High heat dissipation multilayer HDI circuit board

Abstract

The utility model relates to multilayer HDI circuit board technical field, especially a high heat dissipation multilayer HDI circuit board, the utility model has the advantages of: through the circuit board mounting plate and a plurality of heat conduction fins and the heat absorption circuit board of the heat conduction silicone grease adhesion, and through a plurality of heat conduction fins greatly improve the heat dissipation area, then through the airflow of turbine fan input is fully entered the gap between two circuit board mounting plates, make the airflow fast cross a plurality of heat conduction fins and realize high -efficient heat dissipation, improve the heat dissipation effect, through the snap male head and the snap female head, can be the upper and lower two insulating isolation frames butt joint composition, make single -layer module can be stacked combination, realize multilayer combination, convenient installation and disassembly, convenient overhaul, through the inclined flow guide hole, can guide a part of airflow to export the outside of insulating isolation frame, thereby make a part of airflow flow through the top surface of circuit board, realize double -sided heat dissipation, improve the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of multilayer HDI circuit board technology, and in particular to a high heat dissipation multilayer HDI circuit board. Background Technology

[0002] With the continuous development of technology, high-density integrated circuit boards (HDI boards) are increasingly widely used in electronic devices. Due to the high density of electronic components on HDI boards, the heat generated also increases accordingly. If the heat cannot be dissipated in a timely and effective manner, the temperature of the circuit board will rise. In particular, the current multi-layer HDI boards, which are fixed by stacking multiple layers, cause heat accumulation between the circuit boards, making them more prone to overheating. Current multi-layer HDI boards still use traditional axial fans to blow air from one side of the multi-layer circuit boards, allowing airflow to enter the gaps between the circuit boards for heat dissipation. However, this heat dissipation structure can only contact the surface of the circuit board, resulting in insufficient heat dissipation area. Moreover, the air outlet cross-section of the axial fan is circular, which cannot fully flow into the gaps between the circuit boards, leading to a decrease in heat dissipation effect. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a high heat dissipation multilayer HDI circuit board, which effectively solves the deficiencies of the prior art.

[0004] The purpose of this utility model is achieved through the following technical solution: a high heat dissipation multilayer HDI circuit board, comprising a single-layer module, wherein the single-layer module comprises an insulating isolation frame, and circuit board mounting plates are fixedly connected to both sides of the inner side of the insulating isolation frame. Mounting nut posts are fixedly connected to the four corners of the outer sides of the two circuit board mounting plates. A circuit board is fixedly connected to the top of the mounting nut posts. Thermally conductive silicone grease is filled between the heat-generating part of the circuit board and the circuit board mounting plate. Several thermally conductive fins are fixedly connected to the facing sides of the two circuit board mounting plates. Ventilation slots are opened on both sides of the insulating isolation frame. The length direction of the several thermally conductive fins corresponds to the opening direction of the ventilation slots. A turbine fan is fixedly connected to one side of the insulating isolation frame. The output end of the turbine fan is connected to the ventilation slot on one side.

[0005] Preferably, from any of the above solutions, each of the four corners of one side of the insulating isolation frame is fixedly connected with a male snap fastener, and each of the four corners of the other side of the insulating isolation frame is fixedly connected with a female snap fastener. The four male snap fasteners correspond to the four female snap fasteners above and below, and the four male snap fasteners can be snapped and fixed to the four female snap fasteners above and below.

[0006] The technical effect achieved by adopting the above solution is that, through the male and female snap fasteners, two insulating isolation frames can be connected vertically to form a single-layer module that can be stacked vertically to achieve multi-layer combination, which facilitates installation, disassembly, and maintenance.

[0007] Preferably, in any of the above embodiments, inclined guide holes are provided on the edges of both sides of the insulating isolation frame near the turbine fan. The inclined guide holes are connected to the inner wall of the ventilation strip and the outside of the insulating isolation frame. The openings on both sides of the inclined guide holes correspond to the turbine fan and the circuit board, respectively. The width of the inclined guide holes is equal to the width of the ventilation strip.

[0008] The technical effect achieved by adopting the above solution is that, through the inclined guide hole, a part of the airflow can be guided out of the insulating isolation frame, so that a part of the airflow flows over the top surface of the circuit board, realizing double-sided heat dissipation and improving the heat dissipation effect.

[0009] Preferably, in any of the above schemes, the width of the vent strip is equal to the width of the circuit board mounting plate, and the vertical height of the inner wall of the vent strip is adapted to the distance between the two circuit board mounting plates.

[0010] The technical effect achieved by adopting the above solution is that the output airflow can be evenly distributed across the circuit board mounting plate, resulting in sufficient air cooling.

[0011] Preferably, in any of the above solutions, both the circuit board mounting plate and the plurality of heat-conducting fins are made of high thermal conductivity materials, and the distribution width of the plurality of heat-conducting fins is adapted to the width of the circuit board mounting plate.

[0012] The technical effect achieved by adopting the above solution is to maximize the heat dissipation area, so as to conduct heat evenly and improve the heat dissipation effect.

[0013] Preferably, in any of the above embodiments, the size of the turbine fan outlet is equal to the size of the ventilation strip outlet, and the vertical dimension of the turbine fan is between the end of the snap female head away from the insulating isolation frame and the end of the snap male head away from the insulating isolation frame.

[0014] The technical effect achieved by adopting the above solution is to prevent interference between the upper and lower turbine fans after the upper and lower insulating isolation frames are assembled.

[0015] The beneficial effects of this utility model are:

[0016] 1. This high heat dissipation multilayer HDI circuit board absorbs heat from the circuit board through the circuit board mounting plate, several heat-conducting fins, and the attached thermal grease. The heat dissipation area is greatly increased by the heat-conducting fins. Then, the airflow input by the turbine fan fully enters the gap between the two circuit board mounting plates, allowing the airflow to quickly pass through the heat-conducting fins to achieve efficient heat dissipation and improve the heat dissipation effect.

[0017] 2. This high heat dissipation multilayer HDI circuit board can be composed of two insulating isolation frames connected vertically through snap male and female snap connectors, allowing single-layer modules to be stacked and combined to achieve multilayer combination, which is convenient for installation, disassembly and maintenance.

[0018] 3. This high heat dissipation multilayer HDI circuit board, through the inclined airflow guide holes, can guide a part of the airflow outside the insulating isolation frame, so that a part of the airflow flows over the top surface of the circuit board, achieving double-sided heat dissipation and improving the heat dissipation effect. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the combined structure of this utility model;

[0020] Figure 2 This is a top view of the structure of this utility model;

[0021] Figure 3 This utility model Figure 2 Schematic diagram of the cross-sectional structure at point AA;

[0022] Figure 4 This utility model Figure 3 Enlarged schematic diagram of the structure at point B.

[0023] In the diagram: 1-Single-layer module, 101-Insulation frame, 102-Circuit board, 103-Male snap-on connector, 104-Female snap-on connector, 105-Turbine fan, 106-Circuit board mounting plate, 107-Heat-conducting fins, 108-Ventilation strip, 109-Mounting nut post, 110-Thermal grease, 111-Slanted guide hole. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.

[0025] like Figures 1 to 4As shown, a high heat dissipation multilayer HDI circuit board includes a single-layer module 1. The single-layer module 1 includes an insulating isolation frame 101. Circuit board mounting plates 106 are fixedly connected to both sides of the inner side of the insulating isolation frame 101. Mounting nut posts 109 are fixedly connected to the four corners of the outer side of the two circuit board mounting plates 106. Circuit board 102 is fixedly connected to the top of the mounting nut posts 109. Thermal conductive grease 110 is filled between the heat-generating part of the circuit board 102 and the circuit board mounting plate 106. Several thermally conductive fins 107 are fixedly connected to the facing sides of the two circuit board mounting plates 106. Ventilation slots 108 are opened on both sides of the insulating isolation frame 101. The length direction of the several thermally conductive fins 107 corresponds to the opening direction of the ventilation slots 108. A turbine fan 105 is fixedly connected to one side of the insulating isolation frame 101. The output end of the turbine fan 105 is connected to the ventilation slot 108 on one side.

[0026] As an optional technical solution of this utility model: each of the four corners of one side of the insulating isolation frame 101 is fixedly connected with a male snap fastener 103, and each of the four corners of the other side of the insulating isolation frame 101 is fixedly connected with a female snap fastener 104. The four male snap fasteners 103 correspond vertically to the four female snap fasteners 104 respectively, and the four male snap fasteners 103 can be locked vertically with the four female snap fasteners 104. Through the male snap fasteners 103 and the female snap fasteners 104, the upper and lower insulating isolation frames 101 can be connected vertically to form a single-layer module 1 that can be stacked vertically to achieve multi-layer combination, which is convenient for installation and disassembly and for maintenance.

[0027] As an optional technical solution of this utility model: inclined guide holes 111 are provided on the edges of both sides of the insulating isolation frame 101 near the turbine fan 105. The inclined guide holes 111 are connected to the inner wall of the ventilation strip 108 and the outside of the insulating isolation frame 101. The openings on both sides of the inclined guide holes 111 correspond to the turbine fan 105 and the circuit board 102 respectively. The width of the inclined guide holes 111 is equal to the width of the ventilation strip 108. Through the inclined guide holes 111, a part of the airflow can be guided out of the insulating isolation frame 101, so that a part of the airflow flows over the top surface of the circuit board, realizing double-sided heat dissipation and improving the heat dissipation effect.

[0028] As an optional technical solution of this utility model: the width of the ventilation strip 108 is equal to the width of the circuit board mounting plate 106, and the vertical height of the inner wall of the ventilation strip 108 is adapted to the distance between the two circuit board mounting plates 106, so that the output airflow can be evenly distributed on the circuit board mounting plate 106 to achieve sufficient air cooling.

[0029] As an optional technical solution of this utility model: the circuit board mounting plate 106 and the plurality of heat-conducting fins 107 are both made of high thermal conductivity materials. The distribution width of the plurality of heat-conducting fins 107 is adapted to the width of the circuit board mounting plate 106, thereby maximizing the heat dissipation area, so that the heat is conducted evenly and the heat dissipation effect is improved.

[0030] As an optional technical solution of this utility model: the size of the output port of the turbine fan 105 is equal to the size of the ventilation strip port 108, and the vertical dimension of the turbine fan 105 is between the end of the snap female head 104 away from the insulating isolation frame 101 and the end of the snap male head 103 away from the insulating isolation frame 101, so as to prevent the turbine fan 105 from interfering with the vertical dimension after the upper and lower insulating isolation frames 101 are assembled.

[0031] The working process of this utility model is as follows: When the user uses it...

[0032] 1) The male snap button 103 and the female snap button 104 can be connected vertically to form two insulating isolation frames 101, so that the single-layer module 1 can be stacked vertically.

[0033] 2) The heat of the circuit board is absorbed by the circuit board mounting plate 106, a number of heat-conducting fins 107 and thermal grease 110, and the heat dissipation area is greatly increased by the number of heat-conducting fins 107.

[0034] 3) The airflow input by the turbine fan 105 fully enters the gap between the two circuit board mounting plates 106, so that the airflow quickly passes through several heat-conducting fins 107 to achieve efficient heat dissipation.

[0035] In summary, this utility model absorbs the heat of the circuit board through the circuit board mounting plate 106, several heat-conducting fins 107, and the attached thermal grease 110. The heat dissipation area is greatly increased by the heat-conducting fins 107. Then, the airflow input by the turbine fan 105 fully enters the gap between the two circuit board mounting plates 106, allowing the airflow to quickly pass through the heat-conducting fins 107 to achieve efficient heat dissipation and improve the heat dissipation effect. The snap male head 103 and snap female head 104 can be composed of two upper and lower insulating isolation frames 101 connected vertically, so that the single-layer module 1 can be stacked vertically to achieve multi-layer combination, which is convenient for installation and disassembly and maintenance. Through the inclined guide hole 111, part of the airflow can be guided out of the insulating isolation frame 101, so that part of the airflow flows over the top surface of the circuit board to achieve double-sided heat dissipation and improve the heat dissipation effect.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high heat dissipation multilayer HDI circuit board, characterized in that: The system includes a single-layer module (1), which includes an insulating frame (101). Circuit board mounting plates (106) are fixedly connected to both sides of the inner side of the insulating frame (101). Mounting nut posts (109) are fixedly connected to the four corners of the outer sides of the two circuit board mounting plates (106). A circuit board (102) is fixedly connected to the top of each mounting nut post (109). Thermally conductive silicone grease (110) is filled between the heat-generating part of the circuit board (102) and the circuit board mounting plate (106). The two circuit board mounting plates (106) are fixedly connected to a number of heat-conducting fins (107) on their opposite sides. The insulating isolation frame (101) has ventilation slots (108) on both sides. The length direction of the heat-conducting fins (107) corresponds to the opening direction of the ventilation slots (108). A turbine fan (105) is fixedly connected to one side of the insulating isolation frame (101). The output end of the turbine fan (105) is connected to the ventilation slot (108) on one side.

2. The high heat dissipation multilayer HDI circuit board according to claim 1, characterized in that: The insulating isolation frame (101) has four corners on one side fixedly connected with male snap fasteners (103), and four corners on the other side fixedly connected with female snap fasteners (104). The four male snap fasteners (103) correspond vertically to the four female snap fasteners (104), and the four male snap fasteners (103) can be locked and fixed vertically with the four female snap fasteners (104).

3. The high heat dissipation multilayer HDI circuit board according to claim 1, characterized in that: Inclined guide holes (111) are provided on the edges of both sides of the insulating isolation frame (101) near the turbine fan (105). The inclined guide holes (111) are connected to the inner wall of the ventilation strip (108) and the outside of the insulating isolation frame (101). The openings on both sides of the inclined guide holes (111) correspond to the turbine fan (105) and the circuit board (102), respectively. The width of the inclined guide holes (111) is equal to the width of the ventilation strip (108).

4. The high heat dissipation multilayer HDI circuit board according to claim 1, characterized in that: The width of the ventilation slot (108) is equal to the width of the circuit board mounting plate (106), and the vertical height of the inner wall of the ventilation slot (108) is adapted to the distance between the two circuit board mounting plates (106).

5. A high heat dissipation multilayer HDI circuit board according to claim 1, characterized in that: The circuit board mounting plate (106) and the plurality of heat-conducting fins (107) are both made of high thermal conductivity materials, and the distribution width of the plurality of heat-conducting fins (107) is adapted to the width of the circuit board mounting plate (106).

6. The high heat dissipation multilayer HDI circuit board according to claim 1, characterized in that: The size of the outlet of the turbine fan (105) is equal to the size of the ventilation strip (108), and the upper and lower dimensions of the turbine fan (105) are between the end of the snap female head (104) away from the insulating isolation frame (101) and the end of the snap male head (103) away from the insulating isolation frame (101).

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