A high-performance micro-channel high-efficiency radiator with middle air inlet

Abstract

The application relates to the technical field of heat sinks, in particular to a high-performance micro-channel high-efficiency heat sink with middle air inlet, which comprises a heat dissipation plate used for abutting against a heating component and a condenser used for promoting heat dissipation of the heat dissipation plate, heat dissipation cavities are arranged on the heat dissipation plate in positions corresponding to the heating component and with sizes corresponding to the heating component, a plurality of heat dissipation cavities are arranged, the condenser is arranged in positions corresponding to the heat dissipation cavities, any condenser is arranged on a side of the heat dissipation plate away from the heating component, and the heat dissipation cavities and the corresponding condensers are in one-to-one communication, the refrigerant medium in each heat dissipation cavity directly absorbs heat transferred from the heating component, the refrigerant medium carrying the heat enters the corresponding condenser for further cooling, a plurality of independent and efficient heat dissipation systems are formed, thereby targeted heat dissipation treatment can be carried out on the heating components with a scattered design, and the targeting and efficiency of heat dissipation are improved.

Description

Technical Field

[0001] This application relates to the field of radiator technology, and in particular to a high-performance microchannel high-efficiency radiator with central air intake. Background Technology

[0002] Currently, heat generation is a significant issue in the operation of high-power electronic devices such as reactors and inductors. Because these devices continuously generate a large amount of heat, failure to dissipate it effectively and promptly will seriously threaten their stable performance and lifespan. Therefore, achieving efficient heat dissipation using heat sinks is crucial for ensuring the normal operation of these devices.

[0003] However, some electronic devices have relatively dispersed heat-generating components. Using traditional heat sinks for heat dissipation would require a large overall size and space if a single heat sink were used to cover the entire electronic device. On the other hand, using multiple heat sinks would increase the cost of use, which is an area that needs improvement. Utility Model Content

[0004] To address the heat dissipation problem of electronic devices with dispersed heat-generating components, this application provides a high-performance microchannel high-efficiency heat sink with central air intake.

[0005] This application provides a high-performance microchannel high-efficiency radiator with central air intake, which adopts the following technical solution:

[0006] A high-performance microchannel high-efficiency heat sink with central air intake includes a heat sink plate for contacting heat-generating components and a condenser for promoting heat dissipation of the heat sink plate. The heat sink plate is provided with heat dissipation cavities corresponding to the position and size of the heat-generating components. Multiple heat dissipation cavities are provided. The condenser is provided at the position corresponding to the heat dissipation cavities. Each condenser is located on the side of the heat sink plate away from the heat-generating components, and each heat dissipation cavity is connected to its corresponding condenser.

[0007] By adopting the above technical solution, the heat dissipation cavities on the heat sink are positioned and sized to correspond to the heat-generating components. The heat sink is in contact with the heat-generating components, and a condenser is installed on the heat sink corresponding to the heat dissipation cavity. The cooling medium in each heat dissipation cavity directly absorbs the heat transferred from the heat-generating components. The cooling medium then carries the heat into the corresponding condenser for further cooling, forming multiple independent and efficient heat dissipation systems. This allows for targeted heat dissipation of dispersed heat-generating components, improving the targeting and efficiency of heat dissipation. It effectively solves the heat dissipation problem of electronic devices with relatively dispersed heat-generating components. Furthermore, compared to a single large-sized heat sink, this design occupies less space and saves costs.

[0008] Preferably, the heat sink includes a heat sink substrate and a connecting cover plate. The heat sink substrate abuts against the heat-generating component, and the heat sink cavity is formed on the side of the heat sink substrate away from the heat-generating component. The heat sink substrate and the connecting cover plate are welded and fixed together.

[0009] By adopting the above technical solution, the heat dissipation substrate is in direct contact with the heat-generating components, which facilitates the rapid conduction of heat to the heat dissipation cavity. Furthermore, the heat dissipation substrate is welded and fixed to the connecting cover plate to prevent the cooling medium from flowing out of the heat dissipation cavity, thus ensuring the tightness and stability of the heat dissipation plate structure and further improving the heat dissipation efficiency.

[0010] Preferably, the connecting cover plate is provided with an exhaust port and a liquid inlet, the exhaust port is located above the liquid inlet, and both the exhaust port and the liquid inlet are connected to the condenser.

[0011] By adopting the above technical solution, the setting of the exhaust port facilitates the evaporation of the liquid refrigerant in the heat dissipation cavity into a gaseous state, which is then discharged upward from the exhaust port into the condenser. At the same time, the setting of the liquid inlet facilitates the liquefaction of the gaseous refrigerant from the condenser and its return flow from the liquid inlet into the heat dissipation cavity, forming a relatively stable refrigerant circulation heat dissipation path, thereby continuously removing heat.

[0012] Preferably, the condenser includes a heat exchanger core, an air inlet pipe, and a liquid outlet pipe. The heat exchanger core is disposed above the air inlet pipe and the liquid outlet pipe. One end of the air inlet pipe is connected to the exhaust port, and the other end is connected to the heat exchanger core. One end of the liquid outlet pipe is connected to the heat exchanger core, and the other end is connected to the liquid inlet.

[0013] By adopting the above technical solution, the liquid refrigerant in the heat dissipation cavity is heated and evaporated into a gaseous state. The gaseous refrigerant is discharged from the exhaust port and enters the intake pipe. The gaseous refrigerant enters the heat exchanger core through the intake pipe and liquefies upon cooling. The liquid outlet pipe transports the liquefied refrigerant in the heat exchanger core back to the heat dissipation cavity through the liquid inlet. Through this evaporation, heat dissipation liquefaction, and return circulation mechanism, the heat dissipation effect of the condenser is enhanced, and the heat dissipation performance of the entire radiator is improved.

[0014] Preferably, multiple sets of exhaust ports and liquid inlets are provided, and multiple sets of air inlet pipes and liquid outlet pipes are provided, with the number of sets of air inlet pipes and liquid outlet pipes corresponding to the number of sets of exhaust ports and liquid inlets.

[0015] By adopting the above technical solution, multiple sets of exhaust ports, liquid inlets, corresponding air inlets and liquid outlets are set up to form multiple cooling medium circulation paths. These multiple circulation paths work together to further ensure the effective circulation of the cooling medium between the heat dissipation cavity and the condenser, thereby improving the overall heat dissipation capacity and reliability of the radiator.

[0016] Preferably, a fan is provided between adjacent condensers to facilitate heat dissipation from the condensers.

[0017] By adopting the above technical solution and utilizing the fan, the airflow speed around the condenser is accelerated, further improving the heat dissipation performance of the condenser.

[0018] Preferably, the heat dissipation cavity of the heat sink is provided with a rectangular array of welding protrusions, and the welding protrusions are welded to the side of the connecting cover plate opposite to the condenser.

[0019] By adopting the above technical solution and utilizing the welding protrusions inside the heat sink, the effective heat dissipation area between the heat sink and the connecting cover plate is increased, improving the efficiency of heat transfer from the heat sink to the connecting cover plate. At the same time, the rectangular array of welding protrusions makes the heat transfer more uniform, avoiding the problem of local heat accumulation and improving the overall heat dissipation effect of the radiator.

[0020] Preferably, the heat dissipation cavity of the heat sink is provided with a rectangular array of welding protrusions, which are welded to the side of the connecting cover plate away from the condenser.

[0021] By adopting the above technical solution and utilizing the welding protrusions on the heat sink, the efficiency of heat transfer from the heat sink to the connecting cover is enhanced. At the same time, the rectangular array of welding protrusions makes the heat transfer more uniform.

[0022] In summary, this application includes at least one of the following beneficial technical effects:

[0023] 1. By utilizing the heat dissipation cavities on the heat sink to correspond to the positions and sizes of the heat-generating components, with the heat sink in contact with the heat-generating components and condensers positioned on the heat sink corresponding to the heat dissipation cavities, the cooling medium in each heat dissipation cavity directly absorbs the heat transferred from the heat-generating components. The cooling medium then carries the heat into the corresponding condenser for further cooling, forming multiple independent and efficient heat dissipation systems. This allows for targeted heat dissipation of dispersed heat-generating components, improving the targeting and efficiency of heat dissipation. It effectively solves the heat dissipation problem of electronic devices with relatively dispersed heat-generating components. Furthermore, compared to a single large-sized heat sink, this design occupies less space and saves costs.

[0024] 2. The liquid refrigerant in the heat dissipation cavity evaporates into a gaseous state when heated. The gaseous refrigerant is discharged from the exhaust port and enters the intake pipe. The gaseous refrigerant enters the heat exchanger core through the intake pipe and liquefies upon cooling. The liquid outlet pipe transports the liquefied refrigerant in the heat exchanger core back to the heat dissipation cavity through the liquid inlet. Through this cycle mechanism of evaporation, heat dissipation liquefaction, and return, the heat dissipation effect of the condenser is enhanced, and the heat dissipation performance of the entire radiator is improved.

[0025] 3. The fan design accelerates the airflow around the condenser, further improving its heat dissipation performance. Attached Figure Description

[0026] Figure 1 This is an isometric schematic diagram of the main overall structure in the embodiments of this application;

[0027] Figure 2 This is a partial exploded view of the embodiment of this application, which mainly shows the mating relationship between the heat dissipation substrate and the connecting cover plate;

[0028] Figure 3 This is a schematic diagram illustrating the structure of the heat dissipation cavity on the heat dissipation substrate, which is the main feature of this application embodiment;

[0029] Figure 4 This is a schematic diagram of the condenser structure, which is the main feature of the embodiments of this application.

[0030] Reference numerals: 1. Heat sink plate; 11. Heat sink cavity; 12. Heat sink base plate; 121. Welding protrusion; 122. Welding protrusion; 13. Connecting cover plate; 131. Exhaust port; 132. Liquid inlet; 2. Condenser; 21. Heat exchanger core; 22. Air inlet pipe; 23. Liquid outlet pipe; 3. Fan. Detailed Implementation

[0031] The following is in conjunction with the appendix Figure 1 -Appendix Figure 4 This application will be described in further detail.

[0032] This application discloses a high-performance microchannel high-efficiency heat sink with central air intake.

[0033] Reference Figure 1 and Figure 2 A high-performance microchannel high-efficiency heat sink with central air intake includes a heat sink 1 and a condenser 2. One side of the heat sink 1 is used to directly contact the surface of the heat-generating components of the electronic device. The condenser 2 is disposed on the other side of the heat sink 1. Multiple independent heat dissipation cavities 11 are formed inside the heat sink 1. Each heat dissipation cavity 11 is disposed at the location of the heat sink 1 where the heat-generating components of the electronic device are located. Each condenser 2 is connected to a heat dissipation cavity 11 in a one-to-one correspondence. The cooling medium in the condenser 2 dissipates heat from the heat sink 1 through the heat dissipation cavity 11.

[0034] Reference Figure 1 and Figure 2The heat generated by the heat-generating components of the electronic device is transferred to the heat sink 1. The cooling medium in the condenser 2 flows through the heat dissipation cavity 11 inside the heat sink 1, carrying away the heat absorbed by the heat sink 1 during the flow, thereby cooling the heat sink 1. The heat dissipation cavities 11, which are set up independently in each zone, are connected to the corresponding condensers 2, thus forming multiple independent and efficient heat dissipation systems. Different sizes of heat dissipation cavities 11 can be set according to the distribution of the heat-generating components of the electronic device to meet the heat dissipation requirements.

[0035] Reference Figure 1 and Figure 2 The heat sink 1 includes a heat sink substrate 12 and a connecting cover 13. The heat sink cavity 11 is formed on the outer wall of one side of the heat sink substrate 12. The connecting cover 13 is fixed to the side of the heat sink substrate 12 located in the heat sink cavity 11. The connecting cover 13 is sealed to the heat sink substrate 12 to prevent the cooling medium from leaking from the heat sink cavity 11. The condenser 2 is fixedly installed on the side of the connecting cover 13 away from the heat sink substrate 12.

[0036] Reference Figure 3 In this embodiment, two heat dissipation cavities 11 are provided and are independently arranged side by side on the heat dissipation substrate 12. Since the two heat dissipation cavities 11 have the same structure and connection method, one of the heat dissipation cavities 11 will be used as an example for explanation.

[0037] Reference Figure 2 and Figure 3 The inner wall of the heat dissipation cavity 11 of the heat dissipation substrate 12 is integrally formed with welding bumps 121 and welding ridges 122. The welding bumps 121 and welding ridges 122 are arranged in a rectangular array. Gas channels are formed between the welding bumps 121 and liquid channels are formed between the welding ridges 122. The spacing between adjacent welding bumps 121 is preferably 1 mm and the spacing between adjacent welding ridges 122 is preferably 1 mm. The welding bumps 121 and welding ridges 122 are respectively used as welding points to be welded to the connecting cover plate 13 by vacuum brazing to ensure the connection strength and sealing effect of the heat dissipation substrate 12 and the connecting cover plate 13.

[0038] Reference Figure 2 and Figure 3 By utilizing the welding bumps 121 and welding strips 122, the efficiency of heat transfer from the heat dissipation substrate 12 to the connecting cover plate 13 is improved. At the same time, the rectangular array of welding bumps 121 and welding strips 122 makes the heat transfer more uniform, avoiding the problem of local heat accumulation. Thus, the heat generated by the heat-generating components is transferred more effectively through the heat dissipation cavity 11 to the condenser 2 of the connecting cover plate 13, improving the heat dissipation effect of the entire heat sink.

[0039] Reference Figure 3 and Figure 4The condenser 2 includes a heat exchanger core 21, an air inlet pipe 22, and a liquid outlet pipe 23. The liquid outlet pipe 23 is connected to the lower part of the heat dissipation cavity 11, and the air inlet pipe 22 is connected to the upper part of the heat dissipation cavity 11. The liquid refrigerant enters the lower part of the heat dissipation cavity 11 from the liquid outlet pipe 23 of the condenser 2, and absorbs the heat from the heat dissipation substrate 12 in the heat dissipation cavity 11 to evaporate into a gaseous refrigerant. The gaseous refrigerant rises and enters the air inlet pipe 22 of the condenser 2. The gaseous refrigerant gradually condenses as it flows through the heat exchanger core 21, and finally enters the liquid outlet pipe 23 in a liquid state to achieve a circulating cooling effect.

[0040] Reference Figure 3 and Figure 4 The connecting cover plate 13 has multiple sets of exhaust ports 131 and liquid inlets 132. Each set of exhaust ports 131 is located above the liquid inlet 132 in the same set. Each heat dissipation cavity 11 is connected to at least one set of exhaust ports 131 and liquid inlets 132. In this embodiment, each heat dissipation cavity 11 is provided with two sets of exhaust ports 131 and liquid inlets 132. The air inlet pipe 22 and liquid outlet pipe 23 in the condenser 2 corresponding to each heat dissipation cavity 11 are also provided with two sets. The two air inlet pipes 22 and liquid outlet pipes 23 are connected to the heat exchanger core 21. Any exhaust port 131 is connected to the air inlet pipe 22 of the condenser 2, and any liquid inlet 132 is connected to the liquid outlet pipe 23.

[0041] Reference Figure 1 and Figure 4 A fan 3 is installed between adjacent condensers 2 to promote heat dissipation of condensers 2. The air outlet direction of the fan 3 is set perpendicular to the connecting cover plate 13, which accelerates the air flow speed around condensers 2 and further improves the heat dissipation performance of heat exchanger core 21, air inlet pipe 22 and liquid outlet pipe 23. Moreover, by actively dissipating heat, it makes up for the shortcomings of natural convection heat dissipation. Especially when the heat generation power is large or the ambient temperature is high, it can more effectively ensure the heat dissipation effect of the radiator and ensure the normal operation of electronic equipment.

[0042] The implementation principle of this application embodiment is as follows: the heat of the heating element is transferred to the heat dissipation cavity 11 through contact with the heat dissipation substrate 12. The liquid cold medium in the liquid channel absorbs heat and evaporates into gas and enters the gas channel. The gaseous cold medium enters the air inlet pipe 22 through the exhaust port 131. The gaseous cold medium gradually condenses and liquefies as it flows through the heat exchanger core 21. The liquid cold medium flows into the liquid outlet pipe 23 under the action of gravity. The liquid cold medium flows back to the heat dissipation cavity 11 through the liquid inlet 132, thus completing the cycle.

[0043] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A high-performance microchannel high-efficiency radiator with central air intake, characterized in that: It includes a heat sink (1) for contacting a heat-generating component and a condenser (2) for promoting heat dissipation of the heat sink (1). The heat sink (1) is provided with heat dissipation cavities (11) corresponding to the position and size of the heat-generating component. Multiple heat dissipation cavities (11) are provided. The condenser (2) is provided corresponding to the position of the heat dissipation cavities (11). Each condenser (2) is provided on the side of the heat sink (1) away from the heat-generating component, and the heat dissipation cavity (11) is connected to the corresponding condenser (2).

2. The high-performance microchannel high-efficiency radiator with central air intake according to claim 1, characterized in that: The heat sink (1) includes a heat sink substrate (12) and a connecting cover plate (13). The heat sink substrate (12) abuts against the heat-generating component. The heat sink cavity (11) is formed on the side of the heat sink substrate (12) away from the heat-generating component. The heat sink substrate (12) and the connecting cover plate (13) are welded and fixed together.

3. The high-performance microchannel high-efficiency radiator with central air intake according to claim 2, characterized in that: The connecting cover plate (13) is provided with an exhaust port (131) and a liquid inlet (132). The exhaust port (131) is located above the liquid inlet (132). The exhaust port (131) and the liquid inlet (132) are both connected to the condenser (2).

4. A high-performance microchannel high-efficiency radiator with central air intake according to claim 3, characterized in that: The condenser (2) includes a heat exchanger core (21), an air inlet pipe (22), and a liquid outlet pipe (23). The heat exchanger core (21) is located above the air inlet pipe (22) and the liquid outlet pipe (23). One end of the air inlet pipe (22) is connected to the exhaust port (131), and the other end is connected to the heat exchanger core (21). One end of the liquid outlet pipe (23) is connected to the heat exchanger core (21), and the other end is connected to the liquid inlet (132).

5. A high-performance microchannel high-efficiency radiator with central air intake according to claim 4, characterized in that: The exhaust port (131) and liquid inlet (132) are provided in multiple sets, and the air inlet pipe (22) and liquid outlet pipe (23) are provided in multiple sets. The number of sets of the air inlet pipe (22) and liquid outlet pipe (23) corresponds to the number of sets of the exhaust port (131) and liquid inlet (132).

6. A high-performance microchannel high-efficiency radiator with central air intake according to claim 1, characterized in that: A fan (3) is provided between adjacent condensers (2) to promote heat dissipation of the condensers (2).

7. A high-performance microchannel high-efficiency radiator with central air intake according to claim 1, characterized in that: The heat dissipation cavity (11) of the heat dissipation plate (1) is provided with a rectangular array of welding protrusions (121), and the welding protrusions (121) are welded to the side of the connecting cover plate (13) away from the condenser (2).

8. A high-performance microchannel high-efficiency radiator with central air intake according to claim 7, characterized in that: The heat dissipation cavity (11) of the heat dissipation plate (1) is provided with a rectangular array of welding protrusions (122), which are welded to the side of the connecting cover plate (13) away from the condenser (2).

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