Three-dimensional heat dissipation device and immersion cooling system

Abstract

The present application relates to a three-dimensional heat dissipation device and an immersion cooling system. The three-dimensional heat dissipation device comprises a base, a uniform temperature plate assembly and an evaporation structure layer. The uniform temperature plate assembly comprises a first uniform temperature plate and a second uniform temperature plate. The first uniform temperature plate is located on the base and has a first internal space. Two opposite sides of the second uniform temperature plate are connected to the first uniform temperature plate, so that a through channel is formed between the second uniform temperature plate and the first uniform temperature plate. The second uniform temperature plate is arc-shaped and has a second internal space communicating with the first internal space, and the second internal space and the first internal space jointly form an airtight chamber. The evaporation structure layer covers and is in thermal conduction connection with the uniform temperature plate assembly. In this way, through the above structure, the three-dimensional heat dissipation device and the immersion cooling system of the present application can effectively cool and dissipate heat for the to-be-cooled element, so as to maintain the working efficiency and service life of the to-be-cooled element.

Description

Technical Field

[0001] This invention relates to a three-dimensional heat dissipation device, and more particularly to a three-dimensional heat dissipation device with a heat spreader assembly and an immersion cooling system. Background Technology

[0002] In recent years, with the significant increase in processing power of electronic devices (such as computers or servers) used in cloud services, these devices generate a large amount of waste heat. Some manufacturers immerse the components of electronic devices that need to be cooled (such as CPUs and GPUs) in a closed tank of working fluid to remove the heat generated by these components.

[0003] However, if the current cooling system lacks effective heat dissipation methods, it will be unable to effectively cool and dissipate heat from the components to be cooled, which may affect the working performance and service life of the components to be cooled.

[0004] However, the aforementioned technologies still have inconveniences and shortcomings, requiring further improvement. Therefore, how to effectively solve these inconveniences and shortcomings is one of the important research and development topics at present, and has become a goal that urgently needs improvement in related fields. Summary of the Invention

[0005] This invention proposes a three-dimensional heat dissipation device and an immersion cooling system to solve the problems of previous technologies.

[0006] According to one embodiment of the present invention, a three-dimensional heat dissipation device includes a base, a heat spreader assembly, and at least one evaporation structure layer. The heat spreader assembly includes a first heat spreader and a second heat spreader. The first heat spreader is located on the base and has a first internal space. The second heat spreader is arc-shaped, and its two opposite sides are respectively connected to the first heat spreader, forming a through channel between the second heat spreader and the first heat spreader. The second heat spreader has a second internal space communicating with the first internal space, and the first internal space and the second internal space together constitute an airtight chamber. The evaporation structure layer covers and thermally connects to the heat spreader assembly.

[0007] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the evaporation structure layer is located in a position where the heat spreader assembly faces or is away from the through channel.

[0008] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the first vapor chamber includes a top surface and a bottom surface that are opposite to each other. A top abutment protrudes outward from the bottom surface of the first vapor chamber, and these sides of the second vapor chamber are connected to the top surface of the first vapor chamber. The evaporation structure layer includes a plurality of first evaporation structure layers, which are respectively fixedly covered on the top and bottom surfaces of the first vapor chamber.

[0009] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the cross-section of the second heat exchange plate is U-shaped, and the second heat exchange plate covers the top surface of the first heat exchange plate and a first evaporation structure layer therein.

[0010] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the second vapor chamber has a straight plate portion and two side plate portions. The straight plate portion is connected to the side plate portions respectively, and a through channel is located between the straight plate portion and the first vapor chamber. Each side plate portion extends from one end of the straight plate portion to the first vapor chamber. The evaporation structure layer includes a plurality of second evaporation structure layers, which are respectively fixedly covered on the straight plate portion and the side plate portions.

[0011] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, these second evaporation structure layers face and back to the through channel, respectively.

[0012] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the evaporation structure layer has a plurality of filaments that interweave to form a plurality of gaps.

[0013] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the evaporation structure layer is a single-layer or multi-layer structure.

[0014] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the evaporation structure layer is composed of a powder sintered body, a mesh body, a fiber body, a groove, whiskers, or thermally conductive foam.

[0015] According to one embodiment of the present invention, an immersion cooling system includes a liquid container, a heat source module, and the aforementioned three-dimensional heat dissipation device. The liquid container has an inner chamber for storing coolant. The heat source module is located inside the liquid container and is immersed in the coolant. The three-dimensional heat dissipation device is located inside the liquid container and is thermally connected to the heat source module, and the long axis of the through-channel, the long axis of the liquid container, and the long axis of the heat spreader assembly are parallel to each other.

[0016] Thus, through the above architecture, the three-dimensional heat dissipation device and immersion cooling system of this invention can effectively cool and dissipate heat from the components to be cooled, so as to maintain the working performance and service life of the components to be cooled.

[0017] The above description is only used to illustrate the problem that this creation aims to solve, the technical means to solve the problem, and the effects it produces. The specific details of this creation will be described in detail in the implementation methods and related diagrams below. Attached Figure Description

[0018] To make the above and other objects, features, advantages and embodiments of this invention more apparent and understandable, the accompanying drawings are described below:

[0019] Figure 1 This is a perspective view of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0020] Figure 2 for Figure 1 An exploded view of the three-dimensional heat dissipation device.

[0021] Figure 3 for Figure 1 A cross-sectional view along line segment AA.

[0022] Figure 4 for Figure 1 A sectional view along line segment BB.

[0023] Figure 5 for Figure 3 A magnified view of a portion of region M1.

[0024] Figure 6 for Figure 3 A magnified view of a portion of region M2.

[0025] Figure 7 This is a schematic diagram of an immersion cooling system according to an embodiment of the present invention.

[0026] The reference numerals in the attached figures are explained as follows:

[0027] 10: Three-dimensional heat dissipation device

[0028] 100: Base

[0029] 110: Framework

[0030] 120: Opening

[0031] 130: Elastic Clip

[0032] 200: Heat spreader assembly

[0033] 210: First heat spreader

[0034] 211: Top surface

[0035] 212: Bottom surface

[0036] 213: Top and back sections

[0037] 214: First Interior Space

[0038] 220: Second heat spreader

[0039] 221: Straight-bar section

[0040] 222: Side panel section

[0041] 223: Second Interior Space

[0042] 224: Arc-shaped connection part

[0043] 230: Airtight Chamber

[0044] 231: Capillary structure

[0045] 240: Through-passage

[0046] 300: First evaporation structure layer

[0047] 301, 401: Multi-layer structure

[0048] 310: Upper evaporation structure layer

[0049] 320: Lower evaporation structure layer

[0050] 400: Second evaporation structure layer

[0051] 410: Internal evaporation structure layer of the straight plate

[0052] 420: Straight-plate external evaporation structure layer

[0053] 430: Internal evaporation structure layer of side panel

[0054] 440: External evaporation structure layer of side panel

[0055] 500: Immersion Cooling System

[0056] 510: Liquid containers

[0057] 511: Inner Chamber

[0058] 511A: Inner wall

[0059] 520: Coolant

[0060] 600: Heat source module

[0061] 610: Circuit Board

[0062] 620: Electronic Components

[0063] AA, BB: line segments

[0064] M1, M2: Areas

[0065] X, Y, Z: Axes Detailed Implementation

[0066] The following diagrams disclose various embodiments of this invention. For clarity, many practical details will be described in the following description. However, those skilled in the art will understand that these practical details are not essential in some embodiments of this invention and should not be used to limit the invention. Furthermore, for the sake of simplicity, some conventional structures and components are shown in a simplified schematic manner. Additionally, for ease of viewing, the dimensions of the components in the diagrams are not drawn to scale.

[0067] Figure 1 A perspective view of a three-dimensional heat dissipation device 10 according to an embodiment of this invention. Figure 2 for Figure 1 An exploded view of the three-dimensional heat dissipation device 10. Figure 3 for Figure 1 A sectional view along line segment AA. (e.g.) Figures 1 to 3 As shown, in this embodiment, the three-dimensional heat dissipation device 10 includes a base 100, a heat spreader assembly 200, and multiple evaporation structure layers (such as a first evaporation structure layer 300 and a second evaporation structure layer 400). The heat spreader assembly 200 includes a first heat spreader 210 and a second heat spreader 220. The first heat spreader 210 is located on the base 100 and is used to conduct heat to connect the element to be cooled (not shown in the figure). The second heat spreader 220 is arc-shaped, and two opposite sides of the second heat spreader 220 are respectively connected to the first heat spreader 210, so that a through channel 240 is formed between the second heat spreader 220 and the first heat spreader 210. The first heat spreader 210 has a first internal space 214, and the second heat spreader 220 has a second internal space 223. The second internal space 223 is arc-shaped and communicates with the first internal space 214, so that the two together constitute an airtight chamber 230. Figure 3 An airtight chamber 230 is filled with a working fluid (not shown in the figure). These evaporation structure layers are fixedly covered on the outer surface of the heat spreader assembly 200 and are thermally connected to the heat spreader assembly 200. In this way, the heat energy of the element to be cooled can be distributed to these evaporation structure layers through the working fluid (not shown in the figure) in the heat spreader assembly 200, and thus dissipated evenly from these evaporation structure layers to the outside.

[0068] More specifically, in this embodiment, the base 100 includes a frame 110 and a plurality of (e.g., two) elastic clips 130. The frame 110 can be welded or secured to the first heat spreader 210. The elastic clips 130 are located on two opposite sides of the frame 110 for fixing the frame 110 to a stationary component (such as a housing or wiring board). The frame 110 has a plurality of openings 120. These openings 120 are arranged sequentially along the long axis (e.g., the Y-axis) of the frame 110 and are located between the elastic clips 130.

[0069] Figure 4 for Figure 1 A sectional view created along line segment BB. (Example) Figure 2 and Figure 4 As shown, the first heat spreader 210 is generally plate-shaped, and the long axis of the first heat spreader 210 and the long axis of the through channel 240 extend along the Y-axis. The first heat spreader 210 has a top surface 211 and a bottom surface 212 that are opposite to each other. The top surface 211 of the first heat spreader 210 is connected to the through channel 240. A portion of the bottom surface 212 of the first heat spreader 210 protrudes outward to form a top abutment 213. Figure 2 The top support 213 is located at one of the openings 120 of the frame 110. Figure 2 It extends out to abut against the element to be cooled (not shown in the figure).

[0070] More specifically, such as Figure 3 and Figure 4 As shown, the evaporation structure layer includes a plurality of first evaporation structure layers 300. These first evaporation structure layers 300 are respectively located on the top surface 211 and the bottom surface 212 of the first heat spreader 210. However, the invention is not limited thereto, and in other embodiments, the first evaporation structure layers 300 may also be located only on the top surface 211 or the bottom surface 212 of the first heat spreader 210.

[0071] Furthermore, these first evaporation structure layers 300 are divided into an upper evaporation structure layer 310 and a lower evaporation structure layer 320. The upper evaporation structure layer 310 is located on the top surface 211 of the first heat spreader 210 and faces the through channel 240. The lower evaporation structure layer 320 is located on the bottom surface 212 of the first heat spreader 210 and faces away from the through channel 240, and the lower evaporation structure layer 320 is exposed from another opening 120 of the frame 110, wherein the top part 213 is located between the two lower evaporation structure layers 320.

[0072] In one embodiment, the first evaporation structure layer 300 is a powder sintered body, mesh, fiber, groove, whisker, or thermally conductive foam formed on the first heat spreader 210; however, the invention is not limited thereto.

[0073] In this embodiment, the first evaporation structure layer 300 is a mesh structure, hence also called the first mesh structure layer, which contains many filaments (not shown in the figure) that interweave to form multiple gaps. Therefore, these gaps allow more fluid (such as gas or liquid) to pass through and carry away more heat energy from the element to be cooled; however, this invention is not limited to this.

[0074] also, Figure 5 for Figure 3 A magnified view of a portion of region M1. (See attached image.) Figure 2 and Figure 5As shown, in this embodiment, the first evaporation structure layer 300 is a multilayer structure 301 with layers stacked on top of each other. However, this invention is not limited to this. In other embodiments, the first evaporation structure layer 300 may also be a single-layer structure.

[0075] like Figure 2 and Figure 3 As shown, the second heat spreader 220 has a U-shaped cross-section, and its two opposite long sides are inserted into the top surface 211 of the first heat spreader 210. More specifically, the second heat spreader 220 has a straight plate portion 221 and two side plate portions 222, which are arranged opposite to each other. The straight plate portion 221 connects these side plate portions 222, and a through channel 240 is located between the straight plate portion 221 and the first heat spreader 210. Each side plate portion 222 connects to the opposite ends of the straight plate portion 221 and the top surface 211 of the first heat spreader 210. An arc-shaped connecting portion 224 is provided between the straight plate portion 221 and the side plate portions 222.

[0076] like Figure 3 and Figure 4 As shown, the evaporation structure layer includes a plurality of second evaporation structure layers 400. These second evaporation structure layers 400 are respectively located on the straight plate portion 221 and the side plate portions 222, and respectively face and back to the through channel 240. However, the invention is not limited thereto, and in other embodiments, the second evaporation structure layers 400 may also be located only on the straight plate portion 221 or one of the side plate portions 222.

[0077] Furthermore, these second evaporation structure layers 400 are further subdivided into an inner evaporation structure layer 410 of the straight plate, an outer evaporation structure layer 420 of the straight plate, an inner evaporation structure layer 430 of the side plate, and an outer evaporation structure layer 440 of the side plate. The inner evaporation structure layer 410 of the straight plate is located on the straight plate portion 221 facing the through channel 240, the outer evaporation structure layer 420 of the straight plate is located on the straight plate portion 221 facing away from the through channel 240, the inner evaporation structure layer 430 of the side plate is located on each side plate portion 222 facing the through channel 240, and the outer evaporation structure layer 440 of the side plate is located on each side plate portion 222 facing away from the through channel 240.

[0078] Furthermore, the long axis (Y-axis) of the straight plate internal evaporation structure layer 410, the straight plate external evaporation structure layer 420, the side plate internal evaporation structure layer 430, the side plate external evaporation structure layer 440, and the through channel 240 are parallel to each other.

[0079] The second evaporation structure layer 400 is a powder sintered body, mesh, fiber, groove, whisker, or thermally conductive foam formed on the second heat spreader 220; however, this invention is not limited to this.

[0080] In this embodiment, the second evaporation structure layer 400 is a mesh structure, hence also called the second mesh structure layer, which contains many filaments (not shown in the figure) that interweave to form multiple gaps. These gaps allow more fluid (such as gas or liquid) to pass through and carry away more heat energy from the element to be cooled; however, this invention is not limited to this.

[0081] Figure 6 for Figure 3 A magnified view of a portion of region M2. (See attached image.) Figure 2 and Figure 6 As shown, in this embodiment, the second evaporation structure layer 400 is a multilayer structure 401 with layers stacked on top of each other. However, this invention is not limited to this. In other embodiments, the second evaporation structure layer 400 may also be a single-layer structure.

[0082] Furthermore, the airtight chamber 230 of the heat spreader assembly 200 includes a capillary structure 231. The capillary structure 231 is disposed on the inner surface of the airtight chamber 230, allowing the working fluid within the airtight chamber 230 to flow under the guidance of the capillary structure 231. The capillary structure 231, the first evaporation structure layer 300, and the second evaporation structure layer 400 can be similar components. For example, the capillary structure 231 can be made of a powder sintered body, a mesh body, a fiber body, a groove, whiskers, or any combination thereof, but this invention is not limited thereto.

[0083] It should be understood that this invention is not limited to the number of the first evaporation structure layer 300 and the second evaporation structure layer 400. In other embodiments, the first evaporation structure layer 300 and the second evaporation structure layer 400 may also be a single unit.

[0084] Figure 7 This is a schematic diagram of an immersion cooling system 500 according to an embodiment of the present invention. Figure 7 As shown, the immersion cooling system 500 includes a liquid container 510, a heat source module 600, and the aforementioned three-dimensional heat dissipation device 10. The liquid container 510 has an inner chamber 511 for storing coolant 520. The heat source module 600 is located inside the liquid container 510 and is immersed in the coolant 520. The three-dimensional heat dissipation device 10 is located inside the liquid container 510 and is thermally connected to the heat source module 600.

[0085] Thus, as Figure 3 and Figure 7 As shown, when the heat energy of the heat source module 600 is transferred to the heat spreader assembly 200 of the three-dimensional heat dissipation device 10, since all surfaces of the first evaporation structure layer 300 and the second evaporation structure layer 400 are in contact with the coolant 520, some of the heat energy transferred to the first evaporation structure layer 300 and the second evaporation structure layer 400 can be quickly transferred into the coolant 520, thereby effectively removing the heat energy of the heat source module 600.

[0086] Furthermore, in this embodiment, the three-dimensional heat dissipation device 10 is vertically located within the inner chamber 511, and the major axis directions (e.g., Z-axis) of the through channel 240, the liquid container 510, and the heat spreader assembly 200 are parallel to each other. Thus, the coolant 520 can enter the through channel 240, the first evaporation structure layer 300, and the second evaporation structure layer 400, allowing the coolant 520 to evaporate into bubbles upon heating and rise along the Z-axis to the surface of the coolant 520, thereby rapidly dissipating heat from the heat source module 600.

[0087] For example, the immersion cooling system 500 is a two-phase immersion liquid cooling system, and the liquid container 510 is a 1U server chassis; the heat source module 600 includes a circuit board 610 and several electronic components 620. The circuit board 610 is vertically fixed to the inner wall 511A of the liquid container 510. The electronic components 620 are distributed on the circuit board 610 and are in contact with the top portion 213 of the first heat spreader 210. In this embodiment, the electronic components 620 are conventional components such as CPUs, GPUs, or interface cards; however, this invention is not limited to these.

[0088] Thus, through the above architecture, the three-dimensional heat dissipation device and immersion cooling system of this invention can effectively cool and dissipate heat from the components to be cooled, thereby maintaining the working efficiency and service life of the components to be cooled.

[0089] Finally, the embodiments disclosed above are not intended to limit this invention. Any person skilled in the art may make various modifications and refinements without departing from the spirit and scope of this invention, and all such modifications and refinements shall be protected under this invention. Therefore, the scope of protection of this invention shall be determined by the appended claims.

Claims

1. A three-dimensional heat dissipation device, characterized in that, include: A base; A heat exchanger assembly includes a first heat exchanger and a second heat exchanger. The first heat exchanger is located on a base and has a first internal space. The second heat exchanger is arc-shaped, and its two opposite sides are respectively connected to the first heat exchanger, forming a through channel between the second and first heat exchangers. The second heat exchanger has a second internal space communicating with the first internal space, and the first and second internal spaces together constitute an airtight chamber. At least one evaporation structure layer covers and thermally connects the vapor chamber assembly.

2. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The evaporation structure layer is located in the position where the vapor chamber assembly faces or is away from the through channel.

3. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The first heat spreader includes a top surface and a bottom surface opposite to each other. The bottom surface of the first heat spreader protrudes outward with a top abutment, and the opposite sides of the second heat spreader are connected to the top surface of the first heat spreader. The evaporation structure layer includes a plurality of first evaporation structure layers, which are respectively fixedly covered on the top and bottom surfaces of the first heat spreader.

4. The three-dimensional heat dissipation device as described in claim 3, characterized in that, The second heat spreader has a U-shaped cross-section and covers the top surface of the first heat spreader and one of the plurality of first evaporation structure layers.

5. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The second heat exchanger has a straight plate portion and two side plate portions. The straight plate portion is connected to the two side plate portions respectively. The through channel is located between the straight plate portion and the first heat exchanger, and each of the two side plate portions extends from one end of the straight plate portion to the first heat exchanger. The evaporation structure layer includes a plurality of second evaporation structure layers, which are respectively fixedly covered on the straight plate portion and the two side plate portions.

6. The three-dimensional heat dissipation device as described in claim 5, characterized in that, The plurality of second evaporation structure layers face and are opposite to the through channel, respectively.

7. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The evaporation structure layer has multiple filaments that interweave to form multiple gaps.

8. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The evaporation structure layer can be a single layer or multiple layers.

9. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The evaporation structure layer is composed of powder sintered body, mesh body, fiber body, groove, whisker crystal or thermally conductive foam.

10. An immersion cooling system, characterized in that, include: A liquid container having an internal chamber for storing coolant; A heat source module is located inside the liquid container and is used to be immersed in the coolant; as well as The three-dimensional heat dissipation device as described in any one of claims 1 to 9 is located inside the liquid container and is thermally connected to the heat source module. The major axis of the through channel, the major axis of the liquid container, and the major axis of the heat spreader assembly are parallel to each other.

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