A solid-state laser device

Abstract

This application discloses a solid-state laser device, including a first housing, a second housing, a light-emitting component, a plano-convex mirror assembly, a PCB board, and a cooling fan. The first housing has a receiving cavity and a light-emitting hole, the light-emitting hole and the receiving cavity being connected. The second housing has a through hole and covers the receiving cavity. The light-emitting component passes through the through hole, and an inclined reflector is mounted at one end of the light-emitting component, the reflector being opposite to the light-emitting hole. The plano-convex mirror assembly is mounted at the light-emitting hole. The PCB board is connected to the second housing. The cooling fan is located at the ends of the first housing and the second housing and is fixedly connected to both housings. Because the light-emitting component passes through the through hole and the PCB board is connected to the second housing, the light-emitting component or PCB board can be quickly removed and replaced without completely disassembling the first housing, simplifying the maintenance process and improving maintenance efficiency.

Description

Technical Field

[0001] This application relates to the field of lasers, and more specifically, to a solid-state laser device. Background Technology

[0002] A laser is a device that generates light by amplifying stimulated emission, and it has important applications in many fields. Many components of a laser are installed inside a housing, and disassembly and reassembly are often required for maintenance, replacement of electronic components, or internal testing.

[0003] Existing lasers are complex to disassemble and assemble during maintenance. For example, replacing the circuit board requires opening the housing, which affects maintenance efficiency. Therefore, improvements are needed. Utility Model Content

[0004] The purpose of this application is to provide a solid-state laser device to solve the problems of complex disassembly and assembly and low maintenance efficiency of existing lasers.

[0005] To solve the above problems, this application adopts the following technical solution:

[0006] This application provides a solid-state laser device, comprising:

[0007] The first housing has a receiving cavity and a light-emitting hole, and the light-emitting hole and the receiving cavity are connected;

[0008] The second housing has a through hole and covers the receiving cavity;

[0009] A light-emitting component is inserted through the through hole, and an inclined reflector is installed at one end of the light-emitting component. The reflector is arranged opposite to the light-emitting hole.

[0010] A plano-convex mirror assembly is installed at the light outlet.

[0011] The PCB board is connected to the second housing.

[0012] A cooling fan is located at the end of the first housing and the second housing, and the cooling fan is fixedly connected to the first housing and the second housing.

[0013] Because the light-emitting components are installed through the through holes and the PCB board is connected to the second housing, the light-emitting components or PCB board can be quickly removed and replaced without completely disassembling the first housing, which simplifies the maintenance process, shortens maintenance time, and improves maintenance efficiency.

[0014] Furthermore, the second housing includes a bottom plate, a side plate, a first fin, and a second fin. The side plate and the second fin are both fixed to the bottom plate, the first fin is mounted on the side plate, and the bottom plate covers the receiving cavity.

[0015] By setting a first fin and a second fin, the heat dissipation area is increased, the heat dissipation efficiency is improved, and the heat dissipation capacity is enhanced.

[0016] Furthermore, the second housing is located between the first housing and the PCB board, and the PCB board covers the cooling fan, thereby facilitating the disassembly and assembly of the PCB board, and also protecting the cooling fan.

[0017] Furthermore, the first housing is provided with an annular groove, which is adapted to the cross-sectional profile of the receiving cavity. The annular groove is located on the side close to the second housing, thereby improving the assembly efficiency of the first housing and the second housing.

[0018] Furthermore, the central axis of the through hole is vertically arranged, thereby making the light-emitting component vertically arranged, reducing the space occupied by the light-emitting component, and thus reducing the overall size.

[0019] Furthermore, the central axis of the through hole is set perpendicular to the central axis of the light outlet hole, which makes the optical path design of the solid-state laser device more reasonable and unobstructed, thereby meeting the user's needs and improving the utilization rate of the cavity.

[0020] Furthermore, the light-emitting component includes a mounting base, which is fixedly connected to the second housing, and the reflector is located at one end of the mounting base near the receiving cavity.

[0021] Because the fixed base is fixedly connected to the second housing, the positional accuracy of the reflector is improved, thereby enhancing the laser resonance effect of the solid-state laser.

[0022] Furthermore, the fixing base is provided with a stop frustum, which is coaxially arranged with the through hole and abuts against the second housing. By providing the stop frustum, the fixing base is effectively fixed, improving alignment efficiency and facilitating quick disassembly and installation.

[0023] Furthermore, both the first housing and the second housing have two fixing holes at their ends, and the cooling fan has a mounting hole. The fixing hole and the mounting hole are coaxially arranged, which facilitates the installation and disassembly of the cooling fan and makes it easy to quickly replace the cooling fan. At the same time, the cooling fan can effectively dissipate heat from the first housing and the second housing, thereby improving the heat dissipation effect.

[0024] In summary, this application includes at least one of the following beneficial technical effects:

[0025] 1. The light-emitting component is installed through the through hole, and the PCB board is connected to the second housing. It is not necessary to completely disassemble the first housing, which makes the maintenance and replacement of the light-emitting component, PCB board or other components simpler, simplifies the disassembly process of other components of solid-state laser equipment, and improves disassembly and assembly efficiency.

[0026] 2. Since the cooling fan is located at the ends of the first and second housings, it can effectively dissipate the heat generated by the solid-state laser device, maintain the operating temperature of the device, and ensure that the solid-state laser device can operate stably and reliably for a long time. Attached Figure Description

[0027] Figure 1 An exploded view of a solid-state laser device provided in an embodiment of this application;

[0028] Figure 2 This is a schematic diagram of the structure of a solid-state laser device provided in an embodiment of this application;

[0029] Figure 3 A cross-sectional view of a solid-state laser device provided in an embodiment of this application;

[0030] Figure 4 This is a schematic diagram of the structure of a light-emitting component provided in an embodiment of this application.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1. First housing; 11. Receiving cavity; 12. Light emission hole; 13. Annular groove;

[0033] 2. Second shell; 21. Base plate; 211. Through hole; 22. Side plate; 23. First fin; 24. Second fin;

[0034] 3. Light-emitting component; 31. Reflector; 32. Mounting base; 321. Stopping frustum;

[0035] 4. Plano-convex mirror assembly; 5. PCB board; 6. Cooling fan; P, mounting hole; Q, mounting hole. Detailed Implementation

[0036] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0037] It should be noted that, unless otherwise specified, the embodiments and technical features in the embodiments of this application can be combined with each other, and the detailed descriptions in the specific implementation should be understood as explanations of the purpose of this application and should not be regarded as undue limitations on this application.

[0038] It should be understood that the orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings. These orientation terms are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application.

[0039] Many components of a laser are housed within the cavity of a housing. When maintenance or replacement of components is required, they are often completely disassembled. For example, when replacing a circuit board, the housing needs to be opened, which affects maintenance efficiency. Therefore, improvements are needed.

[0040] Figure 1 This is an exploded view of a solid-state laser device provided in an embodiment of this application. Figure 2 This is a schematic diagram of the structure of a solid-state laser device provided in an embodiment of this application. Figure 3 This is a cross-sectional view of a solid-state laser device provided in an embodiment of this application. Figure 4 This is a schematic diagram of the structure of a light-emitting component provided in an embodiment of this application.

[0041] In view of this, such as Figures 1 to 4 As shown in the figure, this application provides a solid-state laser device, including a first housing 1, a second housing 2, a light-emitting component 3, a plano-convex mirror assembly 4, a PCB board 5, and a cooling fan 6. The first housing 1 is provided with a receiving cavity 11 and a light-emitting hole 12, and the light-emitting hole 12 and the receiving cavity 11 are connected. The second housing 2 is provided with a through hole 211, and the second housing 2 covers the receiving cavity 11. The light-emitting component 3 passes through the through hole 211, and an inclined reflector 31 is installed at one end of the light-emitting component 3. The reflector 31 is arranged opposite to the light-emitting hole 12. The plano-convex mirror assembly 4 is installed in the light-emitting hole 12. The PCB board 5 is connected to the second housing 2. The cooling fan 6 is located at the end of the first housing 1 and the second housing 2, and the cooling fan 6 is fixedly connected to the first housing 1 and the second housing 2.

[0042] Specifically, the receiving cavity 11 of the first housing 1 is used to house the core optical and electronic components of the laser, for example, the light-emitting component 3 is partially located within the receiving cavity 11. The light-emitting aperture 12 is located at the end of the first housing 1 and communicates with the receiving cavity 11, for allowing the laser beam to exit the solid-state laser device. It should be noted that the edge of the light-emitting aperture 12 is well-sealed and collimated with the plano-convex mirror assembly 4.

[0043] The second housing 2 is provided with multiple heat dissipation fins. For example, multiple first fins 23 are provided on both sides of the second housing 2, and multiple second fins 24 are provided on the side of the second housing 2 facing the PCB board 5. The multiple first fins 23 and multiple second fins 24 are spaced apart to facilitate heat dissipation. The second housing 2 can tightly cover the opening of the receiving cavity 11 of the first housing 1, forming a nested structure with the first housing 1. A through hole 211 is provided on the second housing 2. The position and size of the through hole 211 correspond precisely to the installation requirements of the light-emitting component 3. The light-emitting component 3 passes through and is fixed in the through hole 211. An inclined reflector 31 is installed at one end of the light-emitting component 3. The tilt angle of the reflector 31 is precisely adjusted, usually forming a specific angle (e.g., 45 degrees) with the direction of the light-emitting hole 12, and is used to construct one end of the laser resonant cavity. The reflector 31 is arranged opposite to the light-emitting hole 12, so that the light beam generated from the light-emitting component 3 can be reflected back and forth between the reflector 31 and another reflective / transmitting element at the light-emitting hole 12, thereby amplifying the light. A plano-convex mirror assembly 4 is installed at the light output aperture 12. The plano-convex mirror assembly 4 includes a plano-convex lens and a lens mount. The plano-convex lens is installed inside the lens mount, which is fixed to the first housing 1. The laser beam is collimated by the plano-convex mirror assembly 4. Various electronic components required for laser operation, such as drive circuits and control circuits, are mounted on the PCB board 5. In this embodiment, the PCB board 5 is connected to the second housing 2 by screws. For example, the edge of the PCB board 5 is directly fixed to a reserved mounting position on the second housing 2 via mounting posts, making the PCB board 5 independent of the first housing 1. When replacing or repairing the PCB board 5, it is not necessary to completely open the first housing 1. A cooling fan 6 is located at the end where the first housing 1 and the second housing 2 connect, and is fixedly connected to the first housing 1 and the second housing 2 by screws or other fasteners. By setting up the cooling fan 6, the heat generated by the second housing 2, the PCB board 5, and the light-emitting component 3 is promptly removed and dissipated to the outside, ensuring that the internal temperature of the laser remains stable within a safe operating range.

[0044] When PCB board 5 needs repair or replacement, the operator only needs to loosen the connection between PCB board 5 and the second housing 2 to remove PCB board 5 from the second housing 2. Since the second housing 2 covers the receiving cavity 11 of the first housing 1, and PCB board 5 is connected to the second housing 2, the replacement process of PCB board 5 does not require completely opening the first housing 1, greatly simplifying the disassembly and assembly steps and significantly improving repair efficiency. At the same time, the presence of the second housing 2 facilitates the observation and inspection of other internal components. Specifically, the second housing 2 is located between the first housing 1 and the PCB board 5, and the PCB board 5 covers the cooling fan 6, thus facilitating the disassembly and assembly of the PCB board 5 while also protecting the cooling fan 6.

[0045] It should be noted that the light-emitting component 3 passes through the through hole 211, and the PCB board 5 is connected to the second housing 2. This eliminates the need for complete disassembly of the first housing 1, making the maintenance and replacement of the light-emitting component 3, PCB board 5, or other components simpler. It also simplifies the disassembly process of other components of the solid-state laser equipment and improves disassembly and assembly efficiency. The cooling fan 6 is located at the ends of the first housing 1 and the second housing 2, effectively dissipating the heat generated by the solid-state laser equipment, maintaining the equipment's operating temperature, and ensuring the long-term stable and reliable operation of the solid-state laser equipment.

[0046] In some embodiments, the second housing 2 includes a base plate 21, a side plate 22, a first fin 23 and a second fin 24. The side plate 22 and the second fin 24 are both fixed on the base plate 21, the first fin 23 is mounted on the side plate 22, and the base plate 21 covers the receiving cavity 11.

[0047] Specifically, the base plate 21 can tightly cover the opening of the receiving cavity 11 of the first housing 1, forming a top cover for the core area inside the device. The base plate 21 has through holes 211 for accommodating the light-emitting component 3, as well as other mounting holes. The side plate 22 is a vertical structure fixed to the edge of the base plate 21, securely fixed to the periphery of the base plate 21 by welding or integral molding. The side plate 22 defines the internal space of the second housing 2, providing lateral protection for the light-emitting component 3. The height and shape of the side plate 22 can be designed according to the layout and installation requirements of the internal components. The first fin 23 is fixed to the side plate 22 to enhance heat dissipation. The first fin 23 extends horizontally outward from the side plate 22, increasing the heat dissipation surface area. The second fin 24 is also for heat dissipation; the second fin 24 is fixed to the base plate 21 and is vertically arranged. By setting the first fin 23 and the second fin 24, the heat dissipation area is increased, heat dissipation efficiency is improved, and heat dissipation capacity is enhanced.

[0048] In some embodiments, the first housing 1 is provided with an annular groove 13, which is adapted to the cross-sectional profile of the receiving cavity 11 and is located on the side near the second housing 2. Specifically, the annular groove 13 is located on the top of the first housing 1, near the edge of the opening of the receiving cavity 11. For example, the annular groove 13 is an annular groove located at the edge of the opening of the receiving cavity 11. The orientation, curvature, or side length of the annular groove 13 is adapted to the shape of the opening of the receiving cavity 11. The annular groove 13 can provide a positioning and sealing space. For example, in the actual assembly process, the second housing 2 is designed to cooperate with the annular groove 13. When the second housing 2 is placed on the first housing 1, so that its bottom plate 21 covers the receiving cavity 11, a sealing ring is placed in the annular groove 13 to form an effective seal.

[0049] In some embodiments, the central axis of the through hole 211 is vertically oriented. For example, the second housing 2 is provided with a through hole 211 for passing through the light-emitting component 3, and the central axis of the through hole 211 is vertical. When the central axis of the through hole 211 is vertical, after the light-emitting component 3 passes through the through hole 211 and is installed, its own weight mainly acts along the central axis, which makes the installation and positioning of the light-emitting component 3 more stable and helps to maintain the precise alignment of its internal optical elements. Compared with horizontally or inclined through holes, vertical orientation can better utilize gravity to assist in fixing the light-emitting component. Operators can more easily insert or remove the light-emitting component 3 vertically from above, especially in situations with limited space, thereby reducing the space occupied by the light-emitting component 3 and thus reducing the overall size. In particular, the central axis of the through hole 211 is perpendicular to the central axis of the light-emitting hole 12. For example, the central axis of the through-hole 211 and the central axis of the light-emitting aperture 12 form a 90-degree angle in space. The light-emitting component 3 passes through the through-hole 211, and the inclined reflector 31 mounted at the front end is positioned opposite the light-emitting aperture 12 to form part of the laser resonant cavity. When the central axis of the through-hole 211 is perpendicular to the central axis of the light-emitting aperture 12, the light beam emitted by the light-emitting component 3 propagates along a specific geometric path. The light-emitting aperture 12 on the first housing 1 is horizontally opened at one end, with its central axis in the horizontal direction. The second housing 2 is placed on the first housing 1, and the through-hole 211 on it is vertically opened, with its central axis in the vertical direction. The light beam emitted by the light-emitting component 3 is reflected by the reflector 31, and its propagation direction changes to horizontal, which is exactly aligned with the light-emitting aperture 12 on the first housing 1. Finally, the laser is output through the light-emitting aperture 12, making the optical path design of the solid-state laser device more reasonable and smooth.

[0050] In some embodiments, the light-emitting component 3 includes a fixing base 32, which is fixedly connected to the second housing 2, and a reflector 31 is located at one end of the fixing base 32 near the receiving cavity 11.

[0051] Specifically, the mounting base 32 can stably accommodate and fix internal components such as laser crystals and pump sources, and also facilitate connection with external structures. Corresponding threaded holes or mounting holes are pre-drilled on the mounting base 32 and the second housing 2. The two are firmly tightened together by screws, so that the light-emitting component 3 can be firmly installed on the second housing 2 as a whole, providing a stable support platform for internal precision optical and electronic components.

[0052] By fixing the mounting base 32 to the second housing 2 and mounting the reflector 31 on the end of the mounting base 32 near the receiving cavity 11, the installation, adjustment, and maintenance of the light-emitting component 3 are made more convenient. Because the mounting base 32 is fixedly connected to the second housing 2, the positional accuracy of the reflector 31 is improved, thereby enhancing the laser resonance effect of the solid-state laser.

[0053] In some embodiments, the mounting base 32 is provided with a stop frustum 321, which is coaxially arranged with the through hole 211 and abuts against the second housing 2. Specifically, the stop frustum 321 is a cylindrical truncated protrusion machined on the mounting base 32 near its mounting end (i.e., near the end of the second housing 2). The central axis of the stop frustum 321 is on the same straight line as the central axis of the through hole 211 through which the light-emitting component 3 passes on the second housing 2. When the light-emitting component 3 is installed in the device, the mounting base 32 moves toward the receiving cavity 11, and the stop frustum 321 contacts the inner wall of the second housing 2, abutting against the second housing 2, precisely defining the mounting position of the mounting base 32 (and the entire light-emitting component 3) along the axial direction of the through hole 211. By setting a stop frustum 321 that is coaxial with the through hole 211 and is used to abut against the second housing 2, the solid-state laser device of this embodiment can achieve precise axial positioning and reliable fixation of the light-emitting component 3, simplifying the assembly process and helping to ensure the stable performance of the solid-state laser device.

[0054] In some embodiments, each end of the first housing 1 and the second housing 2 is provided with two fixing holes P, and the cooling fan 6 is provided with mounting holes Q. The fixing holes P and mounting holes Q are coaxially arranged. Specifically, the cooling fan 6 is provided with mounting holes Q, and four mounting holes Q for fixing are provided on the side of the cooling fan 6. The fixing holes P and mounting holes Q are coaxially arranged. For example, the fixing holes P on the first housing 1 and the second housing 2 have the same diameter and precise axial position; the mounting holes Q of the cooling fan 6 are also designed to match the diameter of these fixing holes P, and their position is such that when the cooling fan 6 is placed at the end of the first housing 1 and the second housing 2, the mounting holes Q naturally align with the fixing holes P on the housing. When installing the cooling fan 6, the operator only needs to place the fan in the end area of ​​the first housing 1 and the second housing 2. Due to the coaxial design of the holes, the mounting holes Q on the fan will easily align with the fixing holes P on the housing, without the need for laborious position adjustment. This facilitates the installation and removal of the cooling fan 6, and makes it easy to quickly replace the cooling fan 6. At the same time, the cooling fan 6 can effectively dissipate heat from the first housing 1 and the second housing 2, improving the heat dissipation effect.

[0055] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions claimed in this application.

Claims

1. A solid-state laser device, characterized in that, include: The first housing has a receiving cavity and a light-emitting hole, and the light-emitting hole and the receiving cavity are connected; The second housing has a through hole and covers the receiving cavity; A light-emitting component is inserted through the through hole, and an inclined reflector is installed at one end of the light-emitting component. The reflector is arranged opposite to the light-emitting hole. A plano-convex mirror assembly is installed at the light outlet. The PCB board is connected to the second housing. A cooling fan is located at the end of the first housing and the second housing, and the cooling fan is fixedly connected to the first housing and the second housing.

2. A solid-state laser device according to claim 1, characterized in that, The second housing includes a bottom plate, a side plate, a first fin, and a second fin. The side plate and the second fin are both fixed to the bottom plate, the first fin is mounted on the side plate, and the bottom plate covers the receiving cavity.

3. A solid-state laser device according to claim 1, characterized in that, The second housing is located between the first housing and the PCB board, and the PCB board covers the cooling fan.

4. A solid-state laser device according to claim 1, characterized in that, The first housing has an annular groove that is adapted to the cross-sectional profile of the receiving cavity, and the annular groove is located on the side close to the second housing.

5. A solid-state laser device according to claim 1, characterized in that, The central axis of the through hole is set vertically.

6. A solid-state laser device according to claim 5, characterized in that, The central axis of the through hole is perpendicular to the central axis of the light outlet hole.

7. A solid-state laser device according to claim 1, characterized in that, The light-emitting component includes a mounting base, which is fixedly connected to the second housing, and the reflector is located at one end of the mounting base near the receiving cavity.

8. A solid-state laser device according to claim 7, characterized in that, The fixed base is provided with a stop frustum, which is coaxially arranged with the through hole and abuts against the second housing.

9. A solid-state laser device according to claim 1, characterized in that, Both the first housing and the second housing have two fixing holes at their ends, and the cooling fan has a mounting hole. The fixing hole and the mounting hole are coaxially arranged.

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