A standing wave heat dissipation micro-fan and an array heat dissipation device

Abstract

The utility model relates to a heat dissipation technical field, concretely relates to a standing wave heat dissipation micro fan and array heat dissipation equipment. Standing wave heat dissipation micro fan includes compression box. Compression box includes: initiative film, compression frame and passive film. Compression frame is set up with passageway. Initiative film and passive film set up at both sides of compression frame. Compression box is set up with airflow hole. Initiative film and passive film can same frequency reverse vibration, thereby form standing wave in compression box interior, and standing wave continuously extrudes the gas in compression box, presents the surge state, makes the air in compression box continuously be compressed and extrude from inside to outside, forms the pressure difference in compression box inside and outside, makes the gas in compression box be repeatedly extruded to pass through airflow hole, to the surge state high -speed injection outside compression box, forms a steady stream of unceasing constant high -speed airflow.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, specifically to a standing wave heat dissipation micro fan. Background Technology

[0002] With the rapid advancement of artificial intelligence technology, numerous miniaturized and ultra-thin powerful electronic devices have emerged in the market. However, the continuous increase in the heat density of the core chips in these devices has placed higher demands on heat dissipation design, becoming a key challenge to ensure normal operation and performance improvement. Currently, micro fans on the market generally have some limitations, such as a relatively large overall size, especially in terms of thickness (over 2.5mm). This results in short airflow channels, making airflow short-circuiting easy and limiting airflow (approximately 0.5CFM). At the same time, they have low heat dissipation efficiency, high energy consumption (greater than 1W), low energy efficiency ratio, and a relatively simple product structure, making it difficult to meet the heat dissipation needs of different devices. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of existing micro fans, such as large size and low heat dissipation efficiency, and to provide a standing wave heat dissipation micro fan and array heat dissipation device.

[0004] First, this utility model provides a standing wave heat dissipation micro fan, including a compression box. The compression box includes an active membrane, a compression frame, and a passive membrane. The compression frame has channels. The active membrane and the passive membrane are disposed on both sides of the compression frame. The compression box has airflow channels.

[0005] According to a preferred embodiment, the active membrane includes an active membrane frame and an active membrane layer. The active membrane frame is disposed along the edge of the active membrane layer. The passive membrane includes a passive membrane frame and a passive membrane layer. The passive membrane frame is disposed along the edge of the passive membrane layer. The two side edges of a compression frame are respectively connected to the active membrane frame and the passive membrane frame. The cavity between the compression frame and the active membrane layer forms a first compression cavity, and the cavity between the compression frame and the passive membrane layer forms a second compression cavity. The channel penetrates the compression frame, connecting the first compression cavity and the second compression cavity.

[0006] According to a preferred embodiment, a groove is provided on the side of the compression frame near the passive membrane. The channel is formed within the groove. The groove includes a first groove and a second groove surrounding the first groove. The first groove is located in the middle of the compression frame. A first protrusion is provided on the side of the passive membrane layer near the compression frame, and the first protrusion is adapted to the first groove.

[0007] According to a preferred embodiment, the standing wave cooling microfan further includes a vibration source. The vibration source is disposed on the side of the active membrane away from the compression frame.

[0008] According to a preferred embodiment, the vibration source is attached to the active membrane; the vibration source is disposed at the center of the active membrane. The vibration source includes a piezoelectric ceramic and an auxiliary electrode. The auxiliary electrode is laid on both sides of the piezoelectric ceramic.

[0009] According to a preferred embodiment, the standing wave cooling micro-fan further includes a frequency tuning board. The frequency tuning board is disposed on the side of the active membrane near the vibration source. The frequency tuning board surrounds the vibration source and is connected to the active membrane layer.

[0010] According to a preferred embodiment, the standing wave cooling micro-fan further includes a housing. The housing is configured as a box-shaped structure with an open top and a hollow interior. The active diaphragm is connected to the inner bottom surface of the housing via vibration damping pads, the passive diaphragm is located at the top of the housing, and the vibration source is located inside the housing.

[0011] According to a preferred embodiment, the airflow channel includes a plurality of air outlets disposed on the passive membrane layer. The plurality of air outlets are arranged at intervals on the surface of the passive membrane layer.

[0012] According to a preferred embodiment, the airflow channel includes an air outlet disposed on the side wall of the compression chamber.

[0013] According to a preferred embodiment, the airflow channel includes a plurality of air outlets. The air outlets are located on the surface of the passive membrane layer and / or on the side wall of the compression chamber.

[0014] According to a preferred embodiment, when the airflow channel is provided on the side wall of the compression chamber, the side wall of the outer shell is provided with a notch, and the notch is coaxially aligned with the airflow channel.

[0015] According to a preferred embodiment, at least two vibration damping pads are connected to the side of the active membrane away from the compression frame, and the mounting surface is connected through the vibration damping pads. The vibration damping pads disposed on the active membrane are symmetrical about the center of the vibration source.

[0016] According to a preferred embodiment, the active membrane, the compression frame, and the passive membrane are integrally formed.

[0017] Secondly, this invention also provides an array heat dissipation device. The array heat dissipation device includes at least two standing wave heat dissipation micro fans provided by this invention.

[0018] According to a preferred embodiment, the array heat dissipation device includes a plurality of standing wave heat dissipation micro fans arranged in the same plane.

[0019] According to a preferred embodiment, the array heat dissipation device includes a plurality of standing wave heat dissipation micro fans arranged in different planes.

[0020] According to a preferred embodiment, the array heat dissipation device includes a mounting bracket, and a plurality of the standing wave heat dissipation micro fans are arranged in an array on the mounting bracket.

[0021] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0022] In the standing wave heat dissipation micro fan provided by this utility model, the active membrane and the passive membrane can vibrate in opposite directions at the same frequency, thereby forming a standing wave inside the compressor box. The standing wave continuously squeezes the gas inside the compressor box, presenting a surge state, which causes the air in the compressor box to be continuously compressed from the inside to the outside, forming a pressure difference between the inside and outside of the compressor box. This causes the gas in the compressor box to be repeatedly squeezed through the airflow channel and ejected at high speed to the outside of the compressor box in a surge state, forming a continuous constant high-speed airflow. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a standing wave heat dissipation micro fan according to a preferred embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of the active membrane according to a preferred embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of a surface-exhaust passive membrane according to a preferred embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of a side-exhaust passive membrane according to a preferred embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the compression frame according to a preferred embodiment of the present invention;

[0028] Figure 6 This is a schematic diagram of a matrix-arranged array heat dissipation device according to a preferred embodiment of the present invention.

[0029] Figure 7 This is a schematic diagram of a ring-shaped planar array heat dissipation device according to a preferred embodiment of the present invention.

[0030] Figure 8 This is a schematic diagram of an array heat dissipation device with two standing wave heat dissipation micro fans arranged at an angle in a preferred embodiment of the present invention.

[0031] Figure 9This is a schematic diagram of an array heat dissipation device with two standing wave heat dissipation micro fans arranged back to back, according to a preferred embodiment of the present invention.

[0032] Figure 10 This is a schematic diagram of a ring-shaped three-dimensional array heat dissipation device according to a preferred embodiment of the present invention.

[0033] Marked in the image:

[0034] Compression box 100, active membrane 110, active membrane frame 111, active membrane layer 112, compression frame 120, first groove 121, second groove 122, channel 123, passive membrane 130, passive membrane frame 131, passive membrane layer 132, air outlet 133, air vent 134, first protrusion 135, vibration source 200, piezoelectric ceramic 210, auxiliary electrode 220, outer shell 300, vibration damping pad 400, frequency modulation board 500, mounting bracket 600. Detailed Implementation

[0035] The present invention will be further described in detail below with reference to specific embodiments. However, it should not be construed as limiting the scope of the present invention to the following embodiments; all technologies implemented based on the content of the present invention fall within the scope of the present invention.

[0036] Unless otherwise specified, the use of terms such as "upper," "lower," "left," "right," "center," "inner," and "outer" to indicate orientation or positional relationships in the description of specific embodiments of this utility model is based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product / equipment / device is typically placed during use. These terms are merely for the purpose of facilitating the description of the utility model solution or simplifying the description in specific embodiments, enabling those skilled in the art to quickly understand the solution, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, they should not be construed as limitations on this utility model.

[0037] Furthermore, the use of terms such as "horizontal," "vertical," "suspended," and "parallel" does not imply that the corresponding device / component / element must be absolutely horizontal, vertical, suspended, or parallel, but rather that it can be slightly tilted or have a deviation. For example, "horizontal" merely means that its direction is more horizontal relative to "vertical," not that the structure must be completely horizontal, but can be slightly tilted. Alternatively, it can be simplified to mean that the corresponding device / component / element, when set in a "horizontal," "vertical," "suspended," or "parallel" direction, can have an error / deviation of ±10% relative to the corresponding direction, more preferably within ±8%, more preferably within ±6%, more preferably within ±5%, and more preferably within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the present invention.

[0038] Furthermore, the use of terms such as "first," "second," and "third" in terminology is merely for distinguishing descriptions of identical or similar components and should not be interpreted as emphasizing or implying the relative importance of a particular component.

[0039] Furthermore, in the description of the embodiments of this utility model, "several", "multiple", and "several" represent at least two. The number can be any number, such as two, three, four, five, six, seven, eight, or nine, and can even exceed nine.

[0040] Furthermore, in the description of the technical solution of this utility model, unless otherwise explicitly specified / limited / restricted, the terms "set up," "install," "connect," "link," "equipped with," "laid out," and "arranged" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to common connection methods in the art, such as welding, riveting, bolting, and threaded connections. Such connections can be mechanical, electrical, or communication connections; they can be direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components.

[0041] Example 1

[0042] This embodiment provides a standing wave heat dissipation micro fan. See also: Figure 1 The standing wave cooling micro fan includes a compression chamber 100. Preferably, the compression chamber 100 includes an active membrane 110, a compression frame 120, and a passive membrane 130. Preferably, the compression frame 120 has a channel 123. Preferably, the active membrane 110 and the passive membrane 130 are disposed on both sides of the compression frame 120. Preferably, the compression chamber 100 has airflow channels.

[0043] In the standing wave cooling micro fan provided in this embodiment, the active membrane 110 and the passive membrane 130 can vibrate in opposite directions at the same frequency, thereby forming a standing wave inside the compression chamber 100. The standing wave continuously squeezes the gas inside the compression chamber 100, presenting a surge state, which causes the air in the compression chamber 100 to be continuously compressed from the inside out, forming a pressure difference between the inside and outside of the compression chamber 100. This causes the gas in the compression chamber 100 to be repeatedly squeezed through the airflow channel and ejected at high speed to the outside of the compression chamber 100 in a surge state, forming a continuous constant high-speed airflow.

[0044] Example 2

[0045] This embodiment is a further improvement on embodiment 1, and the repeated content will not be described again.

[0046] See Figure 1 and Figure 2 Preferably, the active membrane 110 includes an active membrane frame 111 and an active membrane layer 112. The active membrane frame 111 is disposed along the edge of the active membrane layer 112.

[0047] See Figure 1 , Figure 3 and Figure 4 The passive membrane 130 includes a passive membrane frame 131 and a passive membrane layer 132. The passive membrane frame 131 is disposed along the edge of the passive membrane layer 132.

[0048] Preferably, both the active diaphragm 110 and the passive diaphragm 130 are metal or alloy vibrating diaphragms.

[0049] See Figure 1 The two sides of the compression frame 120 are connected to the active membrane frame 111 and the passive membrane frame 131, respectively. The cavity between the compression frame 120 and the active membrane layer 112 forms a first compression cavity, and the cavity between the compression frame 120 and the passive membrane layer 132 forms a second compression cavity. The channel 123 passes through the compression frame 120, connecting the first compression cavity and the second compression cavity.

[0050] See Figure 5 Preferably, a groove is provided on the side of the compression frame 120 near the passive membrane 130. A channel 123 is formed in the groove. The groove includes a first groove 121 and a second groove 122 surrounding the first groove 121. The first groove 121 is located in the middle of the compression frame 120.

[0051] See Figure 1 , Figure 3 and Figure 4The passive membrane layer 132 has a first protrusion 135 on the side near the compression frame 120. The first protrusion 135 is adapted to the first groove 121. Preferably, after the passive membrane 130 is connected to the compression frame 120, the first protrusion 135 can enter the first groove 121, and there is a gap between the first protrusion 135 and the first groove 121.

[0052] Preferably, the compression frame 120 is connected to the active membrane frame 111 and the passive membrane frame 131 by welding, bonding or other means, so that the active membrane 110, the passive membrane 130 and the compression frame 120 together form the compression box 100.

[0053] Preferably, the active membrane 110 is connected to the side of the compression frame 120 away from the passive membrane 130 by welding, bonding, or other methods, so that the compression frame 120 vibrates synchronously with the active membrane 110. Preferably, the active membrane 110, passive membrane 130, and compression frame 120 are arranged in parallel, coaxially aligned, and their shapes are compatible. Preferably, the active membrane 110, passive membrane 130, and compression frame 120 are all rectangular. Preferably, the active membrane 110 and passive membrane 130 are both made of metal or alloy vibrating membranes. Preferably, the compression frame 120 is made of elastic metal or alloy.

[0054] Preferably, the channel 123 is formed within the second groove 122 of the first groove 121. Preferably, a plurality of channels 123 are arranged in the second groove 122 of the first groove 121 with intervals between them.

[0055] Preferably, the first groove 121, the second groove 122, and the first protrusion 135 can be configured as circles, triangles, rectangles, polygons, or other irregular shapes. Preferably, the channel 123 can be configured as circles, triangles, rectangles, polygons, or other irregular shapes, and the channel 123 penetrates the compression frame 120. Preferably, the first protrusion 135 and the second groove 122 are configured as rectangles.

[0056] Preferably, by providing the first protrusion 135 and the second groove 122, a reduced-size compression cavity is added between the passive membrane 130 and the compression frame 120, increasing the cavity volume in the entire compression chamber 100 and improving the compression ratio within the compression chamber 100. Driven by the mechanical vibration standing waves within the compression chamber 100, a surging airflow is formed where the rear wave squeezes the front wave. The airflow within the compression chamber 100 is continuously compressed from the inside out through the airflow channels, generating a high-speed airflow that is continuously ejected outwards.

[0057] Preferably, in this embodiment, the volume of the compression box 100 can be adjusted by adjusting the number, area, and depth of the grooves inside the compression frame 120, the number and area of ​​the channels 123, etc., thereby adjusting the compression ratio inside the compression box 100.

[0058] Preferably, the active membrane 110, the compression frame 120, and the passive membrane 130 can be integrally formed to constitute the compression box 100. Specifically, the compression box 100 can be manufactured using laser processing technology, etching technology, etc.

[0059] See Figure 1 Preferably, the standing wave cooling micro fan further includes a vibration source 200. The vibration source 200 is disposed on the side of the active membrane 110 away from the compression frame 120.

[0060] When using the standing wave heat dissipation device provided in this embodiment for heat dissipation, the vibration source 200 drives the active membrane 110 to vibrate, and the active membrane 110 drives the passive membrane 130 to vibrate. The active membrane 110 and the passive membrane 130 vibrate at the same frequency but in opposite directions, forming a standing wave inside the compression chamber 100. This causes the gas inside the compression chamber 100 to be repeatedly compressed through the airflow channels and ejected to the outside of the compression chamber 100 in a surging state. The active membrane 110 and the passive membrane 130 vibrate in opposite directions at the same frequency to form a standing wave compressing airflow, which is more efficient than a single vibrating membrane vibrating to compress airflow. Furthermore, this embodiment only needs to drive the vibration source 200 to make the active membrane 110 and the passive membrane 130 vibrate in opposite directions at the same frequency to form a standing wave, thus improving the energy efficiency ratio of the heat dissipation device.

[0061] Preferably, the vibration source 200 is attached to the active membrane 110; the vibration source 200 is located at the center of the active membrane 110. The vibration source 200 includes a piezoelectric ceramic 210 and an auxiliary electrode 220. The auxiliary electrode 220 is laid on both sides of the piezoelectric ceramic 210.

[0062] Preferably, the vibration frequency of the vibration source 200 is greater than 25 kHz. The vibration source 200 includes a piezoelectric ceramic 210 and an auxiliary electrode 220. The auxiliary electrode 220 is laid on both sides of the piezoelectric ceramic 210.

[0063] See Figure 1 The vibration source 200 includes a piezoelectric ceramic 210 and an auxiliary electrode 220. The auxiliary electrode 220 is disposed on both sides of the piezoelectric ceramic 210. The piezoelectric ceramic 210 can be shaped as a circle, triangle, rectangle, polygon, or other irregular shape. The auxiliary electrode 220 is disposed on both sides of the piezoelectric ceramic 210. Preferably, the shape of the auxiliary electrode 220 matches that of the piezoelectric ceramic 210.

[0064] The 210 piezoelectric ceramic uses high-frequency ultrasonic piezoelectric ceramics, which has superior performance, high mechanical and electrical properties, piezoelectric constant d33 > 750 PC / N, Curie temperature > 260℃, frequency > 400KHz, elastic modulus > 0.43, dielectric constant εT33 / ε0 = 3500, elastic compliance coefficient S11 > 1810-12 m2 / N, Curie temperature > 320℃, Poisson's ratio σ > 0.35, and can be used for long-term operation in high-temperature environments up to 100℃, with a wide operating temperature range.

[0065] The piezoelectric ceramic 210 is bonded to the active membrane 110 through differential pressure and stepped curing process. During operation, the piezoelectric ceramic sheet and the metal active membrane are subjected to constant and consistent force directions. This ensures that the standing wave after superposition with the mechanical vibration wave of the passive membrane 130 has an increased and constant mechanical vibration amplitude, thus ensuring that the standing wave heat dissipation device can work stably and with high performance for a long time.

[0066] Preferably, the auxiliary electrode 220 is disposed on the electrode layers on both sides of the piezoelectric ceramic 210, avoiding stress concentration at the bonding point caused by directly bonding the piezoelectric ceramic 210, which has a large difference in thermal expansion coefficient, to the active film 110. The auxiliary electrode 220 not only enhances the conductivity, but also prevents the heat dissipation device from failing due to problems such as ceramic sheet breakage and adhesive layer detachment caused by excessive stress concentration between the electrode inside the piezoelectric ceramic 210 and the piezoelectric ceramic sheet and metal film.

[0067] Preferably, the auxiliary electrode 220 can block the pores of the piezoelectric ceramic 210. Traditionally, electrodes are set by brushing silver paste onto the surface of the piezoelectric ceramic 210. When energized, silver ions migrate to the pores of the piezoelectric ceramic 210, forming a galvanic cell, which corrodes the piezoelectric ceramic 210, affecting its lifespan and potentially causing it to break. Using the auxiliary electrode 220 avoids these problems.

[0068] The auxiliary electrodes 220 on the electrode layers on both sides of the piezoelectric ceramic 210 ensure that the adhesive layer between the piezoelectric ceramic 210 and the active membrane 110 does not detach, crack, or develop pores. The adhesive layer is uniform and strong, and the piezoelectric ceramic 210 does not break, allowing the active membrane 110 to operate stably and for a long time under high-frequency vibration. Simultaneously, it also ensures that the heat dissipation device can operate continuously, achieving noise reduction at ultrasonic high frequencies above 25kHz.

[0069] See Figure 1 Preferably, the standing wave cooling micro fan also includes a frequency modulation board 500. The frequency modulation board 500 is disposed on the side of the active membrane 110 near the vibration source 200. The frequency modulation board 500 surrounds the vibration source 200 and is connected to the active membrane layer 112.

[0070] Preferably, the frequency modulation board 500 is configured as a frame. To ensure maximum airflow from the heat dissipation device, it is crucial to maximize the vibration amplitude of the active membrane 110 and the passive membrane 120. This requires finding the resonance point of the two membranes, as the structural form and vibration-related physical characteristics (mass, stiffness, and damping, etc.) of the active membrane 110 and the passive membrane 120 are fixed, making frequency adjustment inconvenient. This embodiment introduces the frequency modulation board 500, using structural superposition to change the natural frequencies of the active membrane 110 and the passive membrane 120, thus achieving frequency adjustment. Fine-tuning the frequency modulation board 500, such as changing its structural shape, stiffness, or damping, allows for adjustment of the vibration frequency of the entire heat dissipation device. This ensures that, under constant low external excitation (drive power) frequency, the heat dissipation device maintains consistency with the frequency delivered by the drive power supply, achieving a resonance effect. This maximizes the vibration amplitude of the active membrane 110 and the passive membrane 120, keeping the heat dissipation device in optimal condition.

[0071] Preferably, by adjusting the vibration frequencies of the active membrane 110 and the passive membrane 120 through the frequency modulation board 500, the consistency of the vibration frequency of the solid heat dissipation device in mass production can be ensured.

[0072] Preferably, this embodiment sets up heat dissipation devices with different air outlet forms by setting the position and form of the airflow channels.

[0073] See Figure 3 Preferably, the airflow channels include a plurality of air outlets 133 disposed on the passive membrane layer 132. The plurality of air outlets 133 are arranged at intervals on the surface of the passive membrane layer 132.

[0074] See Figure 4 Preferably, the airflow channel includes an air outlet 134 disposed on the side wall of the compression chamber 100. Preferably, the air outlet 134 can be disposed on the passive membrane frame 131; it can also be disposed on the edge of the compression frame 120 near the passive membrane 130; or it can be simultaneously disposed on the edges of both the passive membrane frame 131 and the compression frame 120. Preferably, the air outlet 134 is disposed on the side wall of the compression chamber 100. Preferably, the air outlet 134 is rectangular, and the lateral exhaust gas is ejected at high speed from the air outlet 134 to form a small rectangular air curtain. The airflow channel includes the air outlet 134 disposed between the active membrane 110 and the passive membrane layer 132.

[0075] Preferably, the airflow channel includes a plurality of air outlets 133. The air outlets 133 are located on the surface of the passive membrane layer 132 and / or on the side wall of the compression chamber 100.

[0076] Preferably, when the airflow channel is provided on the side wall of the compression chamber 100, the side wall of the outer casing 300 is provided with a notch, and the notch is coaxially aligned with the airflow channel.

[0077] Preferably, the airflow channel of the heat dissipation device can be configured as only an air outlet 134, or only an air outlet 133, or both an air outlet 134 and an air outlet 133 can be included.

[0078] Preferably, when the airflow channel is located on the side wall of the compression chamber 100, the standing wave heat dissipation micro fan is a side-discharge standing wave heat dissipation micro fan; when the airflow channel is located on the passive membrane layer 132, the standing wave heat dissipation micro fan is a side-discharge standing wave heat dissipation micro fan; when the airflow channel is located on both the side wall of the compression chamber 100 and the passive membrane layer 132, the standing wave heat dissipation micro fan is a side-discharge standing wave heat dissipation micro fan.

[0079] Existing micro fans are almost all surface-exit designs. In the flow field, surface-exit structures are limited by the direction of the micro fan, so the device that needs to be cooled needs a relatively large space. There should be no obstructions near the output end of the micro fan. Otherwise, the high-speed airflow output by the micro fan will be bounced off the obstruction, causing airflow disturbance and short circuit, which will greatly reduce the cooling effect of the micro fan. Side-exit standing wave cooling micro fans can avoid the above problems and are more suitable for use in artificial intelligence devices such as AI glasses, wearable devices, wristbands, mobile phones, and tablets.

[0080] Preferably, the airflow channel includes a plurality of air outlets 133 disposed on the passive membrane layer 132. The plurality of air outlets 133 are arranged at intervals on the surface of the passive membrane layer 132; the shape and size of the air outlets 133 are also specified. Preferably, the plurality of air outlets 133 are arranged in a ring at the center of the surface of the passive membrane layer 132.

[0081] When facing the air outlet, multiple air outlets 133, with small diameters (all below 0.5mm), provide a high gas flow rate (greater than 1 CFM), a wind speed (greater than 10 m / s), and a frequency (greater than 25 kHz), resulting in good noise reduction. Air is ejected at high speed and in parallel from these multiple air outlets 133.

[0082] Preferably, the heat dissipation device has a high exhaust air velocity (>20m / s), a large air volume (>3L / min), low noise (<26dB), small size (thickness <0.8mm), and high protection level (IP68), ensuring long-term continuous (MTTF>100000h) and stable output airflow.

[0083] See Figure 1Preferably, the standing wave cooling micro fan also includes a housing 300. The housing 300 is configured as a box-shaped structure with an open top and a hollow interior. The active diaphragm 110 is connected to the inner bottom surface of the housing 300 via a vibration damping pad 400, the passive diaphragm 130 is located at the top of the housing 300, and the vibration source 200 is located inside the housing 300.

[0084] The outer casing 300 is made of high-temperature resistant polymer and ceramic packaging materials for electronic chip devices.

[0085] When the heat dissipation device is encapsulated in the housing 300, the active diaphragm 110 is connected to the inner bottom surface of the housing 300 through the vibration damping pad 400, the passive diaphragm 130 is located at the top of the housing 300, and the compression frame 120, the passive diaphragm 130, the vibration source 200 and the frequency modulation board 500 are located inside the housing 300.

[0086] When the heat dissipation device is working, mechanical vibration will be generated because the active diaphragm 110, compression frame 120, passive diaphragm 130, vibration source 200 and frequency modulation board 500 are connected as one unit. By connecting the vibration damping pad 400 to the inner bottom surface of the housing 300, the vibration can be prevented from being transmitted to the isolation mounting surface (inner bottom surface of the housing 300).

[0087] Preferably, by connecting the vibration damping pad 400 to the mounting surface, the active diaphragm 110 is prevented from directly contacting the inner bottom surface of the housing 300, which would affect the free vibration of the diaphragm, reduce the mechanical vibration frequency of the heat dissipation device, affect the performance of the micro fan, and also cause abnormal high-frequency noise. Since the heat dissipation device is often directly attached to the electronic equipment that needs heat dissipation during operation, connecting it to the mounting surface via the vibration damping pad 400 can also prevent the mechanical vibration of the compression box 100 from being transmitted to the electronic equipment being cooled, while also serving as vibration isolation.

[0088] Preferably, after the vibration source 200 is attached to the active membrane 110, there is a gap between the vibration source 200 and the inner bottom surface of the housing 300. Preferably, after the vibration source 200 is attached to the active membrane 110, the compression box 100 is connected to the mounting surface (inner bottom surface of the housing 300) through the vibration damping pad 400, so that the vibrations of the vibration source 200 and the compression box 100 during operation will not be transmitted to the inner bottom surface of the housing 300.

[0089] According to a preferred embodiment, when the airflow channel is disposed between the active membrane 110 and the passive membrane layer 132, a notch is provided on the side wall of the outer casing 300, and the notch is coaxial with the airflow channel. The notch is coaxially aligned with the air outlet 134. Laterally discharged air is ejected at high speed from the rectangular air outlet 134, forming a tiny rectangular air curtain.

[0090] To adapt to the heat dissipation of micro and small devices, the heat dissipation device has been miniaturized (3-10×3-10×0.4-1.0). The active membrane 110, compression frame 120, passive membrane 130, and frequency modulation board 500 are positioned by fixtures and precisely multi-layered by laser welding to ensure the product consistency of the heat dissipation device, making it suitable for mass production and meeting the large-scale demand of the heat dissipation market for micro and ultra-thin electronic devices.

[0091] Preferably, the power supply pins of the auxiliary electrode 210 pass through the housing 300 and are connected to an external driving power supply, and can be configured in various forms, including surface mount type, bottom mount type, dual upright through-hole type, bent pin type, etc.

[0092] Preferably, the vibration frequency in the heat dissipation device is greater than 26kHz, successfully avoiding the range of sound waves that can be received by the human ear and other household pets and poultry, so that the standing wave solid-state piezoelectric ultrasonic micro fan can operate with no or low noise. The heat dissipation device itself is small in size (10×10×0.5mm3), making it particularly suitable for wearable electronic devices and thin, quiet applications.

[0093] Because of its high standing wave resonant frequency (above 26kHz), it always operates in an ultrasonic high-frequency state, resulting in low noise (<26dB), high air velocity (>10m / s), and low power consumption (<0.3W). The standing wave solid-state piezoelectric ultrasonic micro-fan can be arranged in different arrays to achieve ideal heat dissipation effects, depending on the application scenario.

[0094] See Figure 1 Preferably, at least two damping pads 400 are connected to the side of the active membrane 110 away from the compression frame 120, and the mounting surface is connected through the damping pads 400. The damping pads 400 disposed on the active membrane 110 are symmetrical about the vibration source 200.

[0095] Preferably, the standing wave heat dissipation micro fan can also be installed on a specific device (such as a semiconductor chip) for heat dissipation without the need for a housing 300, via a vibration damping pad 400.

[0096] Preferably, at least two damping pads 400 are connected to the side of the active diaphragm 110 away from the compression frame 120, and the diaphragm 110 is connected to the mounting surface via the damping pads 400. The damping pads 400 on the active diaphragm 110 are symmetrical about the center of the vibration source 200. Preferably, the active diaphragm 110 is connected to the mounting surface via four damping pads 400, and there is a gap between the vibration source 200 and the frequency modulation board 500 and the mounting surface, so that the vibrations of the vibration source 200 and the compression box 100 during operation are not transmitted to the mounting surface. The damping pads 400 are made of elastic material, silicone, or rubber. The active diaphragm 110 is elastically connected to the mounting surface via the damping pads 400. When the heat dissipation device is working, the damping pads 400 provide a buffering effect to prevent vibration from being transmitted to the mounting surface.

[0097] Example 3

[0098] This embodiment provides an array heat dissipation device. Preferably, the array heat dissipation device includes at least two standing wave heat dissipation micro fans as described in Embodiments 1 and 2. Preferably, the standing wave heat dissipation micro fans include front-discharge standing wave heat dissipation micro fans, side-discharge standing wave heat dissipation micro fans, and standing wave heat dissipation micro fans that discharge air from both the front and side simultaneously.

[0099] The standing wave cooling micro fan utilizes the piezoelectric effect of ultrasonic piezoelectric ceramics to generate a standing wave source. Inside the micro fan's compression chamber 100, gas is continuously compressed at high frequency, generating a high-speed airflow that is ejected out of the compression chamber 100. It is particularly suitable for the heat dissipation needs of small electronic devices, especially side-exhaust standing wave cooling micro fans, which can meet the heat dissipation requirements of small electronic devices smaller than 1 mm.

[0100] In this embodiment, the standing wave cooling micro fan utilizes the inverse piezoelectric effect of piezoelectric ceramics to generate a mechanical vibration standing wave in the compression cavity, continuously squeezing the gas in the cavity to form a positive pressure airflow, which is continuously ejected out of the cavity.

[0101] Preferably, the array heat dissipation device includes a plurality of standing-wave heat dissipation micro fans arranged on the same plane. The array heat dissipation device may include a plurality of standing-wave heat dissipation micro fans arranged in a matrix, a ring, or other manner on the same plane. See also Figure 6 Array cooling devices can be standing wave cooling micro-fans arranged in several rows with surface exhaust. See also Figure 7 The heat dissipation device can also be a series of standing wave heat dissipation micro fans arranged in a ring plane.

[0102] Preferably, the array heat dissipation device includes several standing wave heat dissipation micro-fans arranged in different planes. See also Figure 8 An array cooling device can be formed by arranging two standing wave cooling micro-fans at a certain angle. See also Figure 8 Two standing wave cooling micro-fans are arranged in a "V" shape, discharging air in two directions. See also Figure 9 Two standing wave micro-fans can be arranged back-to-back to form an array cooling device. See also Figure 10 Multiple standing-wave heat dissipation micro-fans are arranged in a ring-shaped three-dimensional array to form a heat dissipation device. Preferably, the array heat dissipation device includes a mounting bracket 600, on which several standing-wave heat dissipation micro-fans are arranged in an array. See also Figure 7 and Figure 10 The standing wave cooling micro fans are arranged in a ring-shaped plane or a three-dimensional cylindrical shape using mounting brackets 600 to meet the cooling needs of different cooling scenarios, airflow directions, and angles. Preferably, the mounting brackets 600 can be adjusted according to the actual cooling application scenario.

[0103] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A standing wave heat dissipation micro fan, characterized in that, Includes a compression chamber (100); The compression chamber (100) includes: an active membrane (110), a compression frame (120), and a passive membrane (130); the compression frame (120) has a channel (123); the active membrane (110) and the passive membrane (130) are disposed on both sides of the compression frame (120); the compression chamber (100) has an airflow channel.

2. The standing wave heat dissipation micro fan according to claim 1, characterized in that, The active membrane (110) includes an active membrane frame (111) and an active membrane layer (112); the active membrane frame (111) is disposed along the edge of the active membrane layer (112); The passive membrane (130) includes: a passive membrane frame (131) and a passive membrane layer (132); the passive membrane frame (131) is disposed along the edge of the passive membrane layer (132); The two sides of the compression frame (120) are connected to the active membrane frame (111) and the passive membrane frame (131) respectively. The cavity between the compression frame (120) and the active membrane layer (112) forms a first compression cavity, and the cavity between the compression frame (120) and the passive membrane layer (132) forms a second compression cavity. The channel (123) passes through the compression frame (120) and connects the first compression chamber and the second compression chamber.

3. A standing wave heat dissipation micro fan according to claim 2, characterized in that, The compression frame (120) has a groove on the side near the passive membrane (130); the channel (123) is formed in the groove; The groove includes: a first groove (121) and a second groove (122) surrounding the first groove (121); wherein the first groove (121) is disposed in the middle of the compression frame (120); The passive membrane layer (132) has a first protrusion (135) on the side near the compression frame (120), and the first protrusion (135) is adapted to the first groove (121).

4. A standing wave heat dissipation micro fan according to claim 3, characterized in that, Also includes: Vibration source (200); The vibration source (200) is located on the side of the active membrane (110) away from the compression frame (120).

5. A standing wave heat dissipation micro fan according to claim 4, characterized in that, The vibration source (200) is attached to the active membrane (110); the vibration source (200) is disposed at the center of the active membrane (110); The vibration source (200) includes a piezoelectric ceramic (210) and an auxiliary electrode (220); the auxiliary electrode (220) is laid on both sides of the piezoelectric ceramic (210).

6. A standing wave heat dissipation micro fan according to claim 5, characterized in that, It also includes a frequency modulation board (500); The frequency modulation board (500) is disposed on the side of the active diaphragm (110) near the vibration source (200); The frequency tuning board (500) surrounds the vibration source (200) and is connected to the active diaphragm (112).

7. A standing wave heat dissipation micro fan according to claim 6, characterized in that, It also includes the outer casing (300); The outer shell (300) is configured as a box-shaped structure with a top opening and a hollow interior; The active membrane (110) is connected to the inner bottom surface of the housing (300) via a damping pad (400), the passive membrane (130) is located at the top of the housing (300), and the vibration source (200) is located inside the housing (300).

8. A standing wave heat dissipation micro fan according to claim 7, characterized in that, The airflow channels include a plurality of air outlets (133) disposed on the passive membrane layer (132); the plurality of air outlets (133) are arranged on the surface of the passive membrane layer (132) in a spaced manner.

9. A standing wave heat dissipation micro fan according to claim 7, characterized in that, The airflow channel includes an air outlet (134) disposed on the side wall of the compressor box (100).

10. A standing wave heat dissipation micro fan according to claim 7, characterized in that, The airflow channel includes a plurality of air outlets (133); the air outlets (133) are located on the surface of the passive membrane layer (132) and / or on the side wall of the compression chamber (100).

11. A standing wave heat dissipation micro fan according to claim 9 or 10, characterized in that, When the airflow channel is provided on the side wall of the compression box (100), the side wall of the outer shell (300) is provided with a notch, and the notch is coaxially aligned with the airflow channel.

12. A standing wave heat dissipation micro fan according to claim 6, characterized in that, The active membrane (110) is connected to at least two vibration damping pads (400) on the side away from the compression frame (120), and is connected to the mounting surface through the vibration damping pads (400); The damping pad (400) disposed on the active membrane (110) is symmetrical about the vibration source (200).

13. A standing wave heat dissipation micro fan according to claim 1, characterized in that, The active membrane (110), the compression frame (120), and the passive membrane (130) are integrally formed.

14. An array heat dissipation device, characterized in that, It includes at least two standing wave heat dissipation micro fans as described in any one of claims 1 to 13.

15. An array heat dissipation device according to claim 14, characterized in that, The array heat dissipation device includes a plurality of standing wave heat dissipation micro fans arranged in the same plane.

16. An array heat dissipation device according to claim 14, characterized in that, The heat dissipation device includes several standing wave heat dissipation micro fans arranged on different planes.

17. An array heat dissipation device according to claim 14, characterized in that, It also includes a mounting bracket (600), on which a plurality of the standing wave heat dissipation micro fans are arranged in an array.

Images