Diode assembly apparatus

Abstract

The application provides a diode assembly device, which comprises a feeding assembly and a transfer assembly; the feeding assembly is provided with a hopper module and a feeding module; the feeding module is connected to the hopper module and sequentially conveys diodes output by the hopper module; the transfer assembly comprises a multi-axis moving module and a suction module; the multi-axis moving module is provided with a moving seat which moves along the X-axis direction and the Y-axis direction; the suction module is installed on the moving seat and moves with the moving seat; the suction module is used for sucking diodes; wherein, the suction module is driven by the moving seat to approach the feeding module and can suck diodes conveyed by the feeding module; the suction module is driven by the moving seat to move to an external conveying line and assembles diodes to diodes on the conveying line to realize the assembly of diodes and heat sinks, avoids the assembly of diodes and heat sinks under the action of human beings and improves the assembly efficiency of the diode assembly device.

Description

Technical Field

[0001] This utility model relates to the technical field of diode assembly devices, and more particularly to a diode assembly device. Background Technology

[0002] With the development of technology, diode assembly equipment has been applied in industry to assemble diodes. In existing technology, diode assembly equipment includes a hopper module and a feeding module. The hopper module outputs diodes; the feeding module connects to the hopper module and sequentially conveys the diodes output from the hopper module. Assembly personnel then assemble the diodes from the hopper module onto a heat sink. This assembly process, where the diodes and heat sink are assembled manually, results in low assembly efficiency for existing diode assembly equipment. Utility Model Content

[0003] The purpose of this invention is to provide a diode assembly device. The feeding assembly includes a hopper module and a feeding module. The hopper module outputs diodes. The feeding module connects to the hopper module and sequentially feeds the diodes output from the hopper module. A transfer assembly is located on one side of the feeding assembly. The transfer assembly includes a multi-axis moving module and an adsorption module. The multi-axis moving module has a moving base that moves along the X-axis and Y-axis. The adsorption module is mounted on the moving base and moves with it. The adsorption module is used to adsorb diodes. Driven by the moving base, the adsorption module approaches the feeding module and adsorbs the diodes fed by the feeding module. Further, driven by the moving base, the adsorption module moves to an external conveyor line and assembles the diodes onto the conveyor line, thus achieving diode-heat sink assembly. This avoids manual assembly of the diodes and heat sink, improving the assembly efficiency of the diode assembly device.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a diode assembly apparatus for assembling diodes, the diode assembly apparatus comprising:

[0005] The feeding assembly includes a hopper module and a feeding module. The hopper module is used to output diodes. The feeding module connects to the hopper module and sequentially feeds the diodes output by the hopper module.

[0006] A transfer assembly is disposed on one side of the feeding assembly; the transfer assembly includes a multi-axis moving module and an adsorption module; the multi-axis moving module is provided with a moving base, which moves along the X-axis and Y-axis directions; the adsorption module is mounted on the moving base and moves with the moving base; the adsorption module is used to adsorb diodes.

[0007] The adsorption module is driven by the moving seat to approach the feeding module and can adsorb the diodes conveyed by the feeding module. Furthermore, the adsorption module is driven by the moving seat to move to the external conveying line and assemble the diodes onto the diodes on the conveying line.

[0008] Optionally, there are multiple adsorption modules, and the multiple adsorption modules are arranged at intervals along the width direction of the movable seat;

[0009] A camera is provided between two adjacent adsorption modules. The camera is mounted on the movable base and is used to photograph the diodes on the conveyor line.

[0010] Multiple adsorption modules and the camera are located on the same movable seat.

[0011] Optionally, the adsorption module is provided with a support base and an adsorption element. The support base is connected to the movable base, and the adsorption element is installed on the support base and adsorbs diodes under negative pressure.

[0012] Optionally, the adsorption element includes an adsorption tube and a first adsorption head;

[0013] The adsorption tube is used to connect to an external gas source, and the adsorption tube is installed on the support base;

[0014] The first adsorption head is connected to the adsorption tube and is used to adsorb diodes.

[0015] Optionally, the support base is vertically mounted on the movable base and moves up and down along the Z-axis.

[0016] A lifting module is provided between the support base and the movable base, and the lifting module includes a first motor and a first transmission module;

[0017] The first motor is fixed to the movable base, one end of the first transmission module is connected to the output end of the first motor, and the other end of the first transmission module is connected to the support base.

[0018] Optionally, the first transmission module is provided with a synchronous belt, which extends along the Z-axis and rotates in a ring under the drive of the first motor;

[0019] The support base is connected to the connection point of the synchronous belt and rises and falls as the synchronous belt rotates in a ring.

[0020] The support base is connected to the movable base via a guide rail that extends along the Z-axis.

[0021] Optionally, the adsorption tube is rotatably connected to the support base, and the first adsorption head rotates as the adsorption tube rotates;

[0022] A second motor and a second transmission module are provided between the adsorption tube and the movable base. The second motor is fixedly connected to the movable base, one end of the second transmission module is connected to the output end of the second motor, and the other end of the second transmission module is connected to the adsorption tube, thereby driving the adsorption tube to rotate relative to the support base.

[0023] Optionally, the transfer assembly further includes a first frame, on which the multi-axis moving module is mounted;

[0024] The multi-axis motion module includes an X-axis motion module and a Y-axis motion module, which are connected to each other and drive the moving seat to move along the X-axis and Y-axis directions.

[0025] Optionally, the feeding module includes a positioning seat, a feeding plate, and multiple second suction heads;

[0026] The positioning base is provided with multiple positioning slots, all of which are used to position the diode.

[0027] The feeding plate is movably connected to the first frame and can move along the Y-axis and Z-axis directions;

[0028] The feeding plate is connected to a plurality of second adsorption heads, which are located at different positions on the feeding plate and pass through a plurality of positioning slots in sequence as the feeding plate moves, so that the diode passes through each positioning slot in sequence along the length direction of the positioning seat and can be adsorbed by the adsorption module.

[0029] Optionally, the hopper module includes a second frame, a hopper, and a push rod;

[0030] The second rack is disposed on one side of the first rack;

[0031] The hopper is installed on the second frame, and the hopper is provided with a receiving cavity for accommodating diodes in a tube state;

[0032] The push rod is movably mounted on the second frame and passes through the hopper to push the diode in the receiving cavity, which can be attracted by the second adsorption head.

[0033] Compared with the prior art, the beneficial effects of this utility model are:

[0034] This invention provides a diode assembly device. The feeding assembly includes a hopper module and a feeding module. The hopper module outputs diodes. The feeding module connects to the hopper module and sequentially feeds the diodes output from the hopper module. A transfer assembly is located on one side of the feeding assembly. The transfer assembly includes a multi-axis moving module and an adsorption module. The multi-axis moving module has a moving base that moves along the X-axis and Y-axis. The adsorption module is mounted on the moving base and moves with it. The adsorption module is used to adsorb diodes. Driven by the moving base, the adsorption module approaches the feeding module and adsorbs the diodes fed by the feeding module. Further, driven by the moving base, the adsorption module moves to an external conveyor line and assembles the diodes onto the conveyor line, thus achieving diode-heat sink assembly. This avoids manual assembly of the diodes and heat sinks, improving the assembly efficiency of the diode assembly device. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings. In the following description, the same reference numerals denote the same parts.

[0037] Figure 1 A schematic diagram of a diode assembly apparatus according to an embodiment of this application is shown.

[0038] Figure 2 A schematic diagram of another state of a diode assembly apparatus according to one embodiment of this application is shown.

[0039] Figure 3 A schematic diagram of the loading assembly of a diode assembly apparatus according to an embodiment of this application is shown.

[0040] Figure 4 A schematic diagram of a hopper module of a diode assembly apparatus according to an embodiment of this application is shown.

[0041] Figure 5 A schematic diagram of a feeding module of a diode assembly apparatus according to an embodiment of this application is shown.

[0042] Figure 6 A schematic diagram of a transfer component of a diode assembly apparatus according to an embodiment of this application is shown.

[0043] Figure 7 A schematic diagram of the adsorption module of a diode assembly apparatus according to an embodiment of this application is shown.

[0044] Figure Labels

[0045] 100. Diode assembly equipment;

[0046] 10. Feeding assembly; 11. Hopper module; 111. Second frame; 112. Hopper; 112a. Receiving cavity; 113. Push rod; 114. Third motor; 12. Feeding module; 121. Positioning seat; 121a. Positioning groove; 122. Feeding plate; 123. Second suction head; 124. First cylinder; 125. Movable plate; 126. Second cylinder;

[0047] 20. Transfer assembly; 21. Multi-axis moving module; 211. Moving base; 212. X-axis moving module; 213. Y-axis moving module; 22. Adsorption module; 221. Support base; 222. Adsorption element; 2221. Adsorption tube; 2222. First adsorption head; 23. Camera; 24. Lifting module; 241. First motor; 242. First transmission module; 2421. Synchronous belt; 2422. Synchronous pulley; 25. Second motor; 26. Second transmission module; 27. First frame. Detailed Implementation

[0048] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0049] Please refer to the attached document. Figures 1-7 This application provides a diode assembly apparatus 100 for assembling diodes.

[0050] Please refer to the attached document. Figures 1-7In this embodiment, the diode assembly apparatus 100 includes a feeding assembly 10 and a transfer assembly 20. The feeding assembly 10 is provided with a hopper module 11 and a feeding module 12. The hopper module 11 is used to output diodes; the feeding module 12 docks with the hopper module 11 and sequentially conveys the diodes output by the hopper module 11. The transfer assembly 20 is disposed on one side of the feeding assembly 10. The transfer assembly 20 includes a multi-axis moving module 21 and an adsorption module 22. The multi-axis moving module 21 is provided with a moving seat 211, which moves along the X-axis and Y-axis directions. The adsorption module 21... 2 is installed on the movable base 211 and moves with the movable base 211; the adsorption module 22 is used to adsorb diodes; wherein, the adsorption module 22 is driven by the movable base 211 to approach the feeding module 12 and can adsorb the diodes conveyed by the feeding module 12. Furthermore, the adsorption module 22 is driven by the movable base 211 to move to the external conveying line and assemble the diodes to the diodes on the conveying line, so as to realize the assembly of diodes and heat sinks, avoid the assembly of diodes and heat sinks under human action, and improve the assembly efficiency of diode assembly device 100.

[0051] Please refer to the attached document. Figures 1-5 In this embodiment, the feeding assembly 10 is provided with a hopper module 11 and a feeding module 12. The hopper module 11 is used to output diodes so that the diodes can be adjusted from one position to another, thereby facilitating the position transfer of the diodes. The feeding module 12 docks with the hopper module 11 and sequentially feeds the diodes output by the hopper module 11 so that the feeding module 12 can receive the diodes output by the hopper module 11, thereby facilitating the diodes of the hopper module 11 to be in the feeding module 12.

[0052] Please refer to the attached document. Figures 1-2 6-7, the transfer component 20 is located on the right side of the feeding component 10; the transfer component 20 includes a multi-axis moving module 21 and an adsorption module 22; the multi-axis moving module 21 is provided with a moving seat 211, which moves along the X-axis and Y-axis directions to facilitate adjustment of the position of the moving seat 211 in the X-axis and Y-axis directions, thereby facilitating the movement of the moving seat 211 in multiple directions and improving the movement flexibility of the moving seat 211; the adsorption module 22 is installed on the moving seat 211 and moves with the moving seat 211 to facilitate adjustment of the position of the adsorption module 22 in the X-axis and Y-axis directions; the adsorption module 22 is used to adsorb diodes; so that the adsorption module 22 can drive the diodes to move in position, thereby facilitating the adjustment of the diodes' position to realize the transfer of the diodes.

[0053] The adsorption module 22 is driven by the moving base 211 to approach the feeding module 12 and can adsorb the diodes conveyed by the feeding module 12. Furthermore, the adsorption module 22 is driven by the moving base 211 to move to the external conveying line and assemble the diodes on the conveying line to realize the assembly of the diodes and the heat sink. This avoids the assembly of the diodes and the heat sink under human intervention and improves the assembly efficiency of the diode assembly device 100.

[0054] Please refer to the attached document. Figures 1-2 In embodiments of this application, the adsorption module 22 has multiple modules, which are arranged at intervals along the width direction of the movable seat 211. The multiple adsorption modules 22 can adsorb multiple diodes at the same time. By arranging multiple adsorption modules 22, the assembly efficiency of the diodes relative to the diodes is increased, and the assembly time of multiple diodes and heat sinks is saved.

[0055] Please refer to the attached document. Figures 1-2 6-7, a camera 23 is provided between two adjacent adsorption modules 22. The camera 23 is mounted on the movable base 211 so that the camera 23 can move with the movable base 211, thereby facilitating the adjustment of the position of the camera 23. The camera 23 is used to photograph the diodes on the conveyor line. Multiple adsorption modules 22 and the camera 23 are located on the same movable base 211. The position of the diode is confirmed by the action of the camera 23, so that the diodes adsorbed by multiple adsorption modules 22 can be aligned with the assembly position of the diodes, thereby facilitating the multiple adsorption modules 22 to release the diodes, so as to realize the assembly of the diodes and the heat sink.

[0056] Please refer to the attached document. Figures 1-2 In embodiments 6-7 of this application, the adsorption module 22 is provided with a support base 221 and an adsorption element 222. The support base 221 is located on the side of the moving base 211 away from the feeding assembly 10. The support base 221 is connected to the moving base 211 so that the adsorption module 22 can be connected to the moving base 211 through the support base 221, thereby facilitating the movement of the support base 221 as the moving base 211 moves. The adsorption element 222 is installed on the support base 221 so that the adsorption element 222 can move as the support base 221 moves, thereby facilitating the adjustment of the position of the adsorption element 222, so that the adsorption element 222 can be moved from the feeding module 12 to the diode on the conveyor line. The adsorption element 222 adsorbs the diode under negative pressure so that the adsorption element 222 can drive the diode to be transferred to the diode on the conveyor line. When the adsorption element 222 releases the diode, the diode and the heat sink are assembled.

[0057] Please refer to the attached document. Figures 1-2In embodiments 6-7 of this application, the adsorption element 222 includes an adsorption tube 2221 and a first adsorption head 2222; the adsorption tube 2221 is used to connect to an external gas source, and the adsorption tube 2221 is installed on the support base 221 so that the adsorption element 222 can be connected to the support base 221 through the adsorption tube 2221; the first adsorption head 2222 is disposed on the lower side of the adsorption tube 2221, the first adsorption head 2222 is connected to the adsorption tube 2221, and is used to adsorb diodes. When the external gas source draws gas, it sequentially passes through the first adsorption head... When the gas passes through the first adsorption head 2222 and the adsorption tube 2221, the first adsorption head 2222 adsorbs the diode under negative pressure, so that the diode is fixed to the first adsorption head 2222. This makes it easier for the diode to move with the first adsorption head 2222, and thus easier for the diode to move from the feeding module 12 to the diode in the conveyor line. When the external gas source releases the gas that passes through the first adsorption head 2222 and the adsorption tube 2221 in sequence, the first adsorption head 2222 releases the diode, so as to realize the assembly of the diode and the heat sink.

[0058] Please refer to the attached document. Figures 1-2 In embodiments of this application, the support base 221 is vertically mounted on the movable base 211 and moves up and down along the Z-axis to adjust the height position of the support base 221 relative to the movable base 211, thereby facilitating the height adjustment of the adsorption member 222 as the height of the support base 221 is adjusted.

[0059] Please refer to the attached document. Figures 1-2 At points 6-7, a lifting module 24 is provided between the support base 221 and the movable base 211. The lifting module 24 is located between the support base 221 and the movable base 211. The lifting module 24 includes a first motor 241 and a first transmission module 242. The first motor 241 is fixed to the movable base 211. One end of the first transmission module 242 is connected to the output end of the first motor 241, and the other end of the first transmission module 242 is connected to the support base 221. This allows the first motor 241 to drive the support base 221 to move via the first transmission module 242 under the driving action, thereby facilitating the lifting of the support base 221 along the Z-axis direction via the first motor 241 and the first transmission module 242.

[0060] Please refer to the attached document. Figures 1-2In embodiments 6 and 7 of this application, the first transmission module 242 is provided with a synchronous belt 2421, which extends along the Z-axis and rotates in a ring under the drive of the first motor 241. A support seat 221 is connected to the connection point of the synchronous belt 2421 and rises and falls with the ring rotation of the synchronous belt 2421. This facilitates the lifting and lowering of the support seat 221 under the cooperation of the first motor 241 and the synchronous belt 2421, thereby making it easier to adjust the position of the support seat 221 relative to the movable seat 211. The support seat 221 is connected to the movable seat 211 via a guide rail that extends along the Z-axis. This guide rail improves the smoothness of the lifting and lowering of the support seat 221 relative to the movable seat 211. Simultaneously, the support seat 221 rises and falls under the guidance of the guide rail, preventing positional deviation during the lifting and lowering process.

[0061] Please refer to the attached document. Figures 1-2 6-7, the first transmission module 242 is provided with two synchronous pulleys 2422. One synchronous pulley 2422 is connected to the first motor 241. The two synchronous pulleys 2422 mesh with the synchronous belt 2421. When the first motor 241 drives one synchronous pulley 2422 to rotate, the synchronous belt 2421 rotates along with the synchronous pulley 2422 to achieve the rotation effect of the synchronous belt 2421.

[0062] Please refer to the attached document. Figures 1-2 In embodiments of this application, the adsorption tube 2221 is rotatably connected to the support base 221 to facilitate adjustment of the angular position of the adsorption tube 2221 relative to the support base 221. The first adsorption head 2222 rotates with the rotation of the adsorption tube 2221 to facilitate adjustment of the angular arrangement of the first adsorption head 2222, thereby facilitating the directional change of the first adsorption head 2222.

[0063] Please refer to the attached document. Figures 1-2 In sections 6-7, a second motor 25 and a second transmission module 26 are provided between the adsorption tube 2221 and the movable base 211. The second motor 25 is located on the side of the movable base 211 facing away from the adsorption tube 2221 and is fixedly connected to the movable base 211. One end of the second transmission module 26 is connected to the output end of the second motor 25, and the other end of the second transmission module 26 is connected to the adsorption tube 2221, driving the adsorption tube 2221 to rotate relative to the support base 221. This allows the adsorption tube 2221 to automatically rotate relative to the support base 221 through the cooperation of the second motor 25 and the second transmission module 26, thereby facilitating the rotation of the first adsorption head 2222 by the adsorption tube 2221 and thus facilitating the direction change of the first adsorption head 2222. Optionally, the second transmission module 26 is a synchronous pulley 2422 transmission module.

[0064] Please refer to the attached document. Figures 1-2In embodiment 6 of this application, the transfer assembly 20 further includes a first frame 27, and a multi-axis moving module 21 is disposed on the upper side of the first frame 27. The multi-axis moving module 21 is mounted on the first frame 27 so that the multi-axis moving module 21 is fixed to the upper side of the first frame 27. The multi-axis moving module 21 includes an X-axis moving module 212 and a Y-axis moving module 213, which are respectively oriented towards the X-axis and Y-axis directions of the first frame 27. The X-axis moving module 212 and the Y-axis moving module 213 are interconnected and drive the moving seat 211 to move along the X-axis and Y-axis directions, so that the moving seat 211 can move along the X-axis and Y-axis directions under the action of the X-axis moving module 212 and the Y-axis moving module 213.

[0065] Please refer to the attached document. Figures 1-5 In this embodiment, the feeding module 12 includes a positioning seat 121, a feeding plate 122, and a plurality of second suction heads 123. The positioning seat 121 is disposed on the upper side of the first frame 27 and is fixed to the first frame 27. The positioning seat 121 is provided with a plurality of positioning grooves 121a. The positioning grooves 121a are recessed from top to bottom by the positioning seat 121, and the opening of the positioning grooves 121a faces upward. The outer contour of the diode is adapted to the inner contour of the positioning grooves 121a. The plurality of positioning grooves 121a are used to position the diode so that the diode can be accommodated in the positioning seat 121 through the positioning grooves 121a, thus ensuring the positional accuracy of the diode relative to the positioning seat 121.

[0066] Please refer to the attached document. Figures 1-5 The positioning base 121 extends along the Y-axis direction, and multiple positioning slots 121a are arranged along the length direction of the positioning base 121. The feeding plate 122 is movably connected to the first frame 27 and moves along the Y-axis and Z-axis directions to adjust the position of the feeding plate 122 relative to the first frame 27, thereby facilitating the adjustment of diodes in different positioning slots 121a to the next positioning slot 121a during the movement of the feeding plate 122.

[0067] Please refer to the attached document. Figures 1-5 The feeding plate 122 is connected to multiple second adsorption heads 123. The multiple second adsorption heads 123 are located at different positions on the feeding plate 122 and pass through multiple positioning slots 121a in sequence as the feeding plate 122 moves. This allows the diodes to pass through each positioning slot 121a in sequence along the length of the positioning seat 121. This enables the feeding plate 122 to drive multiple diodes through each positioning slot 121a in sequence via the multiple second adsorption heads 123. This facilitates the multiple diodes to pass through the positioning slots 121a close to the adsorption module 22 in sequence and be adsorbed by the adsorption module 22. This allows the adsorption module 22 to transfer the diodes in the positioning slots 121a to the diodes on the conveyor line.

[0068] Please refer to the attached document. Figures 1-5 The feeding module 12 also includes a first cylinder 124, a movable plate 125, and a second cylinder 126. The first cylinder 124 is arranged along the Y-axis direction. The movable plate 125 is connected to the first cylinder 124 and moves along the Y-axis direction under the drive of the first cylinder 124. The second cylinder 126 is connected to the movable plate 125 and moves with the movable plate 125 to achieve position adjustment of the second cylinder 126 along the Y-axis direction. The second cylinder 126 is arranged along the Z-axis direction. The feeding plate 122 is connected to the second cylinder 126 and moves along the Z-axis direction under the drive of the second cylinder 126, so that the feeding plate 122 can move along the Y-axis and Z-axis directions through the cooperation of the first cylinder 124 and the second cylinder 126.

[0069] Please refer to the attached document. Figures 1-5 In this embodiment, the hopper module 11 includes a second frame 111, a hopper 112, and a push rod 113. The second frame 111 is located on the left side of the first frame 27. The hopper 112 is located on the upper side of the second frame 111 and is mounted on the second frame 111 to ensure that the hopper 112 is fixed to the upper side of the second frame 111. The hopper 112 has a receiving cavity 112a for accommodating diodes in a tube state. This allows the diodes in the tube state to be accommodated in the hopper 112 through the space of the receiving cavity 112a, thus facilitating the placement of the diodes in the tube state inside the hopper 112.

[0070] Please refer to the attached document. Figures 1-5 The push rod 113 is arranged along the Y-axis and is movably mounted on the second frame 111 to adjust the position of the push rod 113 relative to the second frame 111. The push rod 113 passes through the hopper 112 to push the diode in the receiving cavity 112a so that the diode moves closer to the feeding module 12 under the pushing action of the push rod 113. The diode can be attracted by the second adsorption head 123 so that the diode in the receiving cavity 112a is transferred to the positioning groove 121a under the action of the second adsorption head 123, thereby facilitating the transfer of the diode in the hopper module 11 to the feeding module 12.

[0071] Please refer to the attached document. Figure 4 The hopper module 11 is equipped with a third motor 114, which is fixed to the hopper 112. The output end of the third motor 114 is connected to the push rod 113. Under the action of the third motor 114, the push rod 113 pushes the diode in the receiving cavity 112a.

[0072] Operation flow: Multiple diodes are placed in the receiving cavity 112a of the hopper 112. The third motor 114 drives the push rod 113 to move the diodes in the receiving cavity 112a toward the feeding module 12. The second suction head 123 of the feeding plate 122 suctions the diodes in the receiving cavity 112a. The diodes fixed to the second suction head 123 pass through the positioning slots 121a in sequence with the cooperation of the first cylinder 124 and the second cylinder 126. The first suction head 2222 transfers the diodes through the positioning slots 121a to the diodes on the conveyor line under the action of the multi-axis moving module 21. When the first suction head 2222 releases the diode, the assembly of the diode and the heat sink is realized.

[0073] Compared with the prior art, the beneficial effects of this utility model are:

[0074] This utility model provides a diode assembly device 100. The feeding assembly 10 includes a hopper module 11 and a feeding module 12. The hopper module 11 outputs diodes; the feeding module 12 connects to the hopper module 11 and sequentially feeds the diodes output from the hopper module 11. A transfer assembly 20 is disposed on one side of the feeding assembly 10. The transfer assembly 20 includes a multi-axis moving module 21 and an adsorption module 22. The multi-axis moving module 21 has a moving base 211, which moves along the X-axis and Y-axis directions. The adsorption module 22 is mounted on the moving base 211. 11, and moves along with the moving seat 211; the adsorption module 22 is used to adsorb diodes; wherein, the adsorption module 22 is driven by the moving seat 211 to approach the feeding module 12, and can adsorb the diodes conveyed by the feeding module 12. Further, the adsorption module 22 is driven by the moving seat 211 to move to the external conveying line, and assembles the diodes onto the diodes on the conveying line, so as to realize the assembly of the diodes and the heat sink, avoiding the assembly of the diodes and the heat sink under human intervention, and improving the assembly efficiency of the diode assembly device 100.

[0075] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0076] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features.

[0077] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A diode assembly apparatus, characterized in that, For assembling diodes, the diode assembly apparatus includes: The feeding assembly includes a hopper module and a feeding module. The hopper module is used to output diodes. The feeding module connects to the hopper module and sequentially feeds the diodes output by the hopper module. A transfer assembly is disposed on one side of the feeding assembly; the transfer assembly includes a multi-axis moving module and an adsorption module; the multi-axis moving module is provided with a moving base, which moves along the X-axis and Y-axis directions; the adsorption module is mounted on the moving base and moves with the moving base; the adsorption module is used to adsorb diodes; The adsorption module is driven by the moving seat to approach the feeding module and can adsorb the diodes conveyed by the feeding module. Furthermore, the adsorption module is driven by the moving seat to move to the external conveying line and assemble the diodes onto the diodes on the conveying line.

2. The diode assembly apparatus according to claim 1, characterized in that, The adsorption module is a plurality of such modules, which are arranged at intervals along the width direction of the movable seat. A camera is provided between two adjacent adsorption modules. The camera is mounted on the movable base and is used to photograph the diodes on the conveyor line. Multiple adsorption modules and the camera are located on the same movable seat.

3. The diode assembly apparatus according to claim 1, characterized in that, The adsorption module is provided with a support base and an adsorption element. The support base is connected to the movable base, and the adsorption element is installed on the support base and adsorbs diodes under negative pressure.

4. The diode assembly apparatus according to claim 3, characterized in that, The adsorption element includes an adsorption tube and a first adsorption head; The adsorption tube is used to connect to an external gas source, and the adsorption tube is installed on the support base; The first adsorption head is connected to the adsorption tube and is used to adsorb diodes.

5. The diode assembly apparatus according to claim 4, characterized in that, The support base is vertically and flexibly mounted on the movable base and moves up and down along the Z-axis. A lifting module is provided between the support base and the movable base, and the lifting module includes a first motor and a first transmission module; The first motor is fixed to the movable base, and one end of the first transmission module is connected to the first... The output end of a motor is connected to the support base, and the other end of the first transmission module is connected to the support base.

6. The diode assembly apparatus according to claim 5, characterized in that, The first transmission module is equipped with a synchronous belt, which extends along the Z-axis and rotates in a ring under the drive of the first motor; The support base is connected to the connection point of the synchronous belt and rises and falls as the synchronous belt rotates in a ring. The support base is connected to the movable base via a guide rail that extends along the Z-axis.

7. The diode assembly apparatus according to claim 5, characterized in that, The adsorption tube is rotatably connected to the support base, and the first adsorption head rotates as the adsorption tube rotates; A second motor and a second transmission module are provided between the adsorption tube and the movable base. The second motor is fixedly connected to the movable base, one end of the second transmission module is connected to the output end of the second motor, and the other end of the second transmission module is connected to the adsorption tube, thereby driving the adsorption tube to rotate relative to the support base.

8. The diode assembly apparatus according to any one of claims 1 to 7, characterized in that, The transfer assembly also includes a first frame, on which the multi-axis moving module is mounted; The multi-axis motion module includes an X-axis motion module and a Y-axis motion module, which are interconnected and drive the moving seat to move along the X-axis and Y-axis directions.

9. The diode assembly apparatus according to claim 8, characterized in that, The feeding module includes a positioning seat, a feeding plate, and multiple second suction heads; The positioning base is provided with multiple positioning slots, all of which are used to position the diode; The feeding plate is movably connected to the first frame and can move along the Y-axis and Z-axis directions; The feeding plate is connected to a plurality of second adsorption heads, which are located at different positions on the feeding plate and pass through a plurality of positioning slots in sequence as the feeding plate moves, so that the diode passes through each positioning slot in sequence along the length direction of the positioning seat and can be adsorbed by the adsorption module.

10. The diode assembly apparatus according to claim 9, characterized in that, The hopper module is equipped with a second frame, a hopper, and a push rod; The second rack is disposed on one side of the first rack; The hopper is installed on the second frame, and the hopper is provided with a receiving cavity for accommodating diodes in a tube state; The push rod is movably mounted on the second frame and passes through the hopper to push the diode in the receiving cavity, which can be attracted by the second adsorption head.

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