A device for tin hanging of thermistor chip

Abstract

This utility model discloses an inverted soldering device for thermistor chips, relating to the field of thermistor chip manufacturing technology. It includes a feeding mechanism and a chip with leads mounted on the feeding mechanism. The leads of the chip are vertically upward. Two sets of soldering structures are symmetrically arranged on both sides of the feeding mechanism's conveying direction. Each soldering structure includes a hot solder box, inside which a hollow solder tube is fixedly installed. A solder outlet tube is located on the side of the solder tube closest to the feeding mechanism, with its outlet aligned with the chip with leads. A fixing plate is located inside the hot solder box, and a first motor is mounted on the fixing plate. The output shaft of the first motor is connected to a small auger, which is located inside the solder tube. This inverted soldering device for thermistor chips facilitates soldering by placing the chip with leads on the side of the feeding mechanism with its leads vertically upward. The two sets of soldering structures achieve double-sided soldering and make the connection between the resistor and its leads more stable.

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