A microphone head pad structure, a dynamic microphone core, and a device

Abstract

This application discloses a microphone head pad structure, a dynamic microphone core, and a device. The microphone head pad structure includes a microphone head pad body and a vibration damping structure. The microphone head pad body forms a receiving chamber, and the vibration damping structure is disposed on the microphone head pad body for shock absorption. The vibration damping structure includes a floating mounting position for mounting the microphone core body, which allows the microphone core body to be suspended within the receiving chamber. At least a portion of the microphone head pad body is made of a flexible material. The combination of the flexible material portion of the microphone head pad and the vibration damping structure forms a dual vibration damping system. When external vibrations act on the dynamic microphone core, the microphone head pad body first absorbs part of the vibration energy, and the remaining vibration energy is transferred to the vibration damping structure with the floating mounting position. This effectively reduces sound distortion and noise caused by vibration. The floating mounting position further minimizes the impact of vibration to ensure the stability of the sound signal conversion process, meeting the application requirements for high sound quality and vibration resistance.

Description

Technical Field

[0001] This application relates to the field of audio equipment technology, and in particular to a microphone head pad structure, a dynamic microphone core, and a device. Background Technology

[0002] During the operation of a dynamic microphone, external vibrations can interfere with the conversion of sound signals, leading to a decrease in sound quality. To address this, related technologies typically use microphone pads to reduce the impact of vibration on the microphone. However, most existing microphone pad structures achieve their vibration damping function through a single damping design, resulting in limited damping performance that cannot specifically address the vibration interference problem of dynamic microphones, thus failing to meet the demands for high sound quality. Utility Model Content

[0003] This application proposes a headpad structure to effectively solve the technical problem that headpads in related technologies only have a single vibration damping method, making it difficult to meet the application scenarios with high requirements for sound quality and vibration resistance.

[0004] This application also proposes a dynamic microphone core that includes the aforementioned headpad structure.

[0005] This application also proposes a device including the aforementioned dynamic microphone core.

[0006] The first aspect of this application provides a headpad structure, including: a headpad body and a shock-absorbing structure;

[0007] The head pad body has a receiving chamber;

[0008] The shock-absorbing structure is mounted on the headpiece pad body and is used for shock absorption and cushioning.

[0009] The shock-absorbing structure includes a floating mounting position for mounting the microphone core body, the floating mounting position being used to suspend the microphone core body within the receiving cavity;

[0010] At least a portion of the head pad body is made of a flexible material.

[0011] Furthermore, the vibration damping structure includes a first cantilever component and a support assembly. One end of the first cantilever component is disposed on the headpiece body, and the other end of the first cantilever component is located in the receiving cavity and connected to the support assembly. The support assembly has the suspended mounting position formed on it.

[0012] Furthermore, the bracket assembly includes a first support member and a second support member disposed opposite to each other, the first support member and the second support member being used to form the suspended mounting position and to cooperate in limiting the microphone core body.

[0013] Furthermore, the outer sides of the first support member and the second support member are used to connect with the first cantilever component, and the inner sides of the first support member and the second support member are respectively provided with mounting portions for limiting the main body of the microphone.

[0014] And / or at least one of the bracket assembly or the first cantilever component is made of an elastic material.

[0015] Furthermore, the shock-absorbing structure includes a buffer layer disposed around the inner wall of the receiving chamber, so that when the microphone body is installed in the suspended mounting position, the buffer layer can act on the outer periphery of the microphone body.

[0016] Furthermore, the buffer layer includes a damping ring, and the shock absorption structure also includes a second cantilever component. One end of the second cantilever component is disposed on the microphone pad body, and the other end of the second cantilever component is located in the receiving cavity and connected to the damping ring. The damping ring forms a through hole for the microphone core body to pass through.

[0017] Furthermore, at least one of the damping ring or the second cantilever component is made of an elastic material.

[0018] Furthermore, the head pad body is made of rubber.

[0019] As can be seen from the above technical solutions, the embodiments of this application have at least the following beneficial effects: by combining the flexible material part of the microphone pad with the shock-absorbing structure to form a dual shock absorption system, when external vibrations act on the dynamic microphone core, the microphone pad body first absorbs part of the vibration energy, and the remaining vibration energy is transferred to the shock-absorbing structure with a floating mounting position, thereby effectively reducing sound distortion, noise and other problems caused by vibration. The setting of the floating mounting position can further minimize the impact of vibration to ensure the stability of the sound signal conversion process and meet the application requirements for high sound quality and vibration resistance.

[0020] A second aspect of this application provides a dynamic microphone core, including: a headpad structure as described in the first aspect of this application.

[0021] A third aspect of this application provides a device including a dynamic microphone core as described in the second aspect of this application.

[0022] It is easy to understand that the dynamic microphone core in the second aspect embodiment of this application and the device in the third aspect embodiment of this application both have the same technical effects as the microphone pad structure in the first aspect embodiment, and therefore will not be described again.

[0023] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a dynamic microphone core provided in one embodiment of this application;

[0026] Figure 2 This is a cross-sectional view of a dynamic microphone core provided in one embodiment of this application;

[0027] Figure 3 A schematic diagram showing a headpad structure provided in one embodiment of this application along a first direction;

[0028] Figure 4 A schematic diagram showing a headpad structure provided in one embodiment of this application along a second direction;

[0029] The first direction can be understood as the direction facing forward at a certain angle, and the second direction can be understood as the direction facing the opposite back at a certain angle.

[0030] Figure label:

[0031] 100. Head pad body; 110. Receiving chamber;

[0032] 200, Vibration damping structure; 201, Suspended mounting position; 210, First cantilever component; 220, Bracket assembly; 221, First support component; 222, Second support component; 223, Mounting part; 230, Buffer layer; 231, Damping ring; 2311, Through hole; 240, Second cantilever component;

[0033] 300. Microphone core body. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] See Figures 1 to 4As shown, an embodiment of the first aspect of this application discloses a headpad structure, including a headpad body 100 and a shock-absorbing structure 200.

[0036] The microphone pad body 100 has a receiving chamber 110, and a shock-absorbing structure 200 is disposed on the microphone pad body 100 for shock absorption and cushioning; the shock-absorbing structure 200 includes a floating mounting position 201 for mounting the microphone body 300, the floating mounting position 201 for suspending the microphone body 300 within the receiving chamber 110; wherein, at least a portion of the microphone pad body 100 is made of a flexible material.

[0037] In the embodiments of this application, a dual damping system is formed by combining the flexible material part of the microphone pad and the vibration damping structure 200. When external vibrations act on the dynamic microphone core, the microphone pad body 100 first absorbs part of the vibration energy, and the remaining vibration energy is transferred to the vibration damping structure 200 with the floating mounting position 201. This effectively reduces sound distortion, noise and other problems caused by vibration. The floating mounting position 201 further minimizes the impact of vibration to ensure the stability of the sound signal conversion process and meets the application requirements for high sound quality and vibration resistance.

[0038] Understandably, in some embodiments, the microphone pad body 100 is positioned between the frame housing of the dynamic microphone and the microphone body 300 for audio signal acquisition, serving to block external vibration interference and improve the working stability of the dynamic microphone and the quality of audio signal acquisition. Therefore, the microphone pad body 100 forms a receiving chamber 110 for accommodating the microphone body 300, and the vibration damping structure 200 includes a floating mounting position 201, allowing the microphone body 300 to be in a suspended buffer state within the receiving chamber 110 after being mounted at this floating mounting position 201. This ensures that when external vibrations act on the dynamic microphone, the microphone pad body 100 and the vibration damping structure 200 minimize the impact on the microphone body 300 while consuming vibration energy, thereby minimizing the vibration impact.

[0039] In some embodiments, at least a portion of the microphone head pad body 100 is made of a flexible material, so that when external vibrations act on the dynamic microphone core, some of the vibrational energy can be absorbed by the flexible material. In some embodiments, the entire microphone head pad body 100 is made of a flexible material, thereby ensuring an all-around vibration damping effect. Specifically, the flexible material may include, but is not limited to, rubber, thermoplastic elastomers, porous / foamed materials, or fiber-based materials, and the appropriate material can be selected according to the actual application scenario.

[0040] In some embodiments, the shock-absorbing structure 200 itself has a certain shock absorption and buffering function. A floating mounting position 201 is provided on this basis, so that the microphone core body 300 mounted on the floating mounting position 201 is not affected by the shock absorption and buffering action of the shock-absorbing structure 200. Specifically, the shock-absorbing structure 200 can be configured to use friction energy dissipation, deformation energy dissipation, or sliding and rotational energy dissipation methods for shock absorption and buffering. The appropriate action can be selected based on the actual application scenario to achieve the corresponding energy dissipation method.

[0041] The following will combine Figures 1 to 4 The headpad structure disclosed in the embodiments of this application will be explained and described in detail.

[0042] It should be understood that, in order to achieve better shock absorption performance of the shock-absorbing structure 200, the structural design of the components used to form the suspended mounting position 201 is key to realizing the above functions. In this regard, in some embodiments of this application, reference is made to... Figure 3 and Figure 4 The shock-absorbing structure 200 includes a first cantilever component 210 and a support assembly 220. One end of the first cantilever component 210 is disposed on the headpiece pad body 100, and the other end of the first cantilever component 210 is located in the receiving chamber 110 and connected to the support assembly 220. A floating mounting position 201 is formed on the support assembly 220.

[0043] Understandably, the first cantilever component 210 allows the bracket assembly 220 to be suspended within the receiving chamber 110. The bracket assembly 220 forms a suspended mounting position 201 for mounting the microphone body 300, thereby minimizing the occurrence of external vibrations being directly transmitted to the microphone body 300 by the microphone pad body 100 or other components of the dynamic microphone. When external vibrations act on the dynamic microphone, they always pass through the microphone pad body 100, the first cantilever component 210, and the bracket assembly 220 before acting on the microphone body 300, effectively solving the problem of sound quality degradation caused by vibration interference of the dynamic microphone.

[0044] In some embodiments, energy-dissipating components may be provided on at least one of the two ends of the first cantilever component 210 and / or at least one of the two ends of the support assembly 220, thereby further improving the vibration damping and energy dissipation effect of the shock-absorbing structure 200. In some embodiments, the energy-dissipating components may be configured as including, but not limited to, friction pair energy-dissipating components, damping energy-dissipating components, or fluid resistance components.

[0045] Exemplarily, in some embodiments, reference is made to Figure 3 and Figure 4The support assembly 220 includes a first support member 221 and a second support member 222 disposed opposite to each other. The first support member 221 and the second support member 222 are used to form a suspended mounting position 201 and can cooperate to limit the microphone body 300. It is understood that by displacing them opposite each other, vibration energy is transmitted through the first support member 221 and the second support member 222, thereby further reducing the impact of vibration on the microphone body 300.

[0046] In some embodiments, at least one of the support assembly 220 or the first cantilever component 210 is made of an elastic material. It is understood that by employing the elastic deformation of an elastic material to convert vibration energy into heat energy, the impact of vibration on the dynamic microphone core is reduced, ensuring the stability of the sound signal conversion process within the dynamic microphone core and outputting a high-quality audio signal. In some embodiments, the support assembly 220 or the first cantilever component 210 being made of an elastic material can effectively solve the problem of sound quality degradation caused by vibration interference in the dynamic microphone core. In some embodiments, both the support assembly 220 and the first cantilever component 210 are made of elastic materials, thereby effectively reducing sound distortion and noise caused by vibration, significantly improving the audio signal acquisition quality, and ensuring the operational stability of the dynamic microphone core.

[0047] In some embodiments, the first cantilever component 210 includes a plurality of connecting parts, which are divided into two groups and are respectively used to connect the first support 221 and the second support 222. The connecting parts in each group are spaced apart from each other to ensure that the first support 221 and the second support 222 are subjected to uniform force and to ensure structural stability.

[0048] In some embodiments, refer to Figure 3 and Figure 4 The outer sides of the first support member 221 and the second support member 222 are used to connect with the first cantilever component 210. The inner sides of the first support member 221 and the second support member 222 are respectively provided with mounting portions 223 for limiting the microphone body 300. It can be understood that the mounting portions 223 arranged opposite to each other are used to cooperate in limiting and fixing the microphone body 300 installed in the suspended mounting position 201. Specifically, the specific structure of the mounting portions 223 can be adaptively adjusted according to the specific structure of the microphone body 300, so as to ensure the reliable installation of the microphone body 300.

[0049] In some embodiments, the mounting portion 223 may be configured as a curved surface adapted to the outer contour surface of the microphone core body 300, or it may be configured as a connecting structure, with a matching structure provided on the microphone core body 300 to achieve the connection, or the mounting portion 223 may be configured as a combination of a curved surface and a connecting structure, etc. Specifically, the connecting structure may be a threaded connection structure, a snap-fit ​​connection structure, etc., which can be adaptively selected according to actual usage requirements.

[0050] In some embodiments, the first cantilever component 210 and the support assembly 220 are an integral structure. In some embodiments, the first cantilever component 210 and the support assembly 220 are an integral structure with the microphone pad body 100 and are made of the same flexible material. In other embodiments, the first cantilever component 210 and the support assembly 220 are separate structures from the microphone pad body 100, which are made of the same or different flexible materials and then connected to form a whole by common connection methods.

[0051] It should be understood that, in order to achieve better vibration damping and energy dissipation performance of the shock-absorbing structure 200, the structural design of the energy dissipation components is key to realizing the above functions. In this regard, in some embodiments of this application, reference is made to... Figure 3 and Figure 4 The vibration damping structure 200 includes a buffer layer 230, which surrounds the inner wall of the receiving chamber 110 so that when the microphone body 300 is installed in the suspended mounting position 201, the buffer layer 230 can act on the outer periphery of the microphone body 300. It is understood that by placing the buffer layer 230 on the outer periphery of the microphone body 300, when external vibrations act on the moving coil microphone, the vibration energy can be dissipated between the buffer layer 230 and the microphone body 300 in a timely manner, reducing the impact of vibration on the microphone body 300.

[0052] In some embodiments, the buffer layer 230 may be configured as an elastic layer, a friction pair energy dissipation layer, or a fluid resistance energy dissipation layer, which are commonly used damping and energy dissipation structures.

[0053] Exemplarily, in some embodiments, reference is made to Figure 3 and Figure 4 The buffer layer 230 includes a damping ring 231, and the shock absorption structure 200 also includes a second cantilever component 240. One end of the second cantilever component 240 is disposed on the microphone pad body 100, and the other end of the second cantilever component 240 is located in the receiving chamber 110 and connected to the damping ring 231. The damping ring 231 forms a through hole for the microphone core body 300 to pass through.

[0054] Understandably, the microphone core 300, after being mounted in a suspended configuration, abuts against the inner wall of the through-hole of the damping ring 231. When external vibrations act on the dynamic microphone core, the microphone head pad first absorbs some of the vibration energy through elastic deformation, converting it into heat energy. The remaining vibration energy is transferred to the vibration damping frame 200, where it is further absorbed by the deformation of the elastic support and dissipated by the internal friction of the damping ring 231. This synergistic effect minimizes the impact of vibration, ensuring a stable sound signal conversion process within the dynamic microphone core and outputting a high-quality audio signal.

[0055] In some embodiments, to further improve the efficiency of frictional energy dissipation, a friction layer with a large friction coefficient can be provided on the inner wall of the through hole of the damping ring 231 to improve the efficiency of energy dissipation.

[0056] In some embodiments, at least one of the damping ring 231 or the second cantilever component 240 is made of an elastic material. It is understood that by employing the elastic deformation of the elastic material to convert vibrational energy into heat energy, the impact of vibration on the dynamic microphone core is reduced, ensuring the stability of the sound signal conversion process within the dynamic microphone core and outputting a high-quality audio signal.

[0057] In some embodiments, the damping ring 231 or the second cantilever component 240 is made of an elastic material, which can effectively solve the problem of sound quality degradation caused by vibration interference of the dynamic microphone core. In some embodiments, both the damping ring 231 and the second cantilever component 240 are made of elastic materials, thereby effectively reducing sound distortion and noise caused by vibration, significantly improving the audio signal acquisition quality, and ensuring the stability of the dynamic microphone core operation.

[0058] In some embodiments, the second cantilever component 240 includes multiple connecting portions, which are spaced apart from each other to ensure that the damping ring 231 is subjected to uniform force and to ensure structural stability.

[0059] In some embodiments, the second arm component and the damping ring 231 are an integral structure. In some embodiments, the second arm component and the damping ring 231 are an integral structure with the microphone pad body 100 and are made of the same flexible material. In other embodiments, the second arm component and the damping ring 231 are separate structures from the microphone pad body 100, which are made of the same or different flexible materials and then connected to form a whole by common connection methods.

[0060] For example, in some embodiments, the microphone head pad body 100 is made of rubber. It is understood that the embodiments of this application combine the rubber microphone head pad with the suspended vibration damping structure 200 to form a dual vibration damping system, which effectively solves the problem of sound quality degradation caused by vibration interference of the dynamic microphone core, and has significant innovation, practicality and promotional value.

[0061] In summary, the headpad structure provided in this application has the following advantages:

[0062] 1. Dual shock absorption for superior performance: By combining flexible materials with a 200-degree floating shock absorption structure, it more effectively isolates external vibrations compared to a single shock absorption method, significantly reducing the impact of vibrations on the microphone core.

[0063] 2. Improved sound quality and enhanced stability: Effectively reduces sound distortion and noise caused by vibration, significantly improves the quality of audio signal acquisition, ensures the working stability of the dynamic microphone core, and brings users a purer and clearer sound experience.

[0064] 3. Wide range of applications and broad prospects: It is suitable for professional audio equipment, high-quality recording and other scenarios, and meets the application requirements for high sound quality and vibration resistance, and has broad application prospects.

[0065] The headpad structure of this application is described in detail below with a specific embodiment. It should be noted that the following embodiment is merely an exemplary description and should not be construed as limiting the embodiments of this application.

[0066] See Figures 1 to 4 As shown, the microphone head pad structure of this embodiment includes a microphone head pad body 100 and a suspended vibration damping structure 200. The microphone head pad body 100 is mainly made of rubber, and the rubber microphone head pad is located at key parts of the microphone core 300 that come into contact with the outside world (such as the side near the diaphragm). The suspended vibration damping structure 200 includes a structure that supports the microphone core 300 by high-strength elastic support members (such as elastic brackets) and a structure that surrounds the microphone core 300 by damping buffer layers 230 (such as damping rubber rings), ensuring that the microphone core 300 is in a suspended and buffered state within the structure.

[0067] When external vibrations act on the dynamic microphone core, the rubber microphone pad first absorbs some of the vibration energy through elastic deformation, converting it into heat energy. The remaining vibration energy is transferred to the suspended vibration damping structure 200, where the elastic support deforms to further absorb the vibration. At the same time, the damping buffer layer 230 dissipates energy through internal friction, minimizing the impact of vibration. This ensures a stable sound signal conversion process within the dynamic microphone core, resulting in the output of a high-quality audio signal.

[0068] It is understood that the embodiments of this application innovatively improve the microphone head pad by using rubber material. This rubber material absorbs and buffers vibration energy through elastic deformation, converting the kinetic energy of vibration into heat or other forms of energy, thus reducing the transmission of vibration to the microphone core 300. Simultaneously, combined with the suspended vibration damping structure 200, a 360° buffering system is constructed using high-strength elastic support components and a damping buffer layer 230. When external vibrations are transmitted to the microphone core, they are first initially absorbed by the rubber microphone head pad, and then further dissipated through the elastic support of the suspended structure and the damping buffer layer 230. This dual vibration damping design comprehensively blocks external vibration interference, improving the working stability of the dynamic microphone core and the quality of audio signal acquisition.

[0069] The second aspect of this application discloses a dynamic microphone core, including: the headpad structure of the first aspect of this application.

[0070] The device according to the third aspect of this application may be a professional microphone, recording equipment, etc., and the device includes: the dynamic microphone core according to the second aspect of this application.

[0071] It is easy to understand that the dynamic microphone core in the second aspect embodiment of this application and the device in the third aspect embodiment of this application both have the same technical effects as the microphone pad structure in the first aspect embodiment, and therefore will not be described again.

[0072] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0073] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more. It should be noted that the term "and / or" used herein is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Similarly, at least one of A or B can also represent: A alone, A and B simultaneously, or B alone.

[0074] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0075] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A sound head pad structure, characterized by, include: The headpiece pad and vibration damping structure; The head pad body has a receiving chamber; The shock-absorbing structure is mounted on the headpiece pad body and is used for shock absorption and cushioning. The shock-absorbing structure includes a floating mounting position for mounting the microphone core body, the floating mounting position being used to suspend the microphone core body within the receiving cavity; At least a portion of the head pad body is made of a flexible material.

2. The ear tip cushion structure of claim 1, wherein: The vibration damping structure includes a first cantilever component and a support assembly. One end of the first cantilever component is disposed on the headpiece body, and the other end of the first cantilever component is located in the receiving cavity and connected to the support assembly. The support assembly has the suspended mounting position formed on it.

3. The ear tip cushion structure of claim 2, wherein: The bracket assembly includes a first support member and a second support member disposed opposite to each other. The first support member and the second support member are used to form the suspended mounting position and can cooperate to limit the microphone core body.

4. The headpad structure according to claim 3, characterized in that: The outer sides of the first support member and the second support member are used to connect with the first cantilever component, and the inner sides of the first support member and the second support member are respectively provided with mounting portions for limiting the main body of the microphone. And / or at least one of the bracket assembly or the first cantilever component is made of an elastic material.

5. The headpad structure according to claim 1, characterized in that: The shock-absorbing structure includes a buffer layer disposed around the inner wall of the receiving chamber, so that when the microphone body is installed in the suspended mounting position, the buffer layer can act on the outer periphery of the microphone body.

6. The headpad structure according to claim 5, characterized in that: The buffer layer includes a damping ring, and the shock absorption structure also includes a second cantilever component. One end of the second cantilever component is disposed on the microphone pad body, and the other end of the second cantilever component is located in the receiving cavity and connected to the damping ring. The damping ring forms a through hole for the microphone core body to pass through.

7. The headpad structure according to claim 6, characterized in that: At least one of the damping ring or the second cantilever component is made of an elastic material.

8. The headpad structure according to claim 1, characterized in that: The head pad is made of rubber.

9. A dynamic microphone core, characterized in that, include: The headpad structure as described in any one of claims 1 to 8.

10. A device, characterized in that, include: The dynamic microphone core as described in claim 9.

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