Optoelectronic chip and mouse
By adopting a dual-layer layout lead frame in the optical mouse to integrate surface-mount components and circuit chips, the problems of complex manufacturing processes and high equipment costs in the prior art are solved, achieving the effect of simplified design and reduced defect rate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN JINGBANG ELECTRONICS
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-29
Smart Images
Figure CN224304153U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of mice, and more particularly to an optoelectronic chip and a mouse. Background Technology
[0002] As a crucial component of modern computer input devices, the integration level and manufacturing process of the internal electronic circuitry of an optical mouse directly impact its performance and manufacturing cost. Currently, optical mouse circuit boards typically integrate buttons, encoders, photoelectric sensors, control chips, wireless communication modules, and various passive components. Among these, buttons, encoders, and photoelectric sensors, due to their specific structural strength and optical positioning accuracy requirements, must employ through-hole soldering to ensure physical stability. Meanwhile, the remaining numerous functional components generally utilize surface-mount packaging to meet miniaturization demands, significantly increasing the complexity of the circuit design. In the manufacturing process, surface-mount components require high-precision surface-mount equipment for assembly, while through-hole components require traditional reflow soldering. The alternation of these two processes not only necessitates the purchase of expensive surface-mount equipment and associated factory facilities but also leads to production process segmentation, extended lead times, and increased risks of defects such as cold solder joints and bridging during the soldering process. Utility Model Content
[0003] In view of this, the purpose of this application is to overcome the shortcomings of the prior art and provide an optoelectronic chip and a mouse.
[0004] To achieve the above objectives, the technical solution adopted in this application is as follows:
[0005] This application provides:
[0006] An optoelectronic chip, comprising:
[0007] Package components;
[0008] A lead frame, wherein the lead frame portion is disposed within the package, and the lead frame has a first surface and a second surface;
[0009] A surface mount element, the surface mount element being disposed on a first surface of the lead frame;
[0010] A circuit chip is disposed on the second side of the lead frame and is connected to the lead frame by a wire.
[0011] Furthermore, the package includes a housing and a cover, the lead frame portion is disposed within the housing, and the cover is used to seal the bottom of the housing.
[0012] Furthermore, the cover is provided with clearance holes.
[0013] Furthermore, the lead frame includes a plurality of first pins, each first pin including an integrally formed plug portion and a lead connection portion. One side of the lead connection portion is a mating surface, and the side of the lead connection portion away from the mating surface is a soldering surface. The circuit chip is connected to the soldering surface via a wire.
[0014] Furthermore, the lead frame includes at least one second pin, and an extension of the second pin has a mounting portion having a first mounting position and a second mounting position.
[0015] Furthermore, the lead frame includes a wireless transmitter, the wireless transmitter includes a third pin, the third pin is connected to a curved portion, and the end of the curved portion away from the third pin is provided with a solder portion.
[0016] Furthermore, the length of the curved portion is L, which satisfies: 26mm≤L≤32mm.
[0017] Furthermore, the surface mount element includes one or more of a boost chip, a crystal oscillator, a capacitor, a resistor, a charging chip, and a light-emitting element, which are fixedly disposed on the first surface of the lead frame.
[0018] Furthermore, the circuit chip includes a wireless control chip fixedly disposed at the first mounting position and an optical sensor chip disposed at the second mounting position.
[0019] This application also provides a mouse that includes any of the photoelectric chips described above.
[0020] This application forms a double-layer layout structure by integrating surface mount components on the first side of the lead frame and setting the circuit chip on the second side of the lead frame. This allows the surface mount soldering process and the circuit chip bonding process to be implemented independently on the two working surfaces of the lead frame. At the same time, the lead frame achieves three-dimensional interconnection between the surface mount components and the circuit chip through the first and second pins, which highly integrates the mouse functional modules. This allows the mouse to be manufactured using only a single packaged chip to replace the original discrete component layout, greatly simplifying the complexity of the mouse circuit board design. Mouse manufacturers also save on high-precision surface mount equipment, effectively reducing the incidence of soldering defects such as cold solder joints and bridging.
[0021] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This shows a schematic diagram of the overall structure of the optoelectronic chip of this application from a first-view perspective;
[0024] Figure 2 This shows a schematic diagram of the overall structure of the optoelectronic chip of this application from a second perspective;
[0025] Figure 3 This shows a schematic diagram of the structure of the optoelectronic chip in its exposed state at the bottom;
[0026] Figure 4 This paper shows a schematic diagram of the structure of the lead frame and the surface mount element in the bonded state.
[0027] Figure 5 This shows a first-view structural schematic diagram of the first pin and lead wire connection portion of this application;
[0028] Figure 6 This is a schematic diagram of the first pin and lead wire connection portion from a second perspective.
[0029] Figure 7 A schematic diagram of the second pin and mounting section of this application is shown;
[0030] Figure 8 A schematic diagram of the structure of the wireless transmitter of this application is shown.
[0031] Explanation of key component symbols:
[0032] 100 - Package; 110 - Housing; 120 - Cover; 121 - Clearance hole; 200 - Lead frame; 210 - First pin; 220 - Lead connection; 221 - Surface mount; 222 - Soldering surface; 230 - Second pin; 240 - Mounting part; 241 - First mounting position; 242 - Second mounting position; 250 - Wireless transmitter; 251 - Third pin; 252 - Curved part; 253 - Soldering part; 300 - Surface mount component; 310 - Boost converter chip; 320 - Crystal oscillator; 330 - Capacitor; 340 - Resistor; 350 - Charging chip; 360 - Light source; 400 - Circuit chip; 410 - Wireless control chip; 420 - Optical sensor chip. Detailed Implementation
[0033] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0034] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0037] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0038] This application provides an optoelectronic chip, which includes a package 100, a lead frame 200, a surface mount element 300, and a circuit chip 400.
[0039] In some specific embodiments, the lead frame 200 is partially disposed within the package 100, the lead frame 200 has a first surface and a second surface, the surface mount element 300 is disposed on the first surface of the lead frame 200, the circuit chip 400 is disposed on the second surface of the lead frame 200, and the circuit chip 400 is connected to the lead frame 200 via wires.
[0040] See Figure 1 , Figure 2 as well as Figure 3 As shown, in this embodiment, by attaching the surface mount element 300 to the first surface of the lead frame 200, specifically, attaching the surface mount element 300 to the upper surface of the lead frame 200, and then fixing the circuit chip 400 to the second surface of the lead frame 200, specifically, fixing the circuit chip 400 to the bottom surface of the lead frame 200, it can be understood that the surface mount element 300 and the circuit chip 400 are respectively set on two sides of the lead frame 200, forming a double-layer placement space, minimizing the area of the lead frame 200, thereby reducing the overall package volume and packaging cost. In addition, when the packaging plant performs packaging processing, the surface mount process is only performed on the upper surface of the lead frame 200, while the fixing of the circuit chip 400 and the wire connection process are only performed on the bottom surface of the lead frame 200, so that their processes do not affect each other during manufacturing.
[0041] In one embodiment, the surface mount element 300 is mounted on the upper surface of the lead frame 200 using a surface mount process, while the circuit chip 400 is fixed to the bottom surface of the lead frame 200 using an insulating adhesive.
[0042] In this embodiment, the surface mount element 300 includes the electronic components and chips required for the mouse, and the circuit chip 400 includes the chips required for the mouse. It can be understood that by integrating the corresponding electronic components, chips, and chips onto the lead frame 200, the mouse manufacturer does not need to perform surface mount processing. That is, the surface mount process can be omitted in the mouse circuit board design, making the mouse circuit board design simple and easy. It is only necessary to solder the optoelectronic chip onto the circuit board using a solder potting process, thereby reducing the investment in mouse production equipment, optimizing the production process, thereby reducing the cost of mouse manufacturers and improving production efficiency.
[0043] In some specific embodiments, the package 100 includes a housing 110 and a cover 120, the lead frame 200 is partially disposed within the housing 110, and the cover 120 is used to close the bottom of the housing 110.
[0044] Please see Figure 1 and Figure 2 As shown, in this embodiment, after the surface mount element 300 is soldered onto the upper surface of the lead frame 200 using a surface mount process, an injection molding process is performed. Specifically, the surface mount lead frame 200 is placed in a corresponding mold, and molten insulating plastic is injected onto the lead frame 200 under the action of an injection molding machine. After cooling, a housing 110 is formed. At this time, some or all of the surface mount elements 300 are in the housing 110 to prevent the leads connected to the lead frame 200 from moving and causing a short circuit. At this time, the bottom surface of the lead frame 200 exposes the position where the circuit chip 400 is installed and the position where it is connected to the circuit chip 400 through wires. After the circuit chip 400 is fixed to the bottom surface of the lead frame 200 and the circuit chip 400 is connected to the lead frame 200 through wires, the exposed part at the bottom of the housing 110 is sealed by the cover 120, thereby completing the packaging of the entire chip.
[0045] The lead frame 200 includes multiple pins, and the shape and function of the pins vary depending on their location.
[0046] In some specific embodiments, the lead frame 200 includes a plurality of first pins 210, each first pin 210 including an integrally formed plug portion and a lead connection portion 220. One side of the lead connection portion 220 is a mating surface 221, and the side of the lead connection portion 220 away from the mating surface 221 is a soldering surface 222. The circuit chip 400 is connected to the soldering surface 222 via a wire.
[0047] Please see Figures 3 to 6 As shown, in this embodiment, multiple first pins 210 are evenly spaced on both sides of the entire frame, and the first pins 210 are through-hole pins. Each pin includes an integrally formed pin portion and a lead wire connection portion 220. Specifically, the first pin 210, composed of the pin portion and the lead wire connection portion 220, is essentially an irregularly shaped metal conductor. The shape of the first pin 210 can be designed as needed and is not limited here. It can be understood that the first pin 210 can be directly inserted into the corresponding groove of the mouse circuit board through the pin portion to complete the installation of the optoelectronic chip, and can also realize the mutual transmission of signals between the optoelectronic chip and the circuit board.
[0048] It should be noted that the lead connection part 220 is located inside the housing 110, while the pin part is located outside the housing 110 in order to connect with the circuit board.
[0049] Please continue reading. Figure 4 , Figure 5 as well as Figure 6 As shown, the lead connection portion 220 has two surfaces, namely the bonding surface 221 and the soldering surface 222. The bonding surface 221 is located on the upper surface, and the soldering surface 222 is located on the lower surface. Specifically, the bonding surface 221 is connected to the surface mount element 300 using a surface mount process to realize the signal connection between the surface mount element 300 and the first pin 210. The soldering surface 222 is connected to the circuit chip 400 through a wire. It can be understood that the lead connection portion 220 can act as a conductor to realize the signal transmission between the circuit chip 400 and the surface mount element 300.
[0050] In one embodiment, the number of first pins 210 can be adaptively adjusted according to the number of components in the surface mount component 300, and the number of first pins 210 is not limited here.
[0051] In some specific embodiments, the lead frame 200 includes at least one second pin 230, an extension of the second pin 230 having a mounting portion 240, the mounting portion 240 having a first mounting position 241 and a second mounting position 242.
[0052] Please see Figure 3 and Figure 7 As shown, since the circuit chip 400 is fixedly mounted on the bottom surface of the lead frame 200, the second pin 230 is mainly used for the fixed mounting of the circuit chip 400. Specifically, the extension component of the second pin 230 is the mounting part 240. The bottom surface of the mounting part 240 is used for mounting the circuit chip 400, and the upper surface of the mounting part 240 can be used for the bonding and mounting of the surface mount component 300. Specifically, the bottom surface of the mounting part 240 has multiple mounting positions. In this embodiment, the mounting part 240 has two mounting positions, which are respectively the first mounting position 241 and the second mounting position 242. In practice, the mounting positions on the mounting part 240 can be adaptively adjusted according to the corresponding number of chips. The specific number of mounting positions is not limited here.
[0053] See Figure 4 As shown, the second pin 230 is also connected to a pin portion, which is used to insert it into the circuit board for connection. Specifically, the pin portion is used to achieve grounding connection.
[0054] Furthermore, the bottom surface of the second pin 230 also has a soldering position for soldering with the lead wire. The specific soldering position is not limited here and can be designed according to actual needs. Specifically, the upper surface of the second pin 230 has a corresponding surface mount position, that is, there is a surface mount position on the upper surface of the mounting part 240 for surface mount element 300 to be mounted.
[0055] In some specific embodiments, the lead frame 200 includes a wireless transmitter 250, the wireless transmitter 250 includes a third pin 251, the third pin 251 is connected to a curved portion 252, and the end of the curved portion 252 away from the third pin 251 is provided with a solder portion 253.
[0056] See Figure 4 and Figure 8 As shown, in order to integrate the wireless control function into the optoelectronic chip, the wireless transmitter 250 includes a third pin 251. Specifically, in order to realize wireless signal reception and transmission, the extension of the third pin 251 is configured into a curved part 252. In order to connect the curved part 252 to the chip in the circuit chip 400, a soldering part 253 is provided at the end of the curved part 252 to realize the connection with the circuit chip 400.
[0057] The curved part 252, with its serpentine bend, serves as an antenna. Traditional antenna solutions involve etching the antenna onto the circuit board, which requires PCB space. Different PCB materials and antenna placement locations necessitate multiple design and verification processes for the antenna shape and performance of each wireless mouse board to ensure optimal performance, thus increasing design complexity. This implementation integrates the curved part 252 into the optoelectronic chip. The curved part 252, built into the wireless mouse chip package, acts as the antenna, providing stable wireless performance. It eliminates the need for external through-hole connectors to the device's PCB, saving on overall package size and cost while overcoming the drawbacks of traditional onboard antennas.
[0058] In some specific embodiments, the length of the curved portion 252 is L, which satisfies: 26mm≤L≤32mm.
[0059] In this embodiment, the length can be selected from 26 mm, 27 mm, 28 mm, 29 mm, 30 mm, 31 mm, 32 mm, etc., and the specific value is not limited here.
[0060] In some specific embodiments, the patch element 300 includes one or more of a boost chip 310, a crystal oscillator 320, a capacitor 330, a resistor 340, a charging chip 350, and a light-emitting element 360, which are fixedly disposed on the first surface of the lead frame 200.
[0061] See Figure 4 As shown, the surface mount element 300 is attached to the first plane formed by the various bonding surfaces 221, and the connecting pins of each component are connected to the corresponding bonding surface 221 using a surface mount process. Specifically, in this embodiment, the boost chip 310, crystal oscillator 320, capacitor 330, resistor 340, charging chip 350, and light-emitting element 360 are fixed to the bonding surface 221 at the corresponding positions using a surface mount process. The number and installation position of the above components are not limited here and can be designed according to actual needs.
[0062] In some specific embodiments, the circuit chip 400 includes a wireless control chip 410 fixedly disposed at the first mounting position 241 and an optical sensor chip 420 disposed at the second mounting position 242.
[0063] Please see Figure 3 as well as Figure 7 As shown, in this embodiment, the wireless control chip 410 is fixedly mounted on the first mounting position 241 with insulating adhesive. Similarly, the optical sensor chip 420 is also fixedly mounted on the second mounting position 242 with insulating adhesive. The pins of the wireless control chip 410 and the optical sensor chip 420 are connected by wires and corresponding soldering surfaces 222 to achieve signal transmission with the mouse circuit board.
[0064] In some embodiments, the circuit chip 400 may also include one or more of the following: wired control chip, memory chip chip, charging chip chip, boost chip chip, light-emitting LED chip, resistor chip, etc. The specific number and type are not limited here. Correspondingly, multiple mounting positions are provided on the mounting part 240, and it is not limited to providing a first mounting position 241 and a second mounting position 242 on the bottom surface of the mounting part 240. The number of mounting positions can be adaptively designed and adjusted according to the type and number of the circuit chip 400.
[0065] In this embodiment, the cover 120 is provided with a clearance hole 121, and the clearance hole 121 is located in the photosensitive area of the optical sensor chip 420. Furthermore, the light emitted by the light-emitting element 360 is refracted onto the desktop through the optical lens of the mouse. The illuminated desktop image passes upward through the optical lens through the clearance hole 121 to the photosensitive area of the optical sensor chip 420. The optical sensor chip 420 detects the transmitted image and analyzes and processes it to determine the moving direction and moving distance of the optical mouse.
[0066] In this embodiment, the power supply pins of the wireless control chip 410 and the optical sensor chip 420 are connected to the same soldering surface 222, thereby enabling the two chips to share a single power supply pin, thus reducing the number of power supply pins by two.
[0067] This application also provides a mouse that includes any of the photoelectric chips described above, and the mouse further includes a circuit board on which the photoelectric chip is mounted.
[0068] It is understandable that, since the mouse contains the photoelectric chip, the mouse provided in this application has the technical effect of including the photoelectric chip.
[0069] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0070] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.
Claims
1. A photoelectric chip, characterized in that, include: Package (100); A lead frame (200) is partially disposed within the package (100), the lead frame (200) having a first surface and a second surface; A surface mount element (300) is disposed on a first surface of the lead frame (200); A circuit chip (400) is disposed on the second side of the lead frame (200) and is connected to the lead frame (200) by a wire.
2. The optoelectronic chip according to claim 1, characterized in that, The package (100) includes a housing (110) and a cover (120), the lead frame (200) is partially disposed inside the housing (110), and the cover (120) is used to close the bottom of the housing (110).
3. The optoelectronic chip according to claim 2, characterized in that, The cover (120) is provided with a clearance hole (121).
4. The optoelectronic chip according to claim 1, characterized in that, The lead frame (200) includes a plurality of first pins (210), each first pin (210) including an integrally formed plug portion and a lead connection portion (220). One side of the lead connection portion (220) is a mating surface (221), and the side of the lead connection portion (220) away from the mating surface (221) is a soldering surface (222). The circuit chip (400) is connected to the soldering surface (222) by a wire.
5. The optoelectronic chip according to claim 1, characterized in that, The lead frame (200) includes at least one second pin (230), an extension of which has a mounting portion (240) having a first mounting position (241) and a second mounting position (242).
6. The optoelectronic chip according to claim 1, characterized in that, The lead frame (200) includes a wireless transmitter (250), which includes a third pin (251) connected to a curved portion (252), and a solder portion (253) is provided at the end of the curved portion (252) away from the third pin (251).
7. The optoelectronic chip according to claim 6, characterized in that, The length of the curved part (252) is L, which satisfies: 26mm≤L≤32mm.
8. The optoelectronic chip according to claim 1, characterized in that, The patch element (300) includes one or more of a boost chip (310), a crystal oscillator (320), a capacitor (330), a resistor (340), a charging chip (350), and a light-emitting element (360), which are fixedly disposed on the first surface of the lead frame (200).
9. The optoelectronic chip according to claim 5, characterized in that, The circuit chip (400) includes a wireless control chip (410) fixedly disposed at the first mounting position (241) and an optical sensor chip (420) disposed at the second mounting position (242).
10. A mouse, characterized in that, Includes the photoelectric chip according to any one of claims 1 to 9.