Process device for the integral molding of headphones

Abstract

The utility model discloses a headset integrated process device, including mutually engaging upper subassembly and lower subassembly, wherein, the upper subassembly and lower subassembly between being equipped with the cavity of placing metal wire cooperation, lower subassembly includes lower mould seat and with the first bottom plate of lower mould seat fixed connection, wherein, the cavity is equipped with on lower mould seat, and the first magnetic attraction pressure block of metal wire head is arranged to one end of cavity, and the other end is provided with the glue sealing limiting block, the fixed limiting block of fixed metal wire is equipped with outside the cavity of lower mould seat, the upper subassembly includes upper mould seat and with the second bottom plate of upper mould seat fixed connection, wherein, the cavity is equipped with on upper mould seat, and the second magnetic attraction pressure block of cavity one end is arranged with first magnetic attraction pressure block cooperation, and the other end is provided with the glue sealing limiting block, and the middle part of second bottom plate is provided with the runner of communicating with the flow passage between upper mould seat and lower mould seat's gate. The utility model effectively promotes the yield of metal wire integrated in headset.

Description

Technical Field

[0001] This utility model relates to the field of headphone processing technology, and in particular to a process device for integral molding of over-ear headphones. Background Technology

[0002] In today's society, the most popular headphones on the market are mainly over-ear headphones and in-ear headphones. In-ear headphones are known for their lightweight and convenient features, making them suitable for carrying around, but their sound quality is often less than ideal due to their smaller driver size. Furthermore, their small size makes them easy to lose. In contrast, over-ear headphones have a significant advantage in sound quality and are less likely to be lost. However, traditional over-ear headphones are usually assembled with plastic shells, resulting in a larger overall size and heavier weight. With prolonged use, headphones with this assembled structure may also experience quality issues such as cracking.

[0003] Recently, a new type of slim and portable sports headphone has appeared on the market. This headphone uses an internal metal wire and partially molded rubber coating, with the rubber coating wall made as thin as possible. However, due to the thin rubber wall, the metal wire must be securely fixed within the molding device; otherwise, if the wire shifts, it may become exposed, affecting the overall appearance. At the same time, to prevent sweat from corroding the exposed metal wire, the surface of the wire is usually painted or electrophoretically treated. However, when the wire is placed in the molding device, the paint on the surface in contact with the metal device is easily scratched off, further affecting the appearance.

[0004] Therefore, the one-piece molding process for the metal wires in this type of sports headphones is currently quite difficult, resulting in a high product defect rate. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model proposes a manufacturing process device for integral molding of headphones.

[0006] To achieve the above-mentioned invention objectives, the present invention provides a one-piece molding process device for headphones, which includes an upper component and a lower component that are interlocked with each other, wherein a cavity for placing metal wires is provided between the upper component and the lower component.

[0007] The lower component includes a lower mold base and a first base plate fixedly connected to the lower mold base; wherein, the lower mold base is provided with the cavity, and one end of the cavity is provided with a first magnetic suction block for fixing the head of the metal wire, and the other end is provided with a sealing limit block; a fixing limit block for fixing the metal wire is provided outside the cavity of the lower mold base;

[0008] The upper component includes an upper mold base and a second base plate fixedly connected to the upper mold base; wherein, the upper mold base is provided with the cavity, and one end of the cavity is provided with a second magnetic suction block that cooperates with the first magnetic suction block, and the other end is provided with a sealing limit block; the middle part of the second base plate is provided with a gate that communicates with the flow channel between the upper mold base and the lower mold base.

[0009] Furthermore, the lower mold base is provided with a positioning pin, and the upper mold base is provided with a positioning hole that matches the positioning pin.

[0010] Furthermore, the first magnetic pressure block and the lower mold base are detachably connected.

[0011] Furthermore, the first magnetic pressing block and the second magnetic pressing block are positioned by means of a positioning hole and a positioning pin.

[0012] Furthermore, the fixing limit blocks are, in sequence along the direction of the metal wire, a first fixing limit block for fixing the straight section of the metal wire and a second fixing limit block for fixing the arc section of the metal wire.

[0013] Furthermore, a pre-compression limiting block is provided outside the cavity of the lower mold base, and a spring pressure block that cooperates with the pre-compression limiting block is provided on the upper mold base.

[0014] Furthermore, the lower die holder is also provided with a correction limiting block near the tail end of the metal wire.

[0015] Furthermore, an ejector plate is provided at the bottom of the lower mold base.

[0016] This invention has the advantages of simple operation and good molding effect. The magnetic pressure block can prevent the steel wire from shaking, and the fixed limiting block designed in the key parts can prevent the device from scratching the steel wire. It improves the yield of the one-piece molding of metal wire in headphones, reduces unnecessary economic losses for users and improves the aesthetics of the one-piece molding of metal wire in headphones. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a manufacturing process apparatus for integral molding of a headset according to an embodiment of the present invention;

[0018] Figure 2 This is a perspective view of the lower component according to an embodiment of the present utility model;

[0019] Figure 3 This is a schematic diagram of the lower component according to an embodiment of the present invention.

[0020] Figure 4 for Figure 3 A schematic diagram illustrating the method for positioning A in the middle;

[0021] Figure 5 This is a perspective view of the upper component in one embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of the upper component in one embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of a magnetic pressure block in one embodiment of the present invention. Detailed Implementation

[0024] The following, in conjunction with the accompanying drawings and preferred embodiments of the present invention, further illustrates the technical means adopted by the present invention to achieve its intended purpose.

[0025] like Figure 1 As shown in the figure, the device for integral molding of headphones provided in this embodiment of the present invention includes a lower component 1 and an upper component 2. The lower component 1 and the upper component 2 are engaged with each other, and a cavity 30 is provided between the upper component 2 and the lower component 1. The cavity 30 is used to place a metal wire so that the metal wire can be injection molded to form a rubber-coated wall on the outer layer of the metal wire.

[0026] See Figures 2 to 4 The lower component 1 includes a lower mold base 11 and a first base plate 12. The lower mold base 11 is fixedly connected to the first base plate 12. The top of the lower mold base 11 is provided with a plurality of positioning posts 111 for connection with the upper component 2. The lower mold base 11 is provided with two symmetrical cavities 30, which correspond to the injection molding of the metal wires of the left and right ears, respectively.

[0027] Combination Figure 1 , Figure 3 and Figure 7 Each of the two cavities 30 has a first groove 112 at one end for accommodating a first magnetic clamping block 31. The first magnetic clamping block 31 is used to fix the head of the metal wire in the cavity 30. The first magnetic clamping block 31 is detachably connected to the lower mold base 11. Specifically, combined with Figure 3 and Figure 7 The bottom of the first magnetic suction block 31 is provided with a foolproof groove 311. The foolproof groove 311 cooperates with the foolproof protrusion 122 provided on the lower mold base 11 to achieve the above-mentioned detachable connection. The top of the first magnetic suction block 31 is provided with a groove 312, and also with two positioning pins 313. The two positioning pins 313 are used for connection with the upper mold base 21, as detailed below.

[0028] See Figure 3 and Figure 4A sealing and limiting block 115 is provided at the other end of each of the two cavities 30. The sealing and limiting block 115 is used to press the metal wire to prevent the molding material from overflowing. A lower flow channel 116 is provided between the sealing and limiting block 115 and the cavity 30, which cooperates with the upper flow channel 211 of the upper component 2.

[0029] For the metal wire outside the cavity 30 that does not require adhesive coating, the lower mold base 11 is provided with a fixing limit block to prevent the metal wire from shifting and leaking out. Specifically, along the direction of the metal wire, the lower mold base 11 is sequentially provided with a first fixing limit block 117 and a second fixing limit block 118. The first fixing limit block 117 is located near the adhesive sealing limit block 115 and is used to fix the straight area of ​​the metal wire. The first fixing limit block 117 is higher than the plane of the lower mold base 11. The second fixing limit block 118 is used to fix the arc area of ​​the metal wire, and the second fixing limit block 118 is also higher than the plane of the lower mold base 11. A pre-compression limit block 119 is arranged adjacent to the first fixing limit block 117.

[0030] Furthermore, along the direction of the metal wire, the lower component 1 is also provided with a correction limiting block 120. This correction limiting block 120 is independent of the lower mold base 11, and its surface is a groove for accommodating the metal wire rather than fixing it. Since the correction limiting block 120 is rotatable, it is used to correct the metal wire and prevent it from being over-positioned.

[0031] Further, see Figure 1 The lower mold base 11 has an ejector plate 13 at its bottom interior, and ejector pins are mounted on the ejector plate 13. For example... Figure 3 As shown, the ejector pins are located on both sides of the anti-fooling protrusion 122, that is, the through holes 121 in the lower mold base 11 allow the ejector pins to pass through. The first magnetic suction block 31 is placed at the position of the ejector pin. After the metal wire is injected with glue, the ejector plate 13 can push the first magnetic suction block 31 and the metal wire out of the lower mold base 11 together.

[0032] See Figures 5 to 6 The upper component 2 includes an upper mold base 21 and a second base plate 22 fixedly connected to the upper mold base 21. A gate 221 is provided in the middle of the second base plate 22, and an upper runner 211 communicating with the gate 221 is provided on the upper mold base 21. A positioning hole 212 is provided on the upper mold base 21, which mates with a positioning pin 111 of the lower mold base 11. Assembly of the lower component 1 and the upper component 2 can be achieved by inserting the positioning pin 111 of the lower mold base 11 into the positioning hole 212 of the upper mold base 21.

[0033] The upper mold base 21 is provided with a cavity 30, and one end of the cavity 30 is provided with a second groove 213 for accommodating a second magnetic suction block 32 that cooperates with the first magnetic suction block 31. Figure 7The second magnetic pressing block 32 has two positioning holes 321, which cooperate with the positioning pins 313 of the first magnetic pressing block 31 to achieve accurate positioning of the magnetic pressing block. The second magnetic pressing block 32 has a groove 322 that matches the groove 312 of the first magnetic pressing block 31, which is used to place and hold the protective shell of the wire end and fix the head of the wire. The other end of the cavity 30 is also provided with a sealing limit block 115.

[0034] Furthermore, such as Figure 6 As shown, the upper mold base 21 is also provided with a first fixing groove 214 that cooperates with the first fixing limiting block 117 of the lower mold base 11, and a second fixing groove 215 that cooperates with the second fixing limiting block 118. When the upper mold base 21 and the lower mold base 11 are closed, the first fixing limiting block 117 and the second fixing limiting block 118 are respectively accommodated in the first fixing groove 214 and the second fixing groove 215.

[0035] The upper mold base 21 is provided with a spring pressure block 216, which is arranged adjacent to the first fixing groove 214. When the lower mold base 11 contacts the upper mold base 21, the spring pressure block 216 can fix the steel wire on the pre-pressing limit block 119 of the lower mold base 11 in advance to prevent the metal wire from shifting due to vibration when the lower mold base 11 contacts the upper mold base 21.

[0036] In using this invention, the upper mold base 21 corresponds to the lower mold base 11. When the lower mold base 11 contacts the upper mold base 21, a cavity 30 is formed. The adhesive material enters through the gate 221, passes through the cavity created by the assembly of the upper runner 211 and the lower runner 116, and enters the cavity 30, thereby coating and molding the metal wire. After injection molding is completed, an ejector plate 13 is installed on the bottom inner side of the lower mold base 11. After the metal wire is formed, the first magnetic suction block 31, along with the product, can be ejected from the cavity 30, completing the product manufacturing process.

[0037] In summary, this invention, through the setting of magnetic and spring pressure blocks, can prevent the steel wire from shaking. The fixed limiting blocks designed in key parts can also prevent the device from scratching the steel wire, improve the yield of the one-piece molding of metal wire in headphones, reduce unnecessary economic losses for users, and improve the aesthetics of the one-piece molding of metal wire in headphones. In addition, this device has the advantages of simple operation and good molding effect.

[0038] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model's technical solution. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the content of the present utility model's technical solution shall still fall within the scope of the present utility model's technical solution.

Claims

1. A manufacturing process apparatus for integral molding of over-ear headphones, characterized in that, It includes an upper component and a lower component that interlock with each other, wherein a cavity for placing a metal wire is provided between the upper component and the lower component; The lower component includes a lower mold base and a first base plate fixedly connected to the lower mold base; wherein, the lower mold base is provided with the cavity, and one end of the cavity is provided with a first magnetic suction block for fixing the head of the metal wire, and the other end is provided with a sealing limit block; a fixing limit block for fixing the metal wire is provided outside the cavity of the lower mold base; The upper component includes an upper mold base and a second base plate fixedly connected to the upper mold base; wherein, the upper mold base is provided with the cavity, and one end of the cavity is provided with a second magnetic suction block that cooperates with the first magnetic suction block, and the other end is provided with a sealing limit block; the middle part of the second base plate is provided with a gate that communicates with the flow channel between the upper mold base and the lower mold base.

2. The manufacturing process apparatus for integral molding of headphones according to claim 1, characterized in that, The lower mold base is provided with a positioning pin, and the upper mold base is provided with a positioning hole that matches the positioning pin.

3. The manufacturing process apparatus for integral molding of headphones according to claim 1, characterized in that, The first magnetic pressure block and the lower mold base are detachably connected.

4. The manufacturing process apparatus for integral molding of over-ear headphones according to claim 3, characterized in that, The first magnetic pressure block and the second magnetic pressure block are positioned by means of positioning holes and positioning pins.

5. The manufacturing apparatus for integral molding of headphones according to claim 1, characterized in that, The fixed limiting blocks are, in sequence along the direction of the metal wire, a first fixed limiting block for fixing the straight section of the metal wire and a second fixed limiting block for fixing the arc section of the metal wire.

6. The manufacturing apparatus for integral molding of headphones according to claim 1, characterized in that, A pre-compression limiting block is also provided outside the cavity of the lower mold base, and a spring pressure block that cooperates with the pre-compression limiting block is provided on the upper mold base.

7. The manufacturing apparatus for integral molding of headphones according to claim 1, characterized in that, The lower die holder is also provided with a correction limiting block near the tail end of the metal wire.

8. The manufacturing process apparatus for integral molding of over-ear headphones according to claim 1, characterized in that, An ejector plate is provided at the bottom of the lower mold base.

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