge cover 13 facing the bracket body 14, and the hinge cover 13 is connected to the bracket body 14 through the foam. When the hinge cover 13 is subjected to an impact force, the foam is compressed, and the hinge cover 13 moves relative to the bracket body 14, thereby providing a buffering effect and reducing the impact of the impact force on the screen assembly of the electronic device 1. Alternatively, taking a spring assembly as an example, the spring assembly is disposed between the hinge cover 13 and the bracket body 14. In this case, the hinge cover 13 is connected to the bracket body 14 through the spring assembly, that is, the two ends of the spring assembly are respectively connected to the inner side of the hinge cover 13 and the outer side of the bracket body 14. When the hinge cover 13 is subjected to an impact, the spring assembly is compressed, and the hinge cover 13 moves relative to the bracket body 14, thereby playing a buffering role. In this way, the impact of the impact on the screen assembly of the electronic device 1 can also be reduced.

[0036] In this embodiment, a buffer member 2 is provided between the pivot cover 13 and the bracket body 14. The buffer member 2 enables the pivot cover 13 to move in a direction opposite to the direction of the resultant force on the bracket body 14, thereby absorbing the impact force on the pivot cover 13. In this way, the impact force on the screen assembly of the electronic device 1 can be reduced, thereby effectively improving the reliability and durability of the electronic device 1.

[0037] Combination Figure 3 In one embodiment, the buffer member 2 includes a support member 21 and a buffer assembly. The support member 21 is disposed on the inner surface of the pivot cover 13. It should be noted that the inner surface of the pivot cover 13 refers to the side surface of the pivot cover 13 facing the bracket body 14.

[0038] One end of the buffer assembly is disposed on the bracket body 14, and the other end is disposed on the support member 21. The buffer assembly cooperates with the support member 21 to allow the rotating cover 13 to move relative to the bracket body 14 in a direction perpendicular to the bracket body 14, thereby absorbing the impact force on the rotating cover 13. For example, the buffer assembly may be a spring assembly, which is movably connected to the support member 21. When the rotating cover 13 is subjected to an impact force, the spring assembly and the support member 21 move relative to each other, thereby allowing the rotating cover 13 to move relative to the bracket body 14 in a direction perpendicular to the bracket body 14. Alternatively, the buffer assembly may also be a foam assembly, which is connected to the support member 21. When the rotating cover 13 is subjected to an impact force, the foam assembly is compressed, thereby allowing the rotating cover 13 to move relative to the bracket body 14 in a direction perpendicular to the bracket body 14. This embodiment does not impose specific limitations on this aspect.

[0039] This design helps to improve the structural reliability of the buffer assembly, thereby further improving the absorption effect of the impact force acting on the pivot cover 13.

[0040] Combination Figure 3 In one embodiment, a predetermined gap is formed between the support member 21 and the inner surface of the pivot cover 13. The buffer assembly includes a buffer structure 22 and an elastic member 23. The buffer structure 22 includes a fixing part 221 and a guide part 222. The fixing part 221 is fixed to the bracket body 14. The first end of the guide part 222 is connected to the fixing part 221, and the second end of the guide part 222 passes through the support member 21 to extend into the predetermined gap. For example, the support member 21 is provided with a through hole, and the second end of the guide part 222 passes through the through hole and extends into the predetermined gap. The elastic member 23 is sleeved on the guide part 222 and is located on the side of the support member 21 opposite to the pivot cover 13.

[0041] like Figures 4 to 6 As shown, when the pivot cover 13 is subjected to an impact force, the pivot cover 13 moves relative to the support body 14 in a direction perpendicular to the support body 14, moving closer to the support body 14. The gap between the second end of the guide portion 222 and the inner surface of the pivot cover 13 gradually decreases. Simultaneously, the elastic element 23 is gradually compressed until the second end of the guide portion 222 contacts the inner surface of the pivot cover 13. This absorbs the impact force acting on the pivot cover 13. Subsequently, combined with... Figure 3 Since the elastic element 23 has a certain amount of compression, under the reaction of the elastic element 23, the support element 21 is pushed to move away from the support body 14 in a direction perpendicular to the support body 14 until the elastic element 23 is reset. At this time, the guide part 222 and the rotating shaft cover 13 are reset.

[0042] This arrangement results in a simple and compact structure for the buffer assembly, reducing its footprint within the internal space of the electronic device 1. Furthermore, it ensures the structural reliability of the buffer assembly, thereby improving its ability to absorb impact forces on the hinge cover 13 and further enhancing the reliability of the electronic device 1.

[0043] In one embodiment, the fixing part 221 includes a first plate 2211 connected to each other and two second plates 2212 respectively connected to both ends of the first plate 2211. A guide part 222 is disposed on the surface of the first plate 2211 facing the pivot cover 13, and both second plates 2212 are connected to the bracket body 14 by screws. Exemplarily, the fixing part 221 and the guide part 222 can be integrally formed structural components, or they can be structural components connected together by bonding, welding, or other methods. This design simplifies the structure of the fixing part 221, facilitates manufacturing, and reduces the space occupied inside the electronic device 1 and the increase in weight of the electronic device 1.

[0044] Combination Figure 7 In one embodiment, the support body 14 has a hollow structure 141 corresponding to the position of the first plate 2211. The first plate 2211 is located inside the hollow structure 141. Both ends of the first plate 2211 are respectively provided with extension portions 2213 extending toward the pivot cover 13. Each extension portion 2213 has a first end connected to the first plate 2211 and a second end opposite to the first end. Two second plates 2212 are respectively connected to the second ends of the two extension portions 2213. At least a portion of the extension portions 2213 is opposite to the inner wall surface of the hollow structure 141. For example, all the extension portions 2213 may be opposite to the inner wall surface of the hollow structure 141, or only a portion of the extension portions 2213 may be opposite to the inner wall surface of the hollow structure 141, with the other portion extending out from the hollow structure 141 to connect with the second plate 2212. This configuration makes the hinge assembly more compact, thereby reducing the thickness of the hinge assembly in the direction perpendicular to the bracket body 14. This further reduces the space occupied by the hinge assembly in the internal space of the electronic device 1, which is beneficial to the miniaturization design of the electronic device 1.

[0045] Combination Figure 3 and Figure 6 In one embodiment, the guide portion 222 includes a first position and a second position. The distance between the guide portion 222 and the inner surface of the pivot cover 13 in the first position is greater than the distance between the guide portion 222 and the inner surface of the pivot cover 13 in the second position. When the guide portion 222 is in the second position, the surface of the guide portion 222 facing the pivot cover 13 is in contact with the inner surface of the pivot cover 13.

[0046] The buffer assembly also includes a limiting part, which is used to stop the guide part 222 at a first position. Exemplarily, the limiting part may be a protrusion on the outer surface of the second end of the guide part 222, or it may be a slider on the inner wall of a through hole on the support member 21. The guide part 222 has a groove corresponding to the slider position, and the extension direction of the groove is parallel to the movement direction of the guide part 222. When the guide part 222 reaches the first position, the slider abuts against the end of the groove. Here, the specific arrangement of the limiting part is not limited.

[0047] This design prevents the guide part 222 from coming out of the preset gap, thereby effectively improving the structural reliability of the buffer assembly and further enhancing the reliability of the electronic device 1.

[0048] Combination Figure 3 and Figure 7 In one embodiment, the limiting part includes a protrusion structure disposed on the outer surface of the second end of the guide part 222. When the guide part 222 is in the first position, the protrusion structure abuts against the surface of the support member 21 facing the pivot cover 13. In this way, the structure of the limiting part is simple and easy to manufacture and process.

[0049] Combination Figure 3 and Figure 7 In one embodiment, an annular groove 2221 is provided on the outer surface of the second end of the guide portion 222, and the protruding structure includes a retaining ring 24 that is engaged in the annular groove 2221. When the guide portion 222 is in the first position, the retaining ring 24 abuts against the surface of the support member 21 facing the rotating shaft cover 13.

[0050] Combination Figure 6 When the pivot cover 13 is subjected to an impact force, the pivot cover 13 moves relative to the support body 14 in a direction perpendicular to the support body 14, moving closer to the support body 14. The gap between the second end of the guide portion 222 and the inner surface of the pivot cover 13 gradually decreases. Simultaneously, the elastic element 23 is gradually compressed until the second end of the guide portion 222 contacts the inner surface of the pivot cover 13. At this point, the guide portion 222 is in the second position. This achieves the absorption of the impact force acting on the pivot cover 13. Subsequently, combined with... Figure 3 Since the elastic element 23 has a certain amount of compression, under the reaction of the elastic element 23, the support element 21 is pushed to move away from the support body 14 in a direction perpendicular to the support body 14 until the elastic element 23 is reset. The retaining ring 24 on the second end of the guide part 222 abuts against the surface of the support element 21 facing the rotating shaft cover 13. At this time, the guide part 222 is in the first position and the rotating shaft cover 13 is reset.

[0051] This design simplifies the structure of the raised section, making it easier to manufacture and process.

[0052] Combination Figure 3 In one embodiment, when the guide portion 222 is in the first position, the distance between the guide portion 222 and the inner surface of the hinge cover 13 is 0.2 mm to 0.3 mm, for example, 0.25 mm. That is, the travel distance of the hinge cover 13 moving relative to the bracket body 14 in a direction perpendicular to the bracket body 14 toward the bracket body 14 is 0.2 mm to 0.3 mm. This design ensures the absorption effect of the impact force on the hinge cover 13 while reducing the space occupied by the hinge assembly in the internal space of the electronic device 1, thereby facilitating the miniaturization design of the electronic device 1.

[0053] In another embodiment, the guide portion 222 has a columnar structure. This design not only improves the smoothness of the movement of the guide portion 222, but also reduces the wear between the guide portion 222 and the support member 21, thereby helping to further improve the reliability of the electronic device 1.

[0054] Combination Figure 8 In one embodiment, the support member 21 includes a plate-like structure 211 and two bent portions 212 connected to both ends of the plate-like structure 211, respectively. The bent portions 212 are connected to the inner surface of the pivot cover 13. The two bent portions 212 allow a predetermined gap to be formed between the plate-like structure 211 and the inner surface of the pivot cover 13. A through hole 2111 is provided on the plate-like structure 211 corresponding to the guide portion 222, and the second end of the guide portion 222 extends from the through hole 2111 into the predetermined gap. This arrangement simplifies the structure of the support member 21, facilitates production and processing, and reduces the space occupied inside the electronic device 1.

[0055] An exemplary embodiment of this disclosure provides an electronic device, which may be, for example, a mobile phone, a tablet computer, or other foldable electronic device, and this embodiment does not limit this.

[0056] like Figure 1 , Figure 2 and Figure 3 As shown, the electronic device 1 includes the hinge assembly described above. The hinge assembly includes a bracket and two folding portions 15 connected to the bracket. The two folding portions 15 are movable relative to the bracket to fold and unfold relative to each other. The bracket includes a bracket body 14 and a pivot cover 13 disposed on the outside of the bracket body 14. When the two folding portions 15 are folded, i.e., when the electronic device 1 is in a folded state, the pivot cover 13 is exposed. When the two folding portions 15 are unfolded, i.e., when the electronic device 1 is in an unfolded state, the two middle frames 11 are joined together, and the pivot cover 13 is hidden inside the joined middle frames 11. The pivot cover 13 allows for the concealment of the internal components of the hinge assembly, thereby improving the aesthetics of the electronic device 1 and preventing damage to the hinge assembly, thus enhancing the reliability of the hinge assembly.

[0057] Combination Figure 2 and Figure 3 A buffer member 2 is provided between the pivot cover 13 and the bracket body 14. The buffer member 2 enables the pivot cover 13 to move in a direction opposite to the direction of the resultant force on the bracket body 14, so as to absorb the impact force on the pivot cover 13. This design can reduce the impact force on the screen assembly of the electronic device 1, thereby effectively improving the reliability of the electronic device 1.

[0058] like Figure 1 As shown, in one embodiment, the electronic device 1 further includes a flexible screen. The flexible screen 12 is connected to two folding portions 15 of the hinge assembly via two middle frames 11, so that it can be folded and unfolded along with the two folding portions 15, thereby realizing the foldable function of the electronic device 1.

[0059] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0060] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A hinge assembly, characterized in that, It includes a support frame and two folding portions connected to the support frame, the two folding portions being movable relative to the support frame to fold and unfold with each other; The bracket includes a bracket body and a pivot cover disposed on the outside of the bracket body. A buffer member is disposed between the pivot cover and the bracket body. The buffer member is configured such that the pivot cover can move in a direction opposite to the direction of the resultant force on the bracket body, so as to absorb the impact force on the pivot cover.

2. The hinge assembly according to claim 1, characterized in that, The buffer component includes: A support member is disposed on the inner surface of the shaft cover; A buffer assembly is provided, with one end of the buffer assembly disposed on the bracket body and the other end of the buffer assembly disposed on the support member. The buffer assembly is used to cooperate with the support member so that the pivot cover can move relative to the bracket body in a direction perpendicular to the bracket body to absorb the impact force on the pivot cover.

3. The hinge assembly according to claim 2, characterized in that, A predetermined gap is formed between the support member and the inner surface of the pivot cover, and the buffer assembly includes: A buffer structure, comprising a fixing part and a guide part, wherein the fixing part is fixed to the bracket body, the first end of the guide part is connected to the fixing part, and the second end of the guide part passes through the support member to extend into the preset gap; An elastic element is sleeved on the guide portion and located on the side of the support member opposite to the pivot cover.

4. The hinge assembly according to claim 3, characterized in that, The fixing part includes a first plate connected to each other and two second plates respectively connected to both ends of the first plate. The guide part is disposed on the surface of the first plate facing the rotating shaft cover. Both second plates are connected to the bracket body.

5. The hinge assembly according to claim 4, characterized in that, The bracket body has a hollow structure corresponding to the position of the first plate. The first plate is located inside the hollow structure. Both ends of the first plate have extensions extending toward the pivot cover. The two second plates are respectively connected to the two extensions.

6. The hinge assembly according to claim 3, characterized in that, The guide portion includes a first position and a second position. The distance between the guide portion and the inner surface of the pivot cover at the first position is greater than the distance between the guide portion and the inner surface of the pivot cover at the second position. The buffer assembly further includes: A limiting part is provided to stop the guide part at the first position.

7. The hinge assembly according to claim 6, characterized in that, The limiting part includes a protruding structure disposed on the outer surface of the second end of the guide part. In the first position, the protruding structure abuts against the surface of the support member facing the pivot cover.

8. The hinge assembly according to claim 7, characterized in that, An annular groove is provided on the outer surface of the second end of the guide portion, and the protruding structure includes a retaining ring that is engaged in the annular groove. In the first position, the retaining ring abuts against the surface of the support member facing the rotating shaft cover.

9. The hinge assembly according to claim 6, characterized in that, In the first position, the distance between the guide portion and the inner surface of the pivot cover is 0.2 mm to 0.3 mm; and / or, The guide section has a columnar structure.

10. The hinge assembly according to any one of claims 3 to 9, characterized in that, The support member includes a plate-shaped structure and two bent portions connected to both ends of the plate-shaped structure. The bent portions are connected to the inner surface of the pivot cover. The plate-shaped structure and the inner surface of the pivot cover form the preset gap. The plate-shaped structure is provided with a through hole corresponding to the position of the guide portion. The second end of the guide portion extends from the through hole into the preset gap.

11. An electronic device, characterized in that, The electronic device includes a hinge assembly as described in any one of claims 1 to 10.

12. The electronic device according to claim 11, characterized in that, The electronic device also includes a flexible screen connected to two of the folds of the hinge assembly, so as to be able to fold and unfold with the two folds.