Improved structure of vertical down-draw apparatus for forming a temperature field

Abstract

The utility model relates to a vertical downward drawing method forms the temperature field improvement structure of loading device, including loading device, and loading device is hollow structure, and including vertical extension's middle section, upper section and lower section, the both ends surface of middle section and / or lower section is connected with heating unit respectively to be used for the heating heat preservation of loading device inside, and the both sides surface outside of middle section and / or lower section is equipped with temperature adjusting assembly respectively, and temperature adjusting assembly includes a plurality of local cooling unit, and every local cooling unit can be close to or far away the side of loading device, when local cooling unit is close and with the side of loading device abuts, realizes the local cooling of corresponding area through heat conduction. The structure can guarantee the heating and heat preservation of temperature field inside loading device through heating unit, and through temperature adjusting assembly, selectively through local cooling unit to the side local area carries out contact cooling, thereby realizes the accurate adjustment of the small local area needing temperature adjustment, and equivalently reduces the temperature of glass liquid in corresponding area.

Description

Technical Field

[0001] This utility model belongs to the technical field of glass manufacturing and forming in chemistry and metallurgy, and specifically relates to an improved temperature field structure for a vertical pull forming material carrier device. Background Technology

[0002] In the production process of thin sheet glass using a down-draw method (such as the flow hole down-draw method and the vertical rolling method), a feeding device, also known as a material carrier, is usually installed between the outlet of the platinum channel feeding section and the rolling roll mechanism. This device is used to heat and maintain the molten glass before it reaches the rolling roll mechanism and output strip glass for subsequent rolling. The material carrier typically includes a square chamber body. From top to bottom, the chamber body has a central section with a larger inner cavity, a lower section with an inner cavity that gradually decreases in the thickness direction of the glass strip (the width direction of the chamber body), and an outlet section at the bottom of the lower section where the inner cavity is a slit. Functionally, these correspond to the molten glass buffer zone, the molten glass transition zone, and the molten glass outflow zone, respectively. To ensure the heat preservation and heating of the molten glass, the outer wall of the chamber body is usually connected with nickel bars for heating. The nickel bars are installed on both sides of the chamber body along its length and are in contact with the outer wall. They heat the chamber body through contact heat conduction, forming an internal temperature field within the chamber body, thus ensuring the heating and heat preservation of the molten glass inside.

[0003] While the heating nickel bars on both sides of the outer wall of the chamber body can ensure the heating and insulation of the internal molten glass, they are insufficient in effectively controlling the uniformity of the temperature field inside the chamber body. As it is a systemic adjustment structure, it cannot precisely adjust the temperature of relatively small, localized areas requiring temperature control. With increasingly higher requirements for glass quality and the current trends towards higher resolution, thinner profiles, and larger sizes, higher demands are placed on the manufacturing process of thin-plate glass, particularly on controlling the temperature uniformity of the loading device; otherwise, it will be difficult to further improve the quality of the finished product. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the prior art, the technical problem to be solved by this utility model is to provide an improved temperature field structure for a vertical pull-down forming material carrier device, which can accurately adjust the temperature of a relatively local small area on the material carrier device, avoid the problem that the current material carrier device cannot effectively control the uniformity of the internal temperature field, and achieve the effect of adjustable temperature uniformity to improve the quality of the produced glass.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] An improved temperature field structure for a vertical pull-down forming material carrier device includes a material carrier device, which is a hollow structure and includes a vertically extending middle section, an upper section, and a lower section.

[0007] Heating units are connected to both ends of the middle section and / or lower section to heat and keep the inside of the material loading device warm.

[0008] Temperature regulating components are respectively provided on both sides of the middle section and / or lower section, and the temperature regulating components include multiple local cooling units.

[0009] Each local cooling unit can be close to or far from the side of the material loading device; when a local cooling unit is close to and comes into contact with the side of the material loading device, local cooling of the corresponding area is achieved through heat conduction.

[0010] To further improve the above technical solution, the local cooling unit includes a fixing component and a telescopic unit. The telescopic end of the telescopic unit faces the material loading device and is connected to a contact block for heat transfer. The contact block is made of platinum, rhodium, or a platinum-rhodium alloy.

[0011] Furthermore, the telescopic unit is a screw; the fixing member has an internal threaded hole, and the screw is threadedly connected to the fixing member; one end of the screw is connected to the contact block, and the other end is connected to the handle drive unit; by rotating the handle drive unit, the screw is driven to move the contact block closer to or away from the material loading device.

[0012] Furthermore, the contact block is frustum-shaped or pyramidal, with the small end connected to the screw and the large end facing the material loading device.

[0013] Furthermore, the lever drive unit has a cross-shaped plate structure, with its middle part being perpendicularly fixed to the other end of the screw; an adjustment wrench is adapted to the lever drive unit for easy manual operation. The adjustment wrench is rod-shaped, with an inner cross-shaped groove on one end face corresponding to the lever drive unit, and a hand-held part on the other end.

[0014] Furthermore, the heating unit includes an upper nickel busbar and a lower nickel busbar;

[0015] The upper nickel busbar is connected to the upper end face of the middle section and is used to adjust the temperature field of the glass melt buffer zone;

[0016] The lower nickel busbar is connected to the end face of the lower section and is used to adjust the temperature field in the glass melt transition zone.

[0017] Furthermore, temperature regulating components are respectively provided on both sides of the middle section and formed as upper temperature regulating components; the upper temperature regulating components are located at the lower part of the middle section and close to the lower section, and are lower than the upper nickel busbar.

[0018] Furthermore, temperature regulating components are respectively provided on both sides of the lower section and formed as lower temperature regulating components.

[0019] Furthermore, the spacing between the multiple local cooling units included in the upper temperature regulating component is greater than the spacing between the multiple local cooling units included in the lower temperature regulating component.

[0020] Furthermore, a pressure roller assembly is provided below the discharge port of the material loading device.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] This invention features an improved temperature field structure for a vertical pull-down forming material carrier device. Within the material carrier device, the molten glass is heated and maintained to the required temperature via heating units at both ends. Temperature control components on both sides selectively contact, transfer heat, and cool localized areas through localized cooling units. This allows for precise adjustment of small, localized areas requiring temperature control, reducing localized high temperatures. Through heat transfer, the temperature of the molten glass in the corresponding area is effectively reduced, resulting in better control of the overall temperature uniformity within the material carrier device. Attached Figure Description

[0023] Figure 1 A schematic diagram of the improved temperature field structure of the vertical pull-down forming material carrier device in an embodiment;

[0024] Figure 2 for Figure 1 Side view of the intermediate loading device;

[0025] Figure 3 This is a schematic diagram of the local cooling unit in the embodiment;

[0026] Figure 4 This is a schematic diagram of adjusting the wrench in the embodiment;

[0027] The components include: 1. Material carrier; 2. Molten glass; 3. Pressure roller assembly; 4. Glass belt; 5. Temperature control assembly; and 6. Heating unit.

[0028] Feed pipe 101, upper section 102, middle section 103, lower section 104, discharge port 105.

[0029] Upper temperature control assembly 501, lower temperature control assembly 502, lever drive unit 503, fixing member 504, telescopic unit 505, contact block 506.

[0030] Upper nickel busbar 601, lower nickel busbar 602,

[0031] Adjust wrench 7. Detailed Implementation

[0032] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0033] Please see Figure 1 and Figure 2The improved temperature field structure of the vertical pull-down forming material carrier device in a specific embodiment is used between the outlet of the platinum channel feeding section and the calendering roller mechanism in the pull-down thin glass production process. It can heat and maintain the temperature of the molten glass before it reaches the calendering roller mechanism and output strip glass for subsequent calendering. This improved structure allows for precise temperature adjustment of relatively small local areas on the material carrier device, avoiding the current problem of the material carrier device's inability to effectively control the uniformity of the internal temperature field. This improved structure includes a hollow material carrier device 1, which includes a vertically extending middle section 103 with a rectangular horizontal cross-section. The lower end of the middle section 103 is sealed and connected to a downwardly extending lower section 104. The two opposite sides of the lower section 104 gradually approach each other to form a tapered shape that gradually decreases downwards, and a slit-shaped outlet 105 is formed at the bottom of the lower section 104. The upper end of the middle section 103 is sealed and connected to an upper section 102 whose inner cavity gradually decreases upwards, and the upper section 102... A feed pipe 101 is connected; heating units 6 are respectively connected to both ends of the middle section 103 and / or the lower section 104 for heating and heat preservation inside the material loading device 1; temperature regulating components 5 are respectively provided on both sides of the middle section 103 and / or the lower section 104, and the temperature regulating components 5 include multiple local cooling units, each of which can be close to or away from the side of the material loading device 1; when the local cooling unit is close to and abuts against the side of the material loading device 1, local cooling of the corresponding area on the side of the material loading device 1 is achieved through heat conduction.

[0034] In this embodiment, the improved temperature field structure of the loading device features heating units 6 connected to both ends of the middle section 103 and the lower section 104. Temperature regulating components 5 are also provided on both sides of the middle section 103 and the lower section 104. The glass melt 2 within the loading device 1 is heated and kept warm by the heating units 6 at both ends, reaching the required temperature. The temperature regulating components 5 on both sides selectively contact, transfer heat, and cool localized areas of the sides via localized cooling units, thereby achieving precise adjustment of small, localized areas requiring temperature regulation, reducing localized high temperatures, and effectively lowering the temperature of the glass melt 2 in the corresponding area through heat transfer, resulting in better overall uniformity of the temperature field within the loading device 1. It is understood that, during implementation, temperature sensors or thermometers can be provided on the inner or outer sides of the corresponding sides to provide feedback control for the localized cooling process. The localized cooling unit can utilize its contact with the side of the loading device 1 to exchange temperature and cool the corresponding area, or it can be further connected to external heat sinks to transfer more heat away; the specific implementation is not limited.

[0035] Goodbye Figure 3The local cooling unit includes a fixing member 504 and a telescopic unit 505. The telescopic end of the telescopic unit 505 faces the material loading device 1 and is connected to a contact block 506 for contact heat transfer. The contact block 506 is made of platinum, rhodium or platinum-rhodium alloy.

[0036] This facilitates the fixing of the contact block 506 and also facilitates the process of the contact block 506 moving closer to and further away from the material carrier 1. Specifically, when the contact block 506 approaches or moves away from the side of the material carrier 1 and comes into contact with the side of the material carrier 1, local cooling of the corresponding area on the side of the material carrier 1 is achieved through heat conduction. In implementation, the fixing member 504 can be connected to the outer side of the side of the material carrier 1 through the connector, or it can be fixed independently to the outer side of the side of the material carrier 1, which is not limited. The material carrier 1 is usually made of platinum, rhodium, or a platinum-rhodium alloy. The material of the contact block 506 is preferably a platinum-rhodium alloy, as similar materials are easy to improve the efficiency of the heat transfer process. In this embodiment, since the temperature control is for each small area on the side of the material carrier 1, the contact block 506, which has a relatively lower temperature, reduces the temperature of the material carrier 1 by contacting the side of the material carrier 1, which is sufficient to achieve the cooling effect of the corresponding area. No external heat sink is needed, making the structure simpler and easier to implement.

[0037] The telescopic unit 505 is a screw; the fixing member 504 has an internal threaded hole, and the screw is threadedly connected to the fixing member 504; one end of the screw is connected to the contact block 506, and the other end is fixedly connected to the handle drive part 503; by rotating the handle drive part 503, the screw is driven to move the contact block 506 closer to or away from the material loading device 1.

[0038] In this way, the contact block 506 moves closer to and further away from the material loading device 1 via a threaded rotation connection, ensuring reliable operation. The lever drive 503 is used to drive the screw to rotate in both directions under external force, correspondingly moving closer to and further away from the material loading device 1. In practice, the mechanical structure can be controlled by a controller connected to the aforementioned temperature sensor or thermometer to rotate the lever drive 503, or the lever drive 503 can be manually rotated based on feedback from the aforementioned temperature sensor or thermometer; the specific method is not limited. The materials of the fixing part 504, the screw, and the lever drive 503 are preferably made of high-temperature resistant alloy.

[0039] The contact block 506 is frustum or pyramidal in shape, with its small end connected to the screw and its large end facing the material carrier 1. This saves material and ensures an effective heat transfer area with the material carrier 1.

[0040] Please continue reading Figure 3 and Figure 4In this embodiment, the lever drive part 503 is a cross-shaped plate structure, with its middle part being perpendicularly fixed to the other end of the screw; an adjustment wrench 7 is adapted to the lever drive part 503 for easy manual operation. The adjustment wrench 7 is rod-shaped, with an inner cross-shaped groove on one end face corresponding to the lever drive part 503, and a hand-held part with a gradually increasing end diameter on the other end.

[0041] In this way, the operation process can be conveniently carried out when manual adjustment is required by the dedicated adjustment wrench 7; the inner cross-shaped groove on the end face of the adjustment wrench 7 is engaged with the cross-shaped handle drive part 503, and the enlarged diameter hand part can easily output torque to the handle drive part 503 to drive the screw to rotate, thus improving the convenience of operation.

[0042] Please continue reading Figure 1 and Figure 2 The heating unit 6 includes an upper nickel busbar 601 and a lower nickel busbar 602. The upper nickel busbar 601 is connected to the upper end face of the middle section 103 and is used to adjust the temperature field of the glass melt buffer zone. The lower nickel busbar 602 is connected to the end face of the lower section 104 and is used to adjust the temperature field of the glass melt transition zone. The upper nickel busbar 601 mainly conducts heat to the middle section 103 of the material carrier 1, and the lower nickel busbar 602 mainly conducts heat to the lower section 104 of the material carrier 1. The traditional nickel busbar heating insulation method is adopted, and the overall thermal adjustment is practical and reliable.

[0043] In this embodiment, the temperature regulating components 5 respectively provided on both sides of the middle section 103 are formed as upper temperature regulating components 501; the upper temperature regulating components 501 are located at the lower part of the middle section 103 and close to the lower section 104, and are lower than the upper nickel busbar 601. The temperature regulating components 5 respectively provided on both sides of the lower section 104 are formed as lower temperature regulating components 502.

[0044] In this way, temperature regulating components 5 are laid out in a large array on both sides of the middle section 103 and both sides of the lower section 104. The temperature can be precisely adjusted and cooled in the local small areas that need temperature regulation as needed, so as to better ensure the overall uniformity of the temperature field inside the regulating material loading device 1.

[0045] The spacing between the multiple local cooling units in the upper temperature regulating component 501 is greater than the spacing between the multiple local cooling units in the lower temperature regulating component 502. This reduces costs and allows for customized configuration based on the temperature and operational characteristics of different sections. The upper temperature regulating component 501 is more densely arranged, resulting in better temperature adjustment sensitivity but lower flow rate adjustment sensitivity. The lower temperature regulating component 502, being closer to the lower nickel busbar 602, is more sparsely arranged, resulting in relatively lower temperature adjustment sensitivity but better flow rate adjustment sensitivity.

[0046] Please see again. Figure 1Below the discharge port 105 of the material loading device 1, a pressure roller assembly 3 is provided. The pressure roller assembly 3 can be a platform with double rollers pressing against each other or a single roller working together to receive the strip of molten glass 2 output by the material loading device 1 and further press it into glass strip 4.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. An improved temperature field structure for a vertical pull-down forming material carrier device, characterized in that: It includes a material loading device, which has a hollow structure and includes a vertically extending middle section, an upper section, and a lower section; Heating units are connected to both ends of the middle section and / or lower section to heat and keep the inside of the material loading device warm. Temperature regulating components are respectively provided on both sides of the middle section and / or lower section, and the temperature regulating components include multiple local cooling units. Each local cooling unit can be close to or far from the side of the material loading device; when a local cooling unit is close to and comes into contact with the side of the material loading device, local cooling of the corresponding area is achieved through heat conduction.

2. The improved temperature field structure of the vertical pull-down forming material carrier device according to claim 1, characterized in that: The local cooling unit includes a fixing component and a telescopic unit. The telescopic end of the telescopic unit faces the material loading device and is connected to a contact block for heat transfer. The contact block is made of platinum, rhodium, or a platinum-rhodium alloy.

3. The improved temperature field structure of the vertical pull-down forming material carrier device according to claim 2, characterized in that: The telescopic unit is a screw; the fixing member has an internal threaded hole, and the screw is threadedly connected to the fixing member; one end of the screw is connected to the contact block, and the other end is connected to the handle drive unit; by rotating the handle drive unit, the screw is driven to move the contact block closer to or away from the material loading device.

4. The improved temperature field structure of the vertical pull-down forming material carrier device according to claim 3, characterized in that: The contact block is frustum or pyramidal in shape, with the small end connected to the screw and the large end facing the material loading device.

5. The improved temperature field structure of the vertical pull-down forming material carrier device according to claim 3, characterized in that: The lever drive unit has a cross-shaped plate structure, with its middle part being perpendicularly fixed to the other end of the screw; an adjustment wrench is adapted to the lever drive unit for easy manual operation. The adjustment wrench is rod-shaped, with an inner cross-shaped groove on one end face corresponding to the lever drive unit, and a hand-held part on the other end.

6. The improved temperature field structure of the vertical pull-down forming material carrier device according to any one of claims 1-5, characterized in that: The heating unit includes an upper nickel busbar and a lower nickel busbar; The upper nickel busbar is connected to the upper end face of the middle section and is used to adjust the temperature field of the glass melt buffer zone; The lower nickel busbar is connected to the end face of the lower section and is used to adjust the temperature field in the glass melt transition zone.

7. The improved temperature field structure of the vertical pull-down forming material carrier device according to claim 6, characterized in that: Temperature regulating components are respectively provided on both sides of the middle section and form an upper temperature regulating component; The upper temperature control component is located in the lower part of the middle section and close to the lower section, and is lower than the upper nickel busbar.

8. The improved temperature field structure of the vertical pull-down forming material carrier device according to claim 7, characterized in that: Temperature regulating components are respectively provided on both sides of the lower section, forming a lower temperature regulating component.

9. The improved temperature field structure of the vertical pull-down forming material carrier device according to claim 8, characterized in that: The spacing between the multiple local cooling units contained in the upper temperature regulating component is greater than the spacing between the multiple local cooling units contained in the lower temperature regulating component.

10. The improved temperature field structure of the vertical pull-down forming material carrier device according to claim 1, characterized in that: A pressure roller assembly is provided below the discharge port of the material loading device.

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