A ceramic chip diode drying carrier tray

Abstract

The utility model discloses a kind of ceramic chip diode drying time load tray, including the tray welded in the top of support base tray: the inner cavity of the support base tray is slidably connected with rectangular plate, two spring plates are welded between the bottom of the rectangular plate and the inner cavity of support base tray, the top of the rectangular plate is welded with multiple wave bars, the left and right sides of the support base tray are all opened with rectangular hole, the left and right sides of the rectangular plate are all welded with hollow rectangular piece, the inner cavity of the hollow rectangular piece is slidably connected with limit head, two springs are welded between the inner cavity of limit head and hollow rectangular piece, the utility model is pushed by depressing two rectangular blocks limit head sliding back into the inner cavity of hollow rectangular piece, subsequently the rebounding propelling force of spring plate makes rectangular plate exert vibration force to the inner cavity of tray, and then make diode separate from the inner cavity of tray, diode can be conveniently collected.

Description

Technical Field

[0001] This utility model belongs to the field of electronic component technology, and in particular relates to a material carrier tray for drying ceramic chip diodes. Background Technology

[0002] Ceramic surface mount diodes are surface mount devices with ceramic encapsulation. They are widely used in various electronic circuits due to their small size, high reliability, and good heat dissipation. Ceramic surface mount diodes are suitable for circuits with high thermal requirements because of the high thermal conductivity and high temperature resistance of ceramic materials.

[0003] After diode soldering or cleaning, if there is residual flux (containing rosin and organic acids) or cleaning agent (containing surfactants) on the surface, drying can ensure electrical performance and reliability. However, during the drying process, these substances will solidify into an adhesive film, "sticking" some components to the tray. To address this, a ceramic chip diode drying tray was designed. This tray can generate vibration force on itself, thereby detaching the diodes from the inner wall of the tray, making it easier to collect the diodes. Utility Model Content

[0004] The purpose of this invention is to provide a tray for drying ceramic chip diodes, which allows the diodes to be separated from the inner wall of the tray, facilitating their collection, thereby solving the aforementioned technical problems.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A material carrier tray for drying ceramic chip diodes, comprising a tray welded to the top of a supporting chassis; a rectangular plate is slidably connected to the inner cavity of the supporting chassis; two spring plates are welded between the bottom of the rectangular plate and the inner cavity of the supporting chassis; multiple corrugated strips are welded to the top of the rectangular plate; rectangular holes are opened on both the left and right sides of the supporting chassis; hollow rectangular parts are welded to both the left and right sides of the rectangular plate; a limiting head is slidably connected to the inner cavity of the hollow rectangular part; two springs are welded between the limiting head and the inner cavity of the hollow rectangular part; and a rectangular block is slidably connected to the inner cavity of the rectangular hole.

[0006] Preferably, the surface of the limiting head is slidably connected to the inner cavity of the rectangular hole, and rectangular frames are welded to both the left and right sides of the supporting chassis, with the inner cavity of the rectangular frame communicating with the rectangular hole.

[0007] Preferably, a limit strip is welded to the top of the inner cavity of the hollow rectangular part, and a guide groove is provided on the top of the limit head.

[0008] Preferably, the inner cavity of the guide groove is slidably connected to the inner cavity of the limiting strip, and the surface of the limiting head is provided with an arc-shaped surface.

[0009] Preferably, two movable grooves are provided on both the front and rear sides of the supporting chassis, and two connecting strips are welded on both the front and rear sides of the rectangular plate, with the surface of the connecting strips slidably connected to the inner cavity of the movable groove.

[0010] Preferably, an extension strip is welded to the side of the connecting strip opposite to the rectangular plate, and a semi-circular strip is welded to the surface of the extension strip.

[0011] The beneficial effects of this utility model are:

[0012] 1. This utility model pushes the limiting head back into the inner cavity of the hollow rectangular part by pressing the two rectangular blocks. Then, the spring plate's rebound force causes the rectangular plate to apply vibration force to the inner cavity of the tray, thereby causing the diode to detach from the inner cavity of the tray. This achieves the purpose of separating the diode from the inner wall of the tray, making it easier to collect the diode.

[0013] 2. By using the combination of the limiting strip and the guide groove, this utility model can ensure that the limiting head slides in a straight line during the sliding process inside the hollow rectangular part, thus preventing the limiting head from deflecting.

[0014] 3. By setting the arc-shaped surface, this utility model can provide a transitional protective force between the surface of the limiting head and the inner wall of the supporting chassis, thus avoiding damage to the inner wall of the supporting chassis caused by the deflection of the rectangular plate. Attached Figure Description

[0015] in:

[0016] Figure 1 This is a top view schematic diagram of one embodiment of the present utility model;

[0017] Figure 2 This is a top-view split diagram of one embodiment of the present invention;

[0018] Figure 3 This is a schematic cross-sectional view of the support chassis according to an embodiment of the present invention;

[0019] Figure 4 This is a schematic diagram showing the cross-sectional view of the support chassis according to one embodiment of the present invention;

[0020] Figure 5 This is one embodiment of the present utility model. Figure 3 A magnified view of point A in the middle.

[0021] The attached diagram lists the components represented by each number as follows:

[0022] 1. Supporting chassis; 2. Pallet; 3. Rectangular plate; 4. Spring plate; 5. Wave strip; 6. Rectangular hole; 7. Hollow rectangular part; 8. Limiting head; 9. Spring; 10. Rectangular block; 11. Rectangular frame; 12. Limiting strip; 13. Guide groove; 14. Arc surface; 15. Movable groove; 16. Connecting strip; 17. Extension strip; 18. Semicircular strip. Detailed Implementation

[0023] In the following description, embodiments of the ceramic chip diode drying tray of the present invention will be described with reference to the accompanying drawings. Example 1

[0024] Figure 1-5 This invention illustrates a ceramic chip diode drying tray according to an embodiment of the present invention, comprising: a tray 2 welded to the top of a supporting base 1; a rectangular plate 3 slidably connected to the inner cavity of the supporting base 1; two spring plates 4 welded between the bottom of the rectangular plate 3 and the inner cavity of the supporting base 1; multiple corrugated strips 5 welded to the top of the rectangular plate 3; rectangular holes 6 opened on both the left and right sides of the supporting base 1; hollow rectangular parts 7 welded to both the left and right sides of the rectangular plate 3; limit heads 8 slidably connected to the inner cavity of the hollow rectangular parts 7; two springs 9 welded between the limit heads 8 and the inner cavity of the hollow rectangular parts 7; and the inner cavity of the rectangular holes 6... A rectangular block 10 is slidably connected to the cavity. The surface of the limiting head 8 is slidably connected to the inner cavity of the rectangular hole 6. Rectangular frames 11 are welded on both the left and right sides of the supporting base 1. The inner cavity of the rectangular frame 11 is connected to the rectangular hole 6. A limiting strip 12 is welded to the top of the inner cavity of the hollow rectangular part 7. A guide groove 13 is opened on the top of the limiting head 8. The inner cavity of the guide groove 13 is slidably connected to the inner cavity of the limiting strip 12. Through the cooperation of the limiting strip 12 and the guide groove 13, the limiting head 8 can maintain a straight translation during the sliding process in the inner cavity of the hollow rectangular part 7, which can prevent the limiting head 8 from deflecting. Example 2

[0025] Figure 1-5This invention illustrates a ceramic chip diode drying tray according to an embodiment of the present invention, comprising: a tray 2 welded to the top of a supporting base 1; a rectangular plate 3 slidably connected to the inner cavity of the supporting base 1; two spring plates 4 welded between the bottom of the rectangular plate 3 and the inner cavity of the supporting base 1; multiple corrugated strips 5 welded to the top of the rectangular plate 3; rectangular holes 6 opened on both the left and right sides of the supporting base 1; hollow rectangular parts 7 welded to both the left and right sides of the rectangular plate 3; limit heads 8 slidably connected to the inner cavity of the hollow rectangular parts 7; two springs 9 welded between the limit heads 8 and the inner cavity of the hollow rectangular parts 7; and a slidably connected [missing information - likely a type of spring plate 7]. The rectangular block 10 has an arc-shaped surface 14 on its limiting head 8. The arc-shaped surface 14 provides a transitional protective force between the surface of the limiting head 8 and the inner wall of the supporting chassis 1, preventing damage to the inner wall of the supporting chassis 1 caused by the deflection of the rectangular plate 3. Two movable grooves 15 are provided on both the front and rear sides of the supporting chassis 1. Two connecting strips 16 are welded on both the front and rear sides of the rectangular plate 3. The surface of the connecting strips 16 is slidably connected to the inner cavity of the movable grooves 15. An extension strip 17 is welded to the side of the connecting strip 16 opposite to the rectangular plate 3. A semi-circular strip 18 is welded to the surface of the extension strip 17.

[0026] Working principle: When using this utility model, the user presses down on the extension strip 17 on the same side, causing the rectangular plate 3 to deflect and slide to the position of the rectangular hole 6. Then, the rebound force of the spring 9 causes the limiting head 8 to enter the inner cavity of the rectangular hole 6, thereby limiting the left side of the rectangular plate 3. Then, the right side of the rectangular plate 3 is pressed, so that the rectangular plate 3 remains flat in the inner cavity of the support base 1. Then, the diode is placed into the inner cavity of the tray 2 and dried. After drying, the two rectangular blocks 10 are pressed to push the limiting head 8 back into the inner cavity of the hollow rectangular piece 7, thereby releasing the limiting force of the rectangular plate 3 in the inner cavity of the support base 1. Then, the rebound force of the spring plate 4 causes the rectangular plate 3 to slide upward, and under the action of the wave strip 5, the inner cavity of the tray 2 is vibrated, thereby causing the diode to detach from the inner cavity of the tray 2, which can separate the diode from the inner wall of the tray, making it easier to collect the diode.

[0027] In summary: When drying ceramic chip diodes, the material tray is pushed by pressing the two rectangular blocks 10 to push the limiting head 8 back into the inner cavity of the hollow rectangular part 7. Then, the rebound force of the spring plate 4 causes the rectangular plate 3 to apply a vibration force to the inner cavity of the tray 2, thereby causing the diode to detach from the inner cavity of the tray 2. This achieves the purpose of separating the diode from the inner wall of the tray, which facilitates the collection of the diode.

Claims

1. A ceramic chip diode drying time carrier tray characterized by, Includes a tray (2) welded to the top of the support chassis (1): a rectangular plate (3) is slidably connected to the inner cavity of the support chassis (1), two spring plates (4) are welded between the bottom of the rectangular plate (3) and the inner cavity of the support chassis (1), multiple corrugated strips (5) are welded to the top of the rectangular plate (3), rectangular holes (6) are opened on both the left and right sides of the support chassis (1), hollow rectangular parts (7) are welded to both the left and right sides of the rectangular plate (3), a limiting head (8) is slidably connected to the inner cavity of the hollow rectangular part (7), two springs (9) are welded between the limiting head (8) and the inner cavity of the hollow rectangular part (7), and a rectangular block (10) is slidably connected to the inner cavity of the rectangular hole (6).

2. The ceramic chip diode drying carrier tray of claim 1, wherein, The surface of the limiting head (8) is slidably connected to the inner cavity of the rectangular hole (6). Rectangular frames (11) are welded on both the left and right sides of the supporting chassis (1). The inner cavity of the rectangular frame (11) is connected to the rectangular hole (6).

3. A ceramic chip diode drying carrier tray as defined in claim 2, wherein, A limiting strip (12) is welded to the top of the inner cavity of the hollow rectangular part (7), and a guide groove (13) is provided on the top of the limiting head (8).

4. The ceramic chip diode drying carrier tray of claim 3, wherein, The inner cavity of the guide groove (13) is slidably connected to the inner cavity of the limiting strip (12), and the surface of the limiting head (8) is provided with an arc-shaped surface (14).

5. A ceramic chip diode drying carrier tray as defined in claim 4, wherein, The supporting chassis (1) has two movable grooves (15) on both the front and rear sides, and the rectangular plate (3) has two connecting strips (16) welded on both the front and rear sides. The surface of the connecting strips (16) is slidably connected to the inner cavity of the movable grooves (15).

6. A ceramic chip diode drying carrier tray as defined in claim 5, wherein, The connecting strip (16) has an extension strip (17) welded to the side opposite to the rectangular plate (3), and a semi-circular strip (18) is welded to the surface of the extension strip (17).

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