Micromirror assembly and optical device
By designing magnetic conductive components, a base, a support assembly, and a magnet assembly in the MEMS micromirror structure, the distance between the micromirror and the base is increased and the magnetic field distribution is optimized, thus solving the problem of collision damage during micromirror deflection and achieving maximum deflection angle and low power consumption.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN YINGTANG AURORA MICRO TECHNOLOGY CO LTD
- Filing Date
- 2025-07-25
- Publication Date
- 2026-06-02
AI Technical Summary
In existing MEMS micromirror structures, the micromirror is prone to collision and damage with the silicon substrate when it deflects, and the deflection angle is small.
A micromirror assembly was designed, including a magnetic conductor, a base, a support assembly, a magnet assembly, and an energizing assembly. The micromirror and the energizing assembly are clamped by the end of the magnet assembly away from the base, increasing the distance between them and the base. The magnetic field distribution is optimized by setting grooves on the magnetic conductor, ensuring that the energizing assembly is located in the region of maximum magnetic field.
The problem of collision damage between the micromirror and the base during micromirror deflection was solved, achieving the maximum deflection angle while reducing power consumption.
Smart Images
Figure CN224317852U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of micromirror technology, and in particular to a micromirror assembly and optical device. Background Technology
[0002] In today's era of rapid technological development, new technological demands are constantly emerging in the fields of robotics and autonomous driving, among which the need for miniaturized, high-performance optical scanning elements is particularly urgent. Microelectromechanical systems (MEMS) micromirrors, as a highly promising optical scanning element, have shown broad application prospects in the fields of robotics and autonomous driving due to their advantages such as high scanning speed, low power consumption, small size, and ease of mass production.
[0003] Existing MEMS micromirror structures typically consist of a silicon substrate, a stage, a micromirror, a drive coil, a permanent magnet module, and a yoke. A spatial magnetic field is generated by arranging the permanent magnet module, and a current is then applied to the drive coil, creating electromagnetic coupling that causes the micromirror to deflect. However, in existing MEMS micromirror structures, the distance between the micromirror and the drive coil and the silicon substrate is too small. In this case, the micromirror and drive coil are positioned in the lower middle part of the permanent magnet module, making the micromirror prone to collision and damage to the silicon substrate during deflection, resulting in a small deflection angle. Utility Model Content
[0004] This application mainly provides a micromirror assembly and optical device to solve the problems of easy collision and damage to the silicon substrate during micromirror deflection and small deflection angle.
[0005] This application provides a micromirror assembly, including:
[0006] Magnetic conductive components;
[0007] A base is disposed on the magnetic conductive component;
[0008] Support components are disposed on the base;
[0009] A magnet assembly is disposed on the magnetic conductive element and surrounds the support assembly;
[0010] Micromirrors are mounted on the support assembly;
[0011] A power-conducting component is disposed on the support component and surrounds the micromirror;
[0012] The end of the magnet assembly away from the base is configured to hold the micromirror and the energized assembly; the magnetic conductor has a groove, and part of the base is disposed in the groove.
[0013] The magnetic conductor includes a magnetic yoke, the magnet assembly is disposed on the magnetic yoke, and part of the base is disposed in the groove of the magnetic yoke.
[0014] The support assembly includes a first support column, a second support column, and a support frame, with the first support column and the second support column spaced apart on the base.
[0015] The micromirror assembly further includes a support frame, which is elastically connected to the end of the first support column away from the base, and to the end of the second support column away from the base. The micromirror and the power-conducting assembly are disposed on the support frame. The end of the magnet assembly away from the base is configured to clamp the support frame.
[0016] The magnet assembly includes a first permanent magnet, a second permanent magnet, a third permanent magnet, and a fourth permanent magnet. The first permanent magnet is disposed on the magnetic conductor and on one side of the support frame. The second permanent magnet is disposed on the magnetic conductor and corresponds to the first permanent magnet. The third permanent magnet is disposed on the magnetic conductor and on the other side of the support frame, adjacent to the first permanent magnet. The fourth permanent magnet is disposed on the magnetic conductor and corresponds to the third permanent magnet. The ends of the first, second, third, and fourth permanent magnets away from the magnetic conductor clamp the support frame.
[0017] The height of the first permanent magnet is equal to the height of the second permanent magnet, the height of the third permanent magnet is equal to the height of the fourth permanent magnet, and the height of the first permanent magnet is less than the height of the third permanent magnet; the first permanent magnet and the second permanent magnet clamp the support frame at the ends away from the magnetic conductor.
[0018] The energizing component includes a first coil, a second coil, and a third coil. The first coil is disposed between the micromirror and the first permanent magnet, the second coil is disposed between the micromirror and the second permanent magnet, and the third coil is disposed around the micromirror.
[0019] The micromirror assembly further includes an elastic element, through which the micromirror is connected to the support frame, and the micromirror is used to oscillate via the elastic element.
[0020] The first support column and the second support column are connected to the support frame via the elastic element, and the support frame is used to deflect via the elastic element when the energized component is energized.
[0021] This application also provides an optical device, including the micromirror assembly described above.
[0022] The beneficial effects of this application are: the end of the magnet assembly away from the base is configured to hold the micromirror and the power-conducting assembly; compared with the existing MEMS micromirror structure, the micromirror and the power-conducting assembly of this application are held by the end of the magnet assembly away from the base, that is, the distance between the micromirror and the power-conducting assembly and the substrate is increased, which solves the problem that the micromirror is prone to collision and damage to the base when it is deflected, thereby maximizing the deflection angle. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:
[0024] Figure 1 This is a schematic diagram of an embodiment of the existing MEMS micromirror structure provided in this application;
[0025] Figure 2 This is a schematic diagram of the structure of the magnetic yoke, permanent magnet module, silicon substrate and earthen platform in the existing MEMS micromirror structure provided in this application;
[0026] Figure 3 This is a schematic diagram of the structure of an embodiment of the micromirror assembly provided in this application;
[0027] Figure 4 This is a schematic diagram of a structure of an embodiment of the magnetic conductive element, magnet assembly, base and support assembly in the micromirror assembly provided in this application;
[0028] Figure 5 This is a schematic diagram of the magnetic flux density of an embodiment of the existing MEMS micromirror structure and micromirror assembly provided in this application. Detailed Implementation
[0029] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.
[0031] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary and secondary relationship of the indicated technical features.
[0032] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0033] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.
[0034] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).
[0035] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0036] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a connection between two components or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.
[0037] Please see Figures 1-2 As shown, Figure 1 This is a schematic diagram of the structure of an embodiment of a conventional MEMS micromirror provided in this application; Figure 2 This is a schematic diagram of the structure of the magnetic yoke, permanent magnet module, silicon substrate, and stage in the existing MEMS micromirror structure provided in this application. The existing MEMS micromirror structure 200 in this embodiment consists of a silicon substrate 1, a stage 2, a micromirror 3, a drive coil 4, a permanent magnet module 5, and a magnetic yoke 6.
[0038] A spatial magnetic field is generated by arranging permanent magnet modules 5, and then current is passed through the drive coil 4, thereby generating electromagnetic coupling to drive the micromirror 3 to deflect.
[0039] like Figure 1 and Figure 2 As shown, due to the small height of the platform 2, the distance between the micromirror 3 and the drive coil 4 and the silicon substrate 1 is too small. At this time, the micromirror 3 and the drive coil 4 are in the middle and lower position of the permanent magnet module 5. When the micromirror 3 deflects, it is easy to collide and be damaged with the silicon substrate 1, and the deflection angle is small.
[0040] Please see Figures 3-4 As shown, Figure 3 This is a schematic diagram of the structure of an embodiment of the micromirror assembly provided in this application; Figure 4 This is a schematic diagram of one embodiment of the magnetic conductive element, magnet assembly, base, and support assembly in the micromirror assembly provided in this application. The micromirror assembly 100 of this embodiment includes a magnetic conductive element 10, a base 20, a support assembly 30, a magnet assembly 40, a micromirror 50, and a power supply assembly 60.
[0041] The magnetic conductor 10 is used to guide and concentrate the magnetic field, optimizing the magnetic circuit efficiency. The magnetic conductor 10 includes, but is not limited to, a magnetic yoke, silicon steel sheet, pure iron, or low-carbon steel.
[0042] The base 20 is disposed on the magnetic conductor 10, and the support assembly 30 is disposed on the base 20.
[0043] The base 20, also called the silicon substrate, is used to support the support assembly 30, the micromirror 50, and the power-conducting assembly 60. The support assembly 30 supports the micromirror 50 and the power-conducting assembly 60.
[0044] The magnet assembly 40 is disposed on the magnetic conductor 10 and surrounds the support assembly 30.
[0045] In some embodiments, the magnet assembly 40 generates a spatial magnetic field after being placed around the support assembly 30.
[0046] The micromirror 50 is mounted on the support assembly 30, and the power supply assembly 60 is mounted on the support assembly 30 and surrounds the micromirror 50.
[0047] The energizing component 60 is used to generate a magnetic field when energized. The energizing component 60 includes, but is not limited to, a coil.
[0048] In some embodiments, the micromirror 50 and the power supply component 60 are disposed on the end of the support component 30 away from the base 20, and the power supply component 60 is disposed around the micromirror 50.
[0049] The end of the magnet assembly 40 away from the base 20 is configured to hold the micromirror 50 and the energizing assembly 60.
[0050] like Figure 2 and Figure 4 As shown, compared to the height of the platform 2 in the existing MEMS micromirror structure 200, the height of the support component 30 in this embodiment is greater than the height of the platform 2, the distance between the micromirror 50 and the power supply component 60 and the base 20 is increased, and at the same time, the micromirror 50 and the power supply component 60 on the support component 30 are clamped by the end of the magnet component 40 away from the base 20.
[0051] In this embodiment, the end of the magnet assembly 40 away from the base 20 is configured to hold the micromirror 50 and the power supply assembly 60. Compared with the existing MEMS micromirror structure 200, the micromirror 50 and the power supply assembly 60 in this application are held by the end of the magnet assembly 40 away from the base, that is, the distance between the micromirror 50 and the power supply assembly 60 and the base 20 is increased, which solves the problem that the micromirror 50 is prone to collision and damage with the base 20 when it deflects, thereby maximizing the deflection angle.
[0052] The magnetic conductor 10 has a groove 11, and part of the base 20 is disposed in the groove 11.
[0053] Since the deflection angle of the micromirror 50 is affected by the magnetic field and the driving current, when the driving torque is constant, the greater the magnetic field strength at the location of the energized component 60, the smaller the required driving current, resulting in a significant reduction in power. When the arrangement of the magnet component 40 is fixed, the spatial magnetic field distribution remains constant; however, if the position of the energized component 60 is changed, the surrounding magnetic field changes accordingly. Therefore, determining the plane with the strongest magnetic field can minimize power consumption.
[0054] This embodiment solves the problem of the maximum deflection angle limitation by increasing the distance between the micromirror 50 and the power-conducting component 60 and the base 20. However, the increased distance between the power-conducting component 60 and the base 20 indicates that the power-conducting component 60 is raised, which can cause the spatial magnetic field at the location of the power-conducting component 60 to be much lower than that at the maximum magnetic field, resulting in a significant increase in power consumption at the same deflection angle.
[0055] In this embodiment, a groove 11 is provided on the magnetic conductive component 10, and part of the base 20 is disposed in the groove 11. When the maximum deflection angle is achieved, the groove 11 is provided so that the micromirror 50 and the energizing component 60 are lowered by a set height relative to the magnet component 40, so that the spatial magnetic field at the location of the energizing component 60 is the maximum magnetic field, thereby ensuring that the power consumption does not increase when the same deflection angle is reached.
[0056] However, since the groove 11 is provided on the magnetic conductive element 10, i.e., part of the magnetic conductive element 10 is removed, a question arises as to whether removing part of the magnetic conductive element 10 will cause a significant change in the magnetic field. See [link / reference] Figure 5 As shown, Figure 5 This is a schematic diagram of the magnetic flux density of an embodiment of the existing MEMS micromirror structure and micromirror assembly provided in this application. This embodiment calculates the change in magnetic field strength through simulation.
[0057] like Figure 5 As shown, the driving coil 4 of the existing MEMS micromirror structure 200 on the left and the energized component 60 of the micromirror assembly 100 on the right are selected to compare the fast and slow axis magnetic flux densities. The average values of the slow axis are 0.47564T and 0.47253T, respectively, and the average values of the fast axis are 0.36253T and 0.36058T, respectively. The relative error is less than 2%, and the influence in the magnetic field region is very small.
[0058] According to some embodiments of this application, the magnetic conductor 10 includes a magnetic yoke, a magnet assembly 40 is disposed on the magnetic yoke, and a partial base 20 is disposed in the groove 11 of the magnetic yoke.
[0059] In this embodiment, the magnet assembly 40 is disposed on the magnetic yoke, so that the magnetic field is more concentratedly distributed around the micromirror 50 and the energized assembly 60 under the guidance of the magnetic yoke.
[0060] According to some embodiments of this application, the support component 30 includes a first support column 31 and a second support column 32, which are spaced apart on the base 20.
[0061] like Figure 4 As shown, the first support column 31 and the second support column 32 are respectively installed on opposite ends of the base 20. The first support column 31 and the second support column 32 are also called earth platforms.
[0062] In this embodiment, the first support column 31 and the second support column 32 are spaced apart on the base 20 to form a stable double support structure, which can provide more stable support for the micromirror 50 and the power-conducting component 60, and effectively reduce the shaking and position deviation of the micromirror 50 during the deflection process.
[0063] According to some embodiments of this application, see Figure 3 As shown, the micromirror assembly 100 in this embodiment also includes a support frame 70. The support frame 70 is elastically connected to the end of the first support column 31 away from the base 20, and the support frame 70 is elastically connected to the end of the second support column 32 away from the base 20. The micromirror 50 and the power supply assembly 60 are disposed on the support frame 70. The end of the magnet assembly 40 away from the base 20 is configured to clamp the support frame 70.
[0064] Among them, elastic connections include, but are not limited to, torsion bar connections, micro-spring connections, or flexible hinge connections.
[0065] In some embodiments, one side of the support frame 70 is elastically connected to one end of the first support column 31 away from the base 20 and one end of the second support column 32 away from the base 20, respectively. The micromirror 50 and the energizing component 60 are disposed on the side of the support frame 70 away from the first support column 31 and the second support column 32, and the micromirror 50 is elastically connected to the support frame 70. When the energizing component 60 is energized, the micromirror 50 can oscillate in the fast and slow axis directions, and the support frame 70 can deflect in the fast and slow axis directions.
[0066] According to some embodiments of this application, see Figure 3 As shown, the magnet assembly 40 in this embodiment includes a first permanent magnet 41, a second permanent magnet 42, a third permanent magnet 43, and a fourth permanent magnet 44. The first permanent magnet 41 is disposed on the magnetic conductor 10 and on one side of the support frame 70. The second permanent magnet 42 is disposed on the magnetic conductor 10 and is disposed corresponding to the first permanent magnet 41. The third permanent magnet 43 is disposed on the magnetic conductor 10 and is disposed on the other side of the support frame 70, and is disposed adjacent to the first permanent magnet 41. The fourth permanent magnet 44 is disposed on the magnetic conductor 10 and is disposed corresponding to the third permanent magnet 43. The ends of the first permanent magnet 41, the second permanent magnet 42, the third permanent magnet 43, and the fourth permanent magnet 44 away from the magnetic conductor 10 clamp the support frame 70.
[0067] like Figure 3 As shown, the magnetic conductor 10 is provided with four limiting parts for positioning the first permanent magnet 41, the second permanent magnet 42, the third permanent magnet 43, and the fourth permanent magnet 44. The support frame 70 is a rectangular frame. The first permanent magnet 41 is located on one side of the support frame 70. The second permanent magnet 42 is symmetrically arranged with the first permanent magnet 41, forming a pair of permanent magnets. The third permanent magnet 43 is arranged adjacent to the first permanent magnet 41, that is, the third permanent magnet 43 is located on the side of the support frame 70 adjacent to the first permanent magnet 41. The fourth permanent magnet 44 is symmetrically arranged with the third permanent magnet 43, forming a pair of permanent magnets. The ends of the first permanent magnet 41, the second permanent magnet 42, the third permanent magnet 43, and the fourth permanent magnet 44 away from the magnetic conductor 10 clamp the four sides of the support frame 70.
[0068] In this embodiment, a stable spatial magnetic field is formed by setting up a first permanent magnet 41, a second permanent magnet 42, a third permanent magnet 43, and a fourth permanent magnet 44.
[0069] According to some embodiments of this application, the height of the first permanent magnet 41 is equal to the height of the second permanent magnet 42, the height of the third permanent magnet 43 is equal to the height of the fourth permanent magnet 44, and the height of the first permanent magnet 41 is less than the height of the third permanent magnet 43; the end of the first permanent magnet 41 and the second permanent magnet 42 away from the magnetic conductor 10 clamps the support frame 70.
[0070] like Figure 3 As shown, the height of the first permanent magnet 41 and the second permanent magnet 42 is less than the height of the third permanent magnet 43 and the fourth permanent magnet 44. The ends of the first permanent magnet 41 and the second permanent magnet 42 away from the magnetic conductor 10 clamp the support frame 70, that is, the upper ends of the first permanent magnet 41 and the second permanent magnet 42 clamp the support frame 70, and the middle and upper ends of the third permanent magnet 43 and the fourth permanent magnet 44 clamp the support frame 70.
[0071] In this embodiment, the first permanent magnet 41 and the second permanent magnet 42 form a height difference gradient with the third permanent magnet 43 and the fourth permanent magnet 44, generating an asymmetric magnetic field, which can improve the electromagnetic torque efficiency of the micromirror 50 when it deflects at a large angle.
[0072] According to some embodiments of this application, the energized component 60 includes a first coil, a second coil, and a third coil. The first coil is disposed between the micromirror 50 and the first permanent magnet 41, the second coil is disposed between the micromirror 50 and the second permanent magnet 42, and the third coil is disposed around the micromirror 50.
[0073] According to some embodiments of this application, the micromirror assembly 100 further includes an elastic element (not shown), the micromirror 50 is connected to the support frame 70 via the elastic element, and the micromirror 50 is used to oscillate via the elastic element.
[0074] Among them, elastic elements include, but are not limited to, torsion bars, microsprings, or flexible hinges.
[0075] According to some embodiments of this application, the first support column 31 and the second support column 32 are connected to the support frame 70 through elastic members. The support frame 70 is used to deflect through the elastic members when the energized component 60 is energized.
[0076] This application also provides an optical device, including the micromirror assembly 100 of the above embodiments. Optical devices include, but are not limited to, lidar, 3D cameras and projection devices, optical switch modulators, or optical filters.
[0077] In summary, this application configures the end of the magnet assembly 40 away from the base 20 to clamp the micromirror 50 and the power-conducting component 60. Compared with the existing MEMS micromirror structure 200, the micromirror 50 and the power-conducting component 60 in this application are clamped by the end of the magnet assembly 40 away from the base, that is, the distance between the micromirror 50 and the power-conducting component 60 and the base 20 is increased, which solves the problem that the micromirror 50 is prone to collision and damage with the base 20 when it is deflected, thereby maximizing the deflection angle. Through the setting of the groove 11, the micromirror 50 and the power-conducting component 60 are lowered by a set height relative to the magnet assembly 40, so that the spatial magnetic field at the location of the power-conducting component 60 is the maximum magnetic field, thereby ensuring that the power consumption does not increase when deflected at the same angle.
[0078] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A micromirror assembly, characterized in that, include: Magnetic conductive components; A base is disposed on the magnetic conductive component; Support components are disposed on the base; A magnet assembly is disposed on the magnetic conductive element and surrounds the support assembly; Micromirrors are mounted on the support assembly; A power-conducting component is disposed on the support component and surrounds the micromirror; The end of the magnet assembly away from the base is configured to hold the micromirror and the energized assembly; the magnetic conductor has a groove, and part of the base is disposed in the groove.
2. The micromirror assembly according to claim 1, characterized in that, The magnetic conductor includes a magnetic yoke, the magnet assembly is disposed on the magnetic yoke, and a portion of the base is disposed within a groove of the magnetic yoke.
3. The micromirror assembly according to any one of claims 1-2, characterized in that, The support assembly includes a first support column and a second support column, which are spaced apart on the base.
4. The micromirror assembly according to claim 3, characterized in that, The micromirror assembly further includes a support frame, which is elastically connected to the end of the first support column away from the base, and to the end of the second support column away from the base. The micromirror and the power supply assembly are disposed on the support frame. The end of the magnet assembly away from the base is configured to clamp the support frame.
5. The micromirror assembly according to claim 4, characterized in that, The magnet assembly includes a first permanent magnet, a second permanent magnet, a third permanent magnet, and a fourth permanent magnet; the first permanent magnet is disposed on the magnetic conductive element and on one side of the support frame; the second permanent magnet is disposed on the magnetic conductive element and is correspondingly disposed to the first permanent magnet; the third permanent magnet is disposed on the magnetic conductive element and is disposed on the other side of the support frame, and is adjacent to the first permanent magnet; the fourth permanent magnet is disposed on the magnetic conductive element and is correspondingly disposed to the third permanent magnet; the ends of the first, second, third, and fourth permanent magnets away from the magnetic conductive element clamp the support frame.
6. The micromirror assembly according to claim 5, characterized in that, The height of the first permanent magnet is equal to the height of the second permanent magnet, the height of the third permanent magnet is equal to the height of the fourth permanent magnet, and the height of the first permanent magnet is less than the height of the third permanent magnet; the first permanent magnet and the second permanent magnet clamp the support frame at the ends away from the magnetic conductor.
7. The micromirror assembly according to claim 5, characterized in that, The energizing component includes a first coil, a second coil, and a third coil. The first coil is disposed between the micromirror and the first permanent magnet, the second coil is disposed between the micromirror and the second permanent magnet, and the third coil is disposed around the micromirror.
8. The micromirror assembly according to claim 4, characterized in that, The micromirror assembly also includes an elastic element, through which the micromirror is connected to the support frame, and the micromirror is used to oscillate via the elastic element.
9. The micromirror assembly according to claim 8, characterized in that, The first support column and the second support column are connected to the support frame via the elastic element, and the support frame is used to deflect via the elastic element when the energized component is energized.
10. An optical device, characterized in that, Includes the micromirror assembly as described in any one of claims 1-9.