High-temperature-resistant semiconductor wafer electrostatic chuck

Abstract

The utility model relates to a kind of high-temperature-resistant semiconductor wafer electrostatic chuck applied to the field of semiconductor manufacturing, including electrostatic chuck body, electrostatic chuck body is equipped with support frame, multiple mounting plates are fixedly connected between support frame and electrostatic chuck body, the upper end of support frame is carved with two containing grooves, containing groove is fixedly connected with guide rail, linear motor assembly is installed outside guide rail, the upper end of linear motor assembly is fixedly connected with sliding block, the upper end of sliding block is fixedly connected with air cylinder, multiple adjustable positioning blocks are equipped in cleaning assembly, when the surface of electrostatic chuck body is wiped by wiping cloth, the concave-convex position on the surface of electrostatic chuck body can be adapted, even if the edge of groove is scraped wet wipe to cause moisture residue, it can be wiped by the elastic adjustment of dry wipe, effectively avoid moisture residue, significantly reduce the risk of pollutant residue in groove, to effectively improve the adsorption effect of electrostatic chuck.

Description

Technical Field

[0001] This utility model relates to an electrostatic chuck, and more particularly to a high-temperature resistant electrostatic chuck for semiconductor wafers used in the semiconductor manufacturing field. Background Technology

[0002] In semiconductor manufacturing, ensuring the normal and stable operation of all components during machine operation is a crucial aspect that cannot be ignored in the production process. Electrostatic chucks are a general term for ultra-clean thin-film carriers and gripping and handling equipment suitable for atmospheric or vacuum environments. The electrostatic adsorption technology used in electrostatic chucks is an advantageous technology that replaces traditional mechanical clamping and vacuum adsorption methods, and it has wide applications in semiconductors, panel displays, optics and other fields.

[0003] After the wafer is clamped by the electrostatic chuck, gas can flow to the back of the wafer for heat transfer. Due to the numerous steps in chip manufacturing, particulate contaminants can accumulate on the back of the wafer. When these contaminants come into contact with the surface of the electrostatic chuck, they adhere and remain on the chuck surface, affecting the stability of the airflow on the back of the wafer. The contact between the electrostatic chuck and the wafer is based on electrostatic adsorption. The unstable airflow caused by contaminants leads to unstable pressure on the back of the wafer, making it difficult for the wafer to adhere stably to the surface of the electrostatic chuck. This increases the risk of wafer displacement.

[0004] The specification of Chinese Patent Publication No. CN222190686U discloses a new type of electrostatic suction cup. This utility model, by setting up a cleaning mechanism and a driving mechanism, avoids external dust and other foreign objects from contaminating the cleaning dry cloth and the cleaning wet cloth, extends the service life and effectiveness of the cleaning dry cloth and the cleaning wet cloth, and improves the convenience of using the device.

[0005] When cleaning the electrostatic chuck body using the aforementioned patent, the surface of the electrostatic chuck body usually has multiple grooves as gas flow channels. However, when wiping the electrostatic chuck with a dry cloth or a wet cloth, it is often difficult to wipe the inside of the grooves. Moreover, the edge of the groove on the surface of the electrostatic chuck may scratch the wet cloth, causing the water in the wet cloth to flow into the groove, thus leaving contaminants inside the groove and contaminating the wafer. Utility Model Content

[0006] The technical problem to be solved by this utility model in view of the above-mentioned prior art is that the surface of the electrostatic chuck body is provided with grooves, but when cleaning the electrostatic chuck body, it is difficult to wipe the inside of the grooves, resulting in contaminants remaining inside the grooves, which in turn contaminates the wafer.

[0007] To address the aforementioned problems, this utility model provides a high-temperature resistant electrostatic chuck for semiconductor wafers, comprising an electrostatic chuck body, a support frame outside the electrostatic chuck body, and multiple mounting plates fixedly connected between the support frame and the electrostatic chuck body. Two receiving grooves are chiseled at the upper end of the support frame, and guide rails are fixedly connected within the receiving grooves. A linear motor assembly is mounted outside the guide rails, a slider is fixedly connected to the upper end of the linear motor assembly, and a cylinder is fixedly connected to the upper end of the slider. A support plate is fixedly connected to the upper ends of the two cylinders. Two cleaning components are fixedly connected to the lower end of the support plate. Each cleaning component includes multiple mounting cylinders fixedly connected to the lower end of the support plate. A compression spring is fixedly connected to the inner top wall of each mounting cylinder, an extension rod is fixedly connected to the lower end of the compression spring, a positioning block is fixedly connected to the lower end of the extension rod, an elastic layer is fixedly connected to the lower end of the positioning block, and an adhesive layer is fixedly connected to the lower ends of the multiple elastic layers. A wiping cloth is adhered to the lower end of the adhesive layer.

[0008] In the aforementioned high-temperature resistant semiconductor wafer electrostatic chuck, the cleaning assembly is equipped with multiple adjustable positioning blocks. Through compression springs and elastic layers, the wiping cloth can adapt to the unevenness of the electrostatic chuck body surface when wiping it. Even if the edge of the groove is scratched by the wet cloth and water remains, it can be wiped off by adjusting the elasticity of the dry cloth, effectively avoiding water residue and significantly reducing the risk of contaminant residue in the groove, thereby effectively improving the adsorption effect of the electrostatic chuck.

[0009] As a further improvement of this application, the right end of the positioning block is rounded, and two adjacent positioning blocks fit together.

[0010] As a further improvement of this application, the bonding layer includes a plurality of hook and loop fasteners respectively fixedly connected to the lower ends of a plurality of elastic layers, and an elastic band is fixedly connected between two adjacent hook and loop fasteners.

[0011] As a further improvement of this application, the wiping cloth is attached to the Velcro, with the wiping cloth on the right being a wet wipe and the wiping cloth on the left being a dry wipe.

[0012] As another improvement of this application, the two receiving slots are located on the front and rear sides of the electrostatic chuck body, respectively, and the linear motor assembly and cylinder are both connected to the signal of the external controller.

[0013] As another improvement of this application, an L-shaped baffle is fixedly fitted on the outer surface of the extension rod, the corner of the baffle is obtuse, and the lower end of the baffle is rounded.

[0014] In summary, during practical applications, when cleaning the electrostatic chuck body, the linear motor assembly can be activated to move to the right, thereby moving the support plate to the right. As the support plate moves, the cleaning assembly also moves accordingly. The wiping cloth comes into contact with the surface of the electrostatic chuck body, and the wiping cloth is compressed, causing the compression spring to contract upwards and the extension rod to move upwards, thus cleaning the surface of the electrostatic chuck with the wiping cloth. When the wiping cloth is located in the groove on the surface of the electrostatic chuck body, the compression spring extends downwards, causing the extension rod to move downwards, and the wiping cloth wipes the groove. Multiple positioning blocks can clean the uneven areas on the surface of the electrostatic chuck body. Even if the edge of the groove is scraped by a wet cloth, resulting in moisture residue, it can be wiped away by adjusting the elasticity of the dry cloth, effectively avoiding moisture residue and significantly reducing the risk of contaminant residue in the groove, thereby effectively improving the adsorption effect of the electrostatic chuck. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the first embodiment of this application;

[0016] Figure 2 This is a front view of the structure according to the first embodiment of this application;

[0017] Figure 3 This is a front view of the wiping cloth structure according to the first embodiment of this application;

[0018] Figure 4 This is a schematic diagram of the support frame structure according to the first embodiment of this application;

[0019] Figure 5 This is a schematic diagram of the cleaning component structure according to the first embodiment of this application;

[0020] Figure 6 This is a schematic diagram of the positioning block structure according to the first embodiment of this application;

[0021] Figure 7 This is a schematic diagram of the bonding layer structure according to the first embodiment of this application;

[0022] Figure 8 This is a schematic diagram of the baffle structure according to the second embodiment of this application.

[0023] Explanation of the labels in the diagram:

[0024] 1. Electrostatic chuck body, 2. Support frame, 3. Mounting plate, 4. Receiving groove, 5. Guide rail, 6. Linear motor assembly, 7. Slider, 8. Cylinder, 9. Support plate, 10. Mounting cylinder, 11. Compression spring, 12. Extension rod, 13. Positioning block, 14. Elastic layer, 15. Adhesive layer, 151. Velcro, 152. Elastic band, 16. Wiping cloth, 17. Baffle. Detailed Implementation

[0025] The two embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0026] First implementation method:

[0027] Figure 1 , Figure 2 , Figure 3 and Figure 4 The diagram shows a high-temperature resistant electrostatic chuck for semiconductor wafers, comprising a chuck body 1, a support frame 2 surrounding the chuck body 1, and multiple mounting plates 3 fixedly connected between the support frame 2 and the chuck body 1. Two receiving grooves 4 are carved into the upper end of the support frame 2, and guide rails 5 are fixedly connected within the receiving grooves 4. A linear motor assembly 6 is mounted outside the guide rails 5. Those skilled in the art can select a suitable model of linear motor assembly 6 according to actual needs, such as TJKK50. The linear motor assembly 6 can drive a slider 7 to move to the right, thereby driving two cleaning components to move to the right to clean the surface of the chuck body 1. A slider 7 is fixedly connected to the upper end of the linear motor assembly 6, and a cylinder 8 is fixedly connected to the upper end of the slider 7. Those skilled in the art can... The appropriate cylinder 8 model can be selected according to actual needs, such as MI10-25SCA. After cleaning the electrostatic chuck body 1 with the cleaning component, the cylinder 8 can be activated to move upward, driving the support plate 9 and the cleaning component to move upward. Then, the linear motor component 6 is activated to move to the left, so that the cleaning component is reset, effectively preventing contaminants on the wiping cloth 16 from adhering to the surface of the electrostatic chuck body 1. The upper ends of the two cylinders 8 are fixedly connected to the support plate 9, and the lower ends of the support plate 9 are fixedly connected to two cleaning components. The lateral movement range of the cleaning components covers the entire upper surface of the electrostatic chuck body 1. The two receiving slots 4 are located on the front and rear sides of the electrostatic chuck body 1, respectively. The linear motor component 6 and the cylinder 8 are both connected to the external controller signal.

[0028] Figure 5 , Figure 6 and Figure 7The cleaning assembly includes multiple mounting cylinders 10 fixedly connected to the lower end of the support plate 9. A compression spring 11 is fixedly connected to the inner top wall of each mounting cylinder 10. An extension rod 12 is fixedly connected to the lower end of each compression spring 11. The up-and-down movement of the extension rod 12 causes the compression springs 11 to extend and retract, allowing multiple positioning blocks 13 to move according to the unevenness of the surface of the electrostatic chuck body 1. The lower end of the extension rod 12 is fixedly connected to a positioning block 13, and the right end of the positioning block 13 is rounded, allowing the wiping cloth 16 to... During wiping, the end of the cloth is less likely to rub against the end of the groove, thus effectively improving the stability of the wiping cloth 16 during use. Two adjacent positioning blocks 13 fit together, and the lower end of the positioning block 13 is fixedly connected to an elastic layer 14. When the wiping cloth 16 is located at the end of the groove, it can be slightly adjusted by the elastic layer 14, which can effectively increase the wiping range of the wiping cloth 16. The lower ends of multiple elastic layers 14 are fixedly connected to an adhesive layer 15, and the lower end of the adhesive layer 15 is bonded to the wiping cloth 16. The adhesive layer 15 covers... The device includes multiple Velcro straps 151 fixedly connected to the lower ends of multiple elastic layers 14. These Velcro straps 151 can be bonded to the wiping cloth 16, facilitating future replacement of the wiping cloth 16. An elastic band 152 is fixedly connected between adjacent Velcro straps 151. When the positioning block 13 moves up and down, the elastic band 152 expands and contracts accordingly, effectively preventing the bonding layer 15 from obstructing the movement of the positioning block 13, thus enabling localized, individual wiping. The wiping cloth 16 is connected to the Velcro straps 151. The wiping cloth 16 is detachably connected via Velcro 151 and can be easily peeled off for replacement. The wiping cloth 16 on the right is a wet wipe, and the wiping cloth 16 on the left is a dry wipe. When cleaning the surface of the electrostatic suction cup body 1, the surface of the electrostatic suction cup body 1 can be wiped with a wet wipe first, and then the residual moisture can be wiped away with a dry wipe. Even if the edge of the groove is scratched by the wet wipe and moisture remains, it can be wiped away by adjusting the elasticity of the dry wipe, effectively avoiding moisture residue and thus effectively improving the cleaning effect.

[0029] When cleaning the electrostatic chuck body 1, the linear motor assembly 6 can be activated to move to the right, thereby driving the support plate 9 to move to the right. As the support plate 9 moves, the cleaning assembly also moves accordingly. The wiping cloth 16 comes into contact with the surface of the electrostatic chuck body 1 and is squeezed. At this time, the compression spring 11 contracts upward and the extension rod 12 moves upward, so that the wiping cloth 16 cleans the surface of the electrostatic chuck body 1. When the wiping cloth 16 is located in the groove on the surface of the electrostatic chuck body 1, the compression spring 11 extends downward, so that the extension rod 12 moves downward, and the wiping cloth 16 wipes the groove. The multiple positioning blocks 13 can clean the uneven areas on the surface of the electrostatic chuck body 1, significantly reducing the risk of contaminant residue in the groove, thereby effectively improving the adsorption effect of the electrostatic chuck.

[0030] Second implementation method:

[0031] This embodiment adds a baffle 17 to the first embodiment, while the rest remains the same as the first embodiment.

[0032] Figure 8 As shown: an L-shaped baffle 17 is fixedly sleeved on the outer surface of the extension rod 12. The L-shaped opening of the baffle 17 faces the wiping direction, which effectively avoids interference with the elastic deformation of the wiping cloth 16. The corner of the baffle 17 is an obtuse angle, and the lower end of the baffle 17 is rounded.

[0033] The baffle 17 can partially cover the wiping cloth 16, effectively reducing the contamination of the wiping cloth 16 by external dust and other foreign objects, thereby extending the service life and effectiveness of the wiping cloth 16. When wiping and cleaning the surface of the electrostatic chuck body 1 with the wiping cloth 16, the baffle 17 can move up and down with the extension rod 12, thereby effectively avoiding the baffle 17 from causing obstacles to the use of the wiping cloth 16.

[0034] In light of current practical needs, the above-described embodiments adopted in this application are not limited to these. Any changes made within the scope of knowledge possessed by those skilled in the art without departing from the concept of this application still fall within the protection scope of this utility model.

Claims

1. A high-temperature resistant electrostatic chuck for semiconductor wafers, comprising an electrostatic chuck body (1), characterized in that: The electrostatic chuck body (1) is provided with a support frame (2). Multiple mounting plates (3) are fixedly connected between the support frame (2) and the electrostatic chuck body (1). Two receiving grooves (4) are chiseled at the upper end of the support frame (2). A guide rail (5) is fixedly connected in the receiving groove (4). A linear motor assembly (6) is installed outside the guide rail (5). A slider (7) is fixedly connected at the upper end of the linear motor assembly (6). A cylinder (8) is fixedly connected at the upper end of the slider (7). A support plate (9) is fixedly connected at the upper end of the two cylinders (8). Two cleaning components are fixedly connected at the lower end of the support plate (9). The cleaning assembly includes multiple mounting cylinders (10) fixedly connected to the lower end of the support plate (9). A compression spring (11) is fixedly connected to the inner top wall of the mounting cylinder (10). An extension rod (12) is fixedly connected to the lower end of the compression spring (11). A positioning block (13) is fixedly connected to the lower end of the extension rod (12). An elastic layer (14) is fixedly connected to the lower end of the positioning block (13). An adhesive layer (15) is fixedly connected to the lower ends of multiple elastic layers (14). A wiping cloth (16) is adhered to the lower end of the adhesive layer (15).

2. The high-temperature resistant semiconductor wafer electrostatic chuck according to claim 1, characterized in that: The right end of the positioning block (13) is rounded, and two adjacent positioning blocks (13) fit together.

3. The high-temperature resistant semiconductor wafer electrostatic chuck according to claim 1, characterized in that: The bonding layer (15) includes a plurality of hook and loop fasteners (151) respectively fixedly connected to the lower end of a plurality of elastic layers (14), and an elastic band (152) is fixedly connected between two adjacent hook and loop fasteners (151).

4. The high-temperature resistant semiconductor wafer electrostatic chuck according to claim 3, characterized in that: The wiping cloth (16) is attached to the Velcro (151). The wiping cloth (16) on the right side is a wet wipe, and the wiping cloth (16) on the left side is a dry wipe.

5. The high-temperature resistant semiconductor wafer electrostatic chuck according to claim 1, characterized in that: The two receiving slots (4) are located on the front and rear sides of the electrostatic chuck body (1), respectively, and the linear motor assembly (6) and the cylinder (8) are both connected to the external controller.

6. The high-temperature resistant semiconductor wafer electrostatic chuck according to claim 1, characterized in that: The outer surface of the extension rod (12) is fixedly fitted with an L-shaped baffle (17), the corner of the baffle (17) is an obtuse angle, and the lower end of the baffle (17) is rounded.

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