Acoustic sensor and electronic device

Abstract

The embodiments of the present disclosure disclose an acoustic sensor and an electronic device, the acoustic sensor comprises a substrate, a microphone chip, a first ASIC chip, a shell and a waterproof part, the substrate is provided with an opening; the microphone chip is arranged on the substrate, the microphone chip has a back cavity, the back cavity is opposite to the opening, and the first ASIC chip is electrically connected with the microphone chip; the shell is connected to the first side of the substrate and at least covers the microphone chip; the waterproof part is connected to the second side of the substrate and surrounds the first cavity with the second side of the substrate, and the first cavity communicates with the back cavity through the opening. In this way, by arranging the waterproof part on the second side of the substrate and surrounding the first cavity with the substrate, the first cavity communicates with the back cavity of the microphone chip through the opening on the substrate, and the waterproof part can effectively block the moisture from entering the core area inside the acoustic sensor.

Description

Technical Field

[0001] This utility model relates to the field of microelectromechanical technology, and more specifically, to an acoustic sensor and electronic device. Background Technology

[0002] With the continuous development of electronic technology, acoustic sensors have been widely used in various fields. However, in many practical applications, acoustic sensors need to have a certain degree of waterproof performance to prevent moisture from entering the sensor and causing performance degradation or damage. Existing acoustic sensors have shortcomings in waterproof design, making it difficult to meet the needs of use in complex environments. Utility Model Content

[0003] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a new technical solution for acoustic sensors and electronic devices.

[0004] According to one aspect of the present invention, an acoustic sensor is provided.

[0005] The acoustic sensor includes:

[0006] A substrate having an opening;

[0007] A microphone chip and a first ASIC chip, wherein the microphone chip is disposed on the substrate, the microphone chip has a back cavity opposite to the opening, and the first ASIC chip is electrically connected to the microphone chip;

[0008] A housing, the housing being connected to a first side of the substrate and at least covering the microphone chip;

[0009] A waterproof component is connected to a second side of the substrate and forms a first chamber with the second side of the substrate, the first chamber communicating with the back cavity through the opening.

[0010] Optionally, the height of the first chamber ranges from 10 micrometers to 50 micrometers.

[0011] Optionally, it also includes a connector, wherein the waterproof component is a waterproof and breathable membrane, one side of the connector is connected to the second side of the substrate, and the other side of the connector is connected to the waterproof and breathable membrane, such that the connector, the waterproof and breathable membrane, and the second side of the substrate together form the first chamber.

[0012] Optionally, the thickness of the waterproof and breathable membrane is less than the height of the first chamber.

[0013] Optionally, the substrate has a flat plate structure, and the second side and the first side are two opposite sides of the substrate;

[0014] Alternatively, the base has an L-shaped structure, with the second side and the first side being two opposite sides of the long side of the L-shaped structure;

[0015] Alternatively, the substrate may have a U-shaped structure, with the second side being the open side of the U-shaped structure.

[0016] Optionally, it may also include a protective element, which is at least connected to the side of the waterproof element away from the housing, and at least the protective element and the waterproof element form a second chamber.

[0017] Optionally, the protective element is connected to the waterproof element and the substrate, such that the protective element, the waterproof element, and the substrate together form the second chamber.

[0018] Optionally, along the height direction of the acoustic sensor, the protective member is not lower than the lowest end of the substrate.

[0019] Optionally, the protective element is flush with the lowest end of the substrate.

[0020] Optionally, it may also include pads disposed on the substrate.

[0021] Optionally, the system further includes a pressure sensing chip and a second ASIC chip, wherein the pressure sensing chip is disposed on the substrate and the second ASIC chip is electrically connected to the pressure sensing chip.

[0022] Optionally, the first ASIC chip and / or the second ASIC chip are disposed within the substrate.

[0023] According to another aspect of the present invention, an electronic device is provided, comprising the aforementioned acoustic sensor.

[0024] One technical advantage of the embodiments disclosed herein is that:

[0025] The acoustic sensor includes a substrate, a microphone chip, a first ASIC chip, a housing, and a waterproof component. The substrate has an opening. The microphone chip is disposed on the substrate and has a back cavity opposite to the opening. The first ASIC chip is electrically connected to the microphone chip. The housing is connected to a first side of the substrate and at least covers the microphone chip. The waterproof component is connected to a second side of the substrate and forms a first chamber with the second side of the substrate. The first chamber communicates with the back cavity through the opening.

[0026] Therefore, by placing a waterproof component on the second side of the substrate, forming a first chamber with the substrate, and connecting the first chamber to the back cavity of the microphone chip through an opening on the substrate, the waterproof component effectively prevents moisture from entering the core area inside the acoustic sensor. Furthermore, the connection between the waterproof component, the opening on the substrate, and the back cavity of the microphone chip forms a closed acoustic channel, ensuring sound transmission efficiency while providing the acoustic sensor with good waterproof capabilities, significantly improving its reliability in humid, rainy, or underwater environments. Moreover, the acoustic sensor assembly process is simple, facilitating consistency in mass production.

[0027] Other features and advantages of the present invention will become clear from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. Attached Figure Description

[0028] The accompanying drawings, which form part of this specification, illustrate embodiments of the present invention and, together with the specification, serve to explain the principles of the present invention.

[0029] Figure 1 This is a schematic diagram of an acoustic sensor according to an embodiment of the present disclosure;

[0030] Figure 2 This is a schematic diagram of another acoustic sensor according to an embodiment of the present disclosure;

[0031] Figure 3 This is a schematic diagram of another acoustic sensor according to an embodiment of the present disclosure.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Substrate; 11. Opening; 2. Microphone chip; 21. Back cavity; 3. First ASIC chip; 4. Housing; 5. Waterproof component; 51. First chamber; 6. Connector; 7. Protective component; 71. Second chamber; 8. Pressure sensor chip; 9. Second ASIC chip; 10. Solder pad. Detailed Implementation

[0034] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present invention.

[0035] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0036] Technologies and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such technologies and equipment should be considered part of the specification.

[0037] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0038] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0039] This utility model provides an acoustic sensor, which can be a MEMS microphone or a combined sensor.

[0040] like Figures 1 to 3 As shown, the acoustic sensor provided in this embodiment of the present invention includes:

[0041] Base 1, wherein the base 1 has an opening 11;

[0042] The microphone chip 2 and the first ASIC chip 3 are provided. The microphone chip 2 is disposed on the substrate 1. The microphone chip 2 has a back cavity 21, which is opposite to the opening 11. The first ASIC chip 3 is electrically connected to the microphone chip 2.

[0043] Housing 4, which is connected to the first side of the base 1 and at least covers the microphone chip 2;

[0044] Waterproof component 5 is connected to the second side of the base 1 and forms a first chamber 51 with the second side of the base 1. The first chamber 51 communicates with the back cavity 21 through the opening 11.

[0045] Specifically, substrate 1 can be an FPC (Flexible Printed Circuit Board) or a PCB (Printed Circuit Board). Substrate 1 can be made of silicon or other materials suitable for MEMS (Micro-Electro-Mechanical Systems) processes. Substrate 1 has sufficient mechanical strength to provide reliable support for the electronic components on it. An opening 11 can be created on substrate 1 using precision machining techniques such as laser drilling or wet etching. The opening 11 is used to establish the connection between the back cavity 21 of the microphone chip 2 and the first chamber 51. Depending on the actual design, the cross-section of the opening 11 can be circular, elliptical, rectangular, or other shapes.

[0046] like Figures 1 to 3As shown, the microphone chip 2 can be fixed to the substrate 1 by bonding, welding or other means, ensuring that the back cavity 21 of the microphone chip 2 is aligned and connected with the opening 11, thereby ensuring the acoustic performance of the microphone chip 2.

[0047] Furthermore, by opening an opening 11 on the substrate 1 and directly connecting it to the back cavity 21 of the microphone chip 2, the gas exchange and pressure balance within the back cavity 21 can be improved, reducing the impact of gas damping or pressure fluctuations on the performance of the microphone chip 2, and enabling the acoustic sensor to maintain high stability and reliability under complex environmental conditions.

[0048] The first ASIC chip 3 (Application Specific Integrated Circuit) can be set on the substrate 1, or a groove can be dug in the substrate 1 and the first ASIC chip 3 can be buried. The first ASIC chip 3 and the microphone chip 2 are connected by gold wire, solder balls and other means to form a signal connection so that the first ASIC chip 3 can process and amplify the electrical signal output by the microphone chip 2, thereby facilitating the subsequent circuit to identify and analyze it.

[0049] like Figures 1 to 3 As shown, the housing 4 can be made of materials such as metal, ceramic, or plastic, and has good sealing performance and mechanical strength. The housing 4 and the first side of the substrate 1 form a sealed cavity, and the microphone chip 2 is located in the sealed cavity, so that the housing 4 can protect the microphone chip 2 and other components and ensure that the microphone chip 2 can work normally.

[0050] like Figures 1 to 3 As shown, the waterproof component 5 is connected to the second side of the base 1, forming a first chamber 51 with the second side of the base 1. The first chamber 51 communicates with the back cavity 21 of the microphone chip 2 through the opening 11 on the base 1. The waterproof component 5 can be made of waterproof and breathable material, such as a waterproof and breathable membrane or a waterproof and breathable shell, to ensure that only sound can pass through and enter the first chamber 51 while moisture cannot enter. This protects the microphone chip 2 from moisture damage while ensuring its acoustic performance, preventing water stains from entering the acoustic sensor, thus ensuring the reliability of the acoustic sensor and extending its service life.

[0051] Therefore, by providing a waterproof component 5 on the second side of the substrate 1, forming a first chamber 51 with the substrate 1, and the first chamber 51 communicating with the back cavity 21 of the microphone chip 2 through the opening 11 on the substrate 1, the waterproof component 5 can effectively prevent moisture from entering the core area inside the acoustic sensor. Furthermore, the communication between the waterproof component 5, the opening 11 of the substrate 1, and the back cavity 21 of the microphone chip 2 forms a closed acoustic channel, ensuring sound transmission efficiency while giving the acoustic sensor good waterproof capabilities, significantly improving the reliability of the acoustic sensor in humid, rainy, or underwater environments. Moreover, the acoustic sensor assembly process is simple, facilitating consistency in mass production.

[0052] When an audio signal is transmitted to the acoustic sensor, the sound first passes through the waterproof component 5 and enters the first chamber 51. Then, it passes through the opening 11 on the substrate 1 and enters the back cavity 21 of the microphone chip 2, acting on the microphone chip 2. The microphone chip 2 can sense and convert the audio signal into an electrical signal, which is then output to the electrically connected first ASIC chip 3 for processing and amplification. Finally, the processed electrical signal is output to subsequent circuits for identification and analysis.

[0053] The back cavity 21 of the microphone chip 2 is directly opposite the opening 11 on the base 1. Together with the first chamber 51, it can form an unobstructed acoustic path, which also avoids the acoustic impedance changes that may be caused by traditional waterproof structures, effectively ensuring the fidelity of audio acquisition.

[0054] In addition, the connection between the housing 4 and the first side of the base 1 can also be designed with a waterproof seal, such as by setting a waterproof sealing ring or applying waterproof glue, which can also prevent moisture from entering the acoustic sensor from the connection between the two.

[0055] During the process of assembling the acoustic sensor into the electronic device, the waterproof component 5 needs to be embedded in the sound inlet hole of the electronic device housing so that the housing of the electronic device can cover part of the waterproof component 5 to seal the corresponding sound inlet channel, ensuring that the sound can only pass through the waterproof component 5 and the first chamber 51 from the sound inlet hole and enter the back cavity 21 of the microphone chip 2, thereby ensuring the uniqueness and certainty of the sound inlet direction.

[0056] like Figures 1 to 3 As shown, the first chamber 51 communicates with the back cavity 21 through the opening 11, so that the first chamber 51, the opening 11, and the back cavity 21 together form the front cavity of the microphone chip 2. The housing 4 is sealed to the first side of the substrate 1 and forms the rear cavity of the microphone chip 2. The size of the housing 4 can be adjusted as needed, thereby adjusting the size of the rear cavity of the microphone chip 2 to adjust the signal-to-noise ratio and the ability to pick up external signals of the microphone chip 2, and thus adjust the acoustic performance of the acoustic sensor.

[0057] Optionally, the height of the first chamber 51 ranges from 10 micrometers to 50 micrometers.

[0058] like Figures 1 to 3 As shown, there is a first gap between the waterproof component 5 and the substrate 1, and the height of the first gap is also the height of the first chamber 51. Controlling the height of the first gap, i.e. the height of the first chamber 51, ensures that under the action of sound, i.e., sound waves, the waterproof component 5 can agitate the surrounding air and generate vibration. This vibration creates a sound pressure difference between the inner and outer sides of the waterproof component 5, thereby driving the diaphragm of the microphone chip 2 to vibrate through the first chamber 51, the opening 11, and the back cavity 21 of the microphone chip 2, thus achieving reliable transmission and perception of sound signals. On the other hand, the height of the first chamber 51 can also affect the front cavity size of the microphone chip 2 formed by it, the opening 11, and the back cavity 21, which facilitates the optimization of the acoustic performance of the acoustic sensor.

[0059] Optionally, it also includes a connector 6, wherein the waterproof component 5 is a waterproof and breathable membrane, one side of the connector 6 is connected to the second side of the base 1, and the other side of the connector 6 is connected to the waterproof and breathable membrane, such that the connector 6, the waterproof and breathable membrane and the second side of the base 1 together form the first chamber 51.

[0060] like Figures 1 to 3 As shown, the waterproof component 5 can be configured as a waterproof and breathable membrane, allowing external sound signals or sound waves to pass through the membrane into the first chamber 51 and act on the microphone chip 2 through the opening 11. In this case, the connector 6 is used to connect the waterproof component 5 and the base 1 to secure the waterproof component 5.

[0061] The connector 6 can be an adhesive with sufficient thickness to attach the waterproof component 5 to the second side of the substrate 1, thereby reducing the assembly difficulty of the acoustic sensor.

[0062] The waterproof and breathable membrane can be made of polytetrafluoroethylene (PTFE), and the waterproof and breathable properties of PTFE can ensure the waterproof and breathable performance of the membrane.

[0063] Optionally, the thickness of the waterproof and breathable membrane is less than the height of the first chamber 51. That is, the waterproof and breathable membrane is not too thick. On the one hand, this avoids the difficulty in mobilizing the surrounding air to form a sound pressure difference, thus ensuring the acoustic performance of the acoustic sensor; on the other hand, it also avoids the overall thickness of the acoustic sensor from increasing due to the excessive thickness of the waterproof and breathable membrane, which facilitates the development of a thinner and lighter acoustic sensor.

[0064] Optionally, the waterproof component 5 can be configured as a waterproof and breathable shell, which can be bonded or welded to the second side of the base 1, so that the waterproof and breathable shell and the second side of the base 1 form a first chamber 51. In this case, there is no need to provide a connector 6, which can reduce assembly costs and assembly difficulty.

[0065] In one embodiment, the waterproof and breathable shell can be made of polytetrafluoroethylene (PTFE), and the waterproof and breathable properties of PTFE can ensure the waterproof and breathable performance of the shell.

[0066] In another embodiment, the waterproof and breathable shell may include a base layer and a conductive reinforcing layer embedded in the base layer. The base layer is a polytetrafluoroethylene layer, and the conductive reinforcing layer includes a conductive metal layer and / or a conductive material filling layer. This allows the conductive reinforcing layer to support the base layer and improve the overall strength of the waterproof and breathable shell, while also ensuring the conductivity of the waterproof and breathable shell by utilizing the conductive material in the conductive reinforcing layer, thus preventing abnormalities such as electrostatic damage.

[0067] The conductive metal layer can be made of stainless steel, iron, or other conductive metals. The conductive material filling layer includes a substrate and conductive filler filled in the substrate. Adding a certain proportion of conductive filler to a non-conductive substrate enables the conductive material filling layer to conduct electricity, thus giving it conductive properties. The substrate can be made of silicone, plastic, etc., and the conductive filler can be metal sheets, metal powder, metal fibers, etc.

[0068] Optionally, the substrate 1 has a flat plate structure, and the second side and the first side are two opposite sides of the substrate 1;

[0069] Alternatively, the base 1 has an L-shaped structure, with the second side and the first side being two opposite sides of the long side of the L-shaped structure;

[0070] Alternatively, the base 1 may have a U-shaped structure, with the second side being the opening side of the U-shaped structure.

[0071] like Figure 1 As shown, the substrate 1 can be a flat plate structure, and its molding process is simple and convenient. In this case, the second side and the first side are two opposite sides of the substrate 1, for example... Figure 1 The upper and lower sides of the housing 4 are sealed to the first side of the base 1, and the waterproof component 5 is sealed to the second side of the base 1, thereby forming a sealed acoustic sensor to ensure its sensing sensitivity.

[0072] like Figure 2 As shown, the base 1 can also have an L-shaped structure, with the second side and the first side being the two opposite sides of the long side of the L-shaped structure. That is, the first side is... Figure 2 The upper side of the long side of the middle base 1, while the second side is Figure 2The lower side of the long side of the base 1 can be used to facilitate the connection of the waterproof component 5, while the short side of the L-shaped structure can also protect and reinforce the connection between the waterproof component 5 and the base 1 on one side, thereby ensuring the structural reliability of the acoustic sensor.

[0073] like Figure 3 As shown, the base 1 can also have a U-shaped structure, with the second side being the opening side of the U-shaped structure, i.e. Figure 3 The lower middle side, the first side is the U-shaped sealing side, that is... Figure 3 On the upper middle side, the U-shaped structure of the open sidewall can be used to position and protect the connection of the waterproof component 5, thereby simplifying the assembly process and improving the connection reliability between the waterproof component 5 and the base 1, thus ensuring the structural reliability of the acoustic sensor.

[0074] Optionally, it also includes a protective member 7, which is at least connected to the side of the waterproof member 5 away from the housing 4, and at least the protective member 7 and the waterproof member 5 form a second chamber 71.

[0075] like Figures 1 to 3 As shown, the housing 4 is connected to the first side of the base 1 and forms a sealed chamber with the first side of the base 1. The protective member 7 is connected to the side of the waterproof member 5 away from the housing 4 and forms a second chamber 71 with the waterproof member 5. This allows the acoustic sensor to be sealed from both sides, providing a stable internal environment, preventing water stains, dust and other foreign objects from entering the acoustic sensor, and providing reliable protection for the electronic components inside the acoustic sensor, extending the service life of the acoustic sensor, and also protecting the microphone chip 2 from damage such as mechanical impact or chemical corrosion.

[0076] The protective component 7 and the waterproof component 5 form a second chamber 71, that is, there is a second gap between the protective component 7 and the waterproof component 5. The protective component 7 is not directly attached to the waterproof component 5, which can avoid the attachment of the protective component 7 from affecting the vibration of the waterproof component 5, thereby making it difficult for the microphone chip 2 to sense the sound signal.

[0077] The height of the second chamber 71 can be set to be the same as that of the first chamber 51, so as to form the same vibration space on both sides of the waterproof component 5, which can also simplify the production difficulty of the acoustic sensor.

[0078] Optionally, the protective component 7 is a protective mesh. The protective mesh can prevent water stains, dust and other foreign objects from entering the acoustic sensor, while also protecting the inner waterproof component 5, thereby reducing the risk of damage to the waterproof component 5 and ensuring the reliability of the waterproof performance of the acoustic sensor.

[0079] Optionally, the protective component 7 is connected to the waterproof component 5 and the base 1, such that the protective component 7, the waterproof component 5 and the base 1 together form the second chamber 71.

[0080] like Figure 1 As shown, the base 1 has a flat plate structure, and the protective component 7 can be connected to the side of the waterproof component 5 away from the base 1 through the connecting structure, thereby forming a sealed protection for the acoustic sensor from the bottom.

[0081] like Figure 2 As shown, the base 1 has an L-shaped structure. One side of the protective component 7 can be connected to the waterproof component 5 and the short side of the base 1 through a connecting structure, and the other side of the protective component 7 can be connected to the waterproof component 5 through a connecting structure. In this way, the protective component 7 can form a sealed protection for the acoustic sensor from the bottom, and the short side of the base 1 can also form a sealed protection for the connection of the protective component 7, thereby ensuring the structural reliability of the acoustic sensor.

[0082] Among them, the protective component 7 can be set to be flush with the lowest end of the short side of the base 1 of the L-shaped structure, which can improve the flatness of the acoustic sensor while ensuring the sealing effect.

[0083] like Figure 3 As shown, the base 1 has a U-shaped structure. One side of the protective component 7 can be connected to the waterproof component 5 and the inner side of the vertical section of the base 1 through a connecting structure. The other side of the protective component 7 can be connected to the waterproof component 5 and the inner side of the vertical section of the base 1 through a connecting structure. In this way, the protective component 7 can form a sealed protection for the acoustic sensor from the bottom, and the two vertical sections of the U-shaped base 1 can also form a sealed and protected connection between the protective component 7, thereby ensuring the structural reliability of the acoustic sensor.

[0084] Among them, the protective component 7 can be set to be flush with the lowest end of the vertical section of the U-shaped base 1, which can improve the flatness of the acoustic sensor while ensuring the sealing effect.

[0085] Optionally, along the height direction of the acoustic sensor, the protective member 7 is not lower than the lowest end of the substrate 1. That is, the protective member 7 is flush with or higher than the lowest end of the substrate 1, which can avoid the increase in the thickness of the acoustic sensor caused by the setting of the protective member 7.

[0086] Optionally, the protective component 7 is flush with the lowest end of the base 1, which can improve the flatness of the acoustic sensor while ensuring the sealing effect.

[0087] Optionally, it also includes pads 10 disposed on the substrate 1.

[0088] Specifically, the pads 10 are placed on the substrate 1 and electrically connected to the substrate 1 through welding, pressing, or conductive adhesive bonding, thus forming connection points for electrical connection between electronic components and the substrate 1. For the substrate 1 formed by the FPC board, during the assembly process within the electronic device housing, the substrate 1 can be wound around to the bottom and adhered to the housing, saving internal space in the electronic device, facilitating the installation and fixation of acoustic sensors, and improving assembly flexibility.

[0089] like Figure 1 As shown, the substrate 1 has a flat plate structure, and the pads 10 can be disposed on the first side of the substrate 1; as Figure 2 As shown, the substrate 1 has an L-shaped structure, and the pad 10 can be located on the first side of the substrate 1 or on the lower side of the short side of the L-shaped structure; as Figure 3 As shown, the substrate 1 has a U-shaped structure. The pads 10 can be placed on the first side of the substrate 1 or on the lower side of the vertical section of the U-shaped structure. The position of the pads 10 can be reasonably arranged according to actual needs, which facilitates the connection between the pads 10 and the external circuit, shortens the wiring length, and expands the adaptability of the acoustic sensor.

[0090] Optionally, the system further includes a pressure sensing chip 8 and a second ASIC chip 9, wherein the pressure sensing chip 8 is disposed on the substrate 1 and the second ASIC chip 9 is electrically connected to the pressure sensing chip 8.

[0091] like Figures 1 to 3 As shown, a second ASIC chip 9 (Application Specific Integrated Circuit) can be set on the substrate 1, or a groove can be dug in the substrate 1 and the second ASIC chip 9 can be buried. The second ASIC chip 9 and the pressure sensing chip 8 can be connected by gold wire, solder balls, etc., so that the second ASIC chip 9 can process and amplify the electrical signal output by the pressure sensing chip 8, thereby facilitating subsequent circuit identification and analysis.

[0092] Optionally, the first ASIC chip 3 and / or the second ASIC chip 9 are disposed within the substrate 1. That is, the first ASIC chip 3 and the second ASIC chip 9 can be embedded in a groove within the substrate 1 to reduce the overall thickness of the acoustic sensor, reduce the space occupied on the surface of the substrate 1, and facilitate its miniaturization and thinning.

[0093] This invention also provides an electronic device, including the aforementioned acoustic sensor. The electronic device includes, but is not limited to, mobile phones, tablets, and computers.

[0094] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0095] While specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. An acoustic sensor, characterized in that, include: A base (1) having an opening (11); A microphone chip (2) and a first ASIC chip (3) are provided on the substrate (1). The microphone chip (2) has a back cavity (21) opposite to the opening (11). The first ASIC chip (3) is electrically connected to the microphone chip (2). A housing (4) is connected to a first side of the substrate (1) and at least covers the microphone chip (2); A waterproof component (5) is connected to the second side of the base (1) and forms a first chamber (51) with the second side of the base (1). The first chamber (51) communicates with the back cavity (21) through the opening (11).

2. The acoustic sensor according to claim 1, characterized in that, The height of the first chamber (51) ranges from 10 micrometers to 50 micrometers.

3. The acoustic sensor according to claim 1, characterized in that, It also includes a connector (6), the waterproof component (5) is a waterproof and breathable membrane, one side of the connector (6) is connected to the second side of the base (1), and the other side of the connector (6) is connected to the waterproof and breathable membrane, so that the connector (6), the waterproof and breathable membrane and the second side of the base (1) together form the first chamber (51).

4. The acoustic sensor according to claim 3, characterized in that, The thickness of the waterproof and breathable membrane is less than the height of the first chamber (51).

5. The acoustic sensor according to claim 1, characterized in that, The substrate (1) has a flat plate structure, and the second side and the first side are two opposite sides of the substrate (1); Alternatively, the base (1) has an L-shaped structure, with the second side and the first side being two opposite sides of the long side of the L-shaped structure; Alternatively, the substrate (1) has a U-shaped structure, and the second side is the opening side of the U-shaped structure.

6. The acoustic sensor according to claim 5, characterized in that, It also includes a protective element (7), which is at least connected to the waterproof element (5) on the side away from the housing (4), and at least the protective element (7) and the waterproof element (5) form a second chamber (71).

7. The acoustic sensor according to claim 6, characterized in that, The protective component (7) is connected to the waterproof component (5) and the base (1) such that the protective component (7), the waterproof component (5) and the base (1) together form the second chamber (71).

8. The acoustic sensor according to claim 7, characterized in that, Along the height direction of the acoustic sensor, the protective member (7) is not lower than the lowest end of the substrate (1).

9. The acoustic sensor according to claim 8, characterized in that, The protective component (7) is flush with the lowest end of the base (1).

10. The acoustic sensor according to claim 1, characterized in that, It also includes pads (10) disposed on the substrate (1).

11. The acoustic sensor according to claim 1, characterized in that, It also includes a pressure sensing chip (8) and a second ASIC chip (9), wherein the pressure sensing chip (8) is disposed on the substrate (1) and the second ASIC chip (9) is electrically connected to the pressure sensing chip (8).

12. The acoustic sensor according to claim 11, characterized in that, The first ASIC chip (3) and / or the second ASIC chip (9) are disposed within the substrate (1).

13. An electronic device, characterized in that, Includes the acoustic sensor as described in any one of claims 1 to 12.

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