A microwave multilayer vertical interconnection circuit structure

Abstract

The utility model belongs to the microwave device technical field discloses a kind of microwave multilayer board intervertical interconnection circuit structure, including cavity, microwave multilayer board and radio frequency glass insulator;Microwave multilayer board is fixed in the two sides of cavity, glass insulator is set on the extension structure parallel to microwave multilayer board in cavity geometric center, and microwave multilayer board forms air coaxial structure, for being connected with microstrip circuit by bonding mode and realizing the matching transmission of microwave signal, the vertical interconnection of microwave multilayer board radio frequency circuit is completed.The utility model forms air coaxial structure between radio frequency glass insulator and microwave multilayer board to realize circuit matching, more simple than prior art using circuit mode matching.And gold wire bonding mode can realize automation assembly and improve assembly efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of microwave device technology, and specifically relates to a vertical interconnection circuit structure between microwave multilayer boards. Background Technology

[0002] Microwave devices and components are widely used in radar, navigation, communication, electronic warfare, and other fields. The interconnection between circuit boards carries the mechanical connection and electrical interaction of microwave devices and components. With the continuous increase in electromagnetic transmission frequency and system integration density, microwave multilayer boards are now widely used in devices and components, making the interconnection of signals between microwave multilayer boards particularly important for signal transmission performance. Typically, radio frequency (RF) glass insulators are used to solder matching microwave circuits on the microwave multilayer board via through-hole soldering. One end of the RF glass insulator is soldered to the bottom surface of the multilayer board microwave circuit, and the other end is soldered to the top surface. This method requires high soldering precision; the amount of solder can affect circuit matching performance. Furthermore, during the through-hole soldering process, it is impossible to detect solder overflow at the bottom of the microwave multilayer board, posing a potential threat to product reliability.

[0003] Because the microwave multilayer circuit board and the surface of the radio frequency glass insulator are gold-plated, a welding method is used to achieve vertical interconnection between microwave multilayer boards. This method requires the gold-removal treatment of the welding surface, which increases the welding process and thus increases the cost. Utility Model Content

[0004] In view of this, the present invention provides a vertical interconnection circuit structure between microwave multilayer boards to solve the above problems.

[0005] To solve the above technical problems, this utility model provides a microwave multilayer board vertical interconnection circuit structure, including:

[0006] Cavity, microwave multilayer board and radio frequency glass insulator;

[0007] The microwave multilayer board is fixed on both sides of the cavity. The glass insulator is set on the extended structure parallel to the microwave multilayer board at the geometric center of the cavity, forming an air coaxial structure with the microwave multilayer board. It is used to connect with the microstrip circuit through bonding to realize the matching transmission of microwave signals and complete the vertical interconnection of the radio frequency circuit of the microwave multilayer board.

[0008] As an alternative, one side of the microwave multilayer board is gold-plated and bonded to the cavity using conductive adhesive.

[0009] As an alternative, the radio frequency glass insulator is soldered to the cavity using lead-tin solder.

[0010] As an alternative, the thickness of the microwave multilayer board is 6.2 mm.

[0011] As an alternative, the inner conductor of the radio frequency glass insulator has a diameter of 0.38 mm and a length of 14.4 mm, while the outer conductor has a diameter of 2.5 mm and a thickness of 2 mm.

[0012] As an alternative, the diameter of the metallized hole in the microwave multilayer board is 0.9 mm.

[0013] As an alternative, the radio frequency glass insulator is connected to the microwave multilayer microstrip circuit via bonding.

[0014] The beneficial effects of this utility model are as follows:

[0015] (1) Since the present invention uses an air coaxial structure between the radio frequency glass insulator and the microwave multilayer board to achieve circuit matching, it is simpler than the circuit matching method used in the prior art.

[0016] (2) The present invention uses gold wire bonding to achieve automated assembly and improve assembly efficiency, while the prior art uses welding, which has high requirements for welding. The amount of solder will affect the circuit matching performance and thus affect the assembly efficiency.

[0017] (3) This utility model effectively avoids the problem of solder overflow, ensures controllable welding quality, and greatly improves product reliability. Attached Figure Description

[0018] Figure 1 A schematic diagram of the assembly process of the vertical interconnect circuit structure provided in this embodiment of the utility model;

[0019] Figure 2 A schematic diagram of the assembly process of the vertical interconnect circuit structure provided in this embodiment of the utility model;

[0020] Figure 3 A schematic diagram of the assembly process of the vertical interconnect circuit structure provided in the embodiment of this utility model.

[0021] Figure labels and their correspondences:

[0022] 1-Cavity, 2-Microwave multilayer board, 3-RF glass insulator, 4-Gold wire. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to specific embodiments.

[0024] The purpose of this embodiment is to provide a vertical interconnect circuit structure between microwave multilayer boards, solving the impact of soldering on the performance of matching circuits, eliminating the potential reliability risks posed by soldering, and simplifying the design and installation process of microwave multilayer printed circuit boards. This embodiment is implemented as follows; please refer to [link / reference]. Figures 1-3 This embodiment provides a vertical interconnection circuit structure between microwave multilayer boards, including: a cavity, a microwave multilayer board, and a radio frequency glass insulator; the microwave multilayer board is fixed on both sides of the cavity, and the glass insulator is disposed on an extension structure parallel to the microwave multilayer board at the geometric center of the cavity, forming an air coaxial structure with the microwave multilayer board, which is used to connect with the microstrip circuit through bonding to achieve matched transmission of microwave signals, thereby completing the vertical interconnection of the microwave multilayer board radio frequency circuit.

[0025] The interconnection circuit described in this embodiment includes an aluminum alloy cavity with shielding, a gold-plated microwave multilayer board, and an RF glass insulator connecting the upper and lower microwave multilayer boards. The specific implementation process is as follows:

[0026] Microwave multilayer boards are bonded to the upper and lower surfaces of the cavity using conductive adhesive, while radio frequency (RF) glass insulators are connected to the cavity by soldering. An air coaxial structure is formed between the RF glass insulators and the microwave multilayer boards, and then connected to the microstrip circuitry via gold wire bonding to achieve matched transmission of microwave signals, completing the vertical interconnection of the RF circuitry on the upper and lower surfaces of the cavity. Vertical RF glass insulators with an inner conductor diameter of 0.38 mm, a length of 14.4 mm, an outer conductor diameter of 2.5 mm, and a thickness of 2 mm are sintered into the cavity using lead-tin soldering. Figure 1 As shown.

[0027] After the RF glass insulator is sintered, a 6.2mm thick microwave multilayer board with a 0.9mm diameter metallized hole is bonded to the upper surface of the cavity using conductive adhesive. The metallized holes in the microwave multilayer board must pass through the RF glass insulator to form an air coaxial structure, with the RF glass insulator positioned at the center of the metallized hole. Similarly, a 6.2mm thick microwave multilayer board with a 0.9mm diameter metallized hole is then bonded to the lower surface of the cavity using conductive adhesive. Again, the metallized holes in the microwave multilayer board must pass through the RF glass insulator to form an air coaxial structure, with the RF glass insulator positioned at the center of the metallized hole. Figure 2 As shown.

[0028] Finally, Φ25μm gold wires were used to bond the RF glass insulator to the microwave multilayer board circuit on the upper surface of the cavity. Similarly, Φ25μm gold wires were used to bond the RF glass insulator to the microwave multilayer board circuit on the lower surface of the cavity, thus completing the vertical interconnection between the microwave multilayer boards. Figure 3 As shown.

[0029] Compared with the prior art, this utility model has the following significant features:

[0030] (1) Since the present invention uses an air coaxial structure between the radio frequency glass insulator and the microwave multilayer board to achieve circuit matching, it is simpler than the circuit matching method used in the prior art.

[0031] (2) The present invention uses gold wire bonding to achieve automated assembly and improve assembly efficiency, while the prior art uses welding, which has high requirements for welding. The amount of solder will affect the circuit matching performance and thus affect the assembly efficiency.

[0032] (3) This utility model has high reliability. The existing technology uses through-hole welding, and during the welding process, it is impossible to detect whether the solder overflows at the bottom of the microwave multilayer board, which brings certain hidden dangers to the reliability of the product.

[0033] The above are merely preferred embodiments of this utility model. It should be noted that the above preferred embodiments should not be considered as limitations on this utility model, and the scope of protection of this utility model should be determined by the scope defined in the claims. For those skilled in the art, several improvements and modifications can be made without departing from the spirit and scope of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A microwave multilayer board vertical interconnect circuit structure, characterized in that, include: Cavity, microwave multilayer board and radio frequency glass insulator; The microwave multilayer board is fixed on both sides of the cavity, and the glass insulator is disposed on an extended structure parallel to the microwave multilayer board at the geometric center of the cavity, forming an air coaxial structure with the microwave multilayer board. It is used to connect with the microstrip circuit through bonding to achieve matched transmission of microwave signals and complete the vertical interconnection of the radio frequency circuit of the microwave multilayer board.

2. The microwave multilayer board vertical interconnection circuit structure according to claim 1, characterized in that, One side of the microwave multilayer board is gold-plated and is bonded to the cavity using conductive adhesive.

3. The microwave multilayer board vertical interconnection circuit structure according to claim 1, characterized in that, The radio frequency glass insulator is soldered onto the cavity using lead and tin.

4. The microwave multilayer board vertical interconnection circuit structure according to claim 1, characterized in that, The thickness of the microwave multilayer board is 6.2 mm.

5. The microwave multilayer board vertical interconnection circuit structure according to claim 1, characterized in that, The radio frequency glass insulator has an inner conductor diameter of 0.38 mm and a length of 14.4 mm, and an outer conductor diameter of 2.5 mm and a thickness of 2 mm.

6. The microwave multilayer board vertical interconnection circuit structure according to claim 1, characterized in that, The diameter of the metallized hole in the microwave multilayer board is 0.9 mm.

7. The microwave multilayer board vertical interconnection circuit structure according to claim 1, characterized in that, The radio frequency glass insulator is connected to the microwave multilayer microstrip circuit by bonding.

Images