Camera assembly and electronic device

Abstract

The application provides a camera assembly and an electronic device. The camera assembly comprises a first camera module and a first camera support, and the first camera module is fixedly connected to the first camera support. The first camera support comprises a first body piece and a first conductive piece. The first body piece comprises a body layer and an anti-oxidation layer. The material of the body layer comprises magnesium alloy, and the impedance of the body layer is smaller than that of the anti-oxidation layer. The body layer comprises a first region and a second region. The anti-oxidation layer is fixedly connected to the first region, the first conductive piece is fixedly connected to the second region and electrically connected to the body layer, the first conductive piece is also electrically connected to the ground end of the first camera module, and the impedance of the first conductive piece is smaller than that of the anti-oxidation layer. The ground end of the first camera module can be electrically connected to the first body piece, the anti-oxidation layer does not need to be broken through, the electrical connection between the first conductive piece and the ground end of the first camera module is more stable, and the stability of the camera assembly is higher.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a camera component and electronic equipment. Background Technology

[0002] With the development of technology and the demands of the electronic device market, camera modules have become an indispensable component in electronic devices. Camera modules are fixed to the housing of electronic devices via camera brackets and are electrically connected to the housing for grounding. Camera brackets can be made of magnesium alloy; however, magnesium alloy surfaces are prone to oxidation, increasing surface impedance and affecting the electrical connection between the camera bracket and the housing. A traditional solution is to surface-form the camera bracket, creating a film of a certain thickness on the magnesium alloy surface, which provides some anti-oxidation effect. However, because the film is thick, it cannot break down when energized, failing to guarantee a stable electrical connection between the camera bracket and the camera module, thus affecting the stability of the camera module's grounding. Utility Model Content

[0003] This application provides a camera component and electronic device with high electrical connection stability.

[0004] In a first aspect, this application provides a camera assembly. The camera assembly includes a first camera module and a first camera bracket, with the first camera module fixedly connected to the first camera bracket. The first camera bracket includes a first body component and a first conductive component. The first body component includes a body layer and an anti-oxidation layer. The body layer is made of magnesium alloy, and the impedance of the body layer is less than the impedance of the anti-oxidation layer. The body layer includes a first region and a second region. The anti-oxidation layer is fixedly connected to the first region, and the first conductive component is fixedly connected to the second region and electrically connected to the body layer. The first conductive component is also electrically connected to the grounding terminal of the first camera module, and the impedance of the first conductive component is less than the impedance of the anti-oxidation layer.

[0005] Understandably, magnesium alloys have a lower density and higher specific strength and specific stiffness. Compared to other types of alloys, magnesium alloys are lighter, stronger, and stiffer. The first camera bracket is also lighter, stronger, and stiffer, which helps to achieve a lightweight design while ensuring the reliability of the first camera bracket.

[0006] It is understandable that by electrically connecting the grounding terminal of the first camera module to the first conductive component, the grounding terminal of the first camera module can be electrically connected to the first body component, which does not require breaking down the anti-oxidation layer. The impedance fluctuation range between the grounding terminal of the first camera module and the first camera bracket is small and the stability is high. The electrical connection between the first conductive component and the grounding terminal of the first camera module is relatively stable, and the stability of the camera assembly is high.

[0007] In one possible implementation, the impedance between the first conductive element and the body layer is less than or equal to 1Ω.

[0008] It is understandable that by setting the impedance between the first conductive element and the body layer to be less than or equal to 1Ω, the impedance between the first conductive element and the body layer is small, the conductivity of the electrical connection path between the first conductive element and the body layer is good, and the electrical connection between the first conductive element and the body layer is more reliable.

[0009] In one possible implementation, the impedance of the first conductive element is less than or equal to 1Ω.

[0010] Understandably, by setting the impedance of the first conductive element to be less than or equal to 1Ω, the impedance of the first conductive element is smaller, the conductivity of the first conductive element is better, and the electrical connection between the first conductive element and the first body component or between the first conductive element and other structural components is more reliable.

[0011] In one possible implementation, the impedance between the first conductive element and the first camera module is less than or equal to 5Ω.

[0012] It is understandable that by setting the impedance between the first conductive element and the first camera module to be less than or equal to 5Ω, the impedance value of the electrical connection path between the first conductive element and the ground terminal of the first camera module is smaller, and the electrical connection between the first conductive element and the ground terminal of the first camera module is more reliable.

[0013] In one possible implementation, the body layer includes protrusions that protrude from the second region.

[0014] It is understandable that by setting protrusions in the body layer, the surface roughness of the body layer is greater, resulting in a higher coefficient of friction.

[0015] In one possible implementation, the body layer includes a recessed region located in the second region.

[0016] It is understandable that by setting a recessed area in the body layer, the surface roughness of the body layer is larger, and the coefficient of friction is larger.

[0017] In one possible implementation, the first conductive element is a spring, a plating layer, a laser-engraved layer, or a coating.

[0018] Understandably, the first conductive element is easy to electrically connect with the first body element.

[0019] In one possible implementation, the first conductive element is a spring; the first conductive element is fixedly connected to the first body element by welding.

[0020] Understandably, during the process of soldering the first conductive component to the first body component, the solder joint can penetrate the anti-oxidation layer in the second region, causing the first conductive component and the first body component to fuse together at the solder joint. There are no holes or gaps between the first conductive component and the first body component; in other words, an anti-oxidation layer may not be present between the first conductive component and the first body component, and the anti-oxidation layer may not cover the second region. The first conductive component and the first body component can form a stable, closed-loop joint structure, making it difficult for the body layer in the second region to oxidize due to contact with air. Furthermore, the first conductive component can be in direct contact with the anti-oxidation layer, and the first conductive component and the anti-oxidation layer can jointly cover the body layer, making the body layer less susceptible to exposure to air, thus preventing oxidation and consequently preventing an increase in the impedance of the body layer.

[0021] In one possible implementation, the first conductive element is a spring; one of the first body element and the first conductive element is provided with a positioning post, and the other is provided with a positioning hole, with at least a portion of the positioning post located in the positioning hole.

[0022] Understandably, through the cooperation of the positioning pin and the positioning hole, the first conductive element is less likely to slide relative to the first body element, and the connection between the first conductive element and the first body element is more reliable.

[0023] In one possible implementation, the first conductive element includes a first part and a second part, the second part is bent and connected to the first part, the first part is fixedly connected to the first body element and electrically connected to the first body element, and the second part is electrically connected to the grounding terminal of the first camera module.

[0024] Understandably, the grounding terminal of the first camera module can be electrically connected to the first body component through the second part and the first part of the first conductive element. The relative bending of the first and second parts facilitates the electrical connection between the first conductive element and the grounding terminal of the first camera module. Furthermore, during assembly, physical interference is less likely to occur between the first conductive element and the grounding terminal of the first body component and the first camera module. The grounding terminal of the first body component, the first conductive element, and the first camera module is less prone to damage due to collisions, resulting in high reliability among them.

[0025] In one possible implementation, the first conductive element includes a first conductive element body, a first plating layer, and a second plating layer. The first plating layer is fixedly connected to the first conductive element body, and the second plating layer is fixedly connected to the side of the first plating layer away from the first conductive element body. The reducibility of the first plating layer is stronger than that of the second plating layer.

[0026] It is understandable that by setting the reducing power of the first coating to be stronger than that of the second coating, the reactivity of the second coating can be weaker than that of the first coating. The second coating can stabilize the first coating and prevent the first coating from peeling off.

[0027] In one possible implementation, the first conductive element includes a protrusion that protrudes from the first conductive element body of the second portion.

[0028] It is understandable that by setting the protrusion of the first conductive element, the surface roughness of the first conductive element is large, and the coefficient of friction is large.

[0029] In one possible implementation, the first conductive element includes a recessed area located within the second portion of the first conductive element body.

[0030] It is understandable that by setting a recessed area in the first conductive element, the surface roughness of the first conductive element is relatively large, and the coefficient of friction is relatively large.

[0031] In one possible implementation, the first conductive element is a plating layer; the first conductive element includes a first plating layer, the first plating layer is fixedly connected to the first body element, and the impedance of the first plating layer is less than the impedance of the anti-oxidation layer.

[0032] It is understandable that by setting the impedance of the first coating layer to be less than that of the anti-oxidation layer, the conductivity of the first coating layer is better than that of the anti-oxidation layer, and the electrical connection between the first conductive component and the grounding terminal of the first camera module is more reliable.

[0033] In one possible implementation, the first conductive element further includes a second plating layer, which is fixedly connected to the side of the first plating layer away from the first body element, and the first plating layer has stronger reducibility than the second plating layer.

[0034] It is understandable that by setting the reducing power of the first coating to be stronger than that of the second coating, the reactivity of the second coating can be weaker than that of the first coating. The second coating can stabilize the first coating and prevent the first coating from peeling off.

[0035] In one possible implementation, the material of the first coating includes nickel, chromium, or zinc.

[0036] Understandably, the first plating layer has lower resistance and better conductivity, ensuring a more reliable electrical connection between the first plating layer and other structural components. Furthermore, the first plating layer is easier to fix to the first body component.

[0037] In one possible implementation, the material of the second coating includes gold.

[0038] Understandably, the second coating can stabilize the first coating, making it less prone to peeling off, and ensure electrical conductivity between the first coating and other structural components.

[0039] In one possible implementation, the first conductive element is a laser-etched layer, and the surface density P of the first conductive element satisfies: P≥95%.

[0040] Understandably, by setting the surface density P of the first conductive component to be greater than or equal to 95%, the surface of the first conductive component is highly dense, the surface of the first conductive component is not easily oxidized, the impedance of the first conductive component is not easily increased, and the electrical connection between the first conductive component and other structural components is more reliable.

[0041] In one possible implementation, the first conductive element is a coating; the second region protrudes relative to the first region toward the grounding terminal of the first camera module, and the second region is disposed opposite to the grounding terminal of the first camera module.

[0042] It is understandable that, since the second region protrudes relative to the first region, this embodiment makes it easier for the first conductive element to be formed in the second region.

[0043] In one possible implementation, the camera assembly further includes a first silver paste, which is fixedly connected to the grounding terminal of the first conductive element and the first camera module. The first conductive element is electrically connected to the grounding terminal of the first camera module through the first silver paste.

[0044] Understandably, the first silver paste possesses excellent adhesiveness and conductivity, enabling a fixed connection and electrical connection between the first conductive component and the grounding terminal of the first camera module. Furthermore, the first silver paste exhibits a certain degree of fluidity before curing, allowing it to accommodate the space between the first conductive component and the grounding terminal of the first camera module, thereby ensuring the reliability of the fixed connection and electrical connection between the two.

[0045] In one possible implementation, the body layer further includes a third region, which is spaced apart from the second region; the first camera bracket further includes an electrical connector, the impedance of which is less than the impedance of the anti-oxidation layer, the electrical connector is fixedly connected to the third region, and the electrical connector is electrically connected to the body layer.

[0046] It is understandable that the electrical connector and the first conductive component can be electrically connected through the first body component, and the first conductive component can be electrically connected to other structural components through the first body component and the electrical connector.

[0047] Secondly, this application provides an electronic device. The electronic device includes a housing and the aforementioned camera assembly, the camera assembly being fixedly connected to the housing, and a first camera bracket being electrically connected to the housing to ground the grounding terminal of the first camera module.

[0048] Understandably, the grounding of the first camera module in electronic devices is relatively stable.

[0049] In one possible implementation, the body layer further includes a third region, which is spaced apart from the second region; the first camera bracket further includes an electrical connector, the impedance of which is less than the impedance of the anti-oxidation layer, the electrical connector is fixedly connected to the third region, and the electrical connector is electrically connected to the body layer.

[0050] It is understandable that the grounding terminal of the first camera module can be electrically connected to the housing through the first conductive component, the first body component, and the electrical connector to achieve grounding of the first camera module.

[0051] Understandably, the first camera bracket enables the electrical connection between the grounding terminal of the first camera module and the housing, thereby grounding the first camera module. In other words, the first camera bracket not only serves to mount the first camera module but also to ground it.

[0052] In one possible implementation, the electronic device further includes a spring, which is fixedly connected between the electrical connector and the housing, and the spring is also electrically connected between the electrical connector and the housing.

[0053] Understandably, the spring contactor enables electrical connection between the electrical connector and the housing. In this way, the spring contactor can ground the first camera module. Attached Figure Description

[0054] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0055] Figure 2 yes Figure 1 A partial cross-sectional schematic diagram of one embodiment of the electronic device shown at line AA;

[0056] Figure 3 yes Figure 2 The diagram shown is a partial structural schematic of the electronic device in one embodiment;

[0057] Figure 4 yes Figure 3 The diagram shows a partial structural exploded view of the camera assembly in one embodiment.

[0058] Figure 5 yes Figure 4 The first camera bracket shown is a partially exploded view of one embodiment;

[0059] Figure 6 yes Figure 5 A partial structural schematic diagram of the first body component in one embodiment is shown;

[0060] Figure 7A yes Figure 5 A partial cross-sectional schematic diagram of one embodiment of the first body component at line BB;

[0061] Figure 7B yes Figure 5 A partial cross-sectional schematic diagram of one embodiment of the first body component shown at the CC line;

[0062] Figure 8A yes Figure 5 A partial cross-sectional schematic diagram of one embodiment of the first conductive element at the DD line;

[0063] Figure 8B yes Figure 8A A partially enlarged schematic diagram of one embodiment of the first conductive element at point M;

[0064] Figure 9 yes Figure 3 A partial cross-sectional schematic diagram of one embodiment of the first camera bracket at line EE;

[0065] Figure 10 yes Figure 3 A partial cross-sectional schematic diagram of one embodiment of the electronic device shown at the EE line;

[0066] Figure 11 yes Figure 6 A partial structural schematic diagram of the first body component shown from another angle;

[0067] Figure 12 yes Figure 3 A partial cross-sectional schematic diagram of another embodiment of the electronic device at the EE line;

[0068] Figure 13A yes Figure 5 The surface morphology of the first conductive element shown in another embodiment Figure 1 ;

[0069] Figure 13B yes Figure 5 The surface morphology of the first conductive element shown in another embodiment Figure 2 ;

[0070] Figure 13C yes Figure 5 Surface morphology of the first conductive element shown in another embodiment Figure 3 ;

[0071] Figure 14 yes Figure 3 A partial cross-sectional schematic diagram of another embodiment of the electronic device shown at the EE line;

[0072] Figure 15 yes Figure 1 The diagram shows a partial structural representation of the electronic device in another embodiment;

[0073] Figure 16 yes Figure 1 A partial structural schematic diagram of the electronic device shown in yet another embodiment;

[0074] Figure 17 yes Figure 16 The diagram shows a partial cross-sectional view of one embodiment of the electronic device at the FF line. Detailed Implementation

[0075] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0076] In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation," "connection," "joining," and "joining" should be interpreted broadly. For example, "joining" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an electrical connection or a mechanical connection. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after the connection. Furthermore, the integrated structure obtained by a one-piece molding process means that during the formation of one of the two components, that component is connected to the other component without requiring further processing (such as bonding, welding, snap-fit ​​connection, or screw connection). The relative arrangement of components A and B can be such that component A is projected along the target direction to obtain projection C, and component B is projected along the target direction to obtain projection D, with projection C and projection D at least largely overlapping. In some embodiments, this substantial overlap can be any of the following: projection C is completely within projection D; or projection D is completely within projection C; or projection C and projection D intersect each other, and the intersection area of ​​projection C and projection D accounts for more than 50% of projection C or projection D.

[0077] The directional terms mentioned in the embodiments of this application, such as "inner" and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0078] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship. "Multiple" means at least two.

[0079] Furthermore, the limitations on relative positional relationships mentioned in the embodiments of this application, such as parallelism, are all relative to the current technological level and are not absolutely strict limitations. Slight deviations are allowed, and approximation of parallelism is acceptable. For example, A and B being parallel means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 degrees and 10 degrees.

[0080] Figure 1 This is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application.

[0081] like Figure 1 As shown, the electronic device 1000 can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR helmet, virtual reality (VR) glasses, or VR helmet, or any other device with a camera component. Figure 1 The electronic device 1000 of the embodiment shown is illustrated using a mobile phone as an example.

[0082] It is understood that, for ease of description, the width direction of electronic device 1000 is defined as the X-axis, the height direction as the Y-axis, and the thickness direction as the Z-axis in the following text. In other embodiments, the X-axis, Y-axis, and Z-axis can be flexibly set according to actual needs, as long as they are different from each other.

[0083] Figure 2 yes Figure 1 A partial cross-sectional view of one embodiment of the electronic device 1000 shown at line AA.

[0084] like Figure 1 and Figure 2 As shown, in some embodiments, the electronic device 1000 may include a camera assembly 100, a housing 200, and a screen 300. The camera assembly 100 may be a rear-facing camera assembly or a front-facing camera assembly. It is understood that... Figure 1 Appendix Figure 2 The accompanying drawings below only schematically illustrate some components included in the electronic device 1000; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 Appendix Figure 2 As defined in the accompanying drawings below. Furthermore, the electronic device 1000 may include more or fewer structures. For example, when the electronic device 1000 includes more structures, it may also include a speaker (not shown), etc. When the electronic device 1000 includes fewer structures, it may not include the screen 300.

[0085] like Figure 1 and Figure 2 As shown, in some embodiments, the screen 300 is mounted on the housing 200 and together with the housing 200 encloses the interior of the electronic device 1000. The interior of the electronic device 1000 can be used to house components of the electronic device 1000, such as a battery, receiver, or microphone. The screen 300 can be a flat screen or a curved screen.

[0086] For example, housing 200 may include a mid-frame and a back cover. Screen 300 may be fixedly connected to one side of the mid-frame. Back cover may be fixedly connected to the side of the mid-frame away from screen 300.

[0087] It is understood that this embodiment describes the structure of the middle frame and back cover in one embodiment, but it does not affect the fact that the middle frame and back cover can have other configurations. For example, the middle frame and back cover can be a one-piece molded structure. Specifically, this application does not limit the specific configuration.

[0088] For example, the camera assembly 100 may be disposed within the housing 200. The housing 200 has a light-transmitting portion 201. The shape of the light-transmitting portion 201 is not limited to that of the attached... Figure 1 The shape shown can be circular, elliptical, or irregular. Light from outside the electronic device 1000 can enter the interior of the electronic device 1000 through the light-transmitting part 201. The camera assembly 100 can capture the light entering the interior of the electronic device 1000. The light-transmitting part 201 can be a light-transmitting hole or a transparent portion within the housing 200. This application does not specifically limit the specific structure of the light-transmitting part 201.

[0089] Figure 3 yes Figure 2The diagram shows a partial structural schematic of the electronic device 1000 in one embodiment. Figure 4 yes Figure 3 The image sensor 100 shown is partially exploded in one embodiment.

[0090] like Figures 2 to 4 As shown, exemplarily, the camera assembly 100 includes a first camera module 1 and a first camera bracket 2. It is understood that... Figure 2 , Figure 3 The accompanying drawings below only schematically illustrate some components of the camera assembly 100; the actual shape, size, position, and construction of these components are not subject to change. Figure 2 , Figure 3 As defined in the accompanying drawings below. Furthermore, the camera assembly 100 may include more or fewer structures; for example, when the camera assembly 100 includes more structures, it may also include a second camera module 4 ( Figure 2 and Figure 3 (Not shown).

[0091] like Figure 2 As shown, exemplarily, the first camera module 1 may include a prism module 11, a lens module 12, and an image sensor module 13 arranged sequentially from the object side to the image side. It is understood that... Figure 2 The accompanying drawings below only schematically illustrate some components included in the first camera module 1. The actual shape, size, position, and structure of these components are not subject to change. Figure 2 As well as the limitations of the accompanying figures below.

[0092] Exemplarily, the prism module 11 may include a prism 111 and a prism motor 112. The prism motor 112 may be a prism voice coil motor (PVCM). The prism 111 may be fixedly connected to the prism motor 112. The prism motor 112 may drive the prism 111 to move in order to achieve optical image stabilization of the first camera module 1.

[0093] In other embodiments, the prism motor 112 may also be other types of motors (e.g., SMA motors). This application does not specifically limit the application.

[0094] For example, the lens module 12 may include a lens 121 and a lens motor 122. The lens motor 122 may be a lens voice coil motor (LVCM). The lens 121 may be fixedly connected to the lens motor 122. The lens motor 122 may drive the lens 121 to move in order to achieve focusing or zooming of the first camera module 1.

[0095] In other embodiments, the lens motor 122 may also be other types of motors (e.g., SMA motors). This application does not specifically limit the application.

[0096] like Figure 2 As shown, by way of example, the image sensor module 13 may include an image sensor 131 and a circuit board 132.

[0097] For example, the image sensor 131 is a semiconductor chip, also known as a photosensitive chip. The surface of the image sensor 131 contains hundreds of thousands to millions of photodiodes, which generate electrical charges when illuminated. The image sensor 131 utilizes the photoelectric conversion function of an optoelectronic device to convert the light image on its photosensitive surface into an electrical signal proportional to the light image. The photosensitive surface of the image sensor 131 can be positioned facing the first camera module 1. The image sensor 131 can be a charge-coupled device, a complementary metal-oxide-semiconductor, a phototransistor, or a thin-film transistor, etc. In other embodiments, the image sensor 131 can also be a component with other structures.

[0098] For example, the image sensor module 13 may be located on the image side of the lens module 12. In one embodiment, the image sensor 131 may be electrically connected to the circuit board 132. Light can pass sequentially through the prism module 11 and the lens module 12 before reaching the image sensor 131, thereby achieving image formation.

[0099] For example, the prism module 11 and the lens module 12 can be fixedly connected by means of adhesive or other methods. The prism module 11 and the lens module 12 can be electrically connected to the circuit board 132.

[0100] like Figure 2 and Figure 3 As shown, exemplarily, the first camera module 1 can be fixedly connected to the first camera bracket 2. The first camera bracket 2 can be fixedly connected to the housing 200. The first camera bracket 2 can be used to fix the first camera module 1 to the housing 200. In other embodiments, the first camera module 1 can also be directly fixedly connected to the housing 200.

[0101] In one embodiment, the first camera bracket 2 can be fixedly connected to the mid-frame of the housing 200. The first camera bracket 2 can be used to fix the first camera module 1 to the mid-frame of the housing 200.

[0102] like Figure 2 and Figure 3 As shown, exemplarily, the grounding terminal of the first camera module 1 can be electrically connected to the first camera bracket 2. The first camera bracket 2 can be electrically connected to the housing 200. In this way, the grounding terminal of the first camera module 1 can be electrically connected to the housing 200 through the first camera bracket 2, thereby achieving grounding.

[0103] In one embodiment, the first camera bracket 2 can be electrically connected to the mid-frame of the housing 200. Thus, the grounding terminal of the first camera module 1 can be electrically connected to the mid-frame of the housing 200 via the first camera bracket 2, thereby achieving grounding.

[0104] For example, the grounding terminal of the first camera module 1 can be the housing of the first camera module 1 (not shown). In one embodiment, the grounding terminal of the prism motor 112 can be electrically connected to the housing of the first camera module 1. Thus, the grounding terminal of the prism motor 112 is electrically connected to the housing 200 through the grounding terminal of the first camera module 1 and the first camera bracket 2, thereby grounding the prism motor 112. Furthermore, the grounding terminal of the lens motor 122 can be electrically connected to the housing of the first camera module 1. Thus, the grounding terminal of the lens motor 122 is electrically connected to the housing 200 through the grounding terminal of the first camera module 1 and the first camera bracket 2, thereby grounding the lens motor 122. Additionally, the grounding terminal of the circuit board 132 can be electrically connected to the housing of the first camera module 1. Thus, the grounding terminal of the circuit board 132 is electrically connected to the housing 200 through the grounding terminal of the first camera module 1 and the first camera bracket 2, thereby grounding the circuit board 132.

[0105] In other embodiments, the grounding terminal of the first camera module 1 may be the grounding terminal of the prism module 11, the grounding terminal of the lens module 12, or the grounding terminal of the circuit board 132.

[0106] The above text, in conjunction with the accompanying drawings, has provided a detailed description of the camera component 100. The following text, in conjunction with the accompanying drawings, will provide a detailed description of the structure of several types of first camera brackets 2 and the connection relationship between the first camera brackets 2 and other structural components.

[0107] First implementation method: Please refer to Figure 4 and Figure 5 , Figure 5 yes Figure 4 The first camera bracket 2 shown is partially exploded in one embodiment.

[0108] For example, the first camera bracket 2 includes a first body component 21, a first conductive component 22, and an electrical connector 23. It is understood that... Figure 5 The accompanying drawings below only schematically show some components of the first camera bracket 2. The actual shape, size, position, and structure of these components are not subject to change. Figure 5 As well as the accompanying drawings below. Furthermore, the first camera bracket 2 may include more or fewer structures; for example, if the first camera bracket 2 includes fewer structures, it may also omit the electrical connector 23.

[0109] Figure 6 yes Figure 5 The first body component 21 shown is a partial structural schematic diagram in one embodiment. Figure 7A yes Figure 5 A partial cross-sectional view of one embodiment of the first body component 21 at line BB.

[0110] like Figure 6 and Figure 7A As shown, exemplarily, the first body component 21 may include a body layer 211 and an anti-oxidation layer 212. The impedance of the body layer 211 may be less than the impedance of the anti-oxidation layer 212.

[0111] For example, the material of the body layer 211 may include a magnesium alloy.

[0112] Understandably, magnesium alloys have a lower density and higher specific strength and specific stiffness. Compared to other types of alloys, magnesium alloys are lighter, stronger, and stiffer. The first camera bracket 2 is also lighter, stronger, and stiffer, which, while ensuring the reliability of the first camera bracket 2, facilitates the realization of (see [link to relevant documentation]). Figure 3 ) and Electronic Devices 1000 (see also) Figure 3 Lightweight settings.

[0113] In other embodiments, the material of the body layer 211 may also include other materials. This application does not specifically limit the application to these materials.

[0114] like Figure 6 As shown, exemplarily, the body layer 211 may include a first side portion 2111, a second side portion 2112, a third side portion 2113, a fourth side portion 2114, and an extension portion 2115. It is understood that although this embodiment describes the body layer 211 as five parts, it does not affect the fact that the body layer 211 can be a one-piece molded structure; that is, the first side portion 2111, the second side portion 2112, the third side portion 2113, the fourth side portion 2114, and the extension portion 2115 can be integrally molded. In other embodiments, the body layer 211 can also be formed from different independent structural components through an assembly process. The extension portion 2115 of the body layer can be an independent structural component and is fixedly connected to the first side portion 2111, the second side portion 2112, the third side portion 2113, and the fourth side portion 2114 by means of adhesive bonding, welding, or other methods.

[0115] For example, the first side portion 2111 and the third side portion 2113 may be arranged opposite to each other and spaced apart. The second side portion 2112 and the fourth side portion 2114 may be arranged opposite to each other and spaced apart. The second side portion 2112 and the fourth side portion 2114 may be connected between the first side portion 2111 and the third side portion 2113. The extension portion 2115 may be fixedly connected to the first side portion 2111 and extend in a direction away from the third side portion 2113.

[0116] For example, the first side 2111, the second side 2112, the third side 2113 and the fourth side 2114 can enclose the installation space 2116.

[0117] In other embodiments, the shape of the body layer 211 is not specifically limited.

[0118] For example, the material of the anti-oxidation layer 212 may include phosphate.

[0119] It is understandable that the anti-oxidation layer 212 can prevent the body layer 211 from oxidizing due to contact with air, thereby preventing the impedance of the body layer 211 from increasing, and thus preventing the reliability of the electrical connection between the first body component 21 and other components from decreasing.

[0120] In other embodiments, the material of the anti-oxidation layer 212 may also include other salts. This application does not specifically limit the application.

[0121] like Figure 6 As shown, exemplarily, the body layer 211 may include a first region 2117 and a second region 2118. It is understood that... Figure 6 The first region 2117 and the second region 2118 are schematically distinguished by dashed lines. This application does not specifically limit the shape and size of the first region 2117 and the second region 2118. In other embodiments, the shape and size of the first region 2117 and the second region 2118 can be flexibly set according to actual needs. Specifically, this application does not limit them.

[0122] Figure 7B yes Figure 5 A partial cross-sectional view of one embodiment of the first body component 21 at the CC line.

[0123] like Figure 7B As shown, exemplarily, the body layer 211 may include protrusions 211a and recessed areas 211b. It will be understood that... Figure 7BThe diagram only schematically illustrates the size, shape, position, and number of the protrusions 211a and recesses 211b of the body layer 211. In other embodiments, the size, shape, position, and number of the protrusions 211a and recesses 211b of the body layer 211 can be flexibly set according to actual needs. Specifically, this application does not impose any limitations.

[0124] For example, the protrusion 211a of the body layer 211 may protrude from the second region 2118. In one embodiment, the protrusion 211a of the body layer 211 may protrude toward the third side portion 2113.

[0125] For example, the recessed region 211b of the body layer 211 may be located in the second region 2118. In one embodiment, the recessed region 211b of the body layer 211 may be recessed in a direction away from the third side portion 2113.

[0126] It is understandable that by setting the protrusions 211a and the recessed areas 211b of the body layer 211, the surface roughness of the body layer 211 is large and the coefficient of friction is large.

[0127] like Figure 6 and Figure 7A As shown, the anti-oxidation layer 212 can be fixedly connected to the first region 2117 of the body layer 211. The anti-oxidation layer 212 can cover the first side 2111, the second side 2112, the third side 2113, the fourth side 2114, and the extension 2115 of the body layer 211.

[0128] It is understood that the anti-oxidation layer 212 can cover the first region 2117 of the body layer 211, and can prevent the first region 2117 of the body layer 211 from oxidizing, thereby avoiding the increase of the impedance of the body layer 211, and thus avoiding the reduction of the reliability of the electrical connection between the first body component 21 and other components.

[0129] For example, the anti-oxidation layer 212 can be formed on the first region 2117 of the body layer 211 by a surface formation process. The surface formation process refers to immersing the body layer 211 in a liquid and forming an antioxidant conversion film on the first region 2117 of the body layer 211 through a chemical reaction. In this embodiment, the anti-oxidation layer 212 can be a conversion film mainly composed of phosphate salts generated by a redox reaction between phosphate and its salts and the first region 2117 of the body layer 211.

[0130] In other embodiments, the anti-oxidation layer 212 may also be formed by a redox reaction between other acids (e.g., chromic acid) and their salts with the first region 2117 of the bulk layer 211 to create a conversion film with other salts (e.g., chromium salts) as the main component. This application does not specifically limit the method.

[0131] In other embodiments, the anti-oxidation layer 212 may also be formed in the first region 2117 of the body layer 211 by other processes. Specific details are not limited in this application.

[0132] For example, the first conductive element 22 can be a reed. The reed can be an elastic part, typically made of metal, plastic or other elastic material.

[0133] In other embodiments, the first conductive element 22 may also be other types of structural elements. This application does not specifically limit the application to these embodiments.

[0134] Figure 8A yes Figure 5 A partial cross-sectional schematic diagram of one embodiment of the first conductive element 22 at the DD line.

[0135] like Figure 8A As shown, exemplarily, the first conductive element 22 may include a first conductive element body 221, a first plating layer 222, and a second plating layer 223. It is understood that... Figure 8A The accompanying drawings below only schematically show some components of the first conductive element 22; the actual shape, size, location, and construction of these components are not subject to change. Figure 8A As defined in the accompanying drawings below. Furthermore, the first conductive element 22 may include more or fewer structures; for example, when the first conductive element 22 includes fewer structures, it may also exclude the first plating layer 222 and / or the second plating layer 223.

[0136] For example, the material of the first conductive element body 221 may include a copper-titanium alloy.

[0137] It is understandable that copper-titanium alloy has low resistance, the first conductive element 22 has low impedance, the first conductive element 22 has good conductivity, and the electrical connection between the first conductive element 22 and other structural components is more reliable.

[0138] In other embodiments, the material of the first conductive element 22 may also include other materials. This application does not specifically limit the application.

[0139] For example, the reducing power of the first plating layer 222 may be stronger than that of the second plating layer 223. The material of the first plating layer 222 may include nickel, chromium, or zinc, etc. The material of the second plating layer 223 may include gold, etc.

[0140] It is understandable that by setting the reducing power of the first coating layer 222 to be stronger than that of the second coating layer 223, the reactivity of the second coating layer 223 can be weaker than that of the first coating layer 222. The second coating layer 223 can stabilize the first coating layer 222 and prevent the first coating layer 222 from peeling off.

[0141] For example, the first plating layer 222 can be fixedly connected to the first conductive element body 221. The first plating layer 222 can cover the first conductive element body 221. The second plating layer 223 can be fixedly connected to the side of the first plating layer 222 away from the first conductive element body 221. The second plating layer 223 can cover the first plating layer 222.

[0142] In other embodiments, the first plating layer 222 and the second plating layer 223 may also have other configurations. For example, the first plating layer 222 may cover the first conductive element body 221, and the second plating layer 223 may cover a portion of the first plating layer 222. This application does not specifically limit the details.

[0143] like Figure 8A As shown, exemplarily, the first conductive element 22 may include a first portion 224 and a second portion 225, wherein the second portion 225 may be bent and connected to the first portion 224, and is electrically connected to the first portion 224. In this case, the first conductive element 22 may be in a bent shape. It is understood that... Figure 8A The first part 224 and the second part 225 are only schematically distinguished by dashed lines. In other embodiments, the first part 224 and the second part 225 can also be configured in other ways, and can be flexibly set according to actual needs. This application does not limit the specific configuration.

[0144] Figure 8B yes Figure 8A A partially enlarged schematic diagram of one embodiment of the first conductive element 22 at point M.

[0145] like Figure 8A and Figure 8B As shown, the first conductive element 22 may include a protrusion 226 and a recessed area 227. It is understood that... Figure 8B The diagram only schematically illustrates the size, shape, position, and number of the protrusions 226 and recesses 227 of the first conductive element 22. In other embodiments, the size, shape, position, and number of the protrusions 226 and recesses 227 of the first conductive element 22 can be flexibly set according to actual needs. Specifically, this application does not impose any limitations.

[0146] For example, the protrusion 226 of the first conductive element 22 may protrude from the first conductive element body 221 of the second portion 225 and protrude in a direction away from the first conductive element body 221 of the first portion 224. The first plating layer 222 and the second plating layer 223 may cover the protrusion 226 of the first conductive element 22.

[0147] For example, the recessed area 227 of the first conductive element 22 may be located on the first conductive element body 221 of the second portion 225, and recessed towards the first conductive element body 221 of the first portion 224. The first plating layer 222 and the second plating layer 223 may cover the recessed area 227 of the first conductive element 22.

[0148] It is understandable that by setting the protrusions 226 and the recessed areas 227 of the first conductive element 22, the surface roughness of the first conductive element 22 is large and the coefficient of friction is large.

[0149] Figure 9 yes Figure 3 The diagram shows a partial cross-sectional view of one embodiment of the first camera bracket 2 at line EE.

[0150] Please see Figure 9 and combined Figure 6 As shown, exemplarily, the first conductive element 22 can be fixedly connected to the second region 2118 of the body layer 211 and electrically connected to the body layer 211, so that the first conductive element 22 and the first body element 21 are electrically connected. In one embodiment, the first portion 224 of the first conductive element 22 can be fixedly connected to the extension portion 2115. The second portion 225 of the first conductive element 22 can be fixedly connected to the first side portion 2111.

[0151] For example, the first conductive element 22 can be fixedly connected to the first body element 21 by welding. In one embodiment, the first camera bracket 2 may further include a first solder joint 24. The first solder joint 24 can be fixedly connected between the first conductive element 22 and the first body element 21. It is understood that... Figure 9 The diagram only schematically shows three first solder joints 24. In other embodiments, the number, shape, size, and position of the first solder joints 24 can be flexibly set according to actual needs. This application does not impose any specific limitations.

[0152] It is understandable that by welding the first conductive element 22 to the first body element 21, relative sliding between the first conductive element 22 and the first body element 21 is not likely to occur, and the connection between the first conductive element 22 and the first body element 21 is more reliable.

[0153] like Figure 9 As shown, exemplarily, one of the first body component 21 and the first conductive component 22 may have a protruding positioning post 215, and the other may have a positioning hole 229, with at least a portion of the positioning post 215 located within the positioning hole 229. In one embodiment, the first body component 21 may have a protruding positioning post 215, and the first conductive component 22 may have a positioning hole 229. It is understood that... Figure 9The diagram schematically shows two positioning posts 215 and two positioning holes 229, and schematically shows that the positioning posts 215 are cylindrical and the positioning holes 229 are circular. In other embodiments, the size, shape, position, and number of positioning posts 215 and positioning holes 229 can be flexibly set according to actual needs. Specifically, this application does not limit the specific implementation.

[0154] Understandably, through the cooperation of the positioning post 215 and the positioning hole 229, the first conductive element 22 is not easy to slide relative to the first body element 21, and the connection between the first conductive element 22 and the first body element 21 is more reliable.

[0155] In other embodiments, the first body component 21 may be provided with a positioning hole 229, and the first conductive component 22 may be provided with a positioning post 215. The reliability of the connection between the first conductive component 22 and the first body component 21 is improved by the cooperation between the positioning hole 229 of the first body component 21 and the positioning post 215 of the first conductive component 22. This application does not specifically limit the details.

[0156] In other embodiments, the first body component 21 and the first conductive component 22 can also be fixedly connected by other means. This application does not specifically limit the details.

[0157] For example, the impedance of the first conductive element 22 may be less than the impedance of the anti-oxidation layer 212. In other embodiments, other relationships may also exist between the impedance of the first conductive element 22 and the impedance of the anti-oxidation layer 212. This application does not impose specific limitations on these relationships.

[0158] Please see Figure 9 and combined Figure 6 and Figure 7A As shown, exemplarily, the anti-oxidation layer 212 can cover the first region 2117 of the body layer 211, and the first conductive element 22 can cover the second region 2118 of the body layer 211. In other words, the anti-oxidation layer 212 can be in direct contact with the first conductive element 22.

[0159] Please see Figure 9 and combined Figure 6 and Figure 7B As shown, by way of example, the body layer 211 may include protrusions 211a and recesses 211b. In this way, the surface roughness and friction coefficient of the body layer 211 are relatively large.

[0160] Please combine Figure 6 and Figure 7A As shown, by way of example, the anti-oxidation layer 212 can be formed in the first region 2117 and the second region 2118 of the body layer 211 by a surface formation process. The anti-oxidation layer 212 can cover the protrusions 211a and the recesses 211b of the body layer 211.

[0161] Please see Figure 9 and combined Figure 6 , Figure 7B as well as Figure 8B As shown, exemplarily, the first conductive element 22 can be fixedly connected to the second region 2118 of the body layer 211 by a welding process. Furthermore, the first conductive element 22 can cover the protrusions 211a and recesses 211b of the body layer 211, and the first conductive element body 221 of the first conductive element 22 can be provided with protrusions 226 and recesses 227. Welding, also known as fusion welding, is a manufacturing process and technology that joins metals or other thermoplastic materials by heating, high temperature, or high pressure.

[0162] It is understandable that during the process of soldering the first conductive element 22 to the first body element 21, the solder joint can remove the anti-oxidation layer 212 of the second region 2118 (see [link]). Figure 7A The solder joint is broken down, causing the first conductive element 22 and the first body element 21 to fuse together. There are no holes or gaps between the first conductive element 22 and the first body element 21. In other words, the anti-oxidation layer 212 may not be present between the first conductive element 22 and the first body element 21, and the anti-oxidation layer 212 may not cover the second region 2118. The first conductive element 22 and the first body element 21 can form a stable closed bonding structure, and the body layer 211 of the second region 2118 is not easily exposed to air and thus does not oxidize. In addition, the first conductive element 22 can be in direct contact with the anti-oxidation layer 212, and the first conductive element 22 and the anti-oxidation layer 212 can jointly cover the body layer 211, making the body layer 211 less likely to be exposed to air, thereby preventing the body layer 211 from oxidizing and thus preventing the impedance of the body layer 211 from increasing.

[0163] In other embodiments, a partial anti-oxidation layer 212 may exist between the surfaces of the first conductive element 22 and the first body element 21, excluding the solder joint area. This application does not specify the exact embodiment.

[0164] In other embodiments, the first conductive element 22 may also be fixedly connected to the second region 2118 of the body layer 211 by other means. This application does not specifically limit the details.

[0165] Figure 10 yes Figure 3 A partial cross-sectional schematic diagram of one embodiment of the electronic device 1000 at the EE line.

[0166] like Figure 10As shown, exemplarily, the first camera module 1 can be fixedly connected to the first camera bracket 2. The ground terminal 14 of the first camera module 1 can be electrically connected to the first conductive element 22. In one embodiment, the ground terminal 14 of the first camera module 1 can be electrically connected to the second portion 225 of the first conductive element 22. It is understood that... Figure 10 The location of the grounding terminal 14 of the first camera module 1 is only schematically shown in the accompanying drawings below. In other embodiments, the location of the grounding terminal 14 of the first camera module 1 can be flexibly set according to actual needs. Specifically, this application does not limit it.

[0167] It is understandable that by electrically connecting the ground terminal 14 of the first camera module 1 to the first conductive element 22, the ground terminal 14 of the first camera module 1 can be electrically connected to the first body element 21, without having to break down the anti-oxidation layer 212. The impedance fluctuation range between the ground terminal 14 of the first camera module 1 and the first camera bracket 2 is small and the stability is high. The electrical connection between the first conductive element 22 and the ground terminal 14 of the first camera module 1 is relatively stable, and the stability of the camera assembly is high.

[0168] Understandably, the grounding terminal 14 of the first camera module 1 can be electrically connected to the first body component 21 through the second part 225 and the first part 224 of the first conductive element 22. The first part 224 and the second part 225 are relatively bent, which facilitates the electrical connection between the first conductive element 22 and the grounding terminal 14 of the first camera module 1. Furthermore, during assembly, physical interference is less likely to occur between the first conductive element 22 and the first body component 21 and the grounding terminal 14 of the first camera module 1. The first body component 21, the first conductive element 22, and the grounding terminal 14 of the first camera module 1 are less likely to be damaged by collisions, resulting in high reliability among them.

[0169] For example, the camera assembly 100 may also include a first silver paste 3. The first silver paste 3 may be made of silver paste (also known as conductive silver paste), which generally includes conductive fillers (silver powder, silver nanoparticles and other silver-related materials), matrix resin and additives, and is an adhesive that has a certain conductivity after curing.

[0170] For example, the first silver paste 3 can be fixedly connected to the grounding terminal 14 of the first conductive element 22 and the first camera module 1, and the first conductive element 22 can be electrically connected to the grounding terminal 14 of the first camera module 1 through the first silver paste 3.

[0171] Understandably, the first silver paste 3 possesses good adhesiveness and conductivity, thereby enabling the fixed connection and electrical connection between the first conductive component 22 and the grounding terminal 14 of the first camera module 1. Furthermore, the first silver paste 3 exhibits a certain degree of fluidity before curing, allowing it to accommodate the space between the first conductive component 22 and the grounding terminal 14 of the first camera module 1, thus ensuring the reliability of the fixed connection and electrical connection between the first conductive component 22 and the grounding terminal 14 of the first camera module 1.

[0172] For example, the amount of the first silver paste 3 can be controlled. It is understood that by controlling the amount of the first silver paste 3, the amount of the first silver paste 3 is larger and more full, so that it can fully contact the first conductive element 22 and the grounding terminal 14 of the first camera module 1.

[0173] In other embodiments, the first conductive element 22 and the first camera module 1 can be electrically connected in other ways. This application does not specifically limit the method.

[0174] Please see Figure 10 and combined Figure 8B As shown, by way of example, the first silver paste 3 can be fixedly connected between the first conductive element 22 and the grounding terminal 14 of the first camera module 1. In this way, the first silver paste 3 can be fixedly connected to the protrusion 226 of the first conductive element 22, and at least a portion of the first silver paste 3 can be located within the recessed area 227 of the first conductive element 22.

[0175] It is understandable that the surface roughness of the first conductive element 22 that is electrically connected to the ground terminal 14 of the first camera module 1 is relatively high, and the electrical connection between the first conductive element 22 and the ground terminal 14 of the first camera module 1 is more reliable.

[0176] It is understandable that by setting the impedance of the first conductive element 22 to be less than that of the anti-oxidation layer 212, the conductivity of the first conductive element 22 is better than that of the anti-oxidation layer 212. Compared with the scheme of electrically connecting the anti-oxidation layer 212 to the grounding terminal 14 of the first camera module 1, the electrical connection between the first conductive element 22 and the grounding terminal 14 of the first camera module 1 is more reliable.

[0177] Understandably, by setting the impedance of the electrical connector 23 to be less than that of the anti-oxidation layer 212, the electrical connector 23 has a smaller impedance, better conductivity, and a more reliable electrical connection between the electrical connector 23 and the housing 200.

[0178] For example, the impedance between the first conductive element 22 and the first camera module 1 can be less than or equal to 5Ω. For instance, the impedance between the first conductive element 22 and the first camera module 1 can be equal to 0.3Ω, 1Ω, 2.8Ω, 3.3Ω, 4Ω, 4.6Ω, or 5Ω, etc.

[0179] It is understandable that by setting the impedance between the first conductive element 22 and the first camera module 1 to be less than or equal to 5Ω, the impedance value of the electrical connection path between the first conductive element 22 and the ground terminal 14 of the first camera module 1 is smaller, and the electrical connection between the first conductive element 22 and the ground terminal 14 of the first camera module 1 is more reliable.

[0180] In other embodiments, the impedance between the first conductive element 22 and the first camera module 1 may also satisfy other ranges. This application does not specifically limit the details.

[0181] For example, the impedance between the first conductive element 22 and the body layer 211 can be less than or equal to 1Ω (ohms). For instance, the impedance between the first conductive element 22 and the body layer 211 can be equal to 0.06Ω, 0.1Ω, 0.3Ω, 0.5Ω, 0.67Ω, 0.8Ω, 0.95Ω, or 1Ω, etc.

[0182] It is understandable that by setting the impedance between the first conductive element 22 and the body layer 211 to be less than or equal to 1Ω, the impedance between the first conductive element 22 and the body layer 211 is small, the conductivity of the electrical connection path between the first conductive element 22 and the body layer 211 is good, and the electrical connection between the first conductive element 22 and the body layer 211 is more reliable.

[0183] In other embodiments, the impedance between the first conductive element 22 and the body layer 211 may also satisfy other ranges. This application does not specifically limit the details.

[0184] For example, the impedance of the first conductive element 22 may be less than or equal to 1Ω. For instance, the impedance of the first conductive element 22 may be equal to 0.05Ω, 0.1Ω, 0.5Ω, 0.67Ω, 0.8Ω, 0.95Ω, 0.99Ω, or 1Ω, etc.

[0185] It is understandable that by setting the impedance of the first conductive element 22 to be less than or equal to 1Ω, the impedance of the first conductive element 22 is smaller, the conductivity of the first conductive element 22 is better, and the electrical connection between the first conductive element 22 and the first body element 21 or between the first conductive element 22 and other structural elements is more reliable.

[0186] In other embodiments, the impedance of the first conductive element 22 may also satisfy other ranges. This application does not specifically limit the application to this.

[0187] Figure 11 yes Figure 6 The diagram shows a partial structural view of the first body component 21 from another angle.

[0188] like Figure 11As shown, exemplarily, the body layer 211 may also include a third region 2119. The third region 2119 and the second region 2118 (see [reference]). Figure 6 (This can be set at intervals.) It is understandable that... Figure 11 The first region 2117 and the third region 2119 are only schematically distinguished by dashed lines. In other embodiments, the first region 2117 and the third region 2119 can be flexibly set according to actual needs. This application does not limit the specific implementation.

[0189] Please see Figure 11 and combined Figure 6 As shown, the third region 2119 can be located in the extension 2115. The third region 2119 and the second region 2118 can be arranged facing away from each other.

[0190] like Figures 9 to 11 As shown, exemplarily, the electrical connector 23 can be fixedly connected to the third region 2119. The electrical connector 23 can be electrically connected to the body layer 211 so that the electrical connector 23 is electrically connected to the first body member 21.

[0191] It is understandable that the electrical connector 23 and the first conductive element 22 can be electrically connected through the first body component 21, and the first conductive element 22 can be electrically connected to other structural components through the first body component 21 and the electrical connector 23.

[0192] For example, the impedance of the electrical connector 23 may be less than the impedance of the anti-oxidation layer 212.

[0193] In other embodiments, the impedance of the electrical connector 23 and the impedance of the anti-oxidation layer 212 may also satisfy other relationships. This application does not specifically limit the details.

[0194] like Figure 9 As shown, exemplarily, the electrical connector 23 can be fixedly connected to the first body component 21 by welding. In one embodiment, the first camera bracket 2 may further include a second solder joint 25. The second solder joint 25 can be fixedly connected between the electrical connector 23 and the first body component 21. It is understood that... Figure 9 The diagram only schematically shows three second solder joints 25. In other embodiments, the number, position, size, and shape of the second solder joints 25 can be flexibly set according to actual needs. This application does not impose any specific limitations.

[0195] It is understandable that by welding the electrical connector 23 to the first body component 21, relative sliding between the electrical connector 23 and the first body component 21 is not likely to occur, and the connection between the electrical connector 23 and the first body component 21 is more reliable.

[0196] like Figure 10As shown, exemplarily, the electrical connector 23 can be fixedly connected and electrically connected to the housing 200. In other words, the first camera bracket 2 can be electrically connected to the housing 200 through the electrical connector 23. In this way, the grounding terminal 14 of the first camera module 1 can be electrically connected to the housing 200 through the first conductive member 22, the first body member 21 and the electrical connector 23 to achieve grounding of the first camera module 1.

[0197] Understandably, the first camera bracket 2 enables the electrical connection between the grounding terminal 14 of the first camera module 1 and the housing 200, thereby grounding the first camera module 1. In other words, the first camera bracket 2 not only serves to mount the first camera module 1 but also to ground the first camera module 1.

[0198] In one embodiment, the electrical connector 23 can be fixedly connected to and electrically connected to the mid-frame of the housing 200. In other words, the first camera bracket 2 can be electrically connected to the mid-frame of the housing 200 via the electrical connector 23. Thus, the grounding terminal 14 of the first camera module 1 can be electrically connected to the mid-frame of the housing 200 via the first conductive member 22, the first body member 21, and the electrical connector 23, thereby grounding the first camera module 1.

[0199] like Figure 10 As shown, exemplarily, the electronic device 1000 may also include a spring 400. Exemplarily, the spring 400 may be fixedly connected between the electrical connector 23 and the housing 200. The spring 400 may be fixedly connected to the electrical connector 23 and the housing 200 by processes such as welding.

[0200] For example, the spring 400 can also electrically connect the electrical connector 23 to the housing 200. In other words, the electrical connector 23 can be electrically connected to the housing 200 via the spring 400.

[0201] Understandably, the spring 400 enables the electrical connection between the electrical connector 23 and the housing 200. Thus, the spring 400 enables the grounding of the first camera module 1.

[0202] In other embodiments, the electrical connector 23 may also be electrically connected to the housing 200 through other structural components and other means. This application does not specifically limit the details.

[0203] For example, the electrical connector 23 can be a spring. In other embodiments, the electrical connector 23 can also be other types of structural components. This application does not specifically limit the application.

[0204] For example, the experimental data of the relevant tests of the first conductive element 22 are shown in Tables 1 to 3 below.

[0205] Table 1 Drop TTF Test Data of the First Conductive Component 22

[0206]

[0207] Here, PVCM refers to prism motor 112 (see [link]). Figure 2 The first conductive element 22-PVCM refers to the impedance between the first conductive element 22 and the prism motor 112, in Ω. LVCM refers to the lens motor 122 (see [link]). Figure 2 The first conductive element 22-LVCM refers to the impedance between the first conductive element 22 and the lens motor 122, in Ω. BTB refers to the impedance between the first conductive element 22 and the circuit board 132 (see [link]). Figure 2 The impedance between board-to-board connectors (BTB) (not shown in the figure) is expressed in Ω. It is understood that the same term will have the same meaning in the following text and will not be repeated.

[0208] Understandably, after the drop test, the impedance between the first conductive element 22 and the prism motor 112, the impedance between the first conductive element 22 and the lens motor 122, and the impedance between the first conductive element 22 and the connector of the circuit board 132 can all be kept within the range of less than 1Ω. The first conductive element 22 has good drop resistance and the electrical connection between the first conductive element 22 and other structural components has high reliability.

[0209] Table 2. High Temperature and High Humidity Operation Test Data of the First Conductive Component 22

[0210]

[0211] The high temperature and high humidity test of the first conductive component 22 refers to testing whether the function of the first conductive component 22 is normal after it has been placed in an environment with high temperature and high humidity for a period of time.

[0212] Understandably, after being placed under high temperature and high humidity conditions for a period of time, the impedance between the first conductive element 22 and the prism motor 112, the impedance between the first conductive element 22 and the lens motor 122, and the impedance between the first conductive element 22 and the connector of the circuit board 132 can all be kept within the range of less than 1Ω. The first conductive element 22 has good heat resistance and moisture resistance, good stability, and high reliability of electrical connection between the first conductive element 22 and other structural components.

[0213] Table 3. Test data of dual 85 TTF for the first conductive component 22

[0214]

[0215] The "double 85 test" refers to a test conducted by placing the first conductive component 22 at 85°C and 85% humidity for 240 hours to confirm whether the first conductive component 22 functions normally. It is understood that the same terminology will have the same meaning in the following text and will not be repeated.

[0216] Understandably, after the double 85 test, the impedance between the first conductive element 22 and the prism motor 112, the impedance between the first conductive element 22 and the lens motor 122, and the impedance between the first conductive element 22 and the connector of the circuit board 132 can all be kept within the range of less than 5Ω. The first conductive element 22 has good heat resistance and moisture resistance, good stability, and high reliability of electrical connection between the first conductive element 22 and other structural components.

[0217] The second implementation method: It is understood that the design of the first camera bracket 2 in the first implementation method can also be directly applied to the structural design of the first camera bracket 2 shown in this implementation method, provided there is no conflict. The technical content that is largely the same as that of the first camera bracket 2 shown in the first implementation method will not be repeated in this implementation method.

[0218] Figure 12 yes Figure 3 A partial cross-sectional schematic diagram of another embodiment of the electronic device 1000 shown at the EE line.

[0219] like Figure 12 As shown, the first conductive element 22 can be a plating layer. The plating layer can refer to a thin film of metal or alloy with specific properties applied to the surface of a metal or other material using a specific process.

[0220] For example, the first conductive element 22 may include a first plating layer 222 and a second plating layer 223.

[0221] For example, the reducibility of the first coating 222 may be stronger than that of the second coating 223.

[0222] It is understandable that by setting the reducing power of the first coating layer 222 to be stronger than that of the second coating layer 223, the reactivity of the second coating layer 223 can be weaker than that of the first coating layer 222. The second coating layer 223 can stabilize the first coating layer 222 and prevent the first coating layer 222 from peeling off.

[0223] In other embodiments, other relationships may also exist between the reducibility of the first coating 222 and the reducibility of the second coating 223. This application does not impose specific limitations on these relationships.

[0224] For example, the material of the first plating layer 222 may include nickel, chromium or zinc.

[0225] Understandably, the first plating layer 222 has low resistance and good conductivity, ensuring a reliable electrical connection between the first plating layer 222 and other structural components. Furthermore, the first plating layer 222 is easier to fix to the first body component 21.

[0226] In other embodiments, the material of the first coating 222 may also include other materials. This application does not specifically limit the application.

[0227] For example, the material of the second plating layer 223 may include gold.

[0228] Understandably, the second plating layer 223 can keep the first plating layer 222 stable, prevent the first plating layer 222 from peeling off, and ensure electrical conductivity between the first plating layer 222 and other structural components.

[0229] In other embodiments, the material of the second coating 223 may also include other materials. This application does not specifically limit the application.

[0230] For example, the first plating layer 222 can be fixedly connected to the first body component 21, and the second plating layer 223 can be fixedly connected to the side of the first plating layer 222 away from the first body component 21. The first plating layer 222 can be electrically connected to the first body component 21, and the second plating layer 223 can be electrically connected to the first plating layer 222.

[0231] Please combine Figure 7A As shown, by way of example, the impedance of the first coating 222 can be less than the impedance of the anti-oxidation layer 212.

[0232] In other embodiments, the impedance of the first plating layer 222 and the impedance of the anti-oxidation layer 212 may also satisfy other relationships. This application does not specifically limit the details.

[0233] For example, the ground terminal 14 of the first camera module 1 can be electrically connected to the first conductive element 22 via the first silver paste 3. In one embodiment, the ground terminal 14 of the first camera module 1 can be electrically connected to the second plating layer 223 via the first silver paste 3. In other words, the ground terminal 14 of the first camera module 1 can be electrically connected to the first body component 21 via the first silver paste 3, the second plating layer 223, and the first plating layer 222.

[0234] It is understandable that by setting the impedance of the first plating layer 222 to be less than that of the anti-oxidation layer 212, the conductivity of the first plating layer 222 is better than that of the anti-oxidation layer 212, and the electrical connection between the first conductive element 22 and the grounding terminal 14 of the first camera module 1 is more reliable.

[0235] For example, the electrical connector 23 can be electrically connected to the first body component 21 and electrically connected to the housing 200 via the spring contact 400. In other words, the first body component 21 can be electrically connected to the housing 200 via the electrical connector 23 and the spring contact 400.

[0236] It is understood that the grounding terminal 14 of the first camera module 1 can be electrically connected to the housing 200 through the first conductive element 22, the first body element 21, the electrical connector 23, and the spring contact 400 to achieve grounding. Compared with the first embodiment, the first conductive element 22 in this embodiment is smaller in size, which is more conducive to the miniaturization of the camera assembly 100 and the electronic device 1000.

[0237] In one embodiment, the electrical connector 23 can be electrically connected to the first body component 21 and the middle frame of the housing 200. The grounding terminal 14 of the first camera module 1 can be electrically connected to the middle frame of the housing 200 through the first conductive component 22, the first body component 21, and the electrical connector 23 to ground the grounding terminal 14 of the first camera module 1.

[0238] Please see Figure 9 and combined Figure 6 and Figure 7B As shown, exemplarily, a protrusion 211a or a recessed area 211b is formed on the second region 2118 of the body layer 211. This results in a higher roughness and a higher coefficient of friction for the second region 2118 of the body layer 211. An anti-oxidation layer 212 can be formed on the first region 2117 and the second region 2118 of the body layer 211 through a surface formation process, and the anti-oxidation layer 212 can cover the protrusion 211a and the recessed area 211b of the body layer 211.

[0239] For example, the anti-oxidation layer 212 of the second region 2118 of the body layer 211 can be laser-engraved. This allows the second region 2118 of the body layer 211 to be directly exposed to air. In other words, the anti-oxidation layer 212 of this embodiment may not cover the second region 2118 of the body layer 211. Laser engraving, also known as laser marking, utilizes a high-energy-density laser beam to irradiate the surface of a workpiece, causing the surface material to melt or vaporize, thereby forming a long-lasting mark, pattern, or text on the object's surface.

[0240] Please see Figure 12 and combined Figure 6As shown, exemplarily, the first plating layer 222 and the second plating layer 223 can be formed on the second region 2118 of the body layer 211 by processes such as electroplating. The first plating layer 222 and the second plating layer 223 can cover the protrusions 211a and the recessed regions 211b of the body layer 211, and at least a portion of the first plating layer 222 and the second plating layer 223 can be located within the recessed region 211b of the body layer 211. During the formation of the first plating layer 222 and the second plating layer 223, tools such as masking jigs can be used to mask the first region 2117 to prevent the formation of the first plating layer 222 and the second plating layer 223 on the first region 2117, thereby reducing costs.

[0241] In other embodiments, the first plating layer 222 and the second plating layer 223 may also be formed in the second region 2118 of the body layer 211 by other processes. This application does not specifically limit the application.

[0242] Please combine Figure 6 and Figure 7A As shown, exemplarily, the anti-oxidation layer 212 can be formed on the first region 2117 of the body layer 211 by a surface formation process. During the formation of the anti-oxidation layer 212, tools such as a masking jig can be used to mask the first conductive element 22 to prevent the formation of the anti-oxidation layer 212 on the first conductive element 22, thereby avoiding an increase in the impedance of the first conductive element 22 and thus avoiding a decrease in the reliability of the electrical connection between the first conductive element 22 and other structural components.

[0243] In other embodiments, the anti-oxidation layer 212 may also be formed in the first region 2117 of the body layer 211 by other processes. This application does not specifically limit the application.

[0244] Please see Figure 12 and combined Figure 7B As shown, by way of example, the first silver paste 3 can be fixedly connected between the first conductive element 22 and the ground terminal 14 of the first camera module 1. In this way, the first silver paste 3 can be fixedly connected to the protrusion 211a of the body layer 211, and at least a portion of the first silver paste 3 can be located in the recessed area 211b of the body layer 211.

[0245] It is understandable that the surface roughness of the first conductive element 22 that is electrically connected to the ground terminal 14 of the first camera module 1 is relatively high, and the electrical connection between the first conductive element 22 and the ground terminal 14 of the first camera module 1 is more reliable.

[0246] For example, the relevant experimental data of the double 85 test of the first conductive element 22 are shown in Table 4 below.

[0247] Table 4. Impedance comparison table of the first conductive component 22 before and after the double 85 test.

[0248]

[0249] Understandably, after the double 85 test, the impedance of the first conductive component 22 can be kept within the range of less than 1Ω. The first conductive component 22 has good heat resistance and moisture resistance, good stability, and high reliability of electrical connection between the first conductive component 22 and other structural components.

[0250] The third implementation method: It is understood that the related designs of the first camera bracket 2 in the first and second implementation methods can also be directly applied to the structural design of the first camera bracket 2 shown in this implementation method, provided there is no conflict. The technical content that is largely the same as that shown in the first and second implementation methods for the first camera bracket 2 will not be repeated in this implementation method.

[0251] Figure 13A yes Figure 5 The surface morphology of the first conductive element 22 shown in another embodiment Figure 1 . Figure 13B yes Figure 5 The surface morphology of the first conductive element 22 shown in another embodiment Figure 2 . Figure 13C yes Figure 5 The surface morphology of the first conductive element 22 shown in another embodiment Figure 3 Understandably, Figures 13A to 13C The image can be a result obtained by testing the first conductive element 22 in this embodiment using a scanning electron microscope (SEM). In other embodiments, the surface morphology image of the first conductive element 22 can also be obtained by other means. This application does not specifically limit the method.

[0252] like Figures 13A to 13C As shown, the first conductive element 22 can be a laser-etched layer. The surface of the first conductive element 22 is relatively regular, and the depth of the laser-etched pits is relatively uniform with almost no omissions.

[0253] For example, the surface density P of the first conductive element 22 can satisfy: P≥95%, where surface density refers to the compactness of the material surface, which reflects the microstructure characteristics of the material surface and the tightness of the material distribution. For example, P can be equal to 95%, 96%, 97%, 98%, 99%, or 99.9%, etc.

[0254] It is understandable that by setting the surface density P of the first conductive element 22 to be greater than or equal to 95%, the surface of the first conductive element 22 is highly dense, the surface of the first conductive element 22 is not easily oxidized, the impedance of the first conductive element 22 is not easily increased, and the electrical connection between the first conductive element 22 and other structural components is more reliable.

[0255] In other embodiments, the surface density P of the first conductive element 22 may also satisfy other ranges. This application does not specifically limit the range.

[0256] For example, the material of the first conductive element 22 may include magnesium oxide.

[0257] It is understandable that the first conductive element 22 can prevent the first body element 21 from oxidizing, thereby avoiding an increase in the impedance of the first body element 21, and thus avoiding a decrease in the reliability of the electrical connection between the first body element 21 and other structural components.

[0258] In other embodiments, the material of the first conductive element 22 may also include other materials. This application does not specifically limit the application.

[0259] Figure 14 yes Figure 3 A partial cross-sectional view of another embodiment of the electronic device 1000 shown at the EE line.

[0260] like Figure 14 As shown, by way of example, the grounding terminal 14 of the first camera module 1 can be electrically connected to the housing 200 through the first silver paste 3, the first conductive element 22, the first body element 21, the electrical connector 23, and the spring piece 400 to achieve grounding.

[0261] It is understandable that, compared to the first embodiment, the first conductive element 22 in this embodiment has a simpler processing technology and does not require the use of a shielding fixture.

[0262] Please see Figure 9 and combined Figure 6 and Figure 7B As shown, exemplarily, a protrusion 211a or a recessed area 211b is formed on the second region 2118 of the body layer 211. This results in a higher roughness and a higher coefficient of friction for the second region 2118 of the body layer 211. An anti-oxidation layer 212 can be formed on the first region 2117 and the second region 2118 of the body layer 211 through a surface formation process, and the anti-oxidation layer 212 can cover the protrusion 211a and the recessed area 211b of the body layer 211.

[0263] Please see Figure 9 and combined Figure 6As shown, exemplarily, the anti-oxidation layer 212 of the second region 2118 of the body layer 211 can be laser-engraved. In other words, Figure 7A The first conductive element 22 can be formed on the anti-oxidation layer 212 located in the second region 2118 of the body layer 211 by laser engraving. The first conductive element 22 can cover the protrusions 211a and the recessed regions 211b of the body layer 211, and at least a portion of the first conductive element 22 can be located within the recessed region 211b of the body layer 211. There may be no or a small amount of anti-oxidation layer 212 between the first conductive element 22 and the second region 2118 of the body layer 211. The linear velocity of the laser used for laser engraving can be less than or equal to 3000 mm / s.

[0264] In other embodiments, the first conductive element 22 may be formed in the second region 2118 of the body layer 211 by other processes. This application does not specifically limit the application to this method.

[0265] Please see Figure 14 and combined Figure 7B As shown, by way of example, the first silver paste 3 can be fixedly connected between the first conductive element 22 and the ground terminal 14 of the first camera module 1. In this way, the first silver paste 3 can be fixedly connected to the protrusion 211a of the body layer 211, and at least a portion of the first silver paste 3 can be located in the recessed area 211b of the body layer 211.

[0266] It is understandable that the surface roughness of the first conductive element 22 that is electrically connected to the ground terminal 14 of the first camera module 1 is relatively high, and the electrical connection between the first conductive element 22 and the ground terminal 14 of the first camera module 1 is more reliable.

[0267] For example, the relevant test data table for the first conductive element 22 is shown in Table 5 below.

[0268] Table 5 Test data of the first conductive component 22

[0269]

[0270] The data in Table 5 are obtained after placing the first conductive component 22 in an environment with a temperature of 60℃ and a humidity of 95% for a period of time and then testing it. The first conductive component 22-BTB refers to the first conductive component 22 and the circuit board 132 (see [link]). Figure 2 The impedance between the connectors (not shown in the diagram) is expressed in Ω. LVCM-BTB refers to the lens motor 122 (see [link to documentation]). Figure 2 The impedance between the prism motor 112 and the connector on circuit board 132 is expressed in Ω. PVCM-BTB refers to the prism motor 112 (see [link to relevant documentation]). Figure 2 The impedance between the connector of circuit board 132 and the connector of circuit board 132 is expressed in Ω.

[0271] Understandably, after being placed under high temperature and high humidity conditions for a period of time, the impedance between the first conductive element 22 and the connector of the circuit board 132, the impedance between the lens motor 122 and the connector of the circuit board 132, and the impedance between the prism motor 112 and the connector of the circuit board 132 are all relatively small. The first conductive element 22 has good heat resistance and moisture resistance, good stability, and high reliability of electrical connection between the first conductive element 22 and other structural components.

[0272] Fourth implementation method: It is understood that the related designs of the first camera bracket 2 in the first to third implementation methods can also be directly applied to the structural design of the first camera bracket 2 shown in this implementation method, provided there is no conflict. The technical content that is largely the same as that shown in the first to third implementation methods for the first camera bracket 2 will not be repeated in this implementation method.

[0273] Figure 15 yes Figure 1 The diagram shows a partial structural schematic of the electronic device 1000 in another embodiment.

[0274] like Figure 15 As shown, exemplarily, the second region 2118 of the body layer 211 may protrude relative to the first region 2117 of the body layer 211 towards the ground terminal 14 of the first camera module 1. The second region 2118 may be disposed opposite to the ground terminal 14 of the first camera module 1.

[0275] For example, the first conductive element 22 can be a coating. A coating is a thin layer of material that covers the surface of an object and is attached to a substrate through a coating process to improve the performance of the substrate or to give it a specific function.

[0276] For example, the first conductive element 22 can be fixedly connected to the second region 2118 of the body layer 211, and electrically connected to the second region 2118 of the body layer 211 and the ground terminal 14 of the first camera module 1 through the first silver paste 3.

[0277] It is understandable that, compared to the first embodiment, since the second region 2118 protrudes relative to the first region 2117, this embodiment makes it easier for the first conductive element 22 to be formed in the second region 2118.

[0278] For example, the material of the first conductive element 22 may include nickel, chromium, zinc or gold.

[0279] Understandably, the first conductive element 22 has low resistance and good conductivity, making the electrical connection between it and other structural components more reliable. Furthermore, the first conductive element 22 has good stability, is less prone to detachment, and ensures electrical continuity between it and other structural components.

[0280] In other embodiments, the material of the first conductive element 22 may also include other materials. This application does not specifically limit the application.

[0281] Please see Figure 9 and combined Figure 6 and Figure 7B As shown, exemplarily, a protrusion 211a or a recessed area 211b is formed on the second region 2118 of the body layer 211. This results in a higher roughness and a higher coefficient of friction for the second region 2118 of the body layer 211. An anti-oxidation layer 212 can be formed on the first region 2117 and the second region 2118 of the body layer 211 through a surface formation process, and the anti-oxidation layer 212 can cover the protrusion 211a and the recessed area 211b of the body layer 211.

[0282] For example, the anti-oxidation layer 212 of the second region 2118 of the body layer 211 can be laser-engraved. In this way, the second region 2118 of the body layer 211 can be directly exposed to the air. In other words, the anti-oxidation layer 212 of this embodiment may not cover the second region 2118 of the body layer 211.

[0283] like Figure 15 As shown, by way of example, the first conductive element 22 can be formed in the second region 2118 by a coating or dipping process. The first conductive element 22 can cover the protrusions 211a and the recesses 211b of the body layer 211. At least a portion of the first conductive element 22 can be located within the recesses 211b of the body layer 211.

[0284] It is understandable that applying or dipping to the second region 2118, which protrudes from the first region 2117, does not require the use of a masking fixture and the process is simpler.

[0285] In other embodiments, the first conductive element 22 may also be formed in the second region 2118 by other processes. This application does not specifically limit the application.

[0286] Please see Figure 15 and combined Figure 7B As shown, by way of example, the first silver paste 3 can be fixedly connected between the first conductive element 22 and the ground terminal 14 of the first camera module 1. In this way, the first silver paste 3 can be fixedly connected to the protrusion 211a of the body layer 211, and at least a portion of the first silver paste 3 can be located in the recessed area 211b of the body layer 211.

[0287] It is understandable that the surface roughness of the first conductive element 22 that is electrically connected to the ground terminal 14 of the first camera module 1 is relatively high, and the electrical connection between the first conductive element 22 and the ground terminal 14 of the first camera module 1 is more reliable.

[0288] Figure 16 yes Figure 1 The diagram shows a partial structural schematic of the electronic device 1000 in another embodiment. Figure 17 yes Figure 16 A partial cross-sectional view of one embodiment of the electronic device 1000 at the FF line.

[0289] like Figure 16 and Figure 17 As shown, the camera assembly 100 may also include a second camera module 4 and a second camera bracket 5.

[0290] For example, the second camera module 4 can be fixedly connected to the second camera bracket 5, and the second camera bracket 5 can be arranged around the second camera module 4. The optical axis of the second camera module 4 can be approximately parallel to the Z-axis direction. The grounding terminal 41 of the second camera module 4 can be electrically connected to the second camera bracket 5. It is understood that, without conflict, the relevant solutions for the second camera module 4 can refer to the relevant solutions for the first camera module 1 in the first to fourth embodiments. Specific details will not be elaborated further.

[0291] like Figure 17 As shown, exemplarily, the second camera bracket 5 may include a second body component 51 and a second conductive component 52. It is understood that, without conflict, all related solutions for the second camera bracket 5 can be found in the solutions of the second camera bracket 5 in the first to fourth embodiments. Specific details will not be elaborated further.

[0292] For example, the material of the second body component 51 may include magnesium alloy. The second body component 51 may have a through hole 511. The through hole 511 and the second camera module 4 may be arranged along the optical axis direction (i.e., the Z-axis direction) of the second camera module 4.

[0293] For example, the second conductive element 52 may be fixedly connected to the second body element 51 and electrically connected to the second body element 51.

[0294] For example, the second camera module 4 may include a ground terminal 41, which may be electrically connected to the second conductive element 52. The second conductive element 52 and the ground terminal 41 of the second camera module 4 may be arranged along the optical axis direction (i.e., the Z-axis direction) of the second camera module 4.

[0295] For example, the second conductive element 52 can be a spring, a plating layer, a laser engraving layer, or a coating.

[0296] In other embodiments, the second conductive element 52 may also adopt other structures. This application does not specifically limit the specific implementation.

[0297] For example, the material of the second conductive element 52 may include one or more of nickel, chromium, zinc, gold, or magnesium oxide.

[0298] In other embodiments, the material of the second conductive element 52 may also include other materials. This application does not specifically limit the application.

[0299] For example, the camera assembly 100 may further include a second silver paste 6. The second silver paste 6 may be made of silver paste. The second silver paste 6 may be fixedly connected between the ground terminal 41 of the second camera module 4 and the second conductive element 52, and electrically connected between the ground terminal 41 of the second camera module 4 and the second conductive element 52. It is understood that the second silver paste 6 can realize the electrical connection between the ground terminal 41 of the second camera module 4 and the second conductive element 52.

[0300] In other embodiments, the grounding terminal 41 of the second camera module 4 and the second conductive element 52 may also be electrically connected in other ways. This application does not specifically limit the method.

[0301] like Figure 16 As shown, exemplarily, the second camera bracket 5 can be fixedly connected to the first camera bracket 2 and electrically connected to the first camera bracket 2. In one embodiment, the first camera bracket 2 and the second camera bracket 5 can be integrally formed. In other embodiments, the first camera bracket 2 and the second camera bracket 5 can be two independent structural components, and the second camera bracket 5 can be fixedly connected to the first camera bracket 2 by means of adhesive bonding, welding, etc.

[0302] For example, the grounding terminal 41 of the second camera module 4 can be electrically connected to the housing 200 through the second camera bracket 5 and the first camera bracket 2 to achieve grounding. In one embodiment, the grounding terminal 41 of the second camera module 4 can be electrically connected to the middle frame of the housing 200 through the second camera bracket 5 and the first camera bracket 2 to achieve grounding.

[0303] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments described in this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0304] It should be noted that all the above-described figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application. The above are merely some embodiments and implementations of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A camera assembly (100), characterized in that, It includes a first camera module (1) and a first camera bracket (2), wherein the first camera module (1) is fixedly connected to the first camera bracket (2); The first camera bracket (2) includes a first body component (21) and a first conductive component (22). The first body component (21) includes a body layer (211) and an anti-oxidation layer (212). The material of the body layer (211) includes magnesium alloy. The impedance of the body layer (211) is less than the impedance of the anti-oxidation layer (212). The body layer (211) includes a first region (2117) and a second region (2118). The anti-oxidation layer (212) is fixedly connected to the first region (2117). The first conductive element (22) is fixedly connected to the second region (2118) and electrically connected to the body layer (211). The first conductive element (22) is also electrically connected to the ground terminal (14) of the first camera module (1). The impedance of the first conductive element (22) is less than the impedance of the anti-oxidation layer (212).

2. The camera assembly (100) according to claim 1, characterized in that, The impedance between the first conductive element (22) and the body layer (211) is less than or equal to 1Ω.

3. The camera assembly (100) according to claim 2, characterized in that, The impedance of the first conductive element (22) is less than or equal to 1Ω.

4. The camera assembly (100) according to claim 3, characterized in that, The impedance between the first conductive element (22) and the first camera module (1) is less than or equal to 5Ω.

5. The camera assembly (100) according to any one of claims 1 to 4, characterized in that, The body layer (211) includes a protrusion (211a), which protrudes from the second region (2118). And / or, the body layer (211) includes a recessed region (211b) located in the second region (2118).

6. The camera assembly (100) according to claim 5, characterized in that, The first conductive element (22) is a spring, a plating layer, a laser engraving layer, or a coating.

7. The camera assembly (100) according to claim 6, characterized in that, The first conductive element (22) is a spring; The first conductive element (22) is fixedly connected to the first body element (21) by welding, and / or, one of the first body element (21) and the first conductive element (22) is provided with a positioning post (215), and the other is provided with a positioning hole (229), at least a portion of the positioning post (215) is located in the positioning hole (229).

8. The camera assembly (100) according to claim 7, characterized in that, The first conductive element (22) includes a first part (224) and a second part (225). The second part (225) is bent and connected to the first part (224). The first part (224) is fixedly connected to the first body part (21) and electrically connected to the first body part (21). The second part (225) is electrically connected to the ground terminal (14) of the first camera module (1).

9. The camera assembly (100) according to claim 8, characterized in that, The first conductive element (22) includes a first conductive element body (221), a first plating layer (222) and a second plating layer (223). The first plating layer (222) is fixedly connected to the first conductive element body (221), and the second plating layer (223) is fixedly connected to the side of the first plating layer (222) away from the first conductive element body (221). The first coating (222) has a stronger reducing power than the second coating (223).

10. The camera assembly (100) according to claim 9, characterized in that, The first conductive element (22) includes a protrusion (226) that protrudes from the first conductive element body (221) of the second part (225); and / or, the first conductive element (22) includes a recessed area (227) that is located in the first conductive element body (221) of the second part (225).

11. The camera assembly (100) according to claim 6, characterized in that, The first conductive element (22) is a plating layer; The first conductive element (22) includes a first plating layer (222), which is fixedly connected to the first body element (21). The impedance of the first plating layer (222) is less than the impedance of the anti-oxidation layer (212).

12. The camera assembly (100) according to claim 10, characterized in that, The first conductive element (22) further includes a second plating layer (223), which is fixedly connected to the side of the first plating layer (222) away from the first body element (21). The first plating layer (222) has a stronger reducing power than the second plating layer (223).

13. The camera assembly (100) according to claim 12, characterized in that, The material of the first plating layer (222) includes nickel, chromium or zinc; and / or, the material of the second plating layer (223) includes gold.

14. The camera assembly (100) according to claim 6, characterized in that, The first conductive element (22) is a laser-etched layer, and the surface density P of the first conductive element (22) satisfies: P≥95%.

15. The camera assembly (100) according to claim 6, characterized in that, The first conductive element (22) is a coating; The second region (2118) protrudes toward the grounding terminal (14) of the first camera module (1) relative to the first region (2117), and the second region (2118) is disposed opposite to the grounding terminal (14) of the first camera module (1).

16. The camera assembly (100) according to any one of claims 7 to 15, characterized in that, The camera assembly (100) further includes a first silver paste (3), which is fixedly connected to the grounding terminal (14) of the first conductive element (22) and the first camera module (1). The first conductive element (22) is electrically connected to the grounding terminal (14) of the first camera module (1) through the first silver paste (3).

17. The camera assembly (100) according to claim 16, characterized in that, The body layer (211) further includes a third region (2119), which is spaced apart from the second region (2118); The first camera bracket (2) also includes an electrical connector (23), the impedance of which is less than that of the anti-oxidation layer (212), the electrical connector (23) is fixedly connected to the third region (2119), and the electrical connector (23) is electrically connected to the body layer (211).

18. An electronic device (1000), characterized in that, The device includes a housing (200) and a camera assembly (100) as claimed in any one of claims 1 to 16, the camera assembly (100) being fixedly connected to the housing (200), and the first camera bracket (2) being electrically connected to the housing (200) to ground the grounding terminal (14) of the first camera module (1).

19. The electronic device (1000) according to claim 18, characterized in that, The body layer (211) further includes a third region (2119), which is spaced apart from the second region (2118); The first camera bracket (2) also includes an electrical connector (23), the impedance of which is less than that of the anti-oxidation layer (212), the electrical connector (23) is fixedly connected to the third region (2119), and the electrical connector (23) is electrically connected to the body layer (211).

20. The electronic device (1000) according to claim 19, characterized in that, The electronic device (1000) further includes a spring (400), which is fixedly connected between the electrical connector (23) and the housing (200), and the spring (400) is also electrically connected between the electrical connector (23) and the housing (200).

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