A refrigeration camera

Abstract

This application provides a cooled camera, including a sealing cover assembly, an image sensor assembly, a cooling assembly, and a motherboard assembly. A first sealing cover of the sealing cover assembly is sealed and mounted on a first side of the image sensor circuit board, and a second sealing cover is sealed and mounted on a second side of the image sensor circuit board. The image sensor and the cooling assembly are disposed in a sealed cavity and electrically connected to the sealed area of ​​the image sensor circuit board. An extension area of ​​the image sensor circuit board located outside the sealing cover assembly is electrically connected to the motherboard assembly. This embodiment eliminates the need for through holes in the sealing cover assembly for electrical connection between the image sensor assembly and the motherboard assembly, ensuring that the sealed area of ​​the image sensor and the image sensor circuit board is in a completely sealed environment. This prevents condensation inside the camera from entering the sealing cover assembly when the internal temperature of the camera is lower than the external ambient temperature, thereby preventing a short circuit in the image sensor circuit board.

Description

Technical Field

[0001] This application relates to the field of machine vision technology, and in particular to a cooled camera. Background Technology

[0002] Industrial cameras mainly consist of a lens, an image sensor assembly, and a motherboard assembly. During the use of industrial cameras, as temperature increases and noise increases, the imaging performance of their image sensors deteriorates.

[0003] In related technologies, a cooler is typically used to contact the image sensor assembly for cooling, keeping the image sensor assembly at room temperature for an extended period. Furthermore, the cooler and the image sensor assembly are sealed inside a sealed cover assembly to prevent condensation and water vapor formation inside the camera when the internal temperature is lower than the external ambient temperature, thus avoiding short circuits in the image sensor assembly's circuit board.

[0004] However, since the image sensor assembly needs to be electrically connected to the motherboard assembly outside the sealing cover assembly to achieve signal transmission, through holes need to be opened on the sealing cover assembly so that the connecting cable of the image sensor assembly can pass through the sealing cover assembly and be electrically connected to the motherboard assembly. This affects the overall sealing performance of the sealing cover assembly, allowing moisture to enter the sealing cover assembly and causing a short circuit in the circuit board of the image sensor assembly. Utility Model Content

[0005] The purpose of this application is to provide a cooled camera that prevents short circuits in the image sensor circuit board when the internal temperature of the camera is lower than the external ambient temperature. The specific technical solution is as follows:

[0006] This application provides a cooled camera, including: a sealing cover assembly, an image sensor assembly, a cooling assembly, and a motherboard assembly; the sealing cover assembly includes: a first sealing cover and a second sealing cover; the image sensor assembly includes: an image sensor and an image sensor circuit board; the first sealing cover is sealed and installed on a first side of the image sensor circuit board, and the second sealing cover is sealed and installed on a second side of the image sensor circuit board, forming a sealed cavity between the first sealing cover and the second sealing cover; the image sensor and the cooling assembly are disposed in the sealed cavity, and the cooling assembly is located on the side of the image sensor closer to the second sealing cover; the portion of the image sensor circuit board sealed by the sealing cover assembly is a sealed area, and the portion outside the sealing cover assembly is an extension area; the sealed area is electrically connected to the cooling assembly and the image sensor; the extension area is electrically connected to the motherboard assembly.

[0007] In some embodiments of this application, the cooled camera further includes: a housing assembly; the housing assembly has an internal receiving cavity, and the sealing cover assembly and the extension area of ​​the image sensor circuit board are disposed in the receiving cavity; the motherboard assembly is disposed on the outside of the housing assembly; a motherboard connector is disposed on the extension area, and the motherboard connector is electrically connected to the motherboard assembly through a connecting cable passing through the housing assembly.

[0008] In some embodiments of this application, the sealed cavity portion located on the first side of the image sensor circuit board is a first sealed space, and the sealed cavity portion located on the second side of the image sensor circuit board is a second sealed space. The image sensor is located in the first sealed space, and the cooling component is located in the second sealed space. The sealed area has a first through area so that the cooling component cools the image sensor through the first through area.

[0009] In some embodiments of this application, the cooling assembly includes: a cooler and a cooling block arranged sequentially along a first direction; the first direction is the direction from the second sealed space to the first sealed space; the cooler contacts the second sealing cover and the cooling block on both sides along the first direction respectively; the cooling block passes through a first through area of ​​the image sensor circuit board and contacts the image sensor; the cooler is electrically connected to the image sensor circuit board so that the motherboard assembly controls the cooler to work through the image sensor circuit board.

[0010] In some embodiments of this application, the cooling assembly further includes: a heat insulation pad; the heat insulation pad is annular, sleeved on the cooling block, and located between the cooling block and the first through area.

[0011] In some embodiments of this application, the cooled camera further includes: a detection component; the detection component is disposed in the sealing cover assembly and electrically connected to the image sensor circuit board; the detection component is used to detect the temperature and humidity inside the sealing cover assembly and transmit the detection information to the main board assembly through the image sensor circuit board.

[0012] In some embodiments of this application, the detection component includes a temperature sensor and a humidity sensor; the temperature sensor is disposed on the cooling component, located on the side of the cooling component closer to the image sensor, to detect the temperature of the cooling component on that side; the temperature sensor is electrically connected to the sealing area of ​​the image sensor circuit board, and can transmit the detected temperature information to the motherboard assembly through the image sensor circuit board; the humidity sensor is disposed on the sealing area of ​​the image sensor circuit board, electrically connected to the sealing area of ​​the image sensor circuit board, and can detect the humidity inside the sealing cover assembly, and transmit the detected humidity information to the motherboard assembly through the image sensor circuit board.

[0013] In some embodiments of this application, the detection component further includes: a temperature circuit board; the temperature circuit board is electrically connected to the sealed area of ​​the image sensor circuit board; the temperature sensor is electrically connected to the temperature circuit board, and is capable of transmitting the detected temperature information sequentially through the temperature circuit board and the image sensor circuit board to the main board component.

[0014] In some embodiments of this application, the housing assembly includes: a first housing and a second housing; a first sealing cap is fitted to the first housing, and a second sealing cap is fitted to the second housing; the second sealing cap is capable of transferring heat from the cooling component to the second housing, and then from the second housing to the external environment.

[0015] In some embodiments of this application, the cooling camera further includes: a heat dissipation component; the heat dissipation component is disposed on the outside of the second housing; a second through area is provided in the area where the second housing contacts the heat dissipation component, so that the heat dissipation component directly contacts the second sealing cover; the heat dissipation component is capable of transferring the heat from the second sealing cover to the external environment.

[0016] In some embodiments of this application, the heat dissipation assembly includes: a heat sink and a fan; the heat sink is fixed to the second sealing cover to seal the second through area on the second housing; the fan is fixed to the side of the heat sink away from the second sealing cover to blow air onto the heat sink and transfer the heat transferred from the second sealing cover to the heat sink to the external environment.

[0017] In some embodiments of this application, the motherboard assembly is fixed to the outside of the second housing and is located on the same side as the heat sink, and the orthographic projections of the motherboard assembly and the heat sink on the second sealing cover do not overlap; the orthographic projection of the motherboard assembly on the second sealing cover does not overlap with the orthographic projection of the second through area on the second sealing cover; a second heat insulation pad is provided between the motherboard assembly and the second housing; the heat on the second sealing cover is transferred to the heat sink through the second through area on the second housing.

[0018] In some embodiments of this application, the motherboard assembly includes: a motherboard and an interface board; the motherboard is fixed to the outside of the second housing; a third through area is provided on the second housing for the connecting cable to pass through the third through area to electrically connect the motherboard and the motherboard connector of the image sensor circuit board; the interface board is fixed to the side of the motherboard away from the second housing and is electrically connected to the motherboard and external devices.

[0019] In some embodiments of this application, the cooled camera further includes: a lens adapter ring; a fourth through area is formed on the first housing corresponding to the image sensor; the lens adapter ring is fixed to the fourth through area for mounting a lens; the area of ​​the first sealing cover corresponding to the image sensor is a light-transmitting area, so that external light passes through the lens and the light-transmitting area to illuminate the image sensor.

[0020] In some embodiments of this application, the first sealing cover includes: a filter and a cover body; the filter is the light-transmitting area of ​​the first sealing cover, corresponding to the position of the image sensor, so that external light passes through the lens and the filter to illuminate the image sensor; the filter is sealed and installed on the cover body; the cover body is sealed and connected to the first side of the image sensor circuit board.

[0021] In some embodiments of this application, the first sealing cover further includes: a filter pressure plate and two second sealing rings; the cover body, the filter, and the filter pressure plate are arranged sequentially in a direction away from the image sensor assembly; the filter pressure plate presses the filter onto the cover body and is sealed to the filter and the cover body respectively through the two second sealing rings to form the first sealing cover.

[0022] In some embodiments of this application, the housing assembly is provided with a plurality of screw holes; the sealing cover assembly is provided with a plurality of screws accordingly; the screws are threadedly connected to the screw holes to fix the sealing cover assembly to the housing assembly; a gasket is provided at the screw hole to support the sealing cover assembly so that the sealing cover assembly is horizontally positioned relative to the housing assembly.

[0023] This application also provides a cooled camera, including: a sealing cover assembly, an image sensor assembly, a cooling assembly, and a motherboard assembly; the sealing cover assembly includes: a first sealing cover and a second sealing cover; the image sensor assembly includes: an image sensor and an image sensor circuit board; the first sealing cover is sealed and installed on a first side of the image sensor circuit board, and the second sealing cover is sealed and installed on a second side of the image sensor circuit board, forming a sealed cavity between the first sealing cover and the second sealing cover; the second sealing cover is provided with a through mounting area for sealing and installing the cooling assembly; the cold end face of the cooling assembly is located in the sealed cavity, and the hot end face is located outside the sealed cavity; the image sensor is disposed in the sealed cavity; the portion of the image sensor circuit board sealed by the sealing cover assembly is a sealing area, and the portion located outside the sealing cover assembly is an extension area; the sealing area is electrically connected to the cooling assembly and the image sensor; the extension area is electrically connected to the motherboard assembly.

[0024] Beneficial effects of the embodiments in this application:

[0025] The cooling camera provided in this application uses an image sensor circuit board as a sealing element. A first sealing cover is sealed and installed on the first side of the image sensor circuit board, and a second sealing cover is sealed and installed on the second side of the image sensor circuit board. The extension area of ​​the image sensor circuit board is located outside the sealing cover assembly. Compared with the prior art, which places the entire image sensor assembly inside the sealing cover assembly, the remaining space in the sealed cavity is smaller, thereby reducing the risk of condensation during cooling. The image sensor and cooling component are placed in the sealed cavity and electrically connected to the sealed area of ​​the image sensor circuit board. The extension area of ​​the image sensor circuit board located outside the sealing cover assembly is electrically connected to the main board assembly. Compared with the prior art, the sealing cover assembly of this application does not need to have through holes for the image sensor assembly and the main board assembly to be electrically connected. This ensures that the image sensor and the sealed area of ​​the image sensor circuit board are in a completely sealed environment. When the temperature inside the camera is lower than the external ambient temperature, it can prevent water vapor formed by condensation inside the camera from entering the sealing cover assembly, thereby avoiding short circuits in the image sensor circuit board.

[0026] Of course, implementing any product or method of this application does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0028] Figure 1 A perspective view of a cooling camera provided in an embodiment of this application from a first angle;

[0029] Figure 2 A perspective view of a cooling camera provided in an embodiment of this application from a second angle;

[0030] Figure 3 for Figure 1 A cross-sectional view of the cooled camera shown;

[0031] Figure 4 for Figure 1 An exploded view of the cooling camera shown.

[0032] Figure 5 for Figure 4 A three-dimensional view of part A from another angle;

[0033] Figure 6 for Figure 4 A three-dimensional view of the motherboard components shown from another angle;

[0034] Figure 7 for Figure 4 A schematic diagram of the exploded view of part A shown;

[0035] Figure 8 for Figure 4 The diagram shown is a 3D view of part A after the second sealing cap has been removed.

[0036] Figure 9 for Figure 8 The diagram shown is a 3D view of the structure after removing the cooler and the cooling block.

[0037] Figure label:

[0038] Sealing cover assembly 100; first sealing cover 101; filter 1011; cover body 1012; filter pressure plate 1013; second sealing ring 1014; second sealing cover 102; heat dissipation component mounting area 1021; first sealing ring 103; sealing cavity 110; first sealing space 111; second sealing space 112; screw 120;

[0039] Image sensor assembly 200; Image sensor 210; Image sensor circuit board 220; Sealed area 221; Extension area 222; Main board connector 223; First through area 224; Cooler interface 225; Temperature circuit board interface 226;

[0040] Refrigeration component 300; Refrigerator 310; Cooling block 320; Heat insulation pad 330;

[0041] Mainboard assembly 400; First circuit board connector 401; Mainboard 410; Interface board 420; Universal Serial Bus interface 421; CXP interface 422; Power interface 423; Second heat insulation pad 430;

[0042] Housing assembly 500; First housing 501; Screw hole 5011; Second housing 502; Mainboard assembly mounting area 5021; Second through area 503; Third through area 504; Fourth through area 505; Receiving cavity 510;

[0043] Detection component 600; temperature sensor 610; humidity sensor 620; temperature circuit board 630; second circuit board connector 631;

[0044] Heat dissipation component 700; Heat sink 710; Fan 720; Fan shroud 730;

[0045] Lens adapter ring 800;

[0046] Camera back cover 900; cable routing hole 910. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.

[0048] As mentioned in the background section, industrial cameras mainly consist of a lens, an image sensor assembly, and a motherboard assembly. During the use of industrial cameras, as the temperature rises and noise increases, the imaging effect of the image sensor deteriorates.

[0049] In related technologies, a cooler is typically used to contact the image sensor assembly for cooling, keeping the image sensor assembly at room temperature for an extended period. Furthermore, the cooler and the image sensor assembly are sealed inside a sealed cover assembly to prevent condensation and water vapor formation inside the camera when the internal temperature is lower than the external ambient temperature, thus avoiding short circuits in the image sensor assembly's circuit board.

[0050] However, since the image sensor assembly needs to be electrically connected to the motherboard assembly outside the sealing cover assembly to achieve signal transmission, through holes need to be opened on the sealing cover assembly so that the connecting cable of the image sensor assembly can pass through the sealing cover assembly and be electrically connected to the motherboard assembly. This affects the overall sealing performance of the sealing cover assembly, allowing moisture to enter the sealing cover assembly and causing a short circuit in the circuit board of the image sensor assembly.

[0051] In order to prevent short circuits in the image sensor circuit board when the internal temperature of the camera is lower than the external ambient temperature, this application provides a cooling camera, which will be described in detail below.

[0052] See Figures 1 to 4 , Figure 1 A perspective view of a cooling camera provided in an embodiment of this application from a first angle; Figure 2 A perspective view of a cooling camera provided in an embodiment of this application from a second angle; Figure 3 for Figure 1 A cross-sectional view of the cooled camera shown; Figure 4 for Figure 1 The diagram shown is an exploded view of the cooling camera.

[0053] like Figures 1 to 4 As shown, the cooled camera includes: a sealing cover assembly 100, an image sensor assembly 200, a cooling assembly 300, and a mainboard assembly 400.

[0054] The sealing cap assembly 100 includes a first sealing cap 101 and a second sealing cap 102. The image sensor assembly 200 includes an image sensor 210 and an image sensor circuit board 220.

[0055] The first sealing cover 101 is sealed and installed on the first side of the image sensor circuit board 220, and the second sealing cover 102 is sealed and installed on the second side of the image sensor circuit board 220, forming a sealing cavity 110 between the first sealing cover 101 and the second sealing cover 102.

[0056] The image sensor 210 and the cooling assembly 300 are disposed in the sealed cavity 110, and the cooling assembly 300 is located on the side of the image sensor 210 near the second sealing cover 102.

[0057] The portion of the image sensor circuit board 220 sealed by the sealing cover assembly 100 is the sealing area 221, and the portion outside the sealing cover assembly 100 is the extension area 222. The sealing area 221 is electrically connected to the cooling assembly 300 and the image sensor 210; the extension area 222 is electrically connected to the mainboard assembly 400.

[0058] Specifically, such as Figure 3 As shown, a first sealing ring 103 is provided between the first sealing cover 101 and the first side of the image sensor circuit board 220, and between the second sealing cover 102 and the second side of the image sensor circuit board 220, to ensure the sealing performance of the sealing cavity 110.

[0059] Image sensor 210 can be as Figure 3 The light is directly mounted on the image sensor circuit board 220 and located on the side of the image sensor circuit board 220 facing the object to be measured, so as to receive the light reflected from the object to be measured.

[0060] The cooling component 300 can contact the image sensor circuit board 220, or it can be like... Figure 3 As shown, the image sensor 210 is directly contacted through the image sensor circuit board 220, thereby improving the cooling effect and keeping the image sensor 210 at room temperature for a long time.

[0061] The cooling camera provided in this application embodiment uses the image sensor circuit board 220 as a sealing element. A first sealing cover 101 is sealed and installed on the first side of the image sensor circuit board 220, and a second sealing cover 102 is sealed and installed on the second side of the image sensor circuit board 220. The extension area 222 of the image sensor circuit board 220 is located outside the sealing cover assembly 100. Compared with the prior art where the entire image sensor assembly is placed inside the sealing cover assembly, the remaining space in the sealing cavity 110 is smaller, thereby reducing the risk of condensation during cooling. The image sensor 210 and the cooling assembly 300 are placed in the sealing cavity 110, and the image sensor... The sealing area 221 of the circuit board 220 is electrically connected; the extension area 222 of the image sensor circuit board 220 located outside the sealing cover assembly 100 is electrically connected to the main board assembly 400. Compared with the prior art, the sealing cover assembly 100 of this application embodiment does not need to open through holes for the image sensor assembly 200 and the main board assembly 400 to be electrically connected, which ensures that the sealing area 221 of the image sensor 210 and the image sensor circuit board 220 is in a completely sealed environment. When the temperature inside the camera is lower than the temperature of the external environment, it can prevent water vapor formed by condensation inside the camera from entering the sealing cover assembly 100, thereby avoiding short circuit of the image sensor circuit board 220.

[0062] In some embodiments of this application, such as Figures 1 to 4 As shown, the cooling camera also includes: housing assembly 500.

[0063] The housing assembly 500 has an internal receiving cavity 510, a sealing cover assembly 100, and an extension area 222 of the image sensor circuit board 220 disposed in the receiving cavity 510.

[0064] like Figure 3 and Figure 4 As shown, the motherboard assembly 400 is disposed on the outside of the housing assembly 500. A motherboard connector 223 is disposed on the extension area 222, and the motherboard connector 223 is electrically connected to the motherboard assembly 400 through the housing assembly 500 via a connecting cable (not shown in the figure).

[0065] Specifically, see Figure 5 and Figure 6 , Figure 5 for Figure 4 A three-dimensional view of part A from another angle; Figure 6 for Figure 4A three-dimensional view of the motherboard components from another angle. (See image below.) Figure 5 and Figure 6 As shown, there are two motherboard connectors 223, and two first circuit board connectors 401 are also provided on the motherboard assembly 400, which are respectively connected to the two motherboard connectors 223.

[0066] By applying the embodiments of this application, the motherboard connector 223 of the image sensor circuit board 220 is disposed in the receiving cavity 510 outside the sealing cover assembly 100 for electrical connection with the motherboard assembly 400. This ensures that the image sensor 210 and the sealing area 221 of the image sensor circuit board 220 are in a completely sealed environment, preventing short circuits in the image sensor circuit board 220. By placing the motherboard assembly on the outside of the housing assembly 500, most of the heat generated by the motherboard assembly 400 during operation can be directly transferred to the external environment, reducing the impact of the motherboard assembly 400's heat generation on the image sensor 210 and thus improving the imaging effect of the image sensor 210.

[0067] In some embodiments of this application, see Figure 7 , Figure 7 for Figure 4 The diagram shows an exploded view of part A. (As shown) Figure 3 and Figure 7 As shown, the sealing cavity 110 portion on the first side of the image sensor circuit board 220 is the first sealing space 111, and the sealing cavity 110 portion on the second side of the image sensor circuit board 220 is the second sealing space 112. The image sensor 210 is located in the first sealing space 111, and the cooling assembly 300 is located in the second sealing space 112. The sealing area 221 has a first through area 224 so that the cooling assembly 300 cools the image sensor 210 through the first through area 224.

[0068] In this embodiment, the cooling component 300 and the image sensor 210 are disposed on different sides of the image sensor circuit board 220. Compared to the method of indirectly cooling the image sensor 210 by having the cooling component 300 contact the image sensor circuit board 220, this embodiment opens a first through area 224 in the sealed area 221 of the image sensor circuit board 220, so that the cooling component 300 can contact the image sensor 210 through the first through area 224 for direct cooling, which improves the cooling effect and thus improves the imaging effect of the image sensor 210.

[0069] In some embodiments of this application, see Figure 8 , Figure 8 for Figure 4 The diagram shows a 3D view of part A after the second sealing cap has been removed. Figure 7 and Figure 8As shown, the refrigeration assembly 300 includes a cooler 310 and a coolant block 320 arranged sequentially along a first direction. The first direction is from the second sealed space 112 to the first sealed space 111.

[0070] The cooler 310 contacts the second sealing cover 102 and the cooling block 320 on both sides along the first direction, respectively. The cooling block 320 passes through the first through area 224 of the image sensor circuit board 220 and contacts the image sensor 210.

[0071] The cooler 310 is electrically connected to the image sensor circuit board 220 so that the mainboard assembly 400 controls the cooler 310 to work via the image sensor circuit board 220.

[0072] Specifically, the cooler 310 typically employs a thermoelectric cooler (TEC). The first through-region 224 is not limited to... Figure 7 The square hole shown can also be a round hole or an irregular hole; this application does not limit the type of hole.

[0073] The image sensor circuit board 220 has two cooler interfaces 225, located on both sides of the cooling assembly 300, for electrical connection with the cooler 310.

[0074] In this embodiment of the application, the cooling block 320 is provided to prevent cold loss, thereby improving cooling efficiency and enabling the image sensor 210 to cool down quickly. The second sealing cover 102, the cooler 310, the cooling block 320, and the image sensor 210 are arranged to contact each other sequentially. When the cooler 310 starts working, the side in contact with the cooling block 320 is the cold end face, transferring cold energy through the cooling block 320 to the back of the image sensor 210, thus cooling the image sensor 210; the side in contact with the second sealing cover 102 is the hot end face, transferring heat to the second sealing cover 102, which then transfers the heat to the receiving cavity 510, or as... Figure 3 and Figure 4 As shown, the second sealing cover 102 transfers heat to the part of the housing assembly 500 that contacts the second sealing cover 102, and then the housing assembly 500 transfers the heat to the external environment, thereby improving the cooling efficiency of the image sensor 210 and the external heat dissipation efficiency of the sealing cover assembly 100 and the cooling assembly 300.

[0075] The outer contour of the cooling block 320 can be the same size as the first through area 224, so that there is no gap between the cooling block 320 and the image sensor circuit board 220 in the first through area 224; or a heat insulation pad 330 can be fitted on the cooling block 320 to fill the gap between the cooling block 320 and the image sensor circuit board 220, which will be described in detail below.

[0076] In some embodiments of this application, see Figure 9 , Figure 9 for Figure 8 The diagram shows a 3D view of part A after removing the cooler and the heat-conducting block. (See diagram for reference.) Figure 3 , Figure 7 and Figure 9 As shown, the cooling assembly 300 also includes a heat insulation pad 330.

[0077] The heat insulation pad 330 is ring-shaped, sleeved on the cooling block 320, and located between the cooling block 320 and the first through area 224.

[0078] By applying the embodiments of this application, the amount of cold energy transferred from the cooling block 320 to the image sensor circuit board 220 can be reduced, allowing more cold energy to be transferred to the image sensor 210, thereby improving the cooling effect and the imaging effect of the image sensor 210.

[0079] In some embodiments of this application, such as Figure 3 , Figures 7 to 9 As shown, the cooled camera also includes a detection component 600.

[0080] The detection component 600 is disposed in the sealing cover assembly 100 and is electrically connected to the image sensor circuit board 220.

[0081] The detection component 600 is used to detect the temperature and humidity inside the sealing cover assembly 100 and transmits the detection information to the main board assembly 400 via the image sensor circuit board 220.

[0082] By applying the embodiments of this application, a detection component 600 is provided in the sealed cavity 110 to detect the temperature and humidity inside the sealed cover assembly 100. The minimum temperature and humidity inside the sealed cavity 110 can be accurately monitored in real time. The cooling camera can monitor the risk of condensation in real time during use. Before the risk of condensation occurs, the detection component 600 can transmit a signal to the main board assembly 400, so that the main board assembly 400 can adjust the cooling of the cooler 310 accordingly, and maintain the camera in time to avoid camera damage, thereby effectively controlling the risk of condensation when the cooling component 300 is cooling.

[0083] In some embodiments of this application, such as Figure 3 , Figures 7 to 9 As shown, the detection component 600 includes a temperature sensor 610 and a humidity sensor 620.

[0084] Temperature sensor 610 is disposed on the cooling assembly 300, located on the side of the cooling assembly 300 closest to image sensor 210, to detect the temperature of the cooling assembly 300 on that side. Temperature sensor 610 is electrically connected to the sealing area 221 of image sensor circuit board 220, and is capable of transmitting the detected temperature information to motherboard assembly 400 via image sensor circuit board 220.

[0085] The humidity sensor 620 is disposed in the sealing area 221 of the image sensor circuit board 220 and is electrically connected to the sealing area 221 of the image sensor circuit board 220. It can detect the humidity inside the sealing cover assembly 100 and transmit the detected humidity information to the main board assembly 400 through the image sensor circuit board 220.

[0086] Specifically, such as Figure 3 As shown, the temperature sensor 610 is disposed in the second sealed space 112, in contact with the cooling block 320, to detect the temperature of the cooling block 320. The humidity sensor 620 can be disposed in either the first sealed space 111 or the second sealed space 112, as long as the humidity sensor 620 is not obstructed and is exposed to the air. Figure 3 In the specific embodiment shown, the humidity sensor 620 is disposed on the sealed area 221 of the image sensor circuit board 220, located on the side close to the cooling component 300.

[0087] In some embodiments of this application, such as Figure 3 , Figures 7 to 9 As shown, the detection component 600 also includes a temperature circuit board 630.

[0088] Temperature circuit board 630 is electrically connected to the sealed area 221 of image sensor circuit board 220. Temperature sensor 610 is electrically connected to temperature circuit board 630 and can transmit the detected temperature information sequentially through temperature circuit board 630 and image sensor circuit board 220 to main board assembly 400.

[0089] Specifically, such as Figure 3 and Figure 8 As shown, the temperature circuit board 630 is fixed to the cooling block 320 by screws, and the temperature sensor 610 is directly mounted on the temperature circuit board 630, located between the temperature circuit board 630 and the cooling block 320, with its surface in contact with the cooling block 320.

[0090] The image sensor circuit board 220 is provided with a temperature circuit board interface 226 for electrical connection with the second circuit board connector 631 on the temperature circuit board 630.

[0091] By applying the embodiments of this application, a temperature circuit board 630 is provided, making the debugging and maintenance of the temperature sensor 610 more convenient. When it is necessary to debug or replace the temperature sensor 610, only the temperature circuit board 630 needs to be operated, without directly contacting the image sensor circuit board 220, thus simplifying the maintenance process. In case of a fault, maintenance personnel can quickly locate and resolve the problem by checking the connections on the temperature circuit board 630.

[0092] In existing technologies, in addition to placing the entire image sensor assembly and cooling assembly inside the sealed cavity, other assembly components such as the adapter plate are also placed inside the sealed cavity. This results in a large volume of the sealed cavity, a small temperature difference between the front and back of the image sensor, and a higher risk of condensation when the cooling temperature is low.

[0093] The cooling camera provided in the embodiments of this application, such as Figure 3 As shown, only the image sensor assembly 200, the cooling assembly 300, and the detection assembly 600 are installed in the sealed cavity 110. The second sealing cover 102, the cooling assembly 300, the image sensor assembly 200, and the first sealing cover 101 are closely arranged along the first direction, which makes the volume of the sealing cover assembly 100 small and the remaining space in the sealed cavity 110 small, thus reducing the risk of condensation caused by cooling.

[0094] In some embodiments of this application, such as Figures 1 to 4 As shown, the housing assembly 500 includes a first housing 501 and a second housing 502. A first sealing cap 101 is fitted to the first housing 501, and a second sealing cap 102 is fitted to the second housing 502.

[0095] The second sealing cover 102 can transfer the heat from the cooling component 300 to the second housing 502, and then from the second housing 502 to the external environment.

[0096] By applying the embodiments of this application, the first sealing cover 101 is attached to the first housing 501 and the second sealing cover 102 is attached to the second housing 502, which can reduce the size of the cooling camera, making the cooling camera more miniaturized, and also reduce the size of the housing cavity 510, so that the remaining space other than the sealing cover assembly 100 and the extension area 222 is smaller, and the risk of condensation during cooling is lower.

[0097] To further reduce the risk of condensation, this embodiment of the application provides a desiccant (not shown in the figure) in the first sealed space 111, which can further reduce the remaining space of the sealed cavity 110 and can also absorb moisture in a timely manner. The type of desiccant is not limited in this application.

[0098] In some embodiments of this application, such as Figure 1 , Figure 3 and Figure 4As shown, the cooling camera also includes a heat dissipation assembly 700.

[0099] The heat dissipation component 700 is disposed on the outside of the second housing 502. A second through area 503 is provided in the area where the second housing 502 contacts the heat dissipation component 700, so that the heat dissipation component 700 can directly contact the second sealing cover 102.

[0100] The heat dissipation component 700 can transfer the heat from the second sealing cover 102 to the external environment.

[0101] In this embodiment of the application, a heat dissipation component 700 is provided to transfer heat from the housing 510 to the external environment, thereby improving the heat dissipation efficiency of the cooled camera. Furthermore, a second through-hole 503 is provided on the second housing 502 so that the heat dissipation component 700 directly contacts the second sealing cover 102, shortening the heat dissipation path and further improving heat dissipation efficiency, reducing the risk of condensation inside the camera, and improving the imaging effect of the image sensor 210.

[0102] In some embodiments of this application, such as Figure 1 , Figure 3 and Figure 4 As shown, the heat dissipation assembly 700 includes a heat sink 710 and a fan 720.

[0103] The heat sink 710 is fixed to the second sealing cover 102 to seal the second through area 503 on the second housing 502.

[0104] The fan 720 is fixed on the side of the heat sink 710 away from the second sealing cover 102 and is used to blow air onto the heat sink 710 to transfer the heat from the second sealing cover 102 to the external environment.

[0105] Specifically, the top of the heatsink 710 can be flat or... Figure 1 and Figure 3 The inward recess is designed to accommodate the fan 720, resulting in a smaller and more aesthetically pleasing cooling camera. A fan cover 730 is also provided on the outside of the fan 720, and the fan cover 730 is fixedly connected to the heat sink 710.

[0106] In existing technologies, heat sinks and fans are usually placed inside the housing assembly. Due to space and location limitations, fans are not easy to replace, and large-sized, low-speed, vibration-damping fans cannot be used, resulting in low heat dissipation efficiency.

[0107] By applying the embodiments of this application, the heat sink 710 and the fan 720 are disposed outside the housing assembly 500, which reduces the volume of the housing assembly 500. It also makes it possible to replace the fan 720 with a large-sized low-speed vibration-damping fan, thereby improving the heat dissipation efficiency. Furthermore, replacing the fan 720 is more convenient. The area or height of the heat sink 710 can be adjusted according to the user's needs to adapt to different levels of heat dissipation requirements.

[0108] In some embodiments of this application, such as Figure 3 and Figure 4 As shown, the motherboard assembly 400 is fixed to the outside of the second housing 502, located on the same side as the heat sink 710, and the orthographic projections of the motherboard assembly 400 and the heat sink 710 on the second sealing cover 102 do not overlap. The orthographic projection of the motherboard assembly 400 on the second sealing cover 102 does not overlap with the orthographic projection of the second through area 503 on the second sealing cover 102. A second heat insulation pad 430 is provided between the motherboard assembly 400 and the second housing 502. Heat on the second sealing cover 102 is transferred to the heat sink 710 through the second through area 503 on the second housing 502.

[0109] Specifically, such as Figure 3 and Figure 4 As shown, on the second housing 502, the area next to the second through area 503 is the motherboard component mounting area 5021. The motherboard component 400 is fixed in the motherboard component mounting area 5021 and is arranged side by side with the heat sink 710.

[0110] The area on the second sealing cover 102 that is in direct contact with the heat dissipation component 700 is the heat dissipation component mounting area 1021. The heat sink 710 can be set only in the heat dissipation component mounting area 1021, or it can extend toward the motherboard component 400 to cover part of the motherboard component 400 in order to increase the heat dissipation area, improve heat dissipation efficiency, reduce the risk of condensation inside the camera, and improve the imaging effect of the image sensor 210.

[0111] By applying the embodiments of this application, a second heat insulation pad 430 is provided between the motherboard assembly 400 and the second housing 502. This reduces the amount of heat generated by the motherboard 410 that passes sequentially through the second housing 502 and the second sealing cover 102 into the sealed cavity 110. It also reduces the amount of heat transferred from the sealed cavity 110 through the second sealing cover 102 and the second housing 502 to the motherboard assembly 400, thereby improving the cooling effect within the sealed cavity 110 and preventing the motherboard assembly 400 from overheating. Furthermore, the fan 720 can directly transfer the heat from the heatsink 710 to the external environment without passing through the motherboard assembly 400, reducing the amount of heat transferred from the heatsink 710 to the motherboard assembly 400, thereby further preventing the motherboard assembly 400 from overheating.

[0112] exist Figure 3 and Figure 4In the specific embodiment shown, a camera rear cover 900 is provided outside the motherboard assembly 400. The camera rear cover 900 has multiple wiring holes 910 for cables and interfaces on the motherboard assembly 400 to pass through and electrically connect to external devices. Wiring holes 910 are not required in the area of ​​the camera rear cover 900 near the heat dissipation assembly 700. This area can be provided with multiple heat dissipation fins adjacent to the heat dissipation fins 710 of the heat dissipation assembly 700, which also serve a heat dissipation function, improving heat dissipation efficiency and transferring the heat generated by the motherboard assembly 400 to the external environment.

[0113] In some embodiments of this application, such as Figure 4 and Figure 6 As shown, the motherboard assembly 400 includes: a motherboard 410 and an interface board 420.

[0114] The motherboard 410 is fixed to the outside of the second housing 502, and the second heat insulation pad 430 is disposed on the side of the motherboard 410 near the second housing 502. A third through area 504 is provided on the second housing 502 so that the connecting cable can pass through the third through area 504 to electrically connect the motherboard 410 and the motherboard connector 223 of the image sensor circuit board 220.

[0115] The interface board 420 is fixed on the side of the motherboard 410 away from the second housing 502 and is electrically connected to the motherboard 410 and external devices.

[0116] Specifically, the third through area 504 is located in the motherboard component mounting area 5021, and there are two of them, so that the connecting cables of the two motherboard connectors 223 can pass through and connect to the two first circuit board connectors 401 at the bottom of the motherboard 410.

[0117] The interface board 420 is equipped with a universal serial bus interface 421 and a CXP interface 422, which are used to pass through the wiring holes 910 of the camera rear cover 900 to realize data transmission with external devices. It should be noted that CXP (CoaXPress) is a camera data transmission standard that uses coaxial cables for interconnection. The interface board 420 is also equipped with a power interface 423 for connecting an external power supply.

[0118] In the embodiments of this application, the motherboard assembly 400 includes a motherboard 410 and an interface board 420 that are electrically connected to each other. External devices and power supplies are connected to the motherboard 410 through the interface board 420, which simplifies the structure of the motherboard 410, protects the motherboard 410 from external interference and damage, and facilitates troubleshooting later.

[0119] In some embodiments of this application, such as Figure 2 and Figure 4 As shown, the cooled camera also includes: a lens adapter ring 800.

[0120] A fourth through area 505 is provided on the first housing 501 in the area corresponding to the image sensor 210. The lens adapter ring 800 is fixed to the fourth through area 505 for mounting the lens.

[0121] The area of ​​the first sealing cover 101 corresponding to the image sensor 210 is a light-transmitting area, so that external light passes through the lens and the light-transmitting area to illuminate the image sensor 210.

[0122] Specifically, the light-transmitting area of ​​the first sealing cover 101 can be a transparent cover plate, or it can be... Figure 3 and Figure 7 The filter 1011 is shown. Below, embodiments using filter 1011 will be described in detail.

[0123] In some embodiments of this application, such as Figure 2 , Figure 3 and Figure 7 As shown, the first sealing cover 101 includes a filter 1011 and a cover body 1012.

[0124] The filter 1011 is the light-transmitting area of ​​the first sealing cover 101, corresponding to the position of the image sensor 210, so that external light passes through the lens and the filter 1011 and illuminates the image sensor 210.

[0125] The filter 1011 is sealed and installed on the cover 1012; the cover 1012 is sealed and connected to the first side of the image sensor circuit board 220 to ensure the sealing performance of the first sealing cover 101 itself, thereby ensuring the sealing performance of the sealing cavity 110 and preventing condensed water vapor from entering the sealing cavity 110.

[0126] In this embodiment, the lens adapter ring 800 is positioned outside the sealing cover assembly 100, allowing users to replace the interface as needed. This makes replacement more flexible and convenient without compromising the sealing performance of the sealing cover assembly 100, thus avoiding any impact on the imaging effect of the image sensor 210. Directly using the filter 1011 as the light-transmitting area of ​​the first sealing cover 101 allows for a more compact internal camera structure, resulting in less remaining space in the housing cavity 510 and a lower risk of condensation during cooling.

[0127] In some embodiments of this application, such as Figure 3 As shown, the first sealing cover 101 also includes a filter pressure plate 1013 and two second sealing rings 1014.

[0128] The cover 1012, filter 1011, and filter pressure plate 1013 are arranged sequentially in a direction away from the image sensor assembly 200. The filter pressure plate 1013 presses the filter 1011 onto the cover 1012 and is sealed to the filter 1011 and the cover 1012 by two second sealing rings 1014, respectively, to form a first sealing cover 101.

[0129] Specifically, the sealing ring is generally made of silicone rubber and contains volatile substances such as silicone oil. In the embodiments of this application, both second sealing rings 1014 are placed on the side of the filter 1011 away from the image sensor 210, which can prevent the volatile substances generated by the second sealing rings 1014 from contacting the surface of the image sensor 210 and causing image abnormalities.

[0130] like Figure 4 As shown, when assembling the cooled camera, it is necessary to ensure the flatness of the image sensor assembly 200. In the prior art, spring leveling is generally used. To improve production assembly efficiency and adapt to the cooled camera structure provided in this embodiment, a shim leveling method is used between the sealing cover assembly 100 and the housing assembly 500. The specific structure is as follows:

[0131] The housing assembly 500 is provided with a plurality of screw holes 5011; the sealing cover assembly 100 is provided with a plurality of screws 120 accordingly. The screws 120 are threadedly connected to the screw holes 5011 to fix the sealing cover assembly 100 to the housing assembly 500.

[0132] A gasket is provided at the screw hole 5011 to support the sealing cover assembly 100, so that the sealing cover assembly 100 is horizontally positioned relative to the housing assembly 500.

[0133] The following describes the method of leveling the image sensor assembly 200 using shims in the embodiments of this application: The sealing cover assembly 100 and the first housing 501 are first directly fastened and fixed with screws 120, and placed on a collimator to test the flatness. If the target flatness is achieved, the next step of installation is carried out; if the target flatness is not achieved, shims are placed at the corresponding screw holes 5011 of the first housing 501 according to the offset direction displayed by the collimator to compensate for the leveling. No adjustment is required at the other screw holes 5011, thereby improving the efficiency of production assembly.

[0134] This application embodiment also provides a cooled camera, which includes: a sealing cover assembly 100, an image sensor assembly 200, a cooling assembly 300, and a motherboard assembly 400.

[0135] The sealing cap assembly 100 includes a first sealing cap 101 and a second sealing cap 102. The image sensor assembly 200 includes an image sensor 210 and an image sensor circuit board 220.

[0136] The first sealing cover 101 is sealed and installed on the first side of the image sensor circuit board 220, and the second sealing cover 102 is sealed and installed on the second side of the image sensor circuit board 220, forming a sealing cavity 110 between the first sealing cover 101 and the second sealing cover 102.

[0137] The second sealing cover 102 is provided with a through-mounting area for sealing and mounting the refrigeration component 300; the cold end face of the refrigeration component 300 is located in the sealing cavity 110, and the hot end face is located outside the sealing cavity 110.

[0138] The image sensor 210 is disposed in the sealed cavity 110; the portion of the image sensor circuit board 220 sealed by the sealing cover assembly 100 is the sealing area 221, and the portion outside the sealing cover assembly 100 is the extension area 222; the sealing area 221 is electrically connected to the cooling assembly 300 and the image sensor 210; the extension area 222 is electrically connected to the main board assembly 400.

[0139] In this embodiment, except for the location of the cooling component 300 and the structure of the second sealing cover 102 as described above... Figure 3 The illustrated embodiment differs, but the remaining structures can be the same as those shown. Figure 3 The embodiments shown are the same and will not be described again here.

[0140] The refrigeration component 300 is configured such that the cold end face is located inside the sealed cavity 110, and the hot end face is located outside the sealed cavity 110, compared to Figure 3 The embodiment shown places the entire refrigeration assembly 300 in the sealed cavity 110, which can further reduce the volume of the sealed cavity 110 and reduce the risk of condensation during refrigeration.

[0141] The cold end face of the cooling assembly 300 is located in the sealed cavity 110 to cool the image sensor assembly 200. The hot end face of the cooling assembly 300 is located in the receiving cavity 510 and can be in close contact with the second housing 502 to transfer heat to the second housing 502. A through area can also be provided on the second housing 502 so that the hot end face of the cooling assembly 300 is in close contact with the heat dissipation assembly 700, thereby shortening the heat dissipation path and improving heat dissipation efficiency. This application does not limit the connection relationship at the hot end face of the cooling assembly 300.

[0142] The cooling camera provided in this application embodiment, in addition to achieving the aforementioned... Figure 3The beneficial effects of the illustrated embodiment are as follows: Using the image sensor circuit board 220 as a sealing element, a first sealing cover 101 is sealed and installed on the first side of the image sensor circuit board 220, and a second sealing cover 102 is sealed and installed on the second side of the image sensor circuit board 220. The extension area 222 of the image sensor circuit board 220 is located outside the sealing cover assembly 100. Compared to the prior art where the entire image sensor assembly is placed inside the sealing cover assembly, this reduces the remaining space within the sealing cavity 110, thereby lowering the risk of condensation during cooling. The image sensor 210 and the cooling assembly 300 are placed in the sealing cavity 110 and electrically connected to the sealing area 221 of the image sensor circuit board 220. The extension area of ​​the image sensor circuit board 220 located outside the sealing cover assembly 100... 222 is electrically connected to the motherboard assembly 400. Compared with the prior art, the sealing cover assembly 100 of this application embodiment does not need to have through holes for the image sensor assembly 200 and the motherboard assembly 400 to be electrically connected. This ensures that the sealing area 221 of the image sensor 210 and the image sensor circuit board 220 is in a completely sealed environment. When the temperature inside the camera is lower than the temperature of the external environment, it can prevent water vapor formed by condensation inside the camera from entering the sealing cover assembly 100, thereby avoiding short circuit of the image sensor circuit board 220. The cooling camera provided in this application embodiment can also adjust the setting position of the cooling assembly 300 so that the hot end face of the cooling assembly 300 is outside the sealing cavity 110, so as to further reduce the volume of the sealing cavity 110 and reduce the risk of condensation during cooling.

[0143] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0144] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A refrigerated camera, characterized in that, include: Sealing cap assembly (100), image sensor assembly (200), cooling assembly (300) and motherboard assembly (400); The sealing cap assembly (100) includes: a first sealing cap (101) and a second sealing cap (102); the image sensor assembly (200) includes: an image sensor (210) and an image sensor circuit board (220); The first sealing cover (101) is sealed and installed on the first side of the image sensor circuit board (220), and the second sealing cover (102) is sealed and installed on the second side of the image sensor circuit board (220), forming a sealing cavity (110) between the first sealing cover (101) and the second sealing cover (102); The image sensor (210) and the cooling assembly (300) are disposed in the sealed cavity (110), and the cooling assembly (300) is located on the side of the image sensor (210) closer to the second sealing cover (102); The portion of the image sensor circuit board (220) sealed by the sealing cover assembly (100) is the sealing area (221), and the portion located outside the sealing cover assembly (100) is the extension area (222); the sealing area (221) is electrically connected to the cooling assembly (300) and the image sensor (210); the extension area (222) is electrically connected to the motherboard assembly (400).

2. The cooling camera according to claim 1, characterized in that, The cooled camera also includes: a housing assembly (500); The housing assembly (500) has an internal receiving cavity (510), and the sealing cover assembly (100) and the extension area (222) of the image sensor circuit board (220) are disposed in the receiving cavity (510); The motherboard assembly (400) is disposed on the outside of the housing assembly (500); a motherboard connector (223) is disposed on the extension area (222), and the motherboard connector (223) is electrically connected to the motherboard assembly (400) through a connecting cable passing through the housing assembly (500).

3. The cooling camera according to claim 1, characterized in that, The sealing cavity (110) on the first side of the image sensor circuit board (220) is a first sealing space (111), and the sealing cavity (110) on the second side of the image sensor circuit board (220) is a second sealing space (112). The image sensor (210) is located in the first sealing space (111), and the cooling assembly (300) is located in the second sealing space (112). The sealing area (221) has a first through area (224) so ​​that the cooling assembly (300) cools the image sensor (210) through the first through area (224).

4. The cooling camera according to claim 3, characterized in that, The refrigeration assembly (300) includes a cooler (310) and a cooling block (320) arranged sequentially along a first direction; the first direction is the direction from the second sealed space (112) to the first sealed space (111); The cooler (310) contacts the second sealing cover (102) and the cooling block (320) on both sides along the first direction, respectively; The cooling block (320) passes through the first through area (224) of the image sensor circuit board (220) and contacts the image sensor (210); The cooler (310) is electrically connected to the image sensor circuit board (220) so that the motherboard assembly (400) controls the cooler (310) to work through the image sensor circuit board (220).

5. The cooling camera according to claim 4, characterized in that, The cooling assembly (300) further includes: a heat insulation pad (330); The heat insulation pad (330) is annular, sleeved on the cooling block (320), and located between the cooling block (320) and the first through area (224).

6. The cooling camera according to claim 1, characterized in that, The cooled camera also includes: a detection component (600); The detection component (600) is disposed in the sealing cover assembly (100) and is electrically connected to the image sensor circuit board (220); The detection component (600) is used to detect the temperature and humidity inside the sealing cover assembly (100) and transmit the detection information to the main board assembly (400) through the image sensor circuit board (220).

7. The cooling camera according to claim 6, characterized in that, The detection component (600) includes: a temperature sensor (610) and a humidity sensor (620); The temperature sensor (610) is disposed on the cooling assembly (300) and located on the side of the cooling assembly (300) closer to the image sensor (210) to detect the temperature of the cooling assembly (300) on that side; the temperature sensor (610) is electrically connected to the sealing area (221) of the image sensor circuit board (220) and can transmit the detected temperature information to the main board assembly (400) through the image sensor circuit board (220); The humidity sensor (620) is disposed in the sealing area (221) of the image sensor circuit board (220) and is electrically connected to the sealing area (221) of the image sensor circuit board (220). It can detect the humidity inside the sealing cover assembly (100) and transmit the detected humidity information to the main board assembly (400) through the image sensor circuit board (220).

8. The cooling camera according to claim 7, characterized in that, The detection component (600) further includes: a temperature circuit board (630); The temperature circuit board (630) is electrically connected to the sealed area (221) of the image sensor circuit board (220); The temperature sensor (610) is electrically connected to the temperature circuit board (630) and can transmit the detected temperature information to the main board assembly (400) in sequence through the temperature circuit board (630) and the image sensor circuit board (220).

9. The cooling camera according to claim 2, characterized in that, The housing assembly (500) includes: a first housing (501) and a second housing (502); the first sealing cap (101) is fitted to the first housing (501), and the second sealing cap (102) is fitted to the second housing (502); The second sealing cover (102) can transfer the heat from the cooling component (300) to the second housing (502), and then from the second housing (502) to the external environment.

10. The cooling camera according to claim 9, characterized in that, The cooled camera further includes a heat dissipation assembly (700); the heat dissipation assembly (700) is disposed on the outside of the second housing (502); The second housing (502) has a second through area (503) in the area where it contacts the heat dissipation assembly (700) so that the heat dissipation assembly (700) can directly contact the second sealing cover (102); The heat dissipation component (700) is able to transfer the heat from the second sealing cover (102) to the external environment.

11. The cooling camera according to claim 10, characterized in that, The heat dissipation assembly (700) includes: a heat sink (710) and a fan (720); The heat sink (710) is fixed to the second sealing cover (102) to seal the second through area (503) on the second housing (502); The fan (720) is fixed to the side of the heat sink (710) away from the second sealing cover (102) and is used to blow air onto the heat sink (710) to transfer the heat from the second sealing cover (102) to the heat sink (710) to the external environment.

12. The cooling camera according to claim 11, characterized in that, The motherboard assembly (400) is fixed to the outside of the second housing (502) and is located on the same side as the heat sink (710), and the orthographic projections of the motherboard assembly (400) and the heat sink (710) on the second sealing cover (102) do not overlap; The orthographic projection of the motherboard assembly (400) on the second sealing cover (102) does not overlap with the orthographic projection of the second through area (503) on the second sealing cover (102); A second heat insulation pad (430) is provided between the motherboard assembly (400) and the second housing (502); The heat on the second sealing cover (102) is transferred to the heat sink (710) through the second through area (503) on the second housing (502).

13. The cooling camera according to claim 9, characterized in that, The motherboard assembly (400) includes: a motherboard (410) and an interface board (420); The motherboard (410) is fixed to the outside of the second housing (502); The second housing (502) has a third through area (504) for the connecting cable to pass through the third through area (504) to electrically connect the motherboard (410) and the motherboard connector (223) of the image sensor circuit board (220); The interface board (420) is fixed on the side of the motherboard (410) away from the second housing (502) and is electrically connected to the motherboard (410) and external devices.

14. The cooling camera according to claim 9, characterized in that, The cooled camera also includes: a lens adapter ring (800); A fourth through area (505) is provided on the first housing (501) in the area corresponding to the image sensor (210); the lens adapter ring (800) is fixed to the fourth through area (505) for mounting the lens; The area of ​​the first sealing cover (101) corresponding to the image sensor (210) is a light-transmitting area, so that external light passes through the lens and the light-transmitting area to illuminate the image sensor (210).

15. The cooling camera according to claim 14, characterized in that, The first sealing cover (101) includes: a filter (1011) and a cover body (1012); The filter (1011) is the light-transmitting area of ​​the first sealing cover (101) and corresponds to the position of the image sensor (210) so that external light passes through the lens and the filter (1011) and illuminates the image sensor (210); The filter (1011) is sealed and installed on the cover (1012); the cover (1012) is sealed and connected to the first side of the image sensor circuit board (220).

16. The cooling camera according to claim 15, characterized in that, The first sealing cover (101) further includes: a filter pressure plate (1013) and two second sealing rings (1014); The cover (1012), filter (1011), and filter plate (1013) are arranged sequentially in a direction away from the image sensor assembly (200); The filter plate (1013) presses the filter (1011) onto the cover (1012) and is sealed to the filter (1011) and the cover (1012) respectively by the two second sealing rings (1014) to form the first sealing cover (101).

17. The cooling camera according to claim 2, characterized in that, The housing assembly (500) is provided with a plurality of screw holes (5011); The sealing cap assembly (100) is provided with a plurality of screws (120); The screw (120) is threaded into the screw hole (5011) to fix the sealing cap assembly (100) to the housing assembly (500); A gasket is provided at the screw hole (5011) to support the sealing cover assembly (100) so that the sealing cover assembly (100) is horizontally positioned relative to the housing assembly (500).

18. A refrigerated camera, characterized in that, include: Sealing cap assembly (100), image sensor assembly (200), cooling assembly (300) and motherboard assembly (400); The sealing cap assembly (100) includes: a first sealing cap (101) and a second sealing cap (102); the image sensor assembly (200) includes: an image sensor (210) and an image sensor circuit board (220); The first sealing cover (101) is sealed and installed on the first side of the image sensor circuit board (220), and the second sealing cover (102) is sealed and installed on the second side of the image sensor circuit board (220), forming a sealing cavity (110) between the first sealing cover (101) and the second sealing cover (102); The second sealing cover (102) is provided with a through-mounting area for sealing and mounting the refrigeration component (300); the cold end face of the refrigeration component (300) is located in the sealing cavity (110), and the hot end face is located outside the sealing cavity (110); The image sensor (210) is disposed in the sealed cavity (110); The portion of the image sensor circuit board (220) sealed by the sealing cover assembly (100) is the sealing area (221), and the portion located outside the sealing cover assembly (100) is the extension area (222); the sealing area (221) is electrically connected to the cooling assembly (300) and the image sensor (210); the extension area (222) is electrically connected to the motherboard assembly (400).

Images