Dustproof flow guide cavity structure of side-in sound silicon microphone

By setting a sound-receiving hole, mounting base and diaphragm in the dustproof and sound-receiving cavity structure of the side-entry silicon microphone, combined with a dust cover and rubber gasket, better dustproof and sound-receiving effects are achieved, solving the problem of insufficient dustproof and sound-receiving effects in the existing technology.

CN224305884UActive Publication Date: 2026-05-29聆麦声学(深圳)技术有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
聆麦声学(深圳)技术有限公司
Filing Date
2025-07-18
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing side-entry silicon microphones are inadequate in terms of dust protection and sound pickup, and need further improvement.

Method used

In the dustproof and sound-guiding cavity structure of the side-entry silicon microphone, a sound-receiving hole is set on the dust cover, and a support base and a diaphragm are installed on the mounting base. Combined with the dust cover and rubber gasket, resonance operation is achieved to improve the dustproof effect and sound transmission efficiency.

Benefits of technology

It effectively improves the dustproof effect and sound pickup clarity of the side-entry silicon microphone, enhancing its practicality.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224305884U_ABST
    Figure CN224305884U_ABST
Patent Text Reader

Abstract

The utility model discloses a side sound silicon microphone dustproof flow guide cavity structure relates to side sound silicon microphone technical field, aims at solving the problem that the side sound silicon microphone of existing further improves dustproof effect and improves the sound collection effect and all have to be further improved, and its technical scheme main points include circuit board, the dustproof cover is glued on the one side surface of circuit board, the dustproof cover one side surface is provided with the sound hole, the inside installation of sound hole has the mounting seat, the one end of mounting seat has the support seat and inserts buckle, the end face of support seat is glued with second diaphragm through the glue, the outer surface of circuit board is provided with micro motor system and ASIC chip, micro motor system and ASIC chip pass through a plurality of gold wire electric connection, the symmetry side surface of mounting seat all is provided with an installation hole. Reach the effect that can further improve dustproof effect, can improve the sound collection definition and effect simultaneously, and the practicality is strong.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of side-entry silicon microphone technology, and in particular to the dustproof and airflow guiding cavity structure of side-entry silicon microphone. Background Technology

[0002] Side-entry silicon microphones are a type of microphone based on MEMS (Micro-Electro-Mechanical Systems) technology. Their core feature is that sound enters the microphone's pickup area from the side. They are widely used in consumer electronics, smart homes, and other fields. In the composition of a side-entry silicon microphone, the dustproof and airflow-guiding cavity structure is one of the main dustproof components.

[0003] The existing side-entry silicon microphones need further improvement in terms of dust protection and sound pickup. Utility Model Content

[0004] The purpose of this invention is to provide a side-entry silicon microphone dustproof and airflow guiding cavity structure that can further improve the dustproof effect, while also improving the clarity and effect of sound reception, making it highly practical.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] The side-entry silicon microphone dustproof and airflow guiding cavity structure includes a circuit board. A dustproof cover is adhered to one outer surface of the circuit board. A sound receiving hole is provided on one outer surface of the dustproof cover. A mounting base is installed inside the sound receiving hole. A support base is inserted and snapped into one end of the mounting base. A second diaphragm is adhered to the end face of the support base by adhesive.

[0007] By adopting the above technical solution, dustproof operation can be performed while also performing a single resonance operation, which improves the sound propagation and enhances the sound clarity and effect of the side-entry silicon microphone.

[0008] Furthermore, a micro-motor system and an ASIC chip are disposed on the outer surface of the circuit board, and the micro-motor system and the ASIC chip are electrically connected by multiple gold wires.

[0009] By adopting the above technical solution, the side-entry silicon microphone can operate normally.

[0010] Furthermore, each of the symmetrical side surfaces of the mounting base is provided with a mounting hole, and a first vibrating diaphragm is adhered to the port of each mounting hole.

[0011] By adopting the above technical solution, single-resonance operation can be achieved.

[0012] Furthermore, a dust cover is fixedly connected to the end face of the mounting base, and the outer surface of the dust cover is provided with multiple through holes, and the dust cover is arc-shaped.

[0013] By adopting the above technical solutions, effective dust prevention operations can be carried out.

[0014] Furthermore, a rubber gasket is fitted onto the outside of the mounting base, and an adhesive layer is provided on both symmetrical sides of the rubber gasket.

[0015] By adopting the above technical solution, it is easy to install and fix the mounting base.

[0016] Furthermore, one end of the support base is provided with a locking position, and notches are provided on both symmetrical sides of the support base.

[0017] By adopting the above technical solution, sound propagation is facilitated.

[0018] In summary, the beneficial technical effects of this utility model are as follows:

[0019] 1. This utility model provides a sound-receiving hole on the side surface of the dust cover. During normal use, the sound can be received through the sound-receiving hole on the side. In this process, the sound-receiving hole on the side can reduce the chance of dust entering the dust cover, thereby improving the dustproof effect of the entire side-entry silicon microphone.

[0020] 2. This utility model involves installing a mounting base inside the microphone hole, installing a support base at the port of the mounting base, attaching a second diaphragm to the end face of the support base, and attaching a first diaphragm to each of the symmetrical side surfaces of the mounting base. A dust cover is fixedly installed at the port of the mounting base. The dust cover can be used for dust prevention. At the same time, when sound is transmitted into the interior of the dust cover, it can effectively cause the first and second diaphragms to resonate. This can effectively improve the sound transmission efficiency and the sound reception effect of the side-entry silicon microphone, thus significantly improving its practicality. Attached Figure Description

[0021] Figure 1 This is a first-view perspective view of the three-dimensional structure of this utility model;

[0022] Figure 2 This is a second perspective view of the three-dimensional structure of this utility model.

[0023] In the diagram: 1. Circuit board; 2. Micro-motor system; 3. ASIC chip; 4. Dust cover; 5. Microphone hole; 6. Mounting base; 7. Rubber gasket; 8. Dust cover; 9. First diaphragm; 10. Support base; 11. Second diaphragm. Detailed Implementation

[0024] The method of this utility model will be further described in detail below with reference to the accompanying drawings.

[0025] Reference Figure 1 , Figure 2The side-entry silicon microphone dustproof and airflow guiding cavity structure includes a circuit board 1. A dust cover 4 is attached to one outer surface of the circuit board 1. A sound receiving hole 5 is provided on one outer surface of the dust cover 4. A micro-motor system 2 and an ASIC chip 3 are provided on the outer surface of the circuit board 1. The micro-motor system 2 and the ASIC chip 3 are electrically connected by multiple gold wires. By providing a sound receiving hole 5 on the side surface of the dust cover 4, sound can be received through the side sound receiving hole 5 during normal use. In this process, the side sound receiving hole 5 can reduce the probability of dust entering the interior of the dust cover 4, thereby improving the dustproof effect of the entire side-entry silicon microphone.

[0026] Reference Figure 1 The receiver hole 5 has a mounting base 6 installed inside. A support base 10 is inserted and clipped into one end of the mounting base 6. A second diaphragm 11 is glued to the end face of the support base 10. Each of the symmetrical side surfaces of the mounting base 6 has a mounting hole, and a first diaphragm 9 is glued to the port of each mounting hole. A dust cover 8 is fixedly connected to the end face of the mounting base 6. The outer surface of the dust cover 8 has multiple through holes and is arc-shaped. A rubber gasket 7 is fitted onto the outside of the mounting base 6. Adhesive layers are applied to both symmetrical side surfaces of the rubber gasket 7. One end of the support base 10 has a locking position. The symmetrical side surfaces of the support base 10... All are provided with notches and slots. A mounting base 6 is installed inside the sound-receiving hole 5, a support base 10 is installed at the port of the mounting base 6, a second diaphragm 11 is attached to the end face of the support base 10, and a first diaphragm 9 is attached to the symmetrical side surface of the mounting base 6. A dust cover 8 is fixedly installed at the port of the mounting base 6. At this time, the dust cover 8 can be used for dust prevention. At the same time, when the sound is transmitted into the interior of the dust cover 4, it can effectively cause the first diaphragm 9 and the second diaphragm 11 to resonate. This can effectively improve the sound transmission efficiency, improve the sound reception effect of the side-entry silicon microphone, and effectively improve its practicality.

[0027] Working principle: In use, first assemble the various structures, and then install the assembled side-entry silicon microphone in the designated position. Normal use is then possible. During this process, the side sound-receiving hole 5 reduces the chance of dust entering the dust cover 4, thus improving the overall dustproof effect of the side-entry silicon microphone. Simultaneously, by installing a mounting base 6 inside the sound-receiving hole 5, and a support base 10 at the port of the mounting base 6, a second diaphragm 11 is attached to the end face of the support base 10. A first diaphragm 9 is attached to the symmetrical side surface of the mounting base 6. A dust cover 8 is fixedly installed at the port of the mounting base 6. Dust protection is achieved using the dust cover 8. Simultaneously, when sound is transmitted into the dust cover 4, it effectively induces resonance between the first diaphragm 9 and the second diaphragm 11. This effectively improves sound transmission efficiency and the sound reception effect of the side-entry silicon microphone, significantly enhancing its practicality.

[0028] The embodiments described herein are preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape, and principle of this utility model should be included within the scope of protection of this utility model.

Claims

1. A side-entry silicon microphone dustproof and airflow guiding cavity structure, including a circuit board (1), characterized in that: A dust cover (4) is attached to one side of the outer surface of the circuit board (1). A sound-receiving hole (5) is provided on one side of the outer surface of the dust cover (4). A mounting base (6) is installed inside the sound-receiving hole (5). A support base (10) is inserted and snapped into one end of the mounting base (6). A second diaphragm (11) is attached to the end face of the support base (10) by adhesive.

2. The side-entry silicon microphone dustproof and airflow guiding cavity structure according to claim 1, characterized in that: The circuit board (1) has a micro motor system (2) and an ASIC chip (3) on its outer surface, and the micro motor system (2) and the ASIC chip (3) are electrically connected by multiple gold wires.

3. The side-entry silicon microphone dustproof and airflow guiding cavity structure according to claim 1, characterized in that: Each of the symmetrical side surfaces of the mounting base (6) is provided with a mounting hole, and a first vibrating diaphragm (9) is attached to the port of each mounting hole.

4. The side-entry silicon microphone dustproof and airflow guiding cavity structure according to claim 1, characterized in that: A dust cover (8) is fixedly connected to the end face of the mounting base (6). The outer surface of the dust cover (8) is provided with multiple through holes, and the dust cover (8) is arc-shaped.

5. The side-entry silicon microphone dustproof and airflow guiding cavity structure according to claim 1, characterized in that: The mounting base (6) is fitted with a rubber gasket (7), and adhesive layers are provided on both symmetrical sides of the rubber gasket (7).

6. The side-entry silicon microphone dustproof and airflow guiding cavity structure according to claim 1, characterized in that: One end of the support base (10) is provided with a locking position, and notches are provided on both symmetrical sides of the support base (10).