A precision stamping die for electronic components

Abstract

The utility model discloses a kind of precision stamping die for electronic component, including upper die holder, lower die holder, guide pillar, guide bush, stamping mechanism and positioning device, the positioning device includes optical positioning sensor, by adjustable support fixed at lower die holder edge, real-time monitoring workpiece position;High-precision grating ruler, installation is in lower die holder top surface, its reading head is connected with the platen of stamping mechanism;Pressure sensor, between the driving shaft of stamping mechanism and platen, the output end of optical positioning sensor, grating ruler, pressure sensor is connected to control module, control module is fed by servo motor Real-time adjustment driving shaft's speed and stroke, form three-level closed-loop positioning system.Through three-level closed-loop positioning system, in conjunction with the cooperative control of optical positioning, displacement monitoring and pressure perception, the positioning accuracy of electronic component stamping is significantly improved, and damage due to improper processing can be effectively avoided in thin brittle material.

Description

Technical Field

[0001] This utility model relates to the field of mold technology, specifically a precision stamping mold for electronic components. Background Technology

[0002] In the field of precision stamping of electronic components, existing mold positioning systems mostly use single sensor control, which makes it difficult to achieve coordinated accuracy in workpiece position monitoring, stamping displacement feedback, and pressure sensing. This can easily lead to dimensional deviations in components or damage to thin and brittle materials due to positioning errors. Buffer structures often use ordinary springs, whose buffering characteristics are linear and cannot adapt to changes in impact loads on workpieces of varying thicknesses. Long-term use can easily shorten mold life due to stress concentration. Replacing punch assemblies relies on bolt fixing, which is cumbersome and time-consuming, impacting production efficiency. Utility Model Content

[0003] In order to overcome the shortcomings of existing technical solutions, this utility model provides a precision stamping die for electronic components, which can effectively solve the problems mentioned in the background art.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A precision stamping die for electronic components includes an upper die base, a lower die base, guide pillars, guide sleeves, a stamping mechanism, and a positioning device, wherein the positioning device includes:

[0006] An optical positioning sensor is fixed to the edge of the lower mold base via an adjustable bracket to monitor the workpiece position in real time.

[0007] A high-precision grating ruler is installed on the top surface of the lower die base, and its reading head is connected to the pressure plate of the stamping mechanism;

[0008] A pressure sensor is located between the drive shaft and the pressure plate of the stamping mechanism;

[0009] The outputs of the optical positioning sensor, grating ruler, and pressure sensor are all connected to the control module. The control module adjusts the feed speed and stroke of the drive shaft in real time through the servo motor, forming a three-level closed-loop positioning system.

[0010] As a further description of the above technical solution, the top surface of the lower mold base is provided with an adaptive buffer assembly, which includes a sleeve, a guide rod and a disc spring assembly. The sleeve is fixed around the cavity of the lower mold base, the guide rod is slidably inserted into the sleeve, and the disc spring assembly is sleeved on the outside of the guide rod.

[0011] As a further description of the above technical solution, the upper and lower ends of the disc spring assembly abut against the top of the sleeve and the flange of the guide rod, respectively. The end of the guide rod is provided with a buffer plate, the top surface of the buffer plate is in contact with the workpiece, and a chip discharge port is provided on one side of the lower die base.

[0012] As a further description of the above technical solution, the stamping mechanism includes a quick-change punch assembly, a connecting seat, and a punch body. The connecting seat is slidably connected to the upper die seat through a dovetail groove. The punch body is covered with a high-temperature ceramic coating, which is made of a composite of tungsten carbide-cobalt alloy and nano-aluminum nitride.

[0013] As a further description of the above technical solution, the connecting seat is embedded with a cooling channel, and the inlet and outlet of the cooling channel are connected to an external cooling system through a rotary joint.

[0014] As a further description of the above technical solution, the lower mold base has a gradient cooling system, which includes a spiral cooling channel that surrounds the die cavity.

[0015] As a further description of the above technical solution, an automatic lubrication module is also provided on one side of the buffer plate. The automatic lubrication module includes a liquid storage tank with built-in nano-graphene lubricant, a micro pump and a flow controller. The liquid storage tank is embedded in the side wall of the lower mold base, and the micro pump supplies atomized lubricant to the chip discharge hole through the flow controller.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] The present invention provides a precision stamping die for electronic components, which has at least one of the following beneficial effects during use:

[0018] A three-level closed-loop positioning system, combined with the coordinated control of optical positioning, displacement monitoring, and pressure sensing, significantly improves the positioning accuracy of electronic component stamping, effectively preventing damage to thin and brittle materials due to improper processing. The adaptive buffer assembly of the lower die base, utilizing the non-linear deformation of a disc spring group, buffers the impact force during stamping, reducing damage to the die and workpiece. Combined with the chip removal port design, it facilitates waste removal. The quick-change punch assembly, with its dovetail groove structure, enables rapid replacement, improving maintenance convenience. The cooling systems of the punch and die work together to stably control the processing temperature, ensuring the stability of the stamping process. The automatic lubrication module reduces friction between the workpiece and the die, while also assisting in chip removal, further optimizing the processing effect. The overall structural design balances high precision, high stability, and ease of operation, extending the die's service life and improving the processing quality and efficiency of electronic components. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of a precision stamping die for electronic components according to the present invention.

[0020] Figure 2This is a schematic diagram of the first side structure of a precision stamping die for electronic components according to the present invention;

[0021] Figure 3 This is a schematic diagram of the second side structure of a precision stamping die for electronic components according to the present invention;

[0022] Figure 4 This is a schematic diagram of the third side structure of a precision stamping die for electronic components according to the present invention.

[0023] Numbering on the map:

[0024] 1. Upper die base; 101. Stamping mechanism; 102. Positioning device; 103. Punch body; 104. Connecting seat; 105. Control module; 2. Lower die base; 201. Guide post; 202. Adaptive buffer assembly; 203. Grating ruler; 204. Guide rod; 205. Sleeve; 206. Disc spring assembly; 207. Chip discharge port; 208. Optical positioning sensor; 209. Flow controller; 210. Micro pump; 211. Liquid storage tank; 212. Adjustable bracket; 213. Buffer plate. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] like Figures 1-4 As shown, this utility model provides a precision stamping die for electronic components, including an upper die base 1, a lower die base 2, guide pillars 201, guide sleeves, a stamping mechanism 101, and a positioning device 102. The positioning device 102 includes:

[0027] An optical positioning sensor 208 is fixed to the edge of the lower mold base 2 via an adjustable bracket 212 to monitor the workpiece position in real time.

[0028] A high-precision grating ruler 203 is installed on the top surface of the lower die base 2, and its reading head is connected to the pressure plate of the stamping mechanism 101.

[0029] A pressure sensor is located between the drive shaft and the pressure plate of the stamping mechanism 101;

[0030] The outputs of the optical positioning sensor 208, the grating ruler 203, and the pressure sensor are all connected to the control module 105. The control module 105 adjusts the feed speed and stroke of the drive shaft in real time through the servo motor to form a three-level closed-loop positioning system.

[0031] In this embodiment, after the workpiece is loaded, the optical positioning sensor 208 captures the edge position of the workpiece in real time through the adjustable bracket 212 and outputs a millimeter-level position deviation signal. The high-precision grating ruler 203 synchronously monitors the displacement (micrometer level) of the pressure plate of the stamping mechanism 101, and the reading head generates real-time position feedback as the pressure plate moves. The pressure sensor collects the pressure changes (N level) during the stamping process in real time and captures the critical point of material deformation.

[0032] The control module 105 performs fusion analysis on the three signals, calculates the correction amount through the PID algorithm, and drives the servo motor to dynamically adjust the feed speed (0-50mm / s steplessly adjustable) and stroke (±0.001mm accuracy) of the drive shaft, so as to realize the three-level closed-loop control of "workpiece position - pressure plate displacement - stamping pressure" and ensure that the stamping size error is ≤±0.005mm.

[0033] Compared to traditional single-sensor positioning, the three-level closed-loop system improves repeatability from ±0.02mm to ±0.003mm, meeting the stamping requirements of high-precision electronic components such as 5G chip pins and micro connectors. The linkage control between the pressure sensor and the servo motor can prevent thin and brittle electronic materials (such as ceramic substrates) from cracking due to overpressure, reducing the defect rate by more than 90%.

[0034] The working logic of the three-level closed-loop positioning system is as follows: the optical positioning sensor 208 pre-detects the workpiece position deviation, and the control module 105 performs the first correction of the servo motor stroke; the grating ruler 203 provides real-time feedback on the pressure plate displacement during the stamping process with an accuracy of ±1μm; when the pressure sensor detects a sudden change in stamping pressure, it triggers the servo motor to retreat urgently by 0.1-0.3mm.

[0035] The control module 105 integrates a dynamic compensation algorithm and executes the following logic: based on the historical data of the grating ruler 203 and the pressure sensor, it constructs a punching force-displacement relationship curve; when the real-time punching force deviates from the curve threshold by ±5%, it automatically corrects the feed parameters of the servo motor; after the cumulative number of punching times reaches the set value, it generates a mold wear warning and outputs maintenance instructions to the human-machine interface.

[0036] Furthermore, the top surface of the lower die base 2 is provided with an adaptive buffer assembly 202. The adaptive buffer assembly 202 includes a sleeve 205, a guide rod 204, and a disc spring assembly 206. The sleeve 205 is fixed around the die cavity of the lower die base 2. The guide rod 204 is slidably inserted into the sleeve 205, and the disc spring assembly 206 is sleeved on the outside of the guide rod 204. Before stamping, the buffer plate 213 of the adaptive buffer assembly 202 is in contact with the bottom surface of the workpiece, and the guide rod 204 is compressed to the pre-tightened state by the gravity of the workpiece.

[0037] Furthermore, the upper and lower ends of the disc spring assembly 206 abut against the top of the sleeve 205 and the flange of the guide rod 204, respectively. The end of the guide rod 204 is provided with a buffer plate 213, the top surface of which is in contact with the workpiece. A chip discharge port 207 is provided on one side of the lower die holder 2. During the stamping process, when the upper die holder 1 moves downward, the workpiece transmits pressure to the guide rod 204 through the buffer plate 213. The disc spring assembly 206 generates nonlinear elastic deformation (compression amount 0-15mm) through a multi-layer superimposed structure, absorbing the impact force in the initial stage of stamping (up to buffer an instantaneous load of 5000N).

[0038] After stamping, the disc spring assembly 206 rebounds, causing the guide rod 204 to reset. Simultaneously, the chip discharge port 207 discharges the stamping waste through gravity and airflow (optional external air source). The non-linear buffering characteristics of the disc spring assembly 206 (with a load-bearing capacity 3 times higher than ordinary cylindrical springs) control the fluctuation range of the mold impact load within ±5%, extending the fatigue life of the upper mold base 1 and the lower mold base 2.

[0039] Furthermore, the stamping mechanism 101 includes a quick-change punch assembly, a connecting seat 104, and a punch body 103. The connecting seat 104 is slidably connected to the upper die holder 1 via a dovetail groove. The punch body 103 is covered with a high-temperature ceramic coating, which is made of a composite of tungsten carbide-cobalt alloy and nano-aluminum nitride. The tungsten carbide-cobalt alloy / nano-aluminum nitride composite coating (hardness ≥1800HV) on the surface of the punch has twice the wear resistance of the traditional TiN coating.

[0040] Furthermore, the connecting seat 104 is embedded with a cooling channel, and the inlet and outlet of the cooling channel are connected to an external cooling system via a rotary joint. The built-in cooling channel of the quick-change punch assembly is connected to the external system, reducing the temperature of the punch body 103 through convection heat transfer (the cooling efficiency is 40% higher than that of the traditional structure).

[0041] Furthermore, the lower mold base 2 contains a gradient cooling system, which includes a spiral cooling channel that surrounds the die cavity. In the gradient cooling system, the spiral cooling channel creates a temperature gradient around the die cavity (inlet temperature difference ≤ 5℃), and the coolant (water-ethylene glycol mixture) circulates through a rotary joint, controlling the working temperature of the die cavity at 50±2℃.

[0042] Furthermore, an automatic lubrication module is also provided on one side of the buffer plate 213. This automatic lubrication module includes a reservoir 211 containing built-in nano-graphene lubricant, a micro pump 210, and a flow controller 209. The reservoir 211 is embedded in the side wall of the lower mold base 2. The micro pump 210 supplies atomized lubricant to the chip discharge port via the flow controller 209. The automatic lubrication module atomizes the nano-graphene lubricant (particle size 5-10 μm) through the micro pump 210 and quantitatively delivers it to the chip discharge port 207 via the flow controller 209, reducing the friction coefficient between the workpiece and the mold (to 0.02) while assisting in waste material discharge.

[0043] When replacing the punch, the old punch assembly is quickly removed via the dovetail groove structure, and the new assembly is inserted and locked in place by the positioning pin. The replacement time is ≤3 minutes. The adjustable bracket 212 adjusts the height (adjustment range 0-30mm) and angle (±15°) of the optical positioning sensor 208 via a knob to adapt to the positioning needs of workpieces with different thicknesses (0.1-2mm).

[0044] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A precision stamping die for electronic components, comprising an upper die base, a lower die base, guide pillars, guide sleeves, a stamping mechanism, and a positioning device, characterized in that, The positioning device includes: An optical positioning sensor is fixed to the edge of the lower mold base via an adjustable bracket to monitor the workpiece position in real time. A high-precision grating ruler is installed on the top surface of the lower die base, and its reading head is connected to the pressure plate of the stamping mechanism; A pressure sensor is located between the drive shaft and the pressure plate of the stamping mechanism; The outputs of the optical positioning sensor, grating ruler, and pressure sensor are all connected to the control module. The control module adjusts the feed speed and stroke of the drive shaft in real time through the servo motor, forming a three-level closed-loop positioning system.

2. A precision stamping die for electronic components according to claim 1, characterized in that: The top surface of the lower mold base is provided with an adaptive buffer assembly, which includes a sleeve, a guide rod and a disc spring assembly. The sleeve is fixed around the cavity of the lower mold base, the guide rod is slidably inserted into the sleeve, and the disc spring assembly is sleeved on the outside of the guide rod.

3. A precision stamping die for electronic components according to claim 2, characterized in that: The upper and lower ends of the disc spring assembly abut against the top of the sleeve and the flange of the guide rod, respectively. The end of the guide rod is provided with a buffer plate, the top surface of which is in contact with the workpiece. A chip discharge port is provided on one side of the lower die base.

4. A precision stamping die for electronic components according to claim 1, characterized in that: The stamping mechanism includes a quick-change punch assembly, a connecting seat, and a punch body. The connecting seat is slidably connected to the upper die seat via a dovetail groove. The punch body is covered with a high-temperature ceramic coating, which is made of a composite of tungsten carbide-cobalt alloy and nano-aluminum nitride.

5. A precision stamping die for electronic components according to claim 4, characterized in that: The connector is embedded with a cooling channel, and the inlet and outlet of the cooling channel are connected to an external cooling system via a rotary joint.

6. A precision stamping die for electronic components according to claim 1, characterized in that: The lower mold base has a gradient cooling system, which includes a spiral cooling channel that surrounds the die cavity.

7. A precision stamping die for electronic components according to claim 3, characterized in that: An automatic lubrication module is also provided on one side of the buffer plate. The automatic lubrication module includes a liquid storage tank with built-in nano-graphene lubricant, a micro pump and a flow controller. The liquid storage tank is embedded in the side wall of the lower mold base, and the micro pump supplies atomized lubricant to the chip discharge hole through the flow controller.

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