Optoelectronic device

Abstract

An optoelectronic device mainly provides an optical engine chip and sets a fiber connector on the optical engine chip through an adhesive layer, wherein the adhesive layer contains glue material and spacing material, so that the fiber connector is fixed on the optical engine chip through the glue material of the adhesive layer, and the gap between the fiber connector and the optical engine chip is controlled through the spacing material of the adhesive layer.

Description

Technical Field

[0001] This application relates to a semiconductor device, and more particularly to an optoelectronic device. Background Technology

[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. Currently, the application of fifth-generation (5G) communication technology has expanded to fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data will be generated that needs to be efficiently transmitted, computed, and stored. Therefore, in recent years, large data centers and cloud servers have seen a surge in demand for data transmission, leading the industry to enter the field of optical communication, using "light" instead of "electricity" as the data transmission carrier. Against this backdrop, co-packaged optical components have become a future trend in semiconductor and packaging technology.

[0003] In existing co-packaged optical component manufacturing processes, the efficient and precise bonding of fiber optic connectors and optical engine chips (OE chips) is crucial for improving signal transmission efficiency. If the bonding between the fiber optic connector and the OE chip is uneven, signal attenuation, distortion, or loss may occur when the optical signal transmitted through the fiber optic cable reaches the OE chip. However, the distance between the fiber optic connector and the OE chip is typically controlled using ultraviolet (UV) adhesive. Since UV adhesive is a pure liquid, uneven application and shrinkage during UV curing can lead to uneven bonding, resulting in inaccurate spacing control, fiber optic connector misalignment, and impacting optical alignment accuracy and signal transmission efficiency.

[0004] Overcoming the various problems of the existing technologies has become an urgent issue for the industry. Utility Model Content

[0005] To address the problems of the prior art, this application provides an optoelectronic device, comprising: an optical engine chip; an optical fiber connector disposed on the optical engine chip; and an adhesive layer disposed between the optical engine chip and the optical fiber connector, comprising an adhesive material and a spacer material, so that the optical fiber connector is fixed to the optical engine chip by the adhesive material of the adhesive layer, and the gap between the optical fiber connector and the optical engine chip is controlled by the spacer material of the adhesive layer.

[0006] This application also provides a method for manufacturing an optoelectronic device, comprising: providing an optical engine chip; and disposing a fiber optic connector on the optical engine chip via an adhesive layer, wherein the adhesive layer includes an adhesive material and a spacer material, so that the fiber optic connector is fixed to the optical engine chip via the adhesive material of the adhesive layer, and the gap between the fiber optic connector and the optical engine chip is controlled by the spacer material of the adhesive layer.

[0007] In the aforementioned optoelectronic device and its manufacturing method, the adhesive layer is first disposed on the optical engine chip, and then the optical fiber connector is disposed on the optical engine chip through the adhesive layer.

[0008] In the aforementioned optoelectronic device and its manufacturing method, the adhesive layer is first disposed on the optical fiber connector, and then the optical fiber connector is disposed on the optical engine chip through the adhesive layer.

[0009] In the aforementioned optoelectronic device and its manufacturing method, the optical fiber connector has a through-hole to serve as an optical channel.

[0010] In the aforementioned optoelectronic device and its manufacturing method, the optical engine chip integrates electronic integrated circuits and photonic integrated circuits.

[0011] In the aforementioned optoelectronic device and its manufacturing method, the adhesive material is an ultraviolet adhesive.

[0012] In the aforementioned optoelectronic device and its manufacturing method, the material forming the spacer is divinylbenzene or acrylate copolymer.

[0013] The aforementioned optoelectronic device and its manufacturing method also include a plurality of conductive elements disposed on the optical engine chip.

[0014] Therefore, the optoelectronic device of this application mainly incorporates spacer material uniformly into the adhesive material of the adhesive layer between the optical engine chip and the optical fiber connector to control the gap between the optical channels, so that the optical fiber connector and the optical engine chip can maintain a fixed gap and improve flatness when they are bonded. This can improve the shortcomings of traditional bonding processes caused by uneven gaps leading to light transmission loss. Attached Figure Description

[0015] Figures 1A to 1C This is a schematic diagram of the first embodiment of the manufacturing method of the optoelectronic device of this application.

[0016] Figures 2A to 2C This is a schematic diagram of a second embodiment of the manufacturing method of the optoelectronic device of this application.

[0017] Figure 3 This is a cross-sectional schematic diagram of the co-packaged optical element for the optoelectronic device using this application.

[0018] Explanation of reference numerals in the attached figures

[0019] 1. Optoelectronic device

[0020] 11 Optical Engine Chips

[0021] 11a First side

[0022] 11b Second side

[0023] 12 Adhesive Layer

[0024] 121 Adhesive Material

[0025] 122 Spacer Material

[0026] 13 Fiber Optic Connectors

[0027] 130 opening

[0028] 13a First Surface

[0029] 13b Second Surface

[0030] 14. Conductive elements

[0031] 2. Co-packaged optical components

[0032] 21 Circuit Board

[0033] 22. Packaged module. Detailed Implementation

[0034] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0035] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "first," "second," "at least one," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0036] Please see Figures 1A to 1C This is a schematic diagram of the first embodiment of the manufacturing method of the optoelectronic device of this application. Figure 1A As shown, an optical engine chip 11 is provided, having a first side 11a and a second side 11b opposite to each other, and an adhesive layer 12 is formed on the second side 11b of the optical engine chip 11.

[0037] The optical engine chip 11 integrates, for example, an electronic integrated circuit (EIC) and a photonic integrated circuit (PIC). The photonic integrated circuit is used to transmit and receive optical signals, and the electronic integrated circuit and the photonic integrated circuit are electrically connected to perform the conversion between optical signals and electronic signals.

[0038] The adhesive layer 12 is a spacer 122 added to the adhesive 121 (e.g., UV adhesive). Figure 1C The material forming the spacer 122 is, for example, divinylbenzene or acrylate copolymer.

[0039] like Figure 1B As shown, an optical fiber connector 13 is provided, which has a first surface 13a and a second surface 13b opposite to each other, and an opening 130 is formed in the middle position through the first surface 13a and the second surface 13b to serve as an optical channel.

[0040] like Figure 1CAs shown, the fiber optic connector 13 is disposed on the second side 11b of the optical engine chip 11 with the first surface 13a, so that the fiber optic connector 13 is fixed to the optical engine chip 11 by the adhesive material 121 of the adhesive layer 12, and the gap between the fiber optic connector 13 and the optical engine chip 11 is controlled by the spacer material 122 of the adhesive layer 12, so as to obtain the optoelectronic device 1.

[0041] Please see Figures 2A to 2C This is a schematic diagram of a second embodiment of the manufacturing method of the optoelectronic device of this application. Figure 2A As shown, an optical engine chip 11 is provided, having opposing first sides 11a and second sides 11b. The optical engine chip 11 integrates an electronic integrated circuit (EIC) and a photonic integrated circuit (PIC).

[0042] like Figure 2B As shown, a fiber optic connector 13 is provided, having opposing first surfaces 13a and second surfaces 13b, with an opening 130 formed at the middle position, penetrating the first surface 13a and the second surface 13b, and an adhesive layer 12 formed around the periphery of the first surface 13a. The adhesive layer 12 is a spacer 122 added to an adhesive material 121 (e.g., ...). Figure 2C ).

[0043] like Figure 2C As shown, the fiber optic connector 13 is disposed on the second side 11b of the optical engine chip 11 through the adhesive layer 12 to obtain the optoelectronic device 1.

[0044] Through the aforementioned manufacturing method, this application also provides an optoelectronic device 1, which includes an optical engine chip 11, an optical fiber connector 13 disposed on the optical engine chip 11, and an adhesive layer 12 disposed between the optical engine chip 11 and the optical fiber connector 13.

[0045] The optical engine chip 11 has a first side 11a and a second side 11b.

[0046] The fiber optic connector 13 is disposed on the second side 11b of the optical engine chip 11. It has a first surface 13a and a second surface 13b opposite to each other, and forms an opening 130 through the first surface 13a and the second surface 13b to serve as an optical channel.

[0047] The adhesive layer 12 includes an adhesive material 121 and spacers 122 added to the adhesive material 121. The material forming the spacers 122 is, for example, divinylbenzene or acrylate copolymer. The spacers 122 can be uniformly dispersed in the adhesive material 121 under pressure (without agglomeration), and the gap between the fiber optic connector 13 and the optical engine chip 11 can be controlled by the particle size of the spacers 122 themselves. In addition, since the spacers 122 are dimensionally uniform and have high strength, they can effectively prevent gap changes caused by pressure or shrinkage after curing. At the same time, the spacers 122 can be uniformly dispersed without agglomeration and can be evenly distributed in the adhesive material 121 to provide a flat and fixed support force.

[0048] In addition, a plurality of conductive elements 14, such as solder balls, can be provided on the first side 11a of the optical engine chip 11 so that the optoelectronic device 1 can be connected to an external device through the plurality of conductive elements 14.

[0049] Please see Figure 3 Subsequently, multiple optoelectronic devices 1 can be connected to a circuit board 21 via multiple conductive elements 14 on the first side 11a of the optical engine chip 11. A packaging module 22 is provided at the center of the circuit board 21. The packaging module 22 may contain active components such as switch chips, system-on-a-chip (SOC), high-bandwidth memory (HBM) chips or other functional chips, or passive components such as resistors, capacitors or inductors. Multiple optoelectronic devices 1 (optical engine chips 11) are arranged around the packaging module 22 to form a common packaged optical element 2.

[0050] In summary, the optoelectronic device of this application primarily incorporates a spacer material uniformly into the adhesive layer between the optical engine chip and the fiber optic connector. This spacer material controls the gap between the optical channels, ensuring a fixed gap and improving flatness when the fiber optic connector and optical engine chip are bonded. This overcomes the shortcomings of traditional bonding processes where uneven gaps lead to light transmission loss. Furthermore, the aforementioned device is not only simple to implement but also highly feasible, effectively addressing the problems of existing technologies.

[0051] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. A photoelectric device, characterized in that, include: Optical engine chip; The fiber optic connector is located on the optical engine chip; as well as An adhesive layer is disposed between the optical engine chip and the optical fiber connector and includes adhesive material and spacer material, so that the optical fiber connector is fixed to the optical engine chip by the adhesive material of the adhesive layer, and the gap between the optical fiber connector and the optical engine chip is controlled by the spacer material of the adhesive layer.

2. The photoelectric device as described in claim 1, characterized in that, The fiber optic connector has a through-hole to serve as an optical channel.

3. The photoelectric device as described in claim 1, characterized in that, The optical engine chip integrates electronic integrated circuits and photonic integrated circuits.

4. The photoelectric device as claimed in claim 1, characterized in that, This adhesive is a UV adhesive.

5. The optoelectronic device as claimed in claim 1, characterized in that, The material forming this spacer is a divinylbenzene or acrylic copolymer.

6. The photoelectric device as described in claim 1, characterized in that... The optoelectronic device also includes multiple conductive elements disposed on the optical engine chip.

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