A plastic package integrated high-power diode

Abstract

The utility model belongs to diode packaging technical field, concretely relates to a plastic package integrated high -power diode. Its including bottom plate, plastic package body, chip group and terminal piece, the first recess is formed with bottom plate both sides, plastic package body sets up on bottom plate, and plastic package body both sides extend to with bottom plate bottom plane level along the first recess downward, chip group sets up between plastic package body and bottom plate, and chip group bottom plane is contacted with bottom plate, and chip group rest surface is contacted with plastic package body, and terminal piece first end is connected with chip group top surface, and second end extends to plastic package body outside through plastic package body. The utility model is used to solve the problem of high -power diode packaging heat conduction effect is not good. Chip group is covered in plastic package body, and chip group is contacted with bottom plate and plastic package body directly, utilizes plastic package body and bottom plate heat dissipation, and heat dissipation path is shortened, improves heat dissipation effect, and plastic package body can bear higher temperature, improves heat dissipation effect, and plastic package body and bottom plate one -off forming shorten the production flow, and improved production efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of diode packaging technology, specifically relating to a plastic-encapsulated integrated high-power diode. Background Technology

[0002] High-power diodes are semiconductor devices used in high-power circuits. Their core feature is that they can withstand greater current and higher voltage, and they are widely used in scenarios that require high power, high efficiency, and high reliability.

[0003] Currently, high-power diodes are mostly packaged in a case. The casing of a case-packaged diode is mostly made of plastic or resin, with the chip encapsulated inside the casing. Then, potting compound is poured in to provide protection and heat dissipation. However, this case-package method is affected by the potting compound. The complex casing structure can lead to poor flow of the compound, and air can easily be trapped in the mixture. If air bubbles are present inside, it will increase thermal resistance, causing heat accumulation and resulting in poor heat dissipation. Moreover, the potting compound usually has a low temperature tolerance. In addition, the encapsulation method with a casing and potting compound involves many processing steps, from chip mounting and fixing to potting compound alignment, pouring, and heat curing, all of which require precise operation. This not only extends the packaging cycle of a single diode but also increases labor time costs, making it difficult to improve production efficiency. Utility Model Content

[0004] To address the shortcomings of existing technologies, an integrated high-power diode is provided to solve the problem of poor thermal conductivity in high-power diode packaging.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A plastic-encapsulated integrated high-power diode, comprising:

[0006] A base plate, wherein first grooves are formed on both sides of the base plate;

[0007] A molding compound is disposed on the base plate, and both sides of the molding compound extend downward along the first groove to be flush with the bottom surface of the base plate;

[0008] A chipset is disposed between the molding compound and the base plate, with the bottom surface of the chipset in contact with the base plate and the remaining surfaces of the chipset in contact with the molding compound;

[0009] The terminal component has a first end connected to the top surface of the chipset and a second end extending through the molding compound to the outside of the molding compound.

[0010] Compared with existing technologies, the above technical solutions have the following beneficial effects:

[0011] By directly encapsulating the bottom substrate with a molding compound and then encapsulating the chipset within the molding compound, the chipset directly contacts the substrate and the molding compound, allowing for direct heat dissipation through the molding compound and the substrate. This shortens the heat dissipation path and improves the heat dissipation effect. Furthermore, the molding compound can withstand higher temperatures, thus enhancing heat dissipation. The one-piece molding of the molding compound and the substrate shortens the production process and improves production efficiency. Additionally, the bottom of the molding compound is embedded in the first groove of the substrate, making the connection between the molding compound and the substrate tighter and improving the horizontal stability of the molding compound and the substrate.

[0012] Based on the above technical solution, the embodiments of this application can be further improved as follows:

[0013] In one embodiment, the base plate has a second groove formed inwardly on both sides within the first groove.

[0014] The connection stability between the base plate and the molding body in the horizontal direction is further improved by setting a second groove in the first groove.

[0015] In one embodiment, at least one limiting protrusion is provided on both sides of the base plate, and the plastic sealant covers the limiting protrusion.

[0016] By setting limiting protrusions on both sides of the base plate and wrapping them with a plastic sealant, a vertical tension is generated between the base plate and the plastic sealant, preventing the plastic sealant from separating from the base plate.

[0017] In one embodiment, the chipset includes a molybdenum sheet, a chip, and another molybdenum sheet stacked sequentially, with solder pads provided on both sides of the molybdenum sheet and the chip.

[0018] In one embodiment, the device further includes a connector disposed on the top of the encapsulation body, wherein the top of the encapsulation body has a mounting groove that matches and is fixed to the connector.

[0019] In one embodiment, the second end of the terminal is bent toward the top of the encapsulation body, and a through hole corresponding to the mounting groove is formed on the second end of the terminal.

[0020] In one embodiment, at least one bending hole is provided at the middle bend of the terminal member.

[0021] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0022] 1. By encapsulating the chipset with a molding compound and a base plate, the heat dissipation effect of the chipset is not only comprehensively improved, but the chipset also dissipates heat directly to the outside through the base plate and molding compound. The molding compound and base plate can directly contact the external heat dissipation mechanism, resulting in better heat dissipation.

[0023] 2. Moreover, the molding compound and the base plate are completed in one injection molding process, which greatly reduces the production steps and improves production efficiency.

[0024] 3. A groove is made on the side of the base plate, and the molding compound is embedded in the groove to improve the connection stability between the base plate and the molding compound; furthermore, a raised limiting protrusion is set in the groove, and the connection stability can be further improved after the molding compound covers the limiting protrusion.

[0025] 4. Multiple bending holes are provided at intervals at the bend in the middle of the terminal piece, making it easier to bend the terminal piece when needed. Attached Figure Description

[0026] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0028] Figure 2 for Figure 1 A schematic diagram of the overall structure of the middle terminal component after bending.

[0029] Figure 3 for Figure 2 A schematic diagram of the longitudinal cross-section structure.

[0030] Figure 4 for Figure 2 A schematic diagram of the explosion structure.

[0031] Figure label:

[0032] 1. Base plate; 2. Molded enclosure; 3. Chipset; 4. Terminal block; 5. First groove; 6. Second groove; 7. Limiting protrusion; 8. Connector; 9. Mounting groove; 10. Through hole; 11. Bending hole; 12. Connecting hole;

[0033] 301. Chip; 302. Molybdenum sheet; 303. Solder sheet;

[0034] 801. Screw; 802. Nut. Detailed Implementation

[0035] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0036] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.

[0037] In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0038] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly defined.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] Example

[0041] like Figure 1-4 As shown, the present invention provides a plastic-encapsulated integrated high-power diode, which includes: a base plate 1, a plastic encapsulation body 2, a chipset 3 and a terminal piece 4, wherein the terminal piece 4 and the base plate 1 can be made of copper.

[0042] The base plate 1 has first grooves 5 on both sides, and connecting holes 12 are respectively opened at both ends of the base plate 1. One of the connecting holes 12 is a connecting hole 12 that extends outward to facilitate the installation and connection of the base plate 1.

[0043] like Figure 1As shown, the molding compound 2 is disposed on the base plate 1. The two sides of the molding compound 2 extend downward along the first groove 5 to be flush with the bottom surface of the base plate 1. The molding compound 2 is embedded in the first groove 5 on both sides of the base plate 1, covering the side surface of the base plate 1, so that the molding compound 2 is in full contact with the base plate 1. At the same time, the chipset 3 is disposed between the molding compound 2 and the base plate 1. The bottom surface of the chipset 3 is in contact with the base plate 1, and the remaining surfaces of the chipset 3 are in contact with the molding compound 2. The first end of the terminal 4 is connected to the top surface of the chipset 3. Specifically, the first end of the terminal 4 is welded and fixed to the top surface of the chipset 3, and the second end extends through the molding compound 2 to the outside of the molding compound 2.

[0044] By directly covering the bottom plate 1 with the molding compound 2 and encapsulating the chipset 3 inside the molding compound 2, the chipset 3 directly contacts the bottom plate 1 and the molding compound 2, and directly utilizes the molding compound 2 and the bottom plate 1 for heat dissipation. This shortens the heat dissipation path and improves the heat dissipation effect. Moreover, the molding compound 2 can withstand higher temperatures, which further enhances the heat dissipation effect. Furthermore, the one-piece molding of the molding compound 2 and the bottom plate 1 shortens the production process and improves production efficiency. At the same time, the bottom of the molding compound 2 is embedded in the first groove 5 of the bottom plate 1, making the connection between the molding compound 2 and the bottom plate 1 tighter and improving the horizontal stability of the molding compound 2 and the bottom plate 1.

[0045] like Figure 4 As shown, in order to further improve the connection stability between the base plate 1 and the encapsulating body 2, the base plate 1 has two second grooves 6 formed inwardly in the first groove 5 on both sides. Each side of the base plate 1 is provided with two second grooves 6. The two second grooves 6 are located at both ends of the first groove 5 and extend further inward. By setting the second grooves 6 in the first groove 5, the connection stability between the base plate 1 and the encapsulating body 2 in the horizontal direction is further improved.

[0046] To ensure the vertical connection strength between the base plate 1 and the injection molded body, at least one limiting protrusion 7 is provided on both sides of the base plate 1, and the molding body 2 covers the limiting protrusion 7.

[0047] Specifically, the base plate 1 has three limiting protrusions 7 on each side. One limiting protrusion 7 is located at the bottom of the first groove 5 and on the side of the base plate 1. The other two limiting protrusions 7 are located on the side wall of the second groove 6. By setting the limiting protrusions 7 on both sides of the base plate 1 and wrapping them with the plastic sealant 2, the base plate 1 and the plastic sealant 2 are subjected to vertical tension, thus preventing the plastic sealant 2 from separating from the base plate 1.

[0048] like Figure 4As shown, in this embodiment, the chipset 3 includes a molybdenum sheet 302, a chip 301, and a molybdenum sheet 302 stacked sequentially. Both sides of the molybdenum sheet 302 and the chip 301 are provided with solder pads 303. The two sides of the chip 301 are connected to the molybdenum sheets 302 on both sides through two solder pads 303. The two outer sides of the two molybdenum sheets 302 away from the chip 301 are respectively connected and fixed to the base plate 1 and the first end of the terminal through two solder pads 303.

[0049] In this embodiment, a connector 8 is also provided on the top of the encapsulation body 2, and an installation groove 9 is formed on the top of the encapsulation body 2 to match and fix the connector 8.

[0050] Specifically, the connector 8 can be a matching nut 802 and screw 801. The mounting groove 9 on the top of the encapsulation body 2 is shaped to match the nut 802. The nut 802 is embedded in the mounting groove 9 and then connected to the nut 802 by the screw 801. The nut 802 can be embedded in the mounting groove 9 by injection molding with the encapsulation body 2 in one step.

[0051] The second end of the terminal 4 is bent toward the top of the encapsulated body 2. A through hole 10 corresponding to the mounting groove 9 is provided on the second end of the terminal 4. The screw 801 in the connector 8 can pass through the through hole 10 on the second end of the terminal 4 and be connected and fastened to the screw 801 in the mounting groove 9. A washer or the like can be provided between the screw 801 and the nut 802.

[0052] The through hole 10 can be configured as an elongated oval through hole 10 along the length of the terminal 4, in order to prevent the through hole 10 from being unable to align with the mounting groove 9 on the top of the encapsulation body 2 after the terminal 4 is bent.

[0053] Among them, such as Figure 2 As shown, at least one bending hole 11 is provided at the middle bend of the terminal 4. In this embodiment, there are two bending holes, and the bending holes do not penetrate the side of the terminal 4. When the second end of the terminal 4 needs to be bent, it can be bent along the middle bending hole 11. The setting of the bending hole 11 can make it easier for the terminal 4 to be bent and deformed.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A molded, integrated high-power diode, characterized in that, include: A base plate, wherein first grooves are formed on both sides of the base plate; A molding compound is disposed on the base plate, and both sides of the molding compound extend downward along the first groove to be flush with the bottom surface of the base plate; A chipset is disposed between the molding compound and the base plate, with the bottom surface of the chipset in contact with the base plate and the remaining surfaces of the chipset in contact with the molding compound; The terminal component has a first end connected to the top surface of the chipset and a second end extending through the molding compound to the outside of the molding compound.

2. The molded integrated high-power diode according to claim 1, characterized in that, The bottom plate has a second groove formed by inward recessing on both sides within the first groove.

3. The molded integrated high-power diode according to claim 2, characterized in that, At least one limiting protrusion is provided on both sides of the base plate, and the plastic sealant covers the limiting protrusion.

4. The integrated high-power diode with plastic encapsulation according to claim 1, characterized in that, The chipset includes molybdenum sheets, chips, and molybdenum sheets stacked sequentially, with solder pads provided on both sides of the molybdenum sheets and the chips.

5. The integrated high-power diode according to claim 1, characterized in that, It also includes a connector disposed on the top of the encapsulation body, and the top of the encapsulation body has a mounting groove that matches and is fixed to the connector.

6. The molded integrated high-power diode according to claim 5, characterized in that, The second end of the terminal is bent toward the top of the encapsulation body, and a through hole corresponding to the mounting groove is provided on the second end of the terminal.

7. The molded integrated high-power diode according to claim 6, characterized in that, At least one bending hole is provided at the middle bend of the terminal component.

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