Power module waterway structure

Abstract

The utility model provides a kind of power module waterway structure, comprising: waterway structure and power module, power module includes heat dissipation bottom plate, and heat dissipation bottom plate side is provided with multiple needle fins;Waterway structure includes waterway body and the waterway groove being set on waterway body, and flexible backing plate is set in waterway groove bottom;The side of heat dissipation bottom plate setting needle fin is contacted with the side of waterway main body setting waterway groove, so that needle fin is located in waterway groove and with flexible backing plate is pasted together.The utility model sets flexible backing plate in waterway groove bottom, so that needle fin is pasted together with flexible backing plate, to eliminate the gap of needle fin and waterway groove bottom, thereby reduce the module thermal resistance, improve the consistency of module thermal resistance simultaneously, reduce the influence of processing error to thermal resistance.In addition, due to the setting of flexible backing plate, the height of needle fin on heat dissipation bottom plate and the machining precision of waterway groove depth can be appropriately relaxed, thereby avoiding the increase of cost due to high-precision requirement.

Description

Technical Field

[0001] This utility model relates to the field of electric vehicle technology, and in particular to a power module waterway structure. Background Technology

[0002] To reduce thermal resistance and improve coolant heat dissipation efficiency, the gap between the pin fins of the vehicle power module heat sink base plate and the bottom of the water channel should be as small as possible. Considering the actual module warping and error factors such as parts processing, existing solutions usually design a gap of 0.2mm to 0.5mm to avoid interference between the power module and the water channel during installation.

[0003] However, the gap between the heat sink's fins and the bottom of the water channels reduces the heat transfer efficiency of the water flow and increases the module's thermal resistance to some extent. Reducing this gap requires higher precision in the machining of the heat sink's fin height and water channel depth, increasing costs. Increasing the tolerance range, on the other hand, leads to poorer consistency in thermal resistance between different modules. Utility Model Content

[0004] The purpose of this invention is to provide a power module water channel structure that can reduce module thermal resistance, improve the consistency of module thermal resistance, and reduce the impact of processing errors on thermal resistance.

[0005] To solve the above-mentioned technical problems, this utility model provides a power module water channel structure, including: a water channel structure and a power module installed on the water channel structure. The power module includes a heat dissipation base plate, and a plurality of pin fins are provided on one side of the heat dissipation base plate. The water channel structure includes a water channel body and a water channel groove provided on the water channel body, and a flexible pad is provided at the bottom of the water channel groove. The side of the heat dissipation base plate with the pin fins is in contact with the side of the water channel body with the water channel groove, so that the pin fins are located in the water channel groove and are in contact with the flexible pad.

[0006] Optionally, the thickness of the flexible pad is 2mm to 5mm, and the hardness of the flexible pad is A40 to A70.

[0007] Optionally, the flexible pad is an EPDM rubber flexible pad or a polyurethane rubber flexible pad.

[0008] Optionally, the flexible pad is fixed to the bottom of the waterway groove by an adhesive.

[0009] Optionally, the tolerance zones for the height of the needle fins, the thickness of the flexible pad, and the depth of the water channel groove are located within the interference range.

[0010] Optionally, the interference fit is 0.1mm to 0.7mm.

[0011] Optionally, the power module may further include multiple chips located on the side of the heat sink away from the needle fins.

[0012] Optionally, the needle fins are evenly distributed on the heat dissipation base plate corresponding to the water channel groove.

[0013] Optionally, the density of the needles located below the chip is greater than the density of the needles located in the remaining areas.

[0014] Optionally, the needle-like wings are cylindrical or elliptical.

[0015] In the power module water channel structure provided by this utility model, multiple pin fins are provided on one side of the heat dissipation base plate. The water channel structure includes a water channel body and a water channel groove disposed on the water channel body. A flexible pad is disposed at the bottom of the water channel groove. The side of the heat dissipation base plate with the pin fins is in contact with the side of the water channel body with the water channel groove, so that the pin fins are located in the water channel groove and are in close contact with the flexible pad. This utility model provides a flexible pad at the bottom of the water channel groove, so that the pin fins are in close contact with the flexible pad, thereby eliminating the gap between the pin fins and the bottom of the water channel groove, thereby reducing the module's thermal resistance, improving the consistency of the module's thermal resistance, and reducing the impact of processing errors on thermal resistance. In addition, the setting of the flexible pad allows for a more relaxed processing accuracy for the height of the pin fins and the depth of the water channel groove on the heat dissipation base plate, thereby avoiding increased costs due to high precision requirements. Attached Figure Description

[0016] Those skilled in the art will understand that the accompanying drawings are provided to better understand the present invention and do not constitute any limitation on the scope of the present invention. Wherein:

[0017] Figure 1 This is a cross-sectional view of the power module waterway structure provided in one embodiment of the present invention.

[0018] Explanation of reference numerals in the attached figures:

[0019] 10-Power module; 11-Heat dissipation base; 12-Pin fin; 13-Chip; 20-Water channel structure; 21-Water channel body; 22-Water channel groove; 30-Flexible pad. Detailed Implementation

[0020] The core idea of ​​this invention is to set a flexible pad at the bottom of the water channel groove, with the needle fins located within the groove and in contact with the flexible pad. This close contact eliminates the gap between the needle fins and the bottom of the groove, thereby reducing the module's thermal resistance and improving its consistency, while also minimizing the impact of manufacturing errors on thermal resistance. Furthermore, the flexible pad allows for more flexible machining requirements on the needle fin height and water channel groove depth on the heat dissipation base plate, thus avoiding increased costs due to high precision requirements.

[0021] To make the objectives, advantages, and features of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to facilitate and clarify the explanation of the objectives of the embodiments of this utility model. Furthermore, the structures shown in the drawings are often part of the actual structure. In particular, different drawings may emphasize different aspects and sometimes use different scales.

[0022] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects unless otherwise expressly indicated. As used in this invention, the term “or” is generally used to include “and / or” unless otherwise expressly indicated. As used in this invention, the term “a number” is generally used to include “at least one” unless otherwise expressly indicated. As used in this invention, the term “at least two” is generally used to include “two or more” unless otherwise expressly indicated. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature.

[0023] Figure 1 This is a cross-sectional view of the power module waterway structure provided in one embodiment of this utility model. Please refer to it. Figure 1As shown, the power module water channel structure provided in this embodiment of the utility model includes: a water channel structure 20 and a power module 10 installed on the water channel structure 20. The power module 10 includes a heat dissipation base plate 11, and a plurality of pin fins 12 are provided on one side of the heat dissipation base plate 11. The water channel structure 20 includes a water channel body 21 and a water channel groove 22 provided on the water channel body 21. A flexible pad 30 is provided at the bottom of the water channel groove 22. The side of the heat dissipation base plate 11 where the pin fins 12 are provided is in contact with the side of the water channel body 21 where the water channel groove 22 is provided, so that the pin fins 12 are located in the water channel groove 22 and are in contact with the flexible pad 30.

[0024] This invention incorporates a flexible pad 30 at the bottom of the water channel groove 22, allowing the pin fins 12 to fit snugly against the flexible pad 30. This eliminates the gap between the pin fins 12 and the bottom of the water channel groove 22, thereby reducing the module's thermal resistance and improving its consistency. It also minimizes the impact of manufacturing errors on thermal resistance. Furthermore, the flexible pad 30 allows for more flexible machining requirements on the height of the pin fins 12 and the depth of the water channel groove 22 on the heat dissipation base plate 11, thus avoiding increased costs due to high precision requirements.

[0025] The flexible pad 30 has a certain degree of elasticity, allowing all the needle fins 12 to contact the flexible pad 30, thus avoiding gaps between the needle fins 12 and the bottom of the water channel groove 22. In one embodiment of this utility model, considering factors such as the usage environment, lifespan, and cost, the material of the flexible pad 30 is ethylene propylene diene monomer (EPDM) rubber or polyurethane rubber (TPU). The thickness of the flexible pad 30 is set to 2mm to 5mm, for example, the thickness of the flexible pad 30 is 2mm, 3mm, 4mm, or 5mm, and the thickness of the flexible pad 30 is preferably 4mm. The hardness of the flexible pad 30 is A40 to A70, for example, the hardness of the flexible pad 30 is A40, A50, A60, or A70, and the hardness of the flexible pad 30 is preferably A60. It is understood that the material, thickness, and hardness of the flexible pad 30 are not limited to these and can be selected according to actual conditions.

[0026] In one embodiment of this invention, the flexible pad 30 is fixed to the bottom of the water channel groove 22 by an adhesive. Alternatively, the flexible pad 30 can also be fixed to the bottom of the water channel groove 22 using screws or other fixing devices.

[0027] In one embodiment of this utility model, the tolerance zones of the height of the needle wing 12, the thickness of the flexible pad 30, and the depth of the water channel groove 22 are located within the interference range, and the interference amount is, for example, 0.1mm to 0.7mm, to ensure that there is no gap between the needle wing 12 and the flexible pad 30.

[0028] Please refer to Figure 1 As shown, the power module 10 also includes a plurality of chips 13, which are located on the side of the heat dissipation base plate 11 away from the needle fins 12. Figure 1 Three of the chips 13 are shown, but the number of chips 13 is not limited to this.

[0029] Coolant is disposed within the water channel groove 22 to dissipate heat from the power module 10. The side of the heat dissipation base plate 11 with the pin fins 12 contacts and is fixedly connected to the side of the water channel body 21 with the water channel groove 22. The water channel groove 22 forms a coolant flow channel, and the pin fins 12 are completely accommodated within the water channel groove 22, thereby allowing the coolant flowing through the water channel groove 22 to pass through the pin fins 12, thus achieving a heat dissipation effect.

[0030] In one embodiment, the needle fins 12 are evenly distributed on the heat dissipation base plate 11 corresponding to the water channel groove 22. Please refer to... Figure 1 As shown, the heat dissipation base plate 11 includes a central region where the needle fins 12 are disposed and an edge region that contacts the water channel body 21. The needle fins 12 are evenly distributed on the central region. For example, the needle fins 12 can be arranged regularly in a matrix form in the row and column directions.

[0031] In one embodiment, the heat dissipation base plate 11 includes a central region where the pin fins 12 are disposed and an edge region that contacts the water channel body 21. The density of the pin fins 12 located below the chip 13 is greater than the density of the pin fins 12 located in the other regions. That is, the region where the pin fins 12 are disposed includes the region covered by the chip 13 and the region not covered by the chip 13 (e.g., the region between adjacent chips 13). The density of the pin fins 12 in the region covered by the chip 13 is greater than the density of the pin fins 12 in the region not covered by the chip 13, thereby increasing the heat dissipation effect on the chip 13. In another embodiment, the pin fins 12 may not be disposed in the region not covered by the chip 13. Of course, the density of the pin fins 12 below the chip 13 can also be set according to the heat dissipation requirements of different chips 13.

[0032] The water channel groove 22 has a coolant inlet and an outlet on opposite sides to allow coolant flow. In one embodiment, the pin fins 12 are distributed in multiple regions from the coolant inlet to the coolant outlet, each region corresponding to the chip 13 disposed on the heat dissipation base plate 11. For example, the multiple pin fins 12 are divided into three regions: a first region, a second region, and a third region. The first region is close to the coolant inlet, the third region is close to the coolant outlet, and the second region is located between the first region and the second region. The distribution of the pin fins 12 in the first region is relatively sparse compared to the second and third regions, resulting in a less significant heat dissipation effect for the chip 13 in the first region. The distribution of the pin fins 12 in the second region is relatively sparse compared to the third region but denser compared to the first region, resulting in a more significant heat dissipation effect for the chip 13 in the second region. The distribution of the pin fins 12 in the third region is the densest, resulting in the most significant heat dissipation effect for the chip 13 in the third region. This ensures that the coolant can still achieve good heat dissipation after heat exchange, thereby controlling the temperature difference between the individual chips 13 and improving the reliability and lifespan of the entire module.

[0033] In another embodiment, the density of the pin fins 12 can gradually increase from the coolant outlet to the coolant inlet. As the coolant temperature gradually rises from the inlet to the outlet due to heat exchange, the density of the pin fins 13 also gradually increases, thus increasing the heat dissipation of the power module. This allows the coolant to still achieve good heat dissipation after heat exchange, thereby controlling the temperature difference between the individual chips 13 and improving the reliability and lifespan of the entire module.

[0034] In one embodiment, the needle wing 12 may be cylindrical or elliptical, or any suitable shape known to those skilled in the art, such as a cuboid.

[0035] In this embodiment of the invention, the flexible pad 30 eliminates the gap between the fins 12 of the heat dissipation base plate 11 and the bottom of the water channel groove 22, thus preventing a reduction in the heat exchange efficiency of the coolant and consequently reducing the module's thermal resistance. In one embodiment, thermal simulation of the power module water channel structure is performed. Simulations are conducted on the power module water channel structure with the flexible pad 30 and the power module water channel structure without the flexible pad 30, where the fins 12 have a gap with the bottom of the water channel groove 22. The simulated thermal resistance of the power module water channel structure with a 0.5mm gap is 0.09155K / W, the simulated thermal resistance of the power module water channel structure with a 0.2mm gap is 0.08994K / W, and the simulated thermal resistance of the power module water channel structure with the flexible pad 30 is 0.08927K / W. According to simulation results, the module with flexible pad 30 has a thermal resistance that is about 0.74% lower than that of the module with a 0.2mm gap and about 2.49% lower than that of the module with a 0.5mm gap.

[0036] In addition, a flexible pad 30 is provided at the bottom of the water channel groove 22 so that the needle fin 12 fits into the flexible pad 30, thereby eliminating the gap between the needle fin 12 and the bottom of the water channel groove 22. Therefore, there is no need to have high requirements for the machining accuracy of the height of the needle fin 12 and the depth of the water channel groove 22 on the heat dissipation base plate 11. The machining accuracy of the height of the needle fin 12 and the depth of the water channel groove 22 can be appropriately relaxed, thereby avoiding the increase in cost caused by high precision requirements.

[0037] Meanwhile, since the gap between the needle fin 12 and the bottom of the water channel groove 22 is eliminated, there is no need to increase the tolerance range, and it will not cause the thermal resistance consistency between different modules to deteriorate, thereby improving the consistency of module thermal resistance and reducing the impact of processing errors on thermal resistance.

[0038] In summary, the power module water channel structure provided by this utility model includes multiple pin fins on one side of the heat dissipation base plate. The water channel structure comprises a water channel body and a water channel groove on the water channel body. A flexible pad is provided at the bottom of the water channel groove. The side of the heat dissipation base plate with the pin fins contacts the side of the water channel body with the water channel groove, so that the pin fins are located within the water channel groove and are in contact with the flexible pad. This utility model provides a flexible pad at the bottom of the water channel groove, allowing the pin fins to fit snugly against the flexible pad, eliminating gaps between the pin fins and the bottom of the water channel groove. This reduces the module's thermal resistance, improves the consistency of the module's thermal resistance, and reduces the impact of processing errors on thermal resistance. Furthermore, the flexible pad allows for a more relaxed processing precision for the height of the pin fins and the depth of the water channel groove on the heat dissipation base plate, thus avoiding increased costs due to high precision requirements.

[0039] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model. Any person skilled in the art can make possible changes and modifications to the technical solution of the present utility model by using the methods and techniques disclosed above without departing from the spirit and scope of the present utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the content of the technical solution of the present utility model shall fall within the protection scope of the technical solution of the present utility model.

Claims

1. A power module waterway structure, characterized in that, include: The water channel structure and the power module installed on the water channel structure, the power module including a heat dissipation base plate, a plurality of pin fins being provided on one side of the heat dissipation base plate; the water channel structure including a water channel body and a water channel groove provided on the water channel body, a flexible pad being provided at the bottom of the water channel groove; the side of the heat dissipation base plate with the pin fins contacting the side of the water channel body with the water channel groove, such that the pin fins are located in the water channel groove and are in contact with the flexible pad.

2. The power module waterway structure according to claim 1, characterized in that, The thickness of the flexible pad is 2mm to 5mm, and the hardness of the flexible pad is A40 to A70.

3. The power module waterway structure according to claim 1, characterized in that, The flexible pad is an EPDM rubber flexible pad or a polyurethane rubber flexible pad.

4. The power module waterway structure according to claim 1, characterized in that, The flexible pad is fixed to the bottom of the waterway groove with an adhesive.

5. The power module waterway structure according to claim 1, characterized in that, The tolerance zones for the height of the needle fins, the thickness of the flexible pad, and the depth of the water channel groove are within the interference range.

6. The power module waterway structure according to claim 5, characterized in that, The interference fit is 0.1mm to 0.7mm.

7. The power module waterway structure according to claim 1, characterized in that, The power module also includes multiple chips located on the side of the heat sink away from the needle fins.

8. The power module waterway structure according to claim 7, characterized in that, The needle fins are evenly distributed on the heat dissipation base plate corresponding to the water channel groove.

9. The power module waterway structure according to claim 7, characterized in that, The density of the needles located below the chip is greater than the density of the needles located in the remaining areas.

10. The power module waterway structure according to any one of claims 1 to 9, characterized in that, The needle-like wings are cylindrical or elliptical.

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