Small laser and portable laser processing device

Abstract

The utility model discloses a kind of small laser and portable laser processing device, the small laser includes first radiator, second radiator, optical fiber disc, pump source, first circuit board and fan;Optical fiber disc, first radiator, first circuit board and second radiator are along first direction setting, pump source is set on first radiator, fan is set on the side of second radiator along second direction, pump source and first radiator contact heat dissipation, first circuit board and first radiator are spaced apart to be set to enclose the clearance space for accommodating the tail fiber of pump source, the side of second radiator with first circuit board is attached to the heat dissipation of a plurality of electrical components, therefore, the space layout of each functional component and each radiator in small laser is compact, reasonable, can greatly reduce the heat concentration problem inside small laser, conducive to the miniaturization design of laser.

Description

Technical Field

[0001] This utility model relates to the field of laser processing technology, and in particular to a small laser and a portable laser processing device. Background Technology

[0002] Fiber lasers, with their advantages of compact structure, good heat dissipation, high conversion efficiency, excellent beam quality, and stable performance, have gradually replaced solid-state lasers and chemical lasers, becoming one of the mainstream products in the current laser market and are widely used in industrial manufacturing.

[0003] Laser marking requires the emission of high-energy laser beams, which generate a lot of heat. If the heat is not dissipated in time, the temperature of the laser will continue to rise, leading to a decrease in the laser's efficiency. If the laser operates under high-temperature load conditions for a long time, it will severely reduce the lifespan of the laser. In order to cool down the laser, air cooling is usually used. However, the heat dissipation efficiency of existing air cooling is insufficient, resulting in heat concentration inside the laser, which is not conducive to the miniaturization design of the laser. Utility Model Content

[0004] The purpose of this invention is to propose a small laser and a portable laser processing device, which aims to solve the problem that existing lasers use air cooling for heat dissipation, but the heat dissipation efficiency of air cooling is insufficient, resulting in heat concentration inside the laser and hindering the miniaturization design of the laser.

[0005] In a first aspect, the present invention provides a miniature laser, the miniature laser comprising a first heat sink, a second heat sink, an optical fiber disk, a pump source, a first circuit board, and a fan; the optical fiber disk, the first heat sink, the first circuit board, and the second heat sink are arranged along a first direction, the pump source is disposed on the first heat sink, and the fan is disposed on one side of the second heat sink along a second direction;

[0006] The pump source is in contact with the first heat sink for heat dissipation. The first circuit board and the first heat sink are spaced apart to form a gap space for accommodating the pigtail of the pump source. The second heat sink is attached to the side of the first circuit board with several electrical components for heat dissipation to reduce the overall height of the laser.

[0007] In one embodiment, the first circuit board includes a circuit board body and a plurality of electrical components disposed on the circuit board body;

[0008] The second heat sink includes a first plate segment and a second plate segment connected to the first plate segment. The first plate segment and the second plate segment are at different distances from the circuit board body so that the first plate segment and the second plate segment can be adapted to the different heights of the electrical components.

[0009] In one embodiment, the first heat sink includes a first heat sink plate and a plurality of first heat sink fins connected to the first heat sink plate, and the second heat sink includes a second heat sink plate and a plurality of second heat sink fins connected to the second heat sink plate.

[0010] In this configuration, a plurality of first heat sinks are arranged parallel to each other to form a plurality of first ventilation channels extending along a second direction, and a plurality of second heat sinks are arranged parallel to each other to form a plurality of second ventilation channels extending along a second direction. The fan is used to blow air onto the first ventilation channels and the second ventilation channels.

[0011] A plurality of the first heat sinks contact the optical fiber disk for heat dissipation, the first heat sink plate contacts the body portion of the pump source and the pigtail of the pump source for heat dissipation, and the second heat sink plate and the plurality of the second heat sinks are arranged along a first direction.

[0012] In one embodiment, the miniature laser further includes a housing comprising a first plate and a second plate disposed opposite to each other, and a plurality of side plates located between the first plate and the second plate;

[0013] The first plate, the second plate, and a plurality of the side plates enclose a cavity, and the first heat sink, the second heat sink, the optical fiber disk, the pump source, the first circuit board, and the fan are all disposed within the cavity.

[0014] In one embodiment, the plurality of side panels include a first side panel and a second side panel disposed opposite to each other, and a third side panel and a fourth side panel disposed opposite to each other;

[0015] The fan is attached to the first side plate, and the first side plate has a first air vent that is opposite to the fan. The second side plate has a second air vent that is corresponding to a plurality of the first ventilation ducts and the second ventilation ducts.

[0016] In one embodiment, the miniature laser further includes a second circuit board electrically connected to the first circuit board, the second circuit board being attached to the third side panel; the second circuit board has an interface, and the third side panel has a clearance opening for exposing the interface; and / or,

[0017] The fan is provided in a plurality of manners, and the plurality of fans are spaced apart along a third direction, the third direction being at an angle to both the first direction and the second direction.

[0018] In one embodiment, the fiber optic disk is spaced apart from the first plate, and the fiber optic disk, the first plate, and a plurality of side plates enclose a fiber optic cavity, wherein a Q-switching element and an optical fiber are disposed within the fiber optic cavity;

[0019] The miniature laser also includes a fixing structure disposed within the fiber cavity and used to fix the isolator.

[0020] In one embodiment, a plurality of pump sources are provided, and the miniature laser further includes a protective cover covering the plurality of pump sources; and / or, the height of the protective cover in a first direction is less than the height of the second heat sink, thereby leaving space for a cooling air duct so that the fan blows air onto the second heat sink to dissipate heat.

[0021] In one embodiment, the miniature laser extends to a height of H along a first direction, to a length of L along a second direction, and to a width of D along a third direction.

[0022] Among them, 40mm≤H≤65mm, 90mm≤L≤120mm, and 85mm≤D≤115mm.

[0023] Secondly, this utility model also provides a portable laser processing device, which includes a small laser from any of the above embodiments.

[0024] The present invention has the following beneficial effects:

[0025] The miniature laser and portable laser processing device of this invention are arranged with the fiber optic disk, the first heat sink, the first circuit board and the second heat sink along the first direction, and the fiber optic disk, the first heat sink and the pump source along the first direction, and the fan, the pump source and the first circuit board along the second direction. Therefore, the functional components and heat sinks in the miniature laser are reasonably stacked, and the spatial layout is compact and reasonable. This can greatly reduce the problem of heat concentration inside the miniature laser, thereby reducing the size of each heat sink, and maintaining good heat dissipation performance of the miniature laser, which is conducive to the miniaturization design of the laser.

[0026] Specifically, the pump source is in contact with the first heat sink for heat dissipation. The first circuit board and the first heat sink are spaced apart to form a gap space for accommodating the pigtail of the pump source. The first heat sink is mainly used to dissipate heat from the pump source body and the pump source pigtail, resulting in good heat dissipation. The second heat sink is attached to the side of the first circuit board where several electrical components are located for heat dissipation. The second heat sink is mainly used to dissipate heat from the first circuit board. The attachment of the second heat sink to the first circuit board can reduce the overall height of the laser in the first direction while ensuring heat dissipation effect. This avoids the overall height of the laser being too high due to the superposition of the circuit board on the heat sink, which is beneficial for the miniaturization design of the laser. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] in:

[0029] Figure 1 This is a schematic diagram of a small laser in one embodiment.

[0030] Figure 2 for Figure 1 Another schematic diagram of the small laser shown.

[0031] Figure 3 for Figure 1 Another schematic diagram of the small laser shown from another angle.

[0032] Figure 4 for Figure 1 The diagram shows the small laser being removed from the first plate.

[0033] Figure 5 for Figure 1 Partial schematic diagram of the small laser shown Figure 1 .

[0034] Figure 6 for Figure 1 Partial schematic diagram of the small laser shown Figure 2 .

[0035] Figure 7 for Figure 1 Explosion of the small laser shown Figure 1 .

[0036] Figure 8 for Figure 1 Explosion of the small laser shown Figure 2 .

[0037] Reference numerals: 100, First heat sink; 110, First side; 120, Second side; 130, First heat sink plate; 140, First heat sink fin; 101, First ventilation channel; 200, Second heat sink; 210, Second heat sink plate; 211, First board segment; 212, Second board segment; 213, Notch; 220, Second heat sink fin; 201, Second ventilation channel; 300, Fiber optic cable; 400, Pump source; 410, Protective cover; 420, Pigtail; 510, First circuit board; 511, Circuit board body; 512, Electrical component; 513, MOSFET;

[0038] 520, Second circuit board; 521, Interface; 600, Fan; 700, Housing; 710, First board; 720, Second board; 730, First side panel; 731, First air vent; 732, Mesh cover; 740, Second side panel; 741, Second air vent; 7411, First through slot; 7412, Second through slot; 750, Third side panel; 751, Clearance opening; 752, Support component; 760, Fourth side panel; 761, Mounting hole; 762, Wire hole; 800, Q switch element; 900, Fixing structure; 910, First pressure block; 920, Second pressure block; 930, Through hole. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0040] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0041] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include at least one of the stated features. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0042] This invention provides a small laser, which is mainly used for laser cutting, welding, marking, etc. The small laser can achieve precise cutting, welding and marking of various materials such as metals, plastics and ceramics, while ensuring processing efficiency and processing quality.

[0043] Please see Figures 1 to 8 One embodiment of a miniature laser includes a first heat sink 100, a second heat sink 200, an optical fiber disk 300, a pump source 400, a first circuit board 510, and a fan 600. The optical fiber disk 300, the first heat sink 100, the first circuit board 510, and the second heat sink 200 are arranged along a first direction. The pump source 400 is disposed on the first heat sink 100, and the fan 600 is disposed on one side of the second heat sink 200 along a second direction. Therefore, the functional components and heat sinks within the miniature laser are rationally stacked, resulting in a compact and reasonable spatial layout. This greatly reduces the problem of heat concentration inside the miniature laser, thereby reducing the size of each heat sink while maintaining good heat dissipation performance, which is beneficial for the miniaturization design of the laser.

[0044] Figure 1 , Figure 2 , Figure 4 and Figure 6 The direction indicated by the middle arrow Z is the first direction, and the direction indicated by the arrow Y is the second direction.

[0045] In this embodiment, the pump source 400 contacts the first heat sink 100 for heat dissipation. The first circuit board 510 and the first heat sink 100 are spaced apart to form a gap space for accommodating the pigtail of the pump source 400. The first heat sink 100 is mainly used for contact heat dissipation of the body of the pump source 400 and the pigtail 420 of the pump source 400, resulting in good heat dissipation effect. The second heat sink 200 is attached to the side of the first circuit board 510 where several electrical components 512 are located for heat dissipation. The second heat sink 200 is mainly used for contact heat dissipation of the first circuit board 510, which can achieve a good heat dissipation effect. At the same time, the space along the first direction can be fully utilized to reduce the height of the second heat sink 200 as much as possible while ensuring the heat dissipation effect, which is conducive to the miniaturization design of the laser.

[0046] Specifically, the first heat sink 100 includes a first side 110 and a second side 120 disposed opposite to each other. The fiber optic disk 300 is located on the first side 110, and the pump source 400 and the first circuit board 510 are both located on the second side 120. The pump source 400 contacts the second side 120 for heat dissipation. The first circuit board 510 and the second side 120 are spaced apart to form a gap space for accommodating the pigtail 420 of the pump source 400. The second heat sink 200 is located on the side of the first circuit board 510 away from the first heat sink 100 and is in contact with the side of the first circuit board 510 where a plurality of electrical components 512 are disposed for heat dissipation.

[0047] In this embodiment of the miniature laser, the pigtail 420 of the pump source 400 is a passive fiber with low heat generation, which will not affect the heat of the circuit board. At the same time, due to the miniaturized design of the first circuit board 510, the corresponding miniaturized and centralized design of electronic components leads to the heat concentration of the first circuit board 510. Therefore, a second heat sink 200 is required to dissipate heat from the first circuit board 510 separately. The second heat sink 200 is attached to the side of the first circuit board 510 where several electrical components 512 are located. This ensures that the height of the second heat sink 200 along the first direction is higher than that of the pump source 400, thereby keeping the heat dissipation airflow of the second heat sink 200 unobstructed and preventing the heat dissipation airflow from being blocked by the pump source 400. This maintains the miniature laser with good heat dissipation performance. At the same time, the height of the second heat sink 200 can be set as low as possible, which is beneficial to the miniaturization design of the laser.

[0048] In one embodiment, please refer to Figure 5 and Figure 6 The first heat sink 100 includes a first heat sink plate 130 and a plurality of first heat sink fins 140 connected to the first heat sink plate 130. The second heat sink 200 includes a second heat sink plate 210 and a plurality of second heat sink fins 220 connected to the second heat sink plate 210. By distributing the heat sinks, the heat dissipation efficiency of the first heat sink 100 and the second heat sink 200 is increased, thereby reducing the size of the first heat sink 100 and the second heat sink 200 while maintaining sufficient heat dissipation performance, which is beneficial for the miniaturization design of the laser.

[0049] In this embodiment, a plurality of first heat sinks 140 are arranged parallel to each other to form a plurality of first ventilation channels 101 extending along a second direction, and a plurality of second heat sinks 220 are arranged parallel to each other to form a plurality of second ventilation channels 201 extending along the second direction. A fan 600 is used to blow air onto the first ventilation channels 101 and the second ventilation channels 201. By setting the first ventilation channels 101 and the second ventilation channels 201, the heat dissipation efficiency of the first heat sink 100 and the second heat sink 200 can be further increased when the fan 600 blows air through the ventilation channels. This allows for a reduction in the size design of the first heat sink 100 and the second heat sink 200 while maintaining sufficient heat dissipation performance. At the same time, the fan 600 is spaced apart from the first heat sink 100 and the second heat sink 200, which can further reduce the height of the laser extending along the first direction, facilitating the miniaturization design of the laser.

[0050] It is understandable that, since the fan 600 and the pump source 400 are spaced apart along the first direction, the fan 600 can blow air onto the pump source 400. By directly blowing air onto the pump source 400, the heat dissipation efficiency of the pump source 400 can be enhanced. Furthermore, both the first heat sink 100 and the second heat sink 200 are provided with a number of heat sinks, which are arranged parallel to each other to form a number of ventilation channels extending along the first direction. The fan 600 can blow air onto the ventilation channels, thereby increasing the air flow rate in the ventilation channels and improving the heat dissipation efficiency of the first heat sink 100 and the second heat sink 200.

[0051] Meanwhile, since the fan 600 can directly blow air onto the pump source 400 and the heat sink, the heat dissipation performance is good. The fiber disk 300 and the pump source 400 are respectively set on both sides of the first heat sink 100, and the functional components inside the small laser are vertically stacked. The second heat sink 200 is attached to the side of the first circuit board 510 where several electrical components 512 are located, which can ensure that the ventilation channels formed by the several heat sinks contained in the second heat sink 200 are connected to the airflow path blown out by the fan 600. The height of the second heat sink 200 along the first direction is higher than that of the pump source 400, so as to avoid the pump source 400 blocking the ventilation channels and hindering heat dissipation, thereby improving the heat dissipation efficiency of the first circuit board 510. While ensuring the heat dissipation effect, the overall height of the second heat sink 200 can be reduced as much as possible, which is conducive to the flattening and miniaturization design of the small laser and makes it easy to carry.

[0052] In one embodiment, please refer to Figures 5 to 8A number of first heat sinks 140 are located on the first side 110 and contact the fiber optic disk 300 for heat dissipation. The first heat sink 130 is located on the second side 120 and contacts the body of the pump source 400 and the pigtail 420 of the pump source 400 for heat dissipation. Thus, the first heat sink 100 is used to achieve heat dissipation and cooling of the fiber optic disk 300, the body of the pump source 400 and the pigtail 420 of the pump source 400.

[0053] In this embodiment, the second heat sink 210 and a plurality of second heat sinks 220 are arranged along the first direction, that is, the second heat sink 210 is arranged close to the first circuit board 510, and the plurality of second heat sinks 220 are arranged on the side of the second heat sink 210 away from the first heat sink 100. Thus, the second heat sink 200 is mainly used to dissipate heat and cool the first circuit board 510. At the same time, the first circuit board 510 is confined between the first heat sink 100 and the second heat sink 200, which can also increase the heat dissipation and cooling efficiency of the first circuit board 510.

[0054] Therefore, the compact and reasonable spatial layout of the functional components and heat sinks in a small laser can greatly reduce the problem of heat concentration inside the small laser, thereby reducing the size of each heat sink and maintaining good heat dissipation performance, which is conducive to the miniaturization design of the laser.

[0055] In one embodiment, please refer to Figures 5 to 8 The first circuit board 510 includes a circuit board body 511 and a plurality of electrical components 512 disposed on the circuit board body 511. The second heat sink 210 includes a first section 211 and a second section 212 connected to the first section 211. The first section 211 and the second section 212 are spaced differently from the circuit board body 511 so that the first section 211 and the second section 212 can accommodate the different heights of the plurality of electrical components 512. With this arrangement, the second heat sink 210 can fit more tightly with the first circuit board 510, thereby increasing the heat dissipation efficiency of the first circuit board 510. This allows for a reduction in the size of the second heat sink 200 while maintaining sufficient heat dissipation performance, especially facilitating a reduction in the height of the second heat sink and promoting the miniaturization of the laser.

[0056] Furthermore, the second heat sink 210 is also provided with a notch 213 for avoiding electrical components 512, which facilitates the spatial arrangement between components and the miniaturization of small lasers.

[0057] Furthermore, such as Figure 7The several electrical components 512 shown include a MOSFET 513. The first circuit board 510 is fixedly connected to the second heat sink 210 through the MOSFET 513 so that the first circuit board 510 and the second heat sink 210 are tightly attached to each other, which further improves the heat dissipation efficiency. At the same time, it is beneficial to reduce the height of the second heat sink along the first direction, which is conducive to the miniaturization design of the laser.

[0058] Specifically, the MOSFET can be secured to the heat sink using methods such as screw fixing, clip fixing, or hot adhesive fixing, so that the first circuit board 510 and the second heat sink 210 can be tightly connected and further improve heat dissipation efficiency.

[0059] In one embodiment, please refer to Figures 1 to 8 The miniature laser also includes a housing 700, which includes a first plate 710 and a second plate 720 disposed opposite to each other, and several side plates located between the first plate 710 and the second plate 720. The first plate 710, the second plate 720 and the several side plates enclose a cavity, in which the first heat sink 100, the second heat sink 200, the fiber optic disk 300, the pump source 400, the first circuit board 510 and the fan 600 are all disposed within the cavity, thereby completing the spatial arrangement of the various components within the miniature laser.

[0060] Furthermore, in this embodiment, the side plates include a first side plate 730 and a second side plate 740 arranged opposite to each other, as well as a third side plate 750 and a fourth side plate 760 arranged opposite to each other; the fan 600 is attached to the first side plate 730, and the first side plate 730 has a first air vent 731 arranged opposite to the fan 600, and the second side plate 740 has a second air vent 741 arranged corresponding to the plurality of first ventilation channels 101 and second ventilation channels 201. With this arrangement, when the fan 600 is working, it can drive the air to enter from one of the first air vent 731 and the second air vent 741 and exit from the other, and quickly pass through the plurality of ventilation channels to remove the heat from the first heat sink 100 and the second heat sink 200, thereby improving the heat dissipation and cooling effect of the small laser. This allows for a reduction in the size of the first heat sink 100 and the second heat sink 200 while maintaining sufficient heat dissipation performance, which is beneficial for the miniaturization design of the laser.

[0061] Specifically, the second air vent 741 includes a first through slot 7411 corresponding to a plurality of first ventilation ducts 101, and a second through slot 7412 corresponding to a plurality of second ventilation ducts 201. This arrangement not only ensures the smooth flow of air within the miniature laser, but also guarantees the structural strength of the housing 700. The miniature laser also includes a mesh cover 732, which is attached to the first air vent 731 and used to block dust.

[0062] Furthermore, in this embodiment, the height of the miniature laser extending along the first direction is H, the length extending along the second direction is L, and the width extending along the third direction is D; wherein, 40mm≤H≤65mm, 90mm≤L≤120mm, 85mm≤D≤115mm, specifically, the height H of the miniature laser can be selected as 40mm, 45mm, 50mm, 53mm, 60mm, or 65mm, and the length L of the miniature laser can be selected as 90mm, 95mm, or 100mm. The width D of the small laser can be selected as 85mm, 90mm, 95mm, 99mm, 105mm, or 120mm. Through the flexible spatial arrangement of the first heat sink 100, the second heat sink 200, the fiber disk 300, the pump source 400, the first circuit board 510, and the fan 600 in the accommodating cavity in this embodiment, the miniaturization design of the small laser can be realized, and the heat dissipation and cooling performance of the laser can be increased.

[0063] Figure 1 , Figure 2 , Figure 4 and Figure 6 The direction indicated by the middle arrow Z is the first direction, the direction indicated by the arrow Y is the second direction, and the direction indicated by the arrow X is the third direction.

[0064] In one embodiment, please refer to Figures 5 to 8 The miniature laser also includes a second circuit board 520, which is electrically connected to the first circuit board 510 and is attached to the third side plate 750. By separating the first circuit board 510 and the second circuit board 520, the circuit board components can be arranged flexibly in the space of the miniature laser, thereby realizing the miniaturization of the miniature laser.

[0065] Specifically, the second circuit board 520 is provided with an interface 521, and the third side plate 750 has a clearance opening 751 for exposing the interface 521, thereby facilitating the insertion and mating of the external plug with the interface 521. The miniature laser also includes a support member 752, which is disposed in the accommodating cavity and is used to support the first heat sink 100.

[0066] In this embodiment, the first circuit board 510 is electrically connected to the second circuit board 520, and the fiber optic disk 300, pump source 400 and fan 600 are all electrically connected to the first circuit board 510 or the second circuit board 520, thereby realizing the control of each functional component of the small laser.

[0067] In one embodiment, please refer to Figures 5 to 8Several fans 600 are provided, spaced apart along a third direction, which forms an angle with both the first and second directions. This arrangement allows for the selection of a suitable number of fans 600 based on the size of the small laser, thereby ensuring efficient heat dissipation.

[0068] In one embodiment, please refer to Figure 4 and Figure 7 The fiber optic tray 300 is spaced apart from the first plate 710, and the fiber optic tray 300, the first plate 710, and several side plates enclose a fiber optic cavity. A Q-switch element 800 and an optical fiber are disposed within the fiber optic cavity. This arrangement allows the fiber optic tray 300 to be mounted on top of the first plate 710. Specifically, the Q-switch element 800 can be a Q-adapter, and it can be electrically connected to either the first circuit board 510 or the second circuit board 520.

[0069] In one embodiment, please refer to Figure 4 The miniature laser also includes a fixing structure 900, which is disposed within the fiber cavity and used to fix the isolator. The fixing structure 900 includes a first clamping block 910 and a second clamping block 920 that are detachably connected, with a through hole 930 formed between the first clamping block 910 and the second clamping block 920 for securing the isolator. With this arrangement, the isolator can be clamped and fixed within the through hole 930.

[0070] In one embodiment, please refer to Figure 2 The miniature laser also includes a power cord. The fourth side plate 760 has a mounting hole 761 and a wire hole 762. The mounting hole 761 exposes the through hole 930 of the fixing structure 900, facilitating the installation of the isolator. The power cord passes through the wire hole 762 and is electrically connected to the first circuit board 510, facilitating the wiring connection of the power cord.

[0071] In one embodiment, please refer to Figure 8 The system includes several pump sources 400, and the miniature laser also includes a protective cover 410. The protective cover 410 covers several pump sources 400, facilitating protection of the pump sources 400 and preventing dust or moisture accumulation from causing pump source malfunction. The height of the protective cover 410 in the first direction is less than the height of the second heat sink 200, thus providing space for cooling airflow so that the fan 600 can blow air onto the second heat sink 200 for heat dissipation. At the same time, the protective cover 410 also isolates the pump sources 400 from the first circuit board 510, thereby reducing the thermal impact of heat emitted by the pump sources 400 on the first circuit board 510.

[0072] Please see Figures 1 to 8One embodiment of the portable laser processing apparatus includes the miniature laser of any of the above embodiments. The miniature laser of this invention is applied to the portable laser processing apparatus. Due to the compact and rational spatial layout of the functional components and heat sinks within the miniature laser, the problem of heat concentration inside the miniature laser can be greatly reduced, thereby reducing the size of each heat sink and maintaining good heat dissipation performance. This facilitates the miniaturization design of the laser, and further reduces the size of the portable laser processing apparatus, making it easier to carry and use handheld.

[0073] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A miniature laser, characterized in that, The miniature laser includes a first heat sink, a second heat sink, an optical fiber disk, a pump source, a first circuit board, and a fan; the optical fiber disk, the first heat sink, the first circuit board, and the second heat sink are arranged along a first direction, the pump source is disposed on the first heat sink, and the fan is disposed on one side of the second heat sink along a second direction; The pump source is in contact with the first heat sink for heat dissipation. The first circuit board and the first heat sink are spaced apart to form a gap space for accommodating the pigtail of the pump source. The second heat sink is attached to the side of the first circuit board with several electrical components for heat dissipation to reduce the overall height of the laser.

2. The miniature laser according to claim 1, characterized in that, The first circuit board includes a circuit board body and a plurality of electrical components disposed on the circuit board body; The second heat sink includes a first plate segment and a second plate segment connected to the first plate segment. The first plate segment and the second plate segment are at different distances from the circuit board body so that the first plate segment and the second plate segment can be adapted to the different heights of the electrical components.

3. The miniature laser according to claim 1, characterized in that, The first heat sink includes a first heat sink plate and a plurality of first heat sink fins connected to the first heat sink plate; the second heat sink includes a second heat sink plate and a plurality of second heat sink fins connected to the second heat sink plate. In this configuration, a plurality of first heat sinks are arranged parallel to each other to form a plurality of first ventilation channels extending along a second direction, and a plurality of second heat sinks are arranged parallel to each other to form a plurality of second ventilation channels extending along a second direction. The fan is used to blow air onto the first ventilation channels and the second ventilation channels. A plurality of the first heat sinks contact the optical fiber disk for heat dissipation, the first heat sink plate contacts the body portion of the pump source and the pigtail of the pump source for heat dissipation, and the second heat sink plate and the plurality of the second heat sinks are arranged along a first direction.

4. The miniature laser according to any one of claims 1 to 3, characterized in that, The miniature laser also includes a housing, which includes a first plate and a second plate disposed opposite to each other, and a plurality of side plates located between the first plate and the second plate; The first plate, the second plate, and a plurality of the side plates enclose a cavity, and the first heat sink, the second heat sink, the optical fiber disk, the pump source, the first circuit board, and the fan are all disposed within the cavity.

5. The miniature laser according to claim 4, characterized in that, The plurality of side panels include a first side panel and a second side panel disposed opposite to each other, and a third side panel and a fourth side panel disposed opposite to each other; The fan is attached to the first side plate, and the first side plate has a first air vent that is opposite to the fan. The second side plate has a second air vent that is corresponding to a plurality of first ventilation ducts and second ventilation ducts.

6. The miniature laser according to claim 5, characterized in that, The miniature laser further includes a second circuit board electrically connected to the first circuit board, the second circuit board being attached to the third side panel; the second circuit board has an interface, and the third side panel has a clearance opening for exposing the interface; and / or, The fan is provided in a plurality of manners, and the plurality of fans are spaced apart along a third direction, the third direction being at an angle to both the first direction and the second direction.

7. The miniature laser according to claim 5, characterized in that, The fiber optic disk is spaced apart from the first plate, and the fiber optic disk, the first plate, and a plurality of the side plates enclose a fiber optic cavity, in which a Q-switching element and an optical fiber are disposed; The miniature laser also includes a fixing structure disposed within the fiber cavity and used to fix the isolator.

8. The miniature laser according to claim 1, characterized in that, The pump source is provided in a plurality of ways, and the miniature laser also includes a protective cover, which covers the plurality of pump sources; and / or, the height of the protective cover in the first direction is less than the height of the second heat sink, thereby leaving space for cooling air ducts so that the fan blows air onto the second heat sink to dissipate heat.

9. The miniature laser according to claim 1, characterized in that, The small laser extends to a height of H along the first direction, to a length of L along the second direction, and to a width of D along the third direction. Among them, 40mm≤H≤65mm, 90mm≤L≤120mm, and 85mm≤D≤115mm.

10. A portable laser processing device, characterized in that, The portable laser processing device includes the miniature laser as described in any one of claims 1 to 9.

Images