A support structure for MOSFET chip repair

Abstract

This utility model relates to the field of support structure technology and discloses a support structure for MOSFET chip repair. It includes a heat-conducting plate, a placement plate fixedly connected to the surface of the heat-conducting plate, two sets of connecting posts slidably connected inside the placement plate, a push-pull assembly fixedly connected to one side of the bottom of each connecting post, several sets of heat sinks A fixedly connected to the bottom of the heat-conducting plate, cooling pipes sleeved inside each heat sink A, and a cooling assembly connected to one end of each cooling pipe. The push-pull assembly includes a connecting bolt fixedly connected to one side of the bottom of each connecting post, and a transmission rod rotatably connected to one end of the connecting bolt. This support structure for MOSFET chip repair, through the push-pull assembly, achieves rapid chip clamping, reduces manual intervention, improves repair efficiency, and ensures the chip remains stable during testing or repair, avoiding poor contact or testing errors due to displacement.

Description

Technical Field

[0001] This utility model relates to the field of support structure technology, and in particular to a support structure for MOSFET chip maintenance. Background Technology

[0002] During the repair of MOSFET chips, the support structure needs to ensure that the chip remains stable and undisturbed during the repair process. Excessive shaking or vibration can lead to detection errors or chip damage, directly affecting the chip's stability, processing efficiency, and safety. The support structure used for MOSFET chip repair can increase the stability and positioning accuracy of the chip support, providing an efficient and safe platform for chip repair and testing.

[0003] Patent document CN221485475U discloses a chip support structure for chip testing, including a substrate. A central support is fixedly installed in the middle of the substrate, and a grounding block is fixedly installed on the top wall of the central support. A conductive brush is connected to the top of the grounding block, and a grounding wire is assembled at the bottom of the grounding block. Support rods are fixedly installed on both sides of the substrate, and slide rails are fixedly installed on the top of the support rods. In this invention, by setting a conductive brush at the top of the central support to contact the chip held by the fixing clamp, the static electricity generated on the chip is conducted to the ground through the grounding wire at the bottom of the grounding block, achieving the grounding effect. Furthermore, a slider can be driven by a track and a linear motor to slide on the slide rail, thereby adjusting the position of the chip held by the fixing clamp. Thus, while testing one chip, another chip can be fixed on another fixing clamp. As the chip slides on the slide rail, a flowing detection is achieved, greatly improving the practicality of the device.

[0004] However, existing support structures for MOSFET chip repair are difficult to clamp quickly during testing or repair, requiring manual intervention, which reduces repair efficiency and is prone to poor contact or testing errors due to displacement. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] The purpose of this invention is to provide a support structure for MOSFET chip repair, which solves the problems mentioned in the background art, such as the difficulty in quickly clamping the chip during testing or repair, the need for manual intervention, reduced repair efficiency, and the easy occurrence of poor contact or testing errors due to displacement.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model provides the following technical solution: a support structure for MOSFET chip repair, comprising a heat-conducting plate, a placement plate fixedly connected to the surface of the heat-conducting plate, two sets of connecting posts slidably connected inside the placement plate, a push-pull assembly fixedly connected to one side of the bottom of the connecting posts, several sets of heat sinks A fixedly connected to the bottom of the heat-conducting plate, a cooling pipe sleeved inside the heat sink A, a cooling assembly passing through one end of the cooling pipe, the push-pull assembly including a connecting bolt fixedly connected to one side of the bottom of the connecting posts, a transmission rod rotatably connected to one end of the connecting bolt, and a tension frame rotatably connected to one end of the transmission rod; the cooling assembly including a delivery pump passing through one end of the cooling pipe, a storage box passing through the output end of the delivery pump, and a semiconductor cooling chip fixedly connected to the surface of the storage box.

[0009] As a further embodiment of this utility model, a rotating shaft is sleeved in the middle of the tension frame, and a drive motor is fixedly connected to the bottom of the rotating shaft. The drive motor drives the rotating shaft to rotate.

[0010] As a further embodiment of this utility model, a clamping block is fixedly connected to the top of the connecting column, and a protective pad is fixedly connected to one side of the clamping block. The protective pad enhances the protection of the chip.

[0011] As a further embodiment of this utility model, a plurality of heat sinks B are fixedly connected to one side of the semiconductor cooling chip, and a support shell is sleeved on the surface of the semiconductor cooling chip. The support shell serves to separate the hot and cold surfaces of the semiconductor cooling chip and provide support.

[0012] As a further embodiment of this utility model, two sets of cooling fans are fixedly connected to one side of the support shell, and a ventilation opening is provided on one side of the support shell, which facilitates the entry of air.

[0013] As a further embodiment of this utility model, a support platform is fixedly connected to the surface of the placement plate, a magnifying glass is fixedly connected to one side of the support platform, and an illumination lamp is provided on the top of the support platform. The illumination lamp facilitates illumination.

[0014] As a further embodiment of this utility model, the bottom of the clamping block is fixedly connected with two sets of sliders, and the surface of the placement plate is provided with a sliding groove that matches the slider. The sliding groove facilitates the sliding of the slider.

[0015] (III) Beneficial Effects

[0016] This utility model provides a support structure for MOSFET chip maintenance, which has the following advantages:

[0017] 1. This support structure for MOSFET chip repair, through the setting of the push-pull assembly, allows the chip to be placed on the heat-conducting plate during use. Then, the drive motor is started, causing the drive motor to rotate the shaft, which in turn drives the tension frame to rotate. The tension frame pulls the transmission rod, and the two ends of the transmission rod rotate on the tension frame and the connecting bolt respectively, thereby causing the connecting post to slide in the groove on the placement plate. The chip is clamped by two sets of clamping blocks, thereby achieving the effect of quickly clamping the chip, reducing manual intervention, improving repair efficiency, and ensuring that the chip remains in a stable position during testing or repair, avoiding poor contact or testing errors due to displacement.

[0018] 2. This support structure for MOSFET chip repair, through the setting of the cooling components, transfers the heat generated on the chip under repair to the heat sink A via the heat conduction plate during use. Then, the coolant inside the cooling pipe absorbs the heat and starts the delivery pump. The delivery pump drives the coolant into the storage tank, and then the semiconductor cooling chip cools the storage tank. The hot surface is discharged through the heat sink B and the cooling fan, thereby achieving a rapid cooling effect. This avoids MOSFET threshold voltage drift or thermal breakdown due to overheating during repair, and improves the safety of the support structure. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the disassembled structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the push-pull component structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the refrigeration component structure of this utility model.

[0023] In the diagram: 1. Heat-conducting plate; 2. Placement plate; 3. Connecting column; 4. Push-pull assembly; 401. Connecting bolt; 402. Transmission rod; 403. Tension frame; 5. Heat sink A; 6. Cooling pipe; 7. Refrigeration assembly; 701. Delivery pump; 702. Storage box; 703. Semiconductor cooling chip; 8. Rotating shaft; 9. Drive motor; 10. Clamping block; 11. Protective pad; 12. Heat sink B; 13. Support shell; 14. Cooling fan; 15. Support platform; 16. Magnifying glass; 17. Illumination lamp; 18. Slider. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0025] Please see Figures 1 to 4 This utility model provides a technical solution: a support structure for MOSFET chip repair, including a heat-conducting plate 1, a placement plate 2 fixedly connected to the surface of the heat-conducting plate 1, two sets of connecting posts 3 slidably connected inside the placement plate 2, and a push-pull assembly 4 fixedly connected to one side of the bottom of the connecting posts 3. The push-pull assembly 4 achieves the effect of quickly clamping the chip, reducing manual intervention, improving repair efficiency, and ensuring that the chip remains stable during testing or repair, avoiding poor contact or testing errors due to displacement. Several sets of heat sinks A5 are fixedly connected to the bottom of the heat-conducting plate 1, and cooling pipes 6 are sleeved inside the heat sinks A5. A cooling component 7 is connected through the end of the support structure. The cooling component 7 achieves rapid cooling and temperature reduction, avoiding MOSFET threshold voltage drift or thermal breakdown due to overheating during maintenance, thus improving the safety of the support structure. The push-pull component 4 includes a connecting bolt 401 fixedly connected to one side of the bottom of the connecting post 3. One end of the connecting bolt 401 is rotatably connected to a transmission rod 402, and one end of the transmission rod 402 is rotatably connected to a tension frame 403. The cooling component 7 includes a delivery pump 701 connected through the end of the cooling pipe 6. The output end of the delivery pump 701 is connected through the storage box 702, and a semiconductor cooling chip 703 is fixedly connected to the surface of the storage box 702.

[0026] A rotating shaft 8 is sleeved in the middle of the tension frame 403, and a drive motor 9 is fixedly connected to the bottom of the rotating shaft 8. The drive motor 9 drives the rotating shaft 8 to rotate.

[0027] A clamping block 10 is fixedly connected to the top of the connecting post 3, and a protective pad 11 is fixedly connected to one side of the clamping block 10. The protective pad 11 is used to increase the protection of the chip.

[0028] Several sets of heat sinks B12 are fixedly connected to one side of the semiconductor cooling chip 703. A support shell 13 is sleeved on the surface of the semiconductor cooling chip 703. The support shell 13 serves to separate the hot and cold surfaces of the semiconductor cooling chip 703 and provide support.

[0029] Two sets of cooling fans 14 are fixedly connected to one side of the support shell 13. A ventilation opening is provided on one side of the support shell 13, which facilitates the entry of air.

[0030] A support platform 15 is fixedly connected to the surface of the placement plate 2. A magnifying glass 16 is fixedly connected to one side of the support platform 15. An illumination lamp 17 is provided on the top of the support platform 15. The illumination lamp 17 facilitates illumination.

[0031] Two sets of sliders 18 are fixedly connected to the bottom of the clamping block 10. The surface of the placement plate 2 is provided with a sliding groove that matches the slider 18. The sliding groove facilitates the sliding of the slider 18.

[0032] In this invention, the working steps of the device are as follows:

[0033] First step: When in use, place the chip on the heat-conducting plate 1, and then start the drive motor 9, so that the drive motor 9 drives the rotating shaft 8 to rotate, and the rotating shaft 8 drives the tension frame 403 to rotate, so that the tension frame 403 pulls the transmission rod 402. The two ends of the transmission rod 402 rotate on the tension frame 403 and the connecting bolt 401 respectively, thereby driving the connecting post 3 to slide in the groove on the placement plate 2, and using two sets of clamping blocks 10 to clamp the chip;

[0034] The second step: During use, the heat generated on the chip under maintenance is transferred to the heat sink A5 through the heat conduction plate 1. Then, the coolant inside the cooling pipe 6 absorbs the heat and starts the delivery pump 701. The delivery pump 701 drives the coolant into the storage tank 702, and then the semiconductor cooling chip 703 cools the storage tank 702. The hot surface is discharged through the heat sink B12 and the cooling fan 14.

[0035] It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming.

[0036] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A support structure for MOSFET chip repair, comprising a heat-conducting plate (1), characterized in that: A placement plate (2) is fixedly connected to the surface of the heat-conducting plate (1). Two sets of connecting posts (3) are slidably connected inside the placement plate (2). A push-pull assembly (4) is fixedly connected to one side of the bottom of the connecting post (3). Several sets of heat sinks A (5) are fixedly connected to the bottom of the heat-conducting plate (1). A cooling pipe (6) is sleeved inside the heat sink A (5). A refrigeration assembly (7) is connected through one end of the cooling pipe (6). The push-pull assembly (4) includes a connecting bolt (401) fixedly connected to one side of the bottom of the connecting column (3), one end of the connecting bolt (401) is rotatably connected to a transmission rod (402), and one end of the transmission rod (402) is rotatably connected to a tension frame (403). The cooling assembly (7) includes a delivery pump (701) that is connected to one end of the cooling pipe (6), and the output end of the delivery pump (701) is connected to a storage tank (702). A semiconductor cooling chip (703) is fixedly connected to the surface of the storage tank (702).

2. The support structure for MOSFET chip repair according to claim 1, characterized in that: A rotating shaft (8) is sleeved in the middle of the tension frame (403), and a drive motor (9) is fixedly connected to the bottom of the rotating shaft (8).

3. The support structure for MOSFET chip repair according to claim 1, characterized in that: A clamping block (10) is fixedly connected to the top of the connecting column (3), and a protective pad (11) is fixedly connected to one side of the clamping block (10).

4. The support structure for MOSFET chip repair according to claim 1, characterized in that: A number of heat sinks B (12) are fixedly connected to one side of the semiconductor cooling chip (703), and a support shell (13) is sleeved on the surface of the semiconductor cooling chip (703).

5. The support structure for MOSFET chip repair according to claim 4, characterized in that: Two sets of cooling fans (14) are fixedly connected to one side of the support shell (13), and a ventilation opening is provided on one side of the support shell (13).

6. The support structure for MOSFET chip repair according to claim 1, characterized in that: A support platform (15) is fixedly connected to the surface of the placement plate (2), a magnifying glass (16) is fixedly connected to one side of the support platform (15), and an illumination lamp (17) is provided on the top of the support platform (15).

7. The support structure for MOSFET chip repair according to claim 3, characterized in that: The bottom of the clamping block (10) is fixedly connected to two sets of sliders (18), and the surface of the placement plate (2) is provided with a groove that matches the sliders (18).

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