A mold for SBD device packaging

Abstract

The utility model discloses a kind of mould for SBD device packaging, it includes: template and movable insert, the template top surface is recessed and is provided with the positioning slot corresponding with movable insert, the movable insert is reversibly and symmetrically set in positioning slot, the inner wall of the movable insert of both sides and positioning slot is enclosed with the packaging cavity corresponding with SBD device, the movable insert front end bottom recess is provided with the pressure groove corresponding with the pin of SBD device, the positioning pin between the positioning slot of both sides movable insert is provided with. The mould for SBD device packaging of the utility model realizes the positioning of the chip and pin of SBD device, and improves the stability in injection molding packaging process.

Description

Technical Field

[0001] This utility model relates to the field of SBD device packaging technology, and in particular to a mold for SBD device packaging. Background Technology

[0002] During the production of SBD devices (also known as Schottky diodes), insulating plastic materials are often used for injection molding and encapsulation to enhance safety during use.

[0003] The injection molding of SBD devices requires the use of a corresponding mold. The SBD chip is placed into the mold cavity, and after the mold is closed, it is injection molded to encapsulate the chip, exposing the ends of the corresponding leads. SBD devices are small in size, making positioning within the mold cavity difficult. Furthermore, the leads are typically thin and long, resulting in poor structural stability and susceptibility to deformation during injection molding impact. This deformation leads to displacement of the SBD device within the mold, reducing the production yield and necessitating improvements. Utility Model Content

[0004] The purpose of this invention is to provide a mold for packaging SBD devices, positioning the pins and chips of SBD devices, and improving the stability of the packaging process.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A mold for packaging SBD devices includes: a template and movable inserts. The top surface of the template is recessed with a positioning groove corresponding to the movable insert. The movable insert is symmetrically and flip-foldably arranged in the positioning groove. The movable inserts on both sides and the inner wall of the positioning groove form a packaging cavity corresponding to the SBD device. The bottom front end of the movable insert is recessed with a pressing groove corresponding to the pins of the SBD device. A positioning pin is provided in the positioning groove between the two movable inserts.

[0007] The SBD device is provided with a chip positioning base, and the bottom of the chip positioning base is provided with a positioning hole corresponding to the positioning pin.

[0008] The number of the positioning slots is at least one.

[0009] The template is provided with a rotating shaft that horizontally penetrates the rear of the movable insert and passes through the positioning groove.

[0010] The template is provided with a rotation drive mechanism on one side to drive the rotating shaft.

[0011] The rotary drive mechanism is either a motor or a rotary cylinder.

[0012] The movable insert adopts a Z-shaped structure.

[0013] The beneficial effects of this utility model are as follows: A mold for packaging SBD devices uses positioning pins to position the SBD device chip in the positioning groove, and uses the flipping of the movable insert to press the groove onto the pin of the SBD device, thereby achieving the positioning and fastening of the pin and improving the stability of the SBD device and the pin during the injection molding process. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 yes Figure 1 Sectional view along axis AA;

[0016] Figure 3 yes Figure 2 A schematic diagram of the structure in which an SBD device is placed in the positioning slot;

[0017] Figure 4 yes Figure 3 A schematic diagram of the structure after the movable insert is turned outwards and opened. Detailed Implementation

[0018] The following is combined with Figures 1-4 The technical solution of this utility model will be further illustrated through specific embodiments.

[0019] like Figures 1-4 The mold shown is used for packaging SBD devices 10. It includes a template 1 and a movable insert 2. The top surface of the template 1 is recessed and has a positioning groove 3 corresponding to the movable insert 2. The number of positioning grooves 3 is at least one. In this embodiment, two positioning grooves 3 are used, which can package two SBD devices at the same time.

[0020] The movable insert 2 is symmetrically and reversibly arranged in the positioning groove 3, such as... Figure 2 and Figure 4 As shown, the template 1 is provided with a horizontally penetrating pivot 7 that passes through the rear of the movable insert 2 and through the positioning groove 3. The rotation of the pivot 7, as... Figure 4 As shown, this causes the movable inserts 2 in the two positioning slots 3 to flip.

[0021] In this embodiment, a rotation drive mechanism 5 is provided on one side of the template 1 to drive the rotating shaft 7 to rotate. The rotation drive mechanism 5 can be a motor or a rotary cylinder, and the rotation is controlled by a PLC controller to realize the outward opening and inward reset of the movable insert 2.

[0022] The movable inserts 2 on both sides and the inner walls of the positioning grooves 3 form a package cavity corresponding to the SBD device 10, such as... Figure 3As shown, this embodiment only demonstrates the moving mold; a fixed mold is also required to cooperate with the moving mold. After mold closing, the cavity is sealed and injection molded. In this embodiment, the movable insert 2 adopts a Z-shaped structure, as shown... Figure 4 As shown, the Z-shaped movable insert 2 can both turn inward to form a sealing cavity and reduce its own weight.

[0023] like Figure 2 and Figure 3 As shown, a pressure groove 6 corresponding to the pin 8 of the SBD device 10 is recessed at the bottom front end of the movable insert 2. By rotating the movable insert 2 inward, the pressure groove 6 is pressed and secured onto the pin 8 of the SBD device, achieving pin 8 positioning and fastening, preventing deformation and displacement of the pin 8 during injection molding, and further improving the packaging yield of the SBD device 10. After mold closing, injection molding is performed; after mold opening, the movable insert 2 is opened to release the restriction on the pin 8, as shown... Figure 4 As shown, this facilitates the removal of the packaged finished product 13.

[0024] To position the chip 12 of the SBD device 10, a positioning pin 4 is provided in the positioning groove 3 between the two movable inserts 2. In this embodiment, the SBD device 10 is provided with a chip positioning seat 9, and the chip 12 of the SBD device 10 is embedded in the slot in the chip positioning seat 9, and the chip 12 is clamped and fixed by the chip positioning seat 9.

[0025] In this embodiment, the bottom of the chip positioning base 9 is provided with a positioning hole 11 corresponding to the positioning pin 4, such as... Figure 3 As shown, by utilizing the cooperation between the positioning pin 4 and the positioning hole 11, the chip positioning seat 9 is positioned in the positioning groove 3, which indirectly realizes the positioning of the chip 12 of the SBD device 10 in the positioning groove 3, ensuring positioning accuracy and stability during the injection molding process.

[0026] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A mold for packaging SBD devices, characterized in that, include: The template and the movable insert are provided. The top surface of the template is recessed and has a positioning groove corresponding to the movable insert. The movable insert is symmetrically arranged in the positioning groove and can be flipped. The movable inserts on both sides and the inner wall of the positioning groove form a package cavity corresponding to the SBD device. The bottom front end of the movable insert is recessed and has a pressure groove corresponding to the pin of the SBD device. The positioning groove is provided with a positioning pin located between the two movable inserts.

2. The mold for SBD device packaging according to claim 1, characterized in that, The SBD device is provided with a chip positioning base, and the bottom of the chip positioning base is provided with positioning holes corresponding to the positioning pins.

3. The mold for SBD device packaging according to claim 1, characterized in that, The number of positioning slots is at least one.

4. The mold for SBD device packaging according to claim 1, characterized in that, The template is provided with a rotating shaft that runs horizontally through the rear of the movable insert and passes through the positioning groove.

5. The mold for SBD device packaging according to claim 4, characterized in that, A rotary drive mechanism for driving the rotating shaft is provided on one side of the template.

6. The mold for SBD device packaging according to claim 5, characterized in that, The rotary drive mechanism is either a motor or a rotary cylinder.

7. The mold for packaging SBD devices according to claim 1, characterized in that, The movable insert adopts a Z-shaped structure.

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