A power module having an extended copper layer insulated substrate

Abstract

The utility model discloses a kind of power modules with extended copper layer insulating substrate, it includes insulating substrate, multiple the upper copper layer and multiple the connecting copper layer are arranged in the insulating substrate, the side of the upper copper layer is equipped with power chip, the power chip is connected with the connecting copper layer by bonding wire, the upper copper layer includes the extension of the insulating substrate outside, the connecting copper layer includes the connecting portion of the insulating substrate outside. Compared with the connecting mode of binding wire or ultrasonic wave electrode welding in prior art, the utility model not only structure is more simplified, and contact loss and parasitic inductance can be effectively reduced, and process requirement is preferably met.

Description

Technical Field

[0001] This utility model relates to power modules, and more particularly to a power module having an extended copper layer insulating substrate. Background Technology

[0002] In power modules, the insulating substrate primarily serves as an electrical isolation and mechanical support, ensuring the module's safe and stable operation. As the base for semiconductor chips, it deposits various materials to form passive components. It must withstand different operating environments, possess sufficient thermal conductivity for heat dissipation, and maintain surface flatness to meet subsequent process requirements. These specifications directly affect the module's electrical performance and reliability. The insulating substrate generally consists of three parts: an upper copper layer, a ceramic layer, and a lower copper layer. For the bonding of external electrodes of the power module to the upper copper layer of the insulating substrate, conventional methods typically involve wire bonding or ultrasonic electrode welding. Please refer to [link to relevant documentation]. Figure 1 The binding thread 100 and Figure 2 The ultrasonic welding part 101 in the middle is a connection method that is not only complicated in process, but also has large contact loss and parasitic inductance. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a power module with an extended copper insulating substrate that has a simplified structure and can reduce contact loss and parasitic inductance, in order to address the shortcomings of the prior art.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution.

[0005] A power module with an extended copper insulating substrate includes an insulating substrate, wherein a plurality of upper copper layers and a plurality of connecting copper layers are disposed within the insulating substrate, a power chip is disposed on one side of the upper copper layer, the power chip is connected to the connecting copper layers by bonding wires, the upper copper layer includes an extension extending outward from the insulating substrate, and the connecting copper layers include a connecting portion extending outward from the insulating substrate.

[0006] Preferably, the insulating substrate has resistor pins and a thermistor connected to the resistor pins.

[0007] Preferably, the power chip is connected to the adjacent upper copper layer via a copper clip.

[0008] Preferably, the copper clip is bent in an inverted "U" shape.

[0009] Preferably, the extension is Z-shaped.

[0010] Preferably, the connecting portion is bent in a "Z" shape.

[0011] In the power module with an extended copper insulating substrate disclosed in this utility model, the upper copper layer and the connecting copper layer are both disposed on one side of the insulating substrate. The insulating substrate provides support and electrical isolation for the copper layer and the power chip. At the same time, the extension and the connecting portion extend outward from the insulating substrate. Compared with the connection methods such as wire binding or ultrasonic electrode welding in the prior art, this utility model not only has a simpler structure, but also effectively reduces contact loss and parasitic inductance, and better meets the process requirements. Attached Figure Description

[0012] Figure 1 This is a cross-sectional view of an insulating substrate using wire bonding in the prior art;

[0013] Figure 2 A cross-sectional view of an insulating substrate using ultrasonic welding in the prior art;

[0014] Figure 3 This is a perspective view of the internal structure of the power module of this utility model;

[0015] Figure 4 This is a top view of the internal structure of the power module of this utility model;

[0016] Figure 5 This is a perspective view of the power module of this utility model. Detailed Implementation

[0017] The present invention will now be described in more detail with reference to the accompanying drawings and embodiments.

[0018] This utility model discloses a power module with an extended copper layer insulating substrate, combined with Figures 3 to 5 As shown, it includes an insulating substrate 1, in which a plurality of upper copper layers 2 and a plurality of connecting copper layers 3 are disposed. A power chip 6 is disposed on one side of the upper copper layer 2. The power chip 6 and the connecting copper layer 3 are connected by bonding wires 7. The upper copper layer 2 includes an extension portion 4 extending outward from the insulating substrate 1, and the connecting copper layer 3 includes a connecting portion 5 extending outward from the insulating substrate 1.

[0019] In the above structure, the upper copper layer 2 and the connecting copper layer 3 are both disposed on one side of the insulating substrate 1. The insulating substrate 1 serves to support the copper layer and the power chip 6 and provide electrical isolation. At the same time, the extension portion 4 and the connecting portion 5 extend outward from the insulating substrate 1. Compared with the connection methods such as wire binding or ultrasonic electrode welding in the prior art, this utility model not only has a simpler structure, but also effectively reduces contact loss and parasitic inductance, and better meets the process requirements.

[0020] As a preferred embodiment, the insulating substrate 1 is provided with a resistor pin 8 and a thermistor 9 connected to the resistor pin.

[0021] In this embodiment, the power chip 6 is connected to the adjacent upper copper layer 2 via a copper clip 10. The copper clip 10 is bent in an inverted "U" shape. This embodiment preferably uses a "U"-shaped copper clip 10 connection process, which provides stronger connection reliability and heat transfer capability.

[0022] As a preferred lead-out method, in this embodiment, the extension 4 is bent in a "Z" shape. The connecting portion 5 is bent in a "Z" shape.

[0023] The power module with an extended copper insulating substrate disclosed in this utility model preferably adopts an extended copper insulating substrate, and also adopts copper clip technology and wire-binding thermistors, and further optimizes the module structure, which can effectively reduce contact loss and parasitic inductance.

[0024] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. All modifications, equivalent substitutions or improvements made within the technical scope of the present utility model should be included within the scope of protection of the present utility model.

Claims

1. A power module having an extended copper insulating substrate, characterized in that, It includes an insulating substrate (1), in which multiple upper copper layers (2) and multiple connecting copper layers (3) are provided. A power chip (6) is arranged on one side of the upper copper layer (2). The power chip (6) is connected to the connecting copper layer (3) by bonding wires (7). The upper copper layer (2) includes an extension (4) extending outward from the insulating substrate (1), and the connecting copper layer (3) includes a connecting portion (5) extending outward from the insulating substrate (1).

2. The power module with an extended copper insulating substrate as described in claim 1, characterized in that, The insulating substrate (1) is provided with a resistor pin (8) and a thermistor (9) connected to the resistor pin.

3. The power module with an extended copper insulating substrate as described in claim 1, characterized in that, The power chip (6) is connected to the adjacent upper copper layer (2) via a copper clip (10).

4. The power module with an extended copper insulating substrate as described in claim 3, characterized in that, The copper clip (10) is bent in an inverted "U" shape.

5. The power module with an extended copper insulating substrate as described in claim 1, characterized in that, The extension (4) is bent in a "Z" shape.

6. The power module with an extended copper insulating substrate as described in claim 1, characterized in that, The connecting part (5) is bent in a "Z" shape.

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