A tool for removing a silicon wafer stuck in a wet process

Abstract

The utility model discloses a kind of for the extraction tool of silicon wafer jam in wet process, comprising: vacuum generator;Connecting structure is connected with vacuum generator;Detachable assembly is in the end of connecting structure Suction pen stem;And suction nozzle, set in the end of Suction pen stem away from connecting structure, when suction nozzle and silicon wafer contact, the inside of suction nozzle will form a negative pressure cavity, and the adsorption force generated by negative pressure cavity will be jammed silicon wafer adsorbed on suction nozzle.The utility model simple structure, through the combination of vacuum generator, connecting structure, Suction pen stem and suction nozzle, can effectively deal with the various abnormal conditions that may occur in BSG / PSG blanking process, such as turnover ware jam, buffer box jam, unsmooth blanking track or roller jam caused by silicon wafer jam.Using this way to handle exception, not only can reduce the demand of manual direct operation, thereby reducing the risk of falling injury, mechanical injury and chemical corrosion and other safety accidents.

Description

Technical Field

[0001] This utility model relates to the field of auxiliary tooling technology for photovoltaic production lines, specifically a tool for removing blockages in silicon wafers during wet processing. Background Technology

[0002] With the rapid development of the photovoltaic solar energy industry and the continuous improvement of workshop automation levels, personnel safety management has become increasingly critical. The widespread application of intelligent equipment, from manual operation to automation, has not only significantly improved production efficiency but also greatly improved the working environment. However, safety remains the primary consideration throughout this process. Although the introduction of automated equipment reduces the need for manpower, manual operation is still required in many stages, posing a challenge to frontline production managers to continuously optimize processes and reduce safety risks.

[0003] Especially when dealing with wafer jamming issues during the BSG / PSG unloading process, current methods typically require workers to climb ladders to reach the foot pedals in the middle of the machine for manual handling, which poses significant safety hazards. For example, workers operating in a confined standing position increase the risk of falls from heights and mechanical injuries. Furthermore, dust particles may fall from the soles of cleanroom shoes onto the machine or silicon wafers, leading to increased product defect rates and impacting production quality. More seriously, when handling abnormalities such as wafer jamming in the flipper, buffer box, unloading track, or rollers, workers must directly touch the operating machine components and silicon wafers with their bare hands. Since silicon wafers may carry acidic or alkaline chemical liquids, this not only increases the risk of being pinched by the equipment but also may cause acid or alkali corrosion to the hands. To address these issues, a tool for removing silicon wafer blockages in wet processes is proposed. Utility Model Content

[0004] The purpose of this invention is to provide a tool for removing blockages in silicon wafers during wet processing, in order to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a tool for removing silicon wafer blockages during wet processing, comprising:

[0006] Vacuum generator;

[0007] A connection structure is provided for connection to the vacuum generator.

[0008] A detachable pen holder attached to the end of the connecting structure; and

[0009] The suction nozzle is located at the end of the suction pen arm away from the connecting structure. When the suction nozzle comes into contact with the silicon wafer, a negative pressure chamber is formed inside the suction nozzle. The suction force generated by the negative pressure chamber adsorbs the blocked silicon wafer onto the suction nozzle.

[0010] As a further aspect of this utility model: the vacuum generator is equipped with a control button for controlling the opening and closing of the vacuum generator.

[0011] As a further embodiment of this invention, the vacuum generator is equipped with an air inlet pipe.

[0012] As a further embodiment of this invention, the suction nozzle and the pen holder are connected by a threaded connection.

[0013] As a further embodiment of this utility model: the connecting structure includes a connecting tube, the two ends of which are threadedly connected to the pen suction rod and the vacuum generator, respectively.

[0014] As a further embodiment of this utility model: the connection structure includes a first hollow tube, the first hollow tube having two openings, and a second hollow tube and a third hollow tube being slidably inserted into each of the two openings of the first hollow tube, wherein the second hollow tube is threadedly connected to a vacuum generator, and the third hollow tube is threadedly connected to a pen suction rod.

[0015] As a further embodiment of this utility model: both ends of the first hollow tube are equipped with rubber sleeves whose inner diameter is adapted to the outer diameter of the second and third hollow tubes.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] By combining a vacuum generator, connecting structure, suction rod, and suction nozzle, various abnormal situations that may occur during the BSG / PSG feeding process can be effectively addressed, such as wafer blockage caused by flipper jamming, buffer box blockage, obstructed feeding track, or roller jamming. Using this method to handle abnormalities not only reduces the need for direct manual operation, thereby reducing the risk of safety accidents such as falls, mechanical injuries, and chemical corrosion, but also further improves the overall safety level of the production workshop. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the extraction tool of this utility model;

[0019] Figure 2 This is a schematic diagram showing the disassembly of the extraction tool of this utility model;

[0020] Figure 3 This is a schematic diagram of the connection structure of this utility model;

[0021] Figure 4 This is a schematic diagram of another embodiment of the connection structure of this utility model;

[0022] In the diagram: 1. Vacuum generator; 11. Control button; 2. Connection structure; 21. Connecting pipe; 22. First hollow tube; 23. Second hollow tube; 24. Third hollow tube; 25. Rubber sleeve; 3. Pen suction rod; 4. Suction nozzle; 5. Air inlet pipe. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-4 In this embodiment of the invention, a tool for removing blockages from silicon wafers during a wet process includes:

[0025] Vacuum generator 1;

[0026] Connection structure 2 is connected to vacuum generator 1;

[0027] The pen-filling rod 3 is detachably mounted at the end of the connecting structure 2; and

[0028] The suction nozzle 4 is located at the end of the suction pen 3 away from the connecting structure 2. When the suction nozzle 4 comes into contact with the silicon wafer, a negative pressure chamber is formed inside the suction nozzle 4. The suction force generated by the negative pressure chamber adsorbs the blocked silicon wafer onto the suction nozzle 4.

[0029] Specifically, one end of the connecting structure 2 is threadedly connected to the vacuum generator 1, and the interior of the connecting structure 2 is interconnected with the interior of the vacuum generator 1. The threaded connection design makes it easy to fix the connecting structure 2 to the vacuum generator 1, and also facilitates the subsequent replacement of the connecting structure 2 or the vacuum generator 1.

[0030] A suction rod 3 is provided between the suction nozzle 4 and the connecting structure 2 to connect the two. When removing the blocked silicon wafer, the operator needs to stand on the side of the production line with the removal tool in hand and cannot operate directly from above. Therefore, the suction rod 3 is designed in an L-shape to solve this problem. This design allows the bending of the suction rod 3 to better ensure that the suction end of the suction nozzle 4 is accurately facing the silicon wafer, thereby ensuring that the suction nozzle 4 can be tightly attached to the surface of the silicon wafer.

[0031] With the above solution, when the silicon wafer is blocked, the staff removes the removal tool and turns on the vacuum generator 1 to generate internal negative pressure. Since the vacuum generator 1 is connected to the suction nozzle 4 through the connecting structure 2 and the suction pen rod 3, the negative pressure will be transmitted to the suction nozzle 4 in sequence, so that its suction end generates suction. When the suction end of the suction nozzle 4 contacts the surface of the silicon wafer, it can be ensured that the silicon wafer is firmly adsorbed on the suction nozzle 4.

[0032] Please see Figure 1-2 In one embodiment, preferably, the vacuum generator 1 is equipped with a control button 11 for controlling the opening and closing of the vacuum generator 1. The control button 11 can control the opening and closing of the vacuum generator 1, and its principle is the same as that of the vacuum generator 1 purchased on the market.

[0033] Please see Figure 1-2 In one embodiment, preferably, the vacuum generator 1 is equipped with a gas inlet pipe 5, wherein one end of the gas inlet pipe 5 is connected to the vacuum generator 1, and the other end is connected to the CDA (clean dry air) gas supply inside the machine. This arrangement can ensure that the vacuum generator 1 can obtain sufficient pressure, thereby ensuring its normal operation.

[0034] Please see Figure 2 In one embodiment, preferably, the suction nozzle 4 and the pen rod 3 are connected by a thread, which makes it convenient to remove the suction nozzle 4 from the pen rod 3 for replacement.

[0035] Please see Figure 3 In one embodiment, preferably, the connecting structure 2 includes a connecting pipe 21. The two ends of the connecting pipe 21 are threadedly connected to the pen suction rod 3 and the vacuum generator 1, respectively. The connecting pipe 21 is a circular metal tube with an inner diameter of 8 mm. One end of the circular metal tube is provided with an external thread that matches the internal thread on the vacuum generator 1, while the other end of the circular metal tube is provided with an internal thread that matches the external thread on the pen suction rod 3. This ensures the connection of the three components while also ensuring the sealing of the connection point and preventing air leakage.

[0036] Please see Figure 4 In another embodiment, preferably, the connecting structure 2 includes a first hollow tube 22, which has two openings, and a second hollow tube 23 and a third hollow tube 24 are slidably inserted into each of the two openings of the first hollow tube 22. The second hollow tube 23 is threadedly connected to the vacuum generator 1, and the third hollow tube 24 is threadedly connected to the pen suction rod 3.

[0037] Specifically, the inner diameter of the first hollow tube 22 is adapted to the outer diameter of the second hollow tube 23 and the third hollow tube 24, respectively. The ends of both can be inserted into the interior of the first hollow tube 22. Both ends of the first hollow tube 22 are equipped with rubber sleeves 25 whose inner diameter is adapted to the outer diameter of the second hollow tube 23 and the third hollow tube 24. When the rubber sleeves 25 are in contact with the second hollow tube 23 and the third hollow tube 24, a certain frictional force is generated, so that the relative positions of the first hollow tube 22, the second hollow tube 23 and the third hollow tube 24 will not change without the application of external force. When the silicon wafer is stuck far away from the side where the worker is standing, the relative positions of the first hollow tube 22, the second hollow tube 23 and the third hollow tube 24 can be changed by applying external force to the second hollow tube 23 or the third hollow tube 24, thereby extending the length of the pen-holding rod 3. In this way, the worker can easily suck out the silicon wafer that is far away without having to move to the other side or lean forward excessively.

[0038] The working principle and usage process of this utility model are as follows: When an abnormal alarm occurs on the production line, remove the removal tool from the machine, turn on the control button 11 on the vacuum generator 1, and check whether suction force is generated at the suction nozzle 4. After confirming that there is suction force, hold the connecting structure 2 and adjust the suction pen rod 3 to align it with the abnormal position where the silicon wafer is stuck. Accurately align the suction nozzle 4 with the surface of the silicon wafer to adsorb the silicon wafer. After adsorbing the silicon wafer, move it above the defective area, turn off the vacuum generator 1, and the silicon wafer will fall off. Then, perform manual cleaning. After the abnormality is handled, reset the production line to resume production and put the removal tool back in its original position.

[0039] Although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0040] Therefore, the above description is only a preferred embodiment of this application and is not intended to limit the scope of this application; that is, all equivalent modifications made in accordance with the scope of the claims of this application shall be within the protection scope of the claims of this application.

Claims

1. A tool for removing blockages from silicon wafers during wet processing, characterized in that, include: Vacuum generator; A connection structure is provided for connection to the vacuum generator. A detachable pen holder that is attached to the end of the connecting structure; as well as The suction nozzle is located at the end of the suction pen arm away from the connecting structure. When the suction nozzle comes into contact with the silicon wafer, a negative pressure chamber is formed inside the suction nozzle. The suction force generated by the negative pressure chamber adsorbs the blocked silicon wafer onto the suction nozzle.

2. The tool for removing silicon wafer blockage in a wet process according to claim 1, characterized in that, The vacuum generator is equipped with a control button to control the opening and closing of the vacuum generator.

3. The tool for removing silicon wafer blockage in wet processing according to claim 2, characterized in that, The vacuum generator is equipped with a gas inlet pipe.

4. The tool for removing silicon wafer blockage in wet processing according to claim 1, characterized in that, The suction nozzle and the pen holder are connected by a thread.

5. The tool for removing silicon wafer blockage in a wet process according to claim 1, characterized in that, The connection structure includes a connecting tube, the two ends of which are threadedly connected to the pen suction rod and the vacuum generator, respectively.

6. The tool for removing silicon wafer blockage in a wet process according to claim 1, characterized in that, The connection structure includes a first hollow tube with two openings, and a second hollow tube and a third hollow tube are slidably inserted into each of the two openings of the first hollow tube. The second hollow tube is threadedly connected to the vacuum generator, and the third hollow tube is threadedly connected to the pen suction rod.

7. The tool for removing silicon wafer blockage in a wet process according to claim 6, characterized in that, Both ends of the first hollow tube are fitted with rubber sleeves whose inner diameters are compatible with the outer diameters of the second and third hollow tubes.

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