A semiconductor processing apparatus and a semiconductor processing line

Abstract

The application discloses a semiconductor processing device and a semiconductor processing production line. The semiconductor processing device comprises a rack, one end of which is a worker operating end for an operator to operate, and the other end of which is a mechanical arm operating end opposite to the worker operating end; and a work platform arranged on the rack and provided with a material taking and placing area, which faces the mechanical arm operating end. Compared with a conventional semiconductor processing device, the work platform is reversely designed in the application, so that the material taking and placing area is close to or located at the mechanical arm operating end. In this way, the mechanical arm does not need to pass above the moving work platform during operation, the whole moving path of the mechanical arm is effectively shortened, and the efficiency of taking and placing materials can be improved. In addition, compared with the structure that the material taking and placing area is close to or located at the worker operating end, the semiconductor processing device of the application is not easy to interfere with the operator when cooperating with the mechanical arm, and the safety of the operator can be effectively ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment and semiconductor processing production line. Background Technology

[0002] Traditional semiconductor processing equipment (such as wire bonding equipment) includes a first end for operator operation (i.e., worker operation end) and a second end facing away from the first end. The semiconductor processing equipment also includes a mobile work platform and a processing mechanism (such as a wire bonding machine). The mobile work platform has a feeding end and a discharging end, and both the feeding end and the discharging end face the first end to facilitate the operator to put the material to be processed into the feeding end and to take out the processed material from the discharging end.

[0003] Existing semiconductor processing equipment is labor-intensive. Combining it with a robotic arm can effectively reduce manual labor. However, if the loading and unloading are handled by a robotic arm located on the second end, the following problems will arise:

[0004] 1. Both the feed end and the discharge end face the first end. This existing structure means that during operation, the robotic arm needs to pass over the top of the mobile work platform before it can move down to the feed end or discharge end of the mobile work platform. The entire movement path of the robotic arm is relatively long and the efficiency is low.

[0005] 2. The feed end and discharge end face the first end (worker's operating end), which causes the robotic arm to operate towards the operator's side, making it easy to interfere with the operator and causing danger. Utility Model Content

[0006] In view of the above-mentioned problems and to overcome at least one deficiency, this utility model proposes a semiconductor processing apparatus and a semiconductor processing production line.

[0007] The technical solution adopted by this utility model is as follows:

[0008] A semiconductor processing apparatus, comprising:

[0009] The frame has a worker operating end at one end for the operator to operate, and a robotic arm operating end at the other end that is opposite to the worker operating end.

[0010] A work platform is mounted on a frame and has a material handling area facing the operating end of the robotic arm.

[0011] Compared to traditional semiconductor processing apparatuses, this application features a reversed work platform design, placing the material handling area closer to / located at the robotic arm's operating end. This arrangement eliminates the need for the robotic arm to travel over the top of the moving work platform during operation (material handling), effectively shortening its entire movement path and improving material handling efficiency. Furthermore, compared to structures where the material handling area is closer to / located at the operator's operating end, this semiconductor processing apparatus, when used in conjunction with a robotic arm, minimizes interference between the robotic arm and the operator, effectively ensuring operator safety.

[0012] In practical applications, semiconductor processing equipment can be wire bonding equipment, which is used to perform wire bonding operations on materials.

[0013] In one embodiment of the present invention, a processing mechanism is further included, which is mounted on a frame and is used to process the material to be processed on the work platform.

[0014] In practical applications, the processing mechanism can take many structural forms and is not limited to wire bonding operations. For example, the processing mechanism can also be a grinder, cutter, packaging machine, coating machine, etc.

[0015] In one embodiment of the present invention, the working platform has two material handling areas, which are located on both sides of the frame, and the processing mechanism is located between the two material handling areas.

[0016] One processing mechanism can process the materials to be processed in two material handling areas. This symmetrical arrangement facilitates the programming and operation of the robotic arm and also ensures that the semiconductor processing device can process a large number of materials.

[0017] In one embodiment of the present invention, the material handling area has two layers, one layer being a waiting area and the other layer being a completion area.

[0018] The material handling area is designed with two layers, allowing the robotic arm to place materials to be processed and retrieve processed materials, thus reducing the robotic arm's travel distance.

[0019] In one embodiment of this utility model, the robotic arm operating end of the semiconductor processing apparatus is adjacent to the corresponding guide rail.

[0020] In one embodiment of this utility model, in the two-layer area of ​​the material handling area, the upper layer is the waiting area and the lower layer is the completion area.

[0021] In one embodiment of this utility model, the processing mechanism is a wire bonding machine. The wire bonding machine has a gripping component. The wire bonding machine grips the material in the waiting area through the gripping component, and then performs wire bonding operation on the material. After the wire bonding operation is completed, the processed material is placed into the completion area through the gripping component.

[0022] In practical applications, the gripping component can take various existing structural forms, such as a moving mechanism with the ability to move up, down, left, right, forward, and backward (similar to a common machining bed), in conjunction with a vacuum suction cup, electric or pneumatic gripper to grip and release materials.

[0023] In one embodiment of this utility model, a display element and an alarm element are also installed on the frame.

[0024] In practical applications, display elements can be structures such as screens.

[0025] In practical applications, alarm components may include at least one of the following: alarm light, horn, and vibration element.

[0026] This application also discloses a semiconductor processing production line, comprising:

[0027] Guide track;

[0028] Multiple semiconductor processing devices are arranged sequentially along the length of the guide rail. The semiconductor processing devices are those described above, and the robotic arm operating end of the semiconductor processing devices is adjacent to the corresponding guide rail.

[0029] A rail-guided vehicle, which is mounted on a guide rail;

[0030] A robotic arm, mounted on the rail-guided vehicle, is used to place materials to be processed into the material handling area and to remove processed materials from the material handling area.

[0031] When the semiconductor processing production line is in operation, a rail-guided vehicle moves on a guide rail, which drives a robotic arm to the corresponding semiconductor processing unit. The robotic arm then works to put the material to be processed into the semiconductor processing unit and remove the processed material from the semiconductor processing unit.

[0032] The semiconductor processing production line of this application can reduce labor and improve efficiency.

[0033] In one embodiment of the present invention, a first storage shelf and a second storage shelf are further included, the first storage shelf and the second storage shelf being located at both ends of the guide rail, respectively.

[0034] In practical application, the first storage rack is used to store both the materials to be processed and the processed materials at the same time, and the second storage rack is used to store both the materials to be processed and the processed materials at the same time.

[0035] In practical application, of the first and second storage shelves, one is used to store materials to be processed, and the other is used to store processed materials.

[0036] In one embodiment of the present invention, multiple semiconductor processing devices are provided on both sides of the guide rail.

[0037] Semiconductor processing equipment is located on both sides of the guide rail. This arrangement increases the density of the semiconductor processing equipment and enhances the processing capacity of the entire semiconductor processing production line.

[0038] In one embodiment of the present invention, there are two guide rails arranged side by side, and the plurality of semiconductor processing devices are provided on the side of the guide rail away from the other guide rail.

[0039] The design of two guide rails can increase the number of rail-guided vehicles and improve the working capacity of the robotic arm.

[0040] In practical applications, the guide rails can be set to three or more as needed. In this case, multiple semiconductor processing devices are arranged on the outermost guide rail.

[0041] In one embodiment of the present invention, a central controller is further included, which is used to control the operation of the rail-guided vehicle, the robotic arm, and various semiconductor processing devices.

[0042] The central controller enables intelligent scheduling and automated production throughout the entire process.

[0043] The beneficial effects of this utility model are as follows: Compared with traditional semiconductor processing apparatuses, this application features a reversed work platform design, placing the material handling area closer to / located at the robotic arm's operating end. With this configuration, the robotic arm does not need to cross the top of the moving work platform during operation (material handling), effectively shortening the entire movement path and improving material handling efficiency. Furthermore, compared to structures where the material handling area is closer to / located at the operator's operating end, this application's semiconductor processing apparatus, when used in conjunction with a robotic arm, is less likely to interfere with the operator, effectively ensuring operator safety. Attached Figure Description

[0044] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort. In addition, in the following drawings, the components are not necessarily drawn to scale, and components with similar related characteristics or features may have the same or similar reference numerals.

[0045] Figure 1 This is a perspective view of a portion of the semiconductor processing apparatus structure in one embodiment of this application;

[0046] Figure 2 This is a front view of a portion of the semiconductor processing apparatus structure in one embodiment of this application;

[0047] Figure 3 This is a side view of a portion of the structure of a semiconductor processing apparatus according to an embodiment of this application;

[0048] Figure 4 This is a top view of a portion of the structure of a semiconductor processing apparatus according to an embodiment of this application;

[0049] Figure 5 This is a schematic diagram of a portion of the semiconductor processing apparatus structure in one embodiment of this application;

[0050] Figure 6 This is a top view of a semiconductor processing production line according to an embodiment of this application;

[0051] Figure 7 This is a front view of a semiconductor processing production line according to an embodiment of this application;

[0052] Figure 8 This is a top view of a semiconductor processing production line with two guide rails according to an embodiment of this application;

[0053] The labels for the attached figures are as follows:

[0054] 1. Semiconductor processing equipment; 11. Frame; 11a. Worker operating end; 11b. Robotic arm operating end; 12. Work platform; 12a. Material handling area; 121. Material waiting area; 122. Finishing area; 13. Display element; 14. Alarm element; 2. Guide rail; 3. Rail-guided vehicle; 4. Robotic arm; 5. First storage rack; 6. Second storage rack; 7. First conveyor belt; 8. Second conveyor belt. Detailed Implementation

[0055] To make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following describes this application in further detail with reference to the accompanying drawings and embodiments.

[0056] In the description of this application, it should be noted that the use of terms such as "first" and "second" to define objects (such as elements, components, regions, layers, doping types and / or parts) is merely for the purpose of distinguishing different objects and is not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that such data can be used interchangeably where appropriate.

[0057] In the description of this application, it should be understood that the singular forms “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that when the terms “compose” and / or “comprise” are used in this specification, the presence of the stated feature, integer, step, operation, element, and / or part is established, but the presence or addition of one or more other features, integers, steps, operations, elements, parts, and / or groups is not excluded. Meanwhile, when used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0058] In the description of this application, it should also be noted that when a component is referred to as "on another component," "connected to another component," or "in contact with another component," it can mean not only that a component is directly on, directly connected to, or directly in contact with another component, but also that an intermediate component can be inserted between the two components. Furthermore, "connection" includes not only fixed connections but also detachable connections or integral connections. Similarly, when an element is referred to as "electrically connected," "electrically contacted," "electrically coupled," or "electrically coupled to" another element, the two elements can be in direct electrical contact or point coupling, or they can be in electrical contact or point coupling through an intermediate component.

[0059] In the description of this application, it should also be noted that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0060] Furthermore, in the description of this application, spatial relation terms such as "below," "under," "below," "below," "below," "above," "on the upper surface of," "above," etc., can be used to describe the spatial positional relationship between one element or feature shown in the figures and other elements or features. It should be understood that spatial relation terms, in addition to the orientation shown in the figures, also include different orientations of elements or features in use and operation. For example, if an element or feature in the figures is flipped or inverted, an element or feature described as "below" or "below" other elements or features will be oriented "above" other elements or features. Furthermore, elements may also include other orientations (e.g., rotated by an angle or other orientations).

[0061] This application provides semiconductor processing equipment and semiconductor processing production lines, in conjunction with reference to... Figures 1-8 ,in Figure 1 This is a perspective view of a portion of the semiconductor processing apparatus structure in one embodiment of this application; Figure 2 This is a front view of a portion of the semiconductor processing apparatus structure in one embodiment of this application; Figure 3 This is a side view of a portion of the structure of a semiconductor processing apparatus according to an embodiment of this application; Figure 4 This is a top view of a portion of the structure of a semiconductor processing apparatus according to an embodiment of this application; Figure 5 This is a schematic diagram of a portion of the semiconductor processing apparatus structure in one embodiment of this application; Figure 6 This is a top view of a semiconductor processing production line according to an embodiment of this application; Figure 7 This is a front view of a semiconductor processing production line according to an embodiment of this application; Figure 8 This is a top view of a semiconductor processing production line with two guide rails according to an embodiment of this application.

[0062] like Figures 1 to 5 As shown, a semiconductor processing apparatus 1 includes:

[0063] The frame 11 has a worker operating end 11a at one end for the operator to operate, and a robotic arm operating end 11b at the other end facing away from the worker operating end 11a.

[0064] The work platform 12 is mounted on the frame 11. The work platform 12 has a material handling area 12a, which faces the robotic arm operating end 11b.

[0065] Compared to the conventional semiconductor processing apparatus 1, this application features a reversed design for the work platform 12, placing the material handling area 12a closer to / located at the robotic arm's operating end 11b. This arrangement eliminates the need for the robotic arm to pass over the top of the moving work platform 12 during operation (material handling), effectively shortening the entire movement path and improving material handling efficiency. Furthermore, compared to the structure where the material handling area 12a is closer to / located at the worker's operating end 11a, the semiconductor processing apparatus 1 of this application, when used in conjunction with the robotic arm, is less likely to interfere with the operator, effectively ensuring operator safety.

[0066] In practical applications, the semiconductor processing apparatus 1 can be a wire bonding device, which is used to perform wire bonding operations on materials.

[0067] In some embodiments, a processing mechanism (not shown in the figure) is also included, which is mounted on the frame 11 and is used to process the material to be processed on the work platform 12.

[0068] In practical applications, the processing mechanism can take many structural forms and is not limited to wire bonding operations. For example, the processing mechanism can also be a grinder, cutter, packaging machine, coating machine, etc.

[0069] like Figure 5 As shown, in some embodiments, the work platform 12 has two material handling areas 12a, which are located on both sides of the frame 11, and the processing mechanism is located between the two material handling areas 12a.

[0070] One processing mechanism can process the materials to be processed in two material pick-and-place areas 12a. This symmetrical arrangement facilitates the programming operation of the robotic arm and also ensures that the semiconductor processing device 1 can process a large number of materials.

[0071] In some embodiments, the work platform 12 has two material handling areas 12a, which are located on both sides of the frame 11, with one side being the waiting area and the other side being the completion area.

[0072] In some embodiments, the material handling area 12a has two layers, one of which is the waiting area 121 and the other is the completion area 122.

[0073] The material handling area 12a is designed with two layers, which allows the robotic arm to place materials to be processed and pick up processed materials, thus reducing the walking distance of the robotic arm.

[0074] like Figure 5 As shown, in some embodiments, in the two-layer area of ​​the material handling area 12a, the upper layer is the waiting area 121 and the lower layer is the completion area 122.

[0075] In some embodiments, the processing mechanism is a wire bonding machine, which has a gripping component. The wire bonding machine grips the material in the material waiting area 121 through the gripping component, and then performs wire bonding operation on the material. After the wire bonding operation is completed, the processed material is placed into the completion area 122 through the gripping component.

[0076] In practical applications, the gripping component can take various existing structural forms, such as a moving mechanism with the ability to move up, down, left, right, forward, and backward (similar to a common machining bed), in conjunction with a vacuum suction cup, electric or pneumatic gripper to grip and release materials.

[0077] like Figure 1 , Figure 2 and Figure 5 As shown, in some embodiments, a display element 13 and an alarm element 14 are also mounted on the rack 11.

[0078] In practical applications, the display element 13 can be a display screen or similar structure.

[0079] In practical applications, the alarm element 14 may include at least one of an alarm light, a horn, and a vibration element.

[0080] like Figure 6 and 7 As shown, this application also discloses a semiconductor processing production line, comprising:

[0081] Guide track 2;

[0082] Multiple semiconductor processing devices 1 are arranged sequentially along the length of the guide rail 2. The semiconductor processing device 1 can be any of the semiconductor processing devices 1 mentioned above. The robotic arm operating end 11b of the semiconductor processing device 1 is adjacent to the corresponding guide rail 2.

[0083] The rail-guided vehicle 3 is mounted on the guide rail 2.

[0084] The robotic arm 4 is mounted on the rail-guided vehicle 3 and is used to place the material to be processed into the material pick-up and drop area 12a and to remove the processed material from the material pick-up and drop area 12a.

[0085] When the semiconductor processing production line is in operation, the rail-guided vehicle 3 moves on the guide rail 2, thereby driving the robotic arm 4 to the corresponding semiconductor processing device 1. Then the robotic arm 4 works to put the material to be processed into the semiconductor processing device 1 and remove the processed material from the semiconductor processing device 1.

[0086] The semiconductor processing production line of this application can reduce labor and improve efficiency.

[0087] like Figure 6 and Figure 7 As shown, in some embodiments, a first storage shelf 5 and a second storage shelf 6 are also included, with the first storage shelf 5 and the second storage shelf 6 located at opposite ends of the guide rail 2.

[0088] In practical application, the first storage rack 5 is used to store both the materials to be processed and the processed materials at the same time, and the second storage rack 6 is used to store both the materials to be processed and the processed materials at the same time.

[0089] In practical application, of the first storage rack 5 and the second storage rack 6, one is used to store materials to be processed, and the other is used to store processed materials.

[0090] In some embodiments, a plurality of semiconductor processing devices 1 are provided on both sides of the guide rail 2.

[0091] Semiconductor processing devices 1 are arranged on both sides of the guide rail 2. This arrangement can increase the density of the semiconductor processing devices 1 and improve the processing capacity of the entire semiconductor processing production line.

[0092] like Figure 8 As shown, in some embodiments, there are two guide rails 2, which are arranged side by side, and a plurality of semiconductor processing devices 1 are provided on the side of the guide rail 2 away from the other guide rail 2.

[0093] The design of two guide rails 2 can increase the number of rail-guided vehicles 3 and improve the working capacity of the robotic arm 4.

[0094] In practical applications, the guide rail 2 can be set to three or more as needed. In this case, multiple semiconductor processing devices 1 are arranged on the outermost guide rail.

[0095] In some embodiments, a central controller is also included, which controls the operation of the rail-guided vehicle, the robotic arm 4, and each semiconductor processing device 1.

[0096] The central controller enables intelligent scheduling and automated production throughout the entire process.

[0097] It should be noted that, where there is no conflict, the features in the different embodiments of this application described above can be combined with each other. Furthermore, in each of the above embodiments, the focus is on describing the differences from other embodiments; other specific descriptions of the same / similar parts between the embodiments can be referred to (or referenced) interchangeably. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this application.

[0098] Although this application has been disclosed above with reference to preferred embodiments, it is not intended to limit this application. Any person skilled in the art can make possible changes and modifications to the technical solutions of this application by utilizing the methods and techniques disclosed above without departing from the spirit and scope of this application. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the content of the technical solutions of this application shall fall within the protection scope of the technical solutions of this application.

Claims

1. A semiconductor processing apparatus, characterized in that, include: The frame has a worker operating end at one end for the operator to operate, and a robotic arm operating end at the other end facing away from the worker operating end. A work platform is mounted on a frame and has a material handling area facing the operating end of the robotic arm.

2. The semiconductor processing apparatus as described in claim 1, characterized in that, It also includes a processing mechanism, which is mounted on the frame and is used to process the material to be processed on the work platform.

3. The semiconductor processing apparatus as described in claim 2, characterized in that, The working platform has two material handling areas, which are located on both sides of the frame, and the processing mechanism is located between the two material handling areas.

4. The semiconductor processing apparatus as described in claim 3, characterized in that, The material handling area has two layers: one layer is the waiting area, and the other layer is the completion area.

5. The semiconductor processing apparatus as described in claim 4, characterized in that, The material handling area has two layers: the upper layer is the waiting area, and the lower layer is the completed area.

6. The semiconductor processing apparatus as claimed in claim 3, characterized in that, Of the two material handling areas on both sides of the frame, one side is the waiting area and the other side is the completion area.

7. The semiconductor processing apparatus as claimed in claim 4, characterized in that, The processing mechanism is a wire bonding machine, which has a gripping component. The wire bonding machine grips the material in the waiting area through the gripping component, and then performs wire bonding on the material. After the wire bonding operation is completed, the processed material is placed into the completion area through the gripping component.

8. The semiconductor processing apparatus as claimed in claim 1, characterized in that, The rack is also equipped with display and alarm components.

9. A semiconductor processing production line, characterized in that, include: Guide track; Multiple semiconductor processing devices are arranged sequentially along the length of a guide rail, wherein the semiconductor processing device is the semiconductor processing device according to any one of claims 1 to 8, and the robotic arm operating end of the semiconductor processing device is adjacent to the corresponding guide rail. A rail-guided vehicle, which is mounted on a guide rail; A robotic arm, mounted on the rail-guided vehicle, is used to place materials to be processed into the material handling area and to remove processed materials from the material handling area.

10. The semiconductor processing production line as described in claim 9, characterized in that, It also includes a first storage shelf and a second storage shelf, which are located at opposite ends of the guide rail.

11. The semiconductor processing production line as described in claim 9, characterized in that, Multiple semiconductor processing devices are installed on both sides of the guide rail.

12. The semiconductor processing production line as described in claim 9, characterized in that, There are two guide rails arranged side by side, and the plurality of semiconductor processing devices are arranged on the side of the guide rail away from the other guide rail.

13. The semiconductor processing production line as described in claim 9, characterized in that, It also includes a central controller, which is used to control the operation of the rail-guided vehicle, the robotic arm, and the various semiconductor processing devices.

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