Flash memory chip package structure

Abstract

The utility model discloses a flash memory chip packaging structure, include: chip structure main part, including flash memory chip, packaging protection frame and auxiliary column, the flash memory chip is located at the bottom of packaging protection frame, the auxiliary column is located at the bottom of packaging protection frame, and the number of auxiliary column is several groups and shows array distribution, dismantle subassembly is set up at the junction of flash memory chip and packaging protection frame, including the positioning slot of opening in the outside of flash memory chip, can solve the strong connection of the adhesion solidification when the chip body failure needs to replace, and the protection frame and chip form the indivisible whole, force technical personnel to discard the protection frame with the function intact and the fault chip together, thereby leading to maintenance difficulty, secondly, the solidification shrinkage rate difference of different batches of adhesive can cause stress concentration between the protection frame and chip, and there is the problem of interface cracking risk of long -term use.

Description

Technical Field

[0001] This utility model relates to the field of flash memory chip technology, and in particular to flash memory chip packaging structure. Background Technology

[0002] With the increasing demand for data storage, flash memory chips are being used more and more widely in electronic devices. During the chip packaging process, an external protective enclosure is usually required to prevent physical damage during transportation and installation.

[0003] Existing technologies mostly use adhesives to permanently fix the protective frame to the chip substrate. Although this can ensure structural stability, it has certain shortcomings in practical applications: First, when the chip itself fails and needs to be replaced, the strong connection formed by the adhesive curing will make the protective frame and the chip an inseparable whole, forcing technicians to discard both the functional protective frame and the faulty chip, thus making repair difficult. Second, the difference in curing shrinkage rate of different batches of adhesives may cause stress concentration between the protective frame and the chip, and there is a risk of interface cracking after long-term use. Utility Model Content

[0004] This utility model provides a flash memory chip packaging structure that can solve the problem that when the chip body fails and needs to be replaced, the strong connection formed by the adhesive curing will make the protective frame and the chip an inseparable whole, forcing technicians to discard the functional protective frame and the faulty chip together, thus making maintenance difficult. Secondly, the difference in curing shrinkage rate of different batches of adhesive may cause stress concentration between the protective frame and the chip, and there is a risk of interface cracking after long-term use.

[0005] This utility model provides a flash memory chip packaging structure, including:

[0006] The main body of the chip structure includes a flash memory chip, a packaging protective frame, and auxiliary pillars. The flash memory chip is located at the bottom of the packaging protective frame, and the auxiliary pillars are located at the bottom of the packaging protective frame. The number of auxiliary pillars is several groups and they are distributed in an array.

[0007] The disassembly assembly is located at the connection between the flash memory chip and the packaging protective frame. It includes a positioning groove on the outside of the flash memory chip, a compression groove and a moving hole in the middle of the flash memory chip, a linkage post inside the moving hole, and a hand-held block and a moving plate connected to both ends of the linkage post, respectively. A positioning block is connected to one side of the moving plate.

[0008] In a flash memory chip packaging structure according to an embodiment of the present invention, a through hole is provided in the middle of the packaging protective frame, and an inner groove is provided at the bottom of the through hole.

[0009] In a flash memory chip packaging structure according to an embodiment of the present invention, the through hole penetrates the middle of the packaging protective frame, and the thickness of the inner groove is less than the thickness of the through hole.

[0010] In a flash memory chip packaging structure according to an embodiment of the present invention, the auxiliary post and the inner groove are fixedly connected, and the auxiliary post is made of silicone rubber.

[0011] In a flash memory chip packaging structure according to an embodiment of the present invention, the positioning slots and positioning blocks are adapted to each other, and the number of positioning slots is two sets and they are symmetrically distributed.

[0012] In a flash memory chip packaging structure according to an embodiment of the present invention, the compression groove is connected to the movable hole, and the movable hole is adapted to the linkage post, wherein the linkage post is a cylindrical structure.

[0013] In a flash memory chip packaging structure according to an embodiment of the present invention, the moving board and the positioning block are an integral structure, and the bottom edge of the positioning block is provided with rounded corners.

[0014] In a flash memory chip packaging structure according to an embodiment of the present invention, a reset spring is wrapped around the outside of the linkage post, and the two ends of the reset spring are respectively connected to the moving plate and the compression groove.

[0015] In a flash memory chip packaging structure according to an embodiment of the present invention, the handheld block and the linkage post are an integral structure, and the two sides of the handheld block are semi-circular structures.

[0016] The technical solutions provided in this application embodiment may include the following beneficial effects: This application designs a flash memory chip packaging structure, which can solve the problem that when the chip body fails and needs to be replaced, the strong connection formed by the adhesive curing will make the protective frame and the chip an inseparable whole, forcing technicians to discard the functional protective frame and the faulty chip together, thus leading to maintenance difficulties. Secondly, the difference in curing shrinkage rate of different batches of adhesive may cause stress concentration between the protective frame and the chip, and there is a risk of interface cracking after long-term use.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a flash memory chip packaging structure provided in an embodiment of this application;

[0020] Figure 2 yes Figure 1 A partial breakdown diagram of the flash memory chip packaging structure;

[0021] Figure 3 yes Figure 1 A schematic diagram of the packaging protective frame in the flash memory chip packaging structure;

[0022] Figure 4 yes Figure 1 Top view of the flash memory chip packaging structure;

[0023] Figure 5 yes Figure 4 Side sectional view of AA;

[0024] Figure 6 yes Figure 5 Enlarged view of point A in the middle;

[0025] Figure 7 yes Figure 1 A partial structural diagram of the disassembled components in the flash memory chip packaging structure. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0028] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0029] like Figures 1 to 7 As shown, this application provides a flash memory chip packaging structure. The main body of the chip structure 100 includes a flash memory chip 10, a packaging protective frame 20, and auxiliary pillars 40. The flash memory chip 10 is located at the bottom of the packaging protective frame 20, and the auxiliary pillars 40 are located at the bottom of the packaging protective frame 20. The number of auxiliary pillars 40 is several groups and they are arranged in an array. The disassembly component 30 is set at the connection between the flash memory chip 10 and the packaging protective frame 20. It includes a positioning groove 31 opened on the outside of the flash memory chip 10, a compression groove 32 and a moving hole 33 opened in the middle of the flash memory chip 10, a linkage pillar 34 is set inside the moving hole 33, and a hand-held block 38 and a moving plate 35 are respectively connected to the two ends of the linkage pillar 34. A positioning block 36 is connected to one side of the moving plate 35.

[0030] After adopting the above technical solution, since the disassembly component 30 is located at the connection between the flash memory chip 10 and the packaging protective frame 20, when the damaged flash memory chip 10 is disassembled, it is necessary to pull the disassembly component 30 to disassemble the flash memory chip 10. This can solve the problem that when the chip body fails and needs to be replaced, the strong connection formed by the adhesive curing will make the protective frame and the chip an inseparable whole, forcing technicians to discard the intact protective frame and the faulty chip together, which will lead to maintenance difficulties. Secondly, the difference in curing shrinkage rate of different batches of adhesive may cause stress concentration between the protective frame and the chip, and there is a risk of interface cracking after long-term use.

[0031] It should be noted that when the flash memory chip 10 needs to be disassembled and replaced, the user will pull the hand block 38, which will drive the linkage column 34 to move along the inside of the moving hole 33, so that the linkage column 34 will drive the moving plate 35 to move along the inside of the compression groove 32, further driving the positioning block 36 to disengage from the inside of the positioning groove 31, and at the same time compressing the reset spring 37 until the positioning block 36 disengages from the inside of the positioning groove 31. Similarly, the other set of positioning blocks 36 will operate the above steps at the same time, thereby lifting the packaging protection frame 20 along the outside of the flash memory chip 10, thereby disengaging the flash memory chip 10 from the inside of the inner groove 22, and then disengaging it from the auxiliary column 40, thereby completing the disassembly of the flash memory chip 10.

[0032] When installing the flash memory chip 10 and the packaging protective frame 20, simply press the top of the flash memory chip 10 along the inside of the inner groove 22. First, the flash memory chip 10 contacts the rounded corner 39, pressing the positioning block 36. This causes the positioning block 36 and the moving plate 35 to move along the inside of the compression groove 32, and the linkage column 34 to move along the inside of the moving hole 33. The reset spring 37 compresses until the flash memory chip 10 is completely pressed into the inside of the inner groove 22, so that the top of the flash memory chip 10 contacts the auxiliary column 40. At this time, the positioning groove 31 and the positioning block 36 are aligned. Under the elastic potential energy of the reset spring 37, the moving plate 35 and the positioning block 36 are ejected, so that the positioning block 36 is inserted into the inside of the positioning groove 31, thereby fixing the flash memory chip 10 and completing the installation operation of the flash memory chip 10. The structure is simple and the operation is convenient.

[0033] In an optional embodiment, the encapsulation protective frame 20 has a through hole 21 in the middle and an inner groove 22 at the bottom of the through hole 21, so that the flash memory chip 10 can be wrapped by the inner groove 22 to achieve a protective effect and prevent physical damage to the flash memory chip 10 during transportation and installation.

[0034] In an optional embodiment, the through-hole 21 extends through the middle of the package protection frame 20, and the thickness of the recess 22 is less than the thickness of the through-hole 21, wherein the through-hole 21 exposes the top of the flash memory chip 10 for heat dissipation during use.

[0035] In an optional embodiment, the auxiliary post 40 is fixedly connected to the inner groove 22, and the auxiliary post 40 is made of silicone rubber, which can support the flash memory chip 10 during the installation process and provide a buffering effect until the positioning groove 31 is aligned with the positioning block 36, so as to facilitate the positioning of the positioning block 36 after it is inserted into the positioning groove 31. At the same time, silicone rubber has high high temperature resistance and long service life.

[0036] In an optional embodiment, the positioning slots 31 and the positioning blocks 36 are adapted to each other, and there are two sets of positioning slots 31 that are symmetrically distributed. During the connection process between the flash memory chip 10 and the inner groove 22, the positioning blocks 36 are inserted into the interior of the positioning slots 31 to complete the positioning between the inner groove 22 and the flash memory chip 10.

[0037] In an optional embodiment, the compression groove 32 is connected to the moving hole 33, and the moving hole 33 is adapted to the linkage column 34. The linkage column 34 is a cylindrical structure, and the linkage column 34 is fixedly connected to the hand-held block 38 and the moving plate 35. Thus, during the movement of the linkage column 34, it can move along the inside of the moving hole 33, which facilitates the subsequent pulling of the positioning block 36 by the hand-held block 38.

[0038] In an optional embodiment, the movable plate 35 and the positioning block 36 are an integral structure. The bottom edge of the positioning block 36 is provided with a rounded corner 39. During the installation of the flash memory chip 10 and the inner groove 22, the top of the flash memory chip 10 contacts the rounded corner 39, forcing the positioning block 36 to retract along the inside of the compression groove 32. This allows the flash memory chip 10 to be installed simply by pressing it along the inside of the inner groove 22, without requiring much operation, saving time and effort.

[0039] In an optional embodiment, the outer side of the linkage column 34 is wrapped with a return spring 37, and the two ends of the return spring 37 are respectively connected to the moving plate 35 and the compression groove 32. After the moving plate 35 and the positioning block 36 are forced to squeeze, the return spring 37 is compressed and stored. When the positioning block 36 is aligned with the positioning groove 31, the return spring 37 resets and drives the positioning block 36 to insert along the inside of the positioning groove 31.

[0040] In one alternative implementation, the handheld block 38 and the linkage column 34 are an integral structure, and the two sides of the handheld block 38 are semi-circular to facilitate hand holding and avoid hand abrasion at the corners.

[0041] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0042] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0043] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0044] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0045] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A flash memory chip packaging structure, characterized in that, include: The main body of the chip structure includes a flash memory chip, a packaging protective frame, and auxiliary pillars. The flash memory chip is located at the bottom of the packaging protective frame, and the auxiliary pillars are located at the bottom of the packaging protective frame. The number of auxiliary pillars is several groups and they are distributed in an array. The disassembly assembly is located at the connection between the flash memory chip and the packaging protective frame. It includes a positioning groove on the outside of the flash memory chip, a compression groove and a moving hole in the middle of the flash memory chip, a linkage post inside the moving hole, and a hand-held block and a moving plate connected to both ends of the linkage post, respectively. A positioning block is connected to one side of the moving plate.

2. The flash memory chip packaging structure according to claim 1, characterized in that, The encapsulation and protective frame has a through hole in the middle and an inner groove at the bottom of the through hole.

3. The flash memory chip packaging structure according to claim 2, characterized in that, The through hole penetrates the middle of the encapsulation and protective frame, and the thickness of the inner groove is less than the thickness of the through hole.

4. The flash memory chip packaging structure according to claim 1, characterized in that, The auxiliary column is fixedly connected to the inner groove, and the auxiliary column is made of silicone rubber.

5. The flash memory chip packaging structure according to claim 1, characterized in that, The positioning grooves are adapted to the positioning blocks, and there are two sets of positioning grooves that are symmetrically distributed.

6. The flash memory chip packaging structure according to claim 1, characterized in that, The compression groove is connected to the moving hole, and the moving hole is adapted to the linkage column, which is a cylindrical structure.

7. The flash memory chip packaging structure according to claim 1, characterized in that, The movable plate and the positioning block are an integral structure, and the bottom edge of the positioning block is provided with rounded corners.

8. The flash memory chip packaging structure according to claim 1, characterized in that, The outer side of the linkage column is wrapped with a return spring, and the two ends of the return spring are connected to the moving plate and the compression groove, respectively.

9. The flash memory chip packaging structure according to claim 1, characterized in that, The handheld block and the linkage column are an integral structure, and the two sides of the handheld block are semi-circular structures.

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