Middle air inlet high-performance micro-channel efficient radiator

By incorporating a microchannel design with a heat dissipation cavity and condenser on the heat sink, combined with welding bumps and a fan, the heat dissipation problem caused by the dispersion of heat-generating components in high-power electronic devices is solved, achieving efficient and space-saving heat dissipation.

CN224306102UActive Publication Date: 2026-05-29SHANGHAI HOTTOP ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202520522732.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-22
Publication Date
2026-05-29
Estimated Expiration
2035-03-22

AI Technical Summary

Technical Problem

In the existing technology, the dispersed heat-generating components of high-power electronic devices result in traditional heat sink designs having problems such as large space occupation or high cost.

Method used

It adopts a high-performance microchannel heat sink with central air intake, and uses the heat dissipation cavity on the heat sink to set up condensers corresponding to the positions of heat-generating components, forming multiple independent heat dissipation systems. The cooling medium absorbs heat in the heat dissipation cavity and enters the condenser for cooling. Combined with welded bumps and fans to accelerate airflow, it forms an efficient heat dissipation circulation path.

Benefits of technology

It achieves a targeted and efficient heat dissipation effect, reduces the space occupied by the heat sink and lowers the cost, while improving the overall performance of the heat sink.

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Abstract

The utility model relates to the technical field of radiators, in particular to a middle air inlet high-performance micro-channel efficient radiator which comprises a heat dissipation plate used for abutting against a heating component and a condenser used for promoting the heat dissipation plate to dissipate heat, and a heat dissipation cavity is formed in the position, corresponding to the heating component, of the heat dissipation plate. A plurality of heat dissipation cavities are arranged, the condensers are arranged corresponding to the positions of the heat dissipation cavities, any condenser is arranged on the side, away from the heating component, of the heat dissipation plate, the heat dissipation cavities are communicated with the corresponding condensers in a one-to-one mode, and after a refrigerant medium in each heat dissipation cavity directly absorbs heat transmitted by the heating component, the heat is transmitted to the heat dissipation cavities through the corresponding condensers. And the refrigerant medium carries heat to enter the corresponding condenser for further cooling, so that a plurality of sets of independent and efficient heat dissipation systems are formed, heat dissipation treatment can be performed on heating components which are designed in a dispersed manner in a targeted manner, and the heat dissipation pertinence and efficiency are improved.
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